ASSY Process Introduction

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Assembly Process Flow
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DIP
(Dual In Line Package) SRAM, ROM, EPROM, EEPROM, FLASH, Microcontroller PLCC (Plastic Leaded Chip Carrier) SRAM, ROM, EPROM, EEPROM, FLASH, Microcontroller
SOP
(Small Outline Package) Linear, Logic, DRAM, SRAM
SOJ
(Small Outline Package) Linear, Logic, DRAM, SRAM
QFP
(Quad Flat Package) Microprocessor
BGA
TSOP
(Thin Small Outline Package) DRAM, SRAM, SDRAM, FLASH
(Ball Grid Array) SRAM, ROM, EPROM, EEPROM, FLASH, Microcontroller
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MCP
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IBM1960
IC
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BGA
()
Wafer process: , ,
TSOP
()
()
()
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IC
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Trench BGA Trench BGA topside
Compound Body
Trench BGA Trench BGA backside Substrate Solder ball
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Trench BGA Trench BGA lateral
Solder ball
Solder mask Complex resin
Substrate Body (compound) Solder mask Glass fiber BT
Glass BT fiber
Solder mask
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Taping
Wafer Grinding
Wafer Mount
Wafer Saw
Substrate curing
Screen Print
Post Cure
Die Bond
Post Cure
Wire Bond
Molding
Laser Marking
Post Mold Cure
Ball Mount
Singulation
Visual Inspection
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Taping
Wafer Grinding
De-taping
Wafer Mount
Wafer Saw
Die Bonding
Wire Bonding
Molding
Post Mold Cure
Laser Marking
Dejunk/ Trim
Solder Plating
Forming/ Singulation
Visual Inspection
Lead Scan
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Input
Taping
Output
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Input
Grinding
Output
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Input
Auto Mount
Output
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Input
Wafer Saw
Output
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Input
Screen Print
Output
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Input
Die Bond
Output
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Input
Wire Bond
Output
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Molding Input Output
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Laser Marking Input Output
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Input
Ball Mount
Output
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Singulation
Output
Input
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LOC Die Mounter
Top Side
Back Side
LOC Pkg
Epoxy Die Bonder
Epoxy
Die Bond
Con. Pkg
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Input
Die Bond
Output
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Input
Wire Bond
Output
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Molding Input Output
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Laser Marking
Input Output
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Input
Dejunk
Output
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Solder plating
Input Output
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Trim Forming
Input
Output
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ASSY Process Introduction

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Assembly Process Flow

Assembly Process Flow

(Ball Grid Array) SRAM, ROM, EPROM, EEPROM, FLASH, Microcontroller

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Trench BGA Trench BGA topside

Assembly Process Flow

Trench BGA Trench BGA lateral

Solder mask Complex resin

Substrate Body (compound) Solder mask Glass fiber BT

Assembly Process Flow

Post Mold Cure

Assembly Process Flow

Post Mold Cure

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Molding Input Output

Assembly Process Flow

Laser Marking Input Output

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

LOC Die Mounter

Epoxy Die Bonder

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Molding Input Output

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

Assembly Process Flow

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