8 1
1 8
Operation from 3.0 V to 40 V Input Low Standby Current Current Limiting Output Switch Current to 1.5 A Output Voltage Adjustable Frequency Operation to 100 kHz Precision 2% Reference PbFree Packages are Available
8 1 Drive 8 Collector S Q 7 R 100 Ipk Oscillator CT 6 VCC Comparator + Comparator 5 Inverting Input (Bottom View) This device contains 79 active transistors. 1.25 V Reference Regulator 4 GND 3 1 Timing Capacitor x A L, WL Y, YY W, WW G or G Q2 Q1 2 Switch Emitter 1 Switch Collector
1 8
3x063V ALYWA G
3x063AP1 AWL YYWWG PDIP8 P, P1 SUFFIX CASE 626 1 8 33063AVP AWL YYWWG 1
Ipk Sense
33063 ALYWA G
Switch Collector
Switch Emitter
EP Flag
(Top View)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Maximum package power dissipation limits must be observed. 2. This device series contains ESD protection and exceeds the following tests: Human Body Model 4000 V per MILSTD883, Method 3015. Machine Model Method 400 V. 3. NCV prefix is for automotive and other applications requiring site and change control.
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Regline
IIB
4. Tlow = 0C for MC34063, SC34063; 40C for MC33063, SC33063, MC33063V, NCV33063 Thigh = +70C for MC34063, SC34063; + 85C for MC33063, SC33063; +125C for MC33063V, NCV33063 5. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible. 6. If the output switch is driven into hard saturation (nonDarlington configuration) at low switch currents ( 300 mA) and high driver currents ( 30 mA), it may take up to 2.0 ms for it to come out of saturation. This condition will shorten the off time at frequencies 30 kHz, and is magnified at high temperatures. This condition does not occur with a Darlington configuration, since the output switch cannot saturate. If a nonDarlington configuration is used, the following output drive condition is recommended: IC output w 10 Forced b of output switch : IC driver 7.0 mA * * The 100 W resistor in the emitter of the driver device requires about 7.0 mA before the output switch conducts.
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1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0 0.2 0.4 0.6 0.8 1.0 1.2 IE, EMITTER CURRENT (A) 1.4 1.6 VCC = 5.0 V Pins 1, 7, 8 = VCC Pins 3, 5 = GND TA = 25C (See Note 7) VCE(sat), SATURATION VOLTAGE (V) VCE(sat), SATURATION VOLTAGE (V)
1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 0.2 0.4 VCC = 5.0 V Pin 7 = VCC Pins 2, 3, 5 = GND TA = 25C (See Note 7)
Darlington Connection
Forced b = 20
1.4
1.6
Figure 5. Emitter Follower Configuration Output Saturation Voltage versus Emitter Current
VIPK(sense), CURRENT LIMIT SENSE VOLTAGE (V)
Figure 6. Common Emitter Configuration Output Switch Saturation Voltage versus Collector Current
3.6 3.2 I CC, SUPPLY CURRENT (mA)
400 380 360 340 320 300 280 260 240 220 200 -55 -25 0 25 50 75 TA, AMBIENT TEMPERATURE (C) 100 125 VCC = 5.0 V Ichg = Idischg
2.8 2.4 2.0 1.6 1.2 0.8 0.4 0 0 5.0 10 15 20 25 30 VCC, SUPPLY VOLTAGE (V) 35 40 CT = 1.0 nF Pin 7 = VCC Pin 2 = GND
7. Low duty cycle pulse techniques are used during test to maintain junction temperature as close to ambient temperature as possible.
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200 mV/DIV
1 Q2 Q1 2 1N5819 CT 3 CT Comp. 1.25 V Ref Reg 4 1.0 mH R2 Vout 28 V/175 mA + 330 CO + 100 47 k Vout 1500 pF
R1
2.2 k
Optional Filter
Test Line Regulation Load Regulation Output Ripple Efficiency Output Ripple With Optional Filter
Conditions Vin = 8.0 V to 16 V, IO = 175 mA Vin = 12 V, IO = 75 mA to 175 mA Vin = 12 V, IO = 175 mA Vin = 12 V, IO = 175 mA Vin = 12 V, IO = 175 mA
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Vout
R 8 1
Vout
2 Rsc
Figure 10. External Current Boost Connections for IC Peak Greater than 1.5 A 9a. External NPN Switch 9b. External NPN Saturated Switch
(See Note 8)
8. If the output switch is driven into hard saturation (nonDarlington configuration) at low switch currents ( 300 mA) and high driver currents ( 30 mA), it may take up to 2.0 ms to come out of saturation. This condition will shorten the off time at frequencies 30 kHz, and is magnified at high temperatures. This condition does not occur with a Darlington configuration, since the output switch cannot saturate. If a nonDarlington configuration is used, the following output drive condition is recommended.
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Comp.
Optional Filter Test Line Regulation Load Regulation Output Ripple Short Circuit Current Efficiency Output Ripple With Optional Filter Conditions Vin = 15 V to 25 V, IO = 500 mA Vin = 25 V, IO = 50 mA to 500 mA Vin = 25 V, IO = 500 mA Vin = 25 V, RL = 0.1 W Vin = 25 V, IO = 500 mA Vin = 25 V, IO = 500 mA Results 12 mV = 0.12% 3.0 mV = 0.03% 120 mVpp 1.1 A 83.7% 40 mVpp
1 8
1 V
7 Rsc Vin 6
Figure 12. External Current Boost Connections for IC Peak Greater than 1.5 A 11a. External NPN Switch 11b. External PNP Saturated Switch
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1 Q2 Q1 2 L 3 1.25 V Ref Reg 4 R1 953 1.0 mH Vout -12 V/100 mA 1000 mf + CO + 100 Vout + 1500 pF 1N5819 88 mH
CT
Comp.
R2
8.2 k
Optional Filter
Test Line Regulation Load Regulation Output Ripple Short Circuit Current Efficiency Output Ripple With Optional Filter
Conditions Vin = 4.5 V to 6.0 V, IO = 100 mA Vin = 5.0 V, IO = 10 mA to 100 mA Vin = 5.0 V, IO = 100 mA Vin = 5.0 V, RL = 0.1 W Vin = 5.0 V, IO = 100 mA Vin = 5.0 V, IO = 100 mA
Results 3.0 mV = 0.012% 0.022 V = 0.09% 500 mVpp 910 mA 62.2% 70 mVpp
1 8
1 Vout
2 Vout
Vin
3 Vin + 4 6
3 +
Figure 14. External Current Boost Connections for IC Peak Greater than 1.5 A 13a. External NPN Switch 13b. External PNP Saturated Switch
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INDUCTOR DATA
Converter StepUp StepDown VoltageInverting Inductance (mH) 170 220 88 Turns/Wire 38 Turns of #22 AWG 48 Turns of #22 AWG 28 Turns of #22 AWG
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ton CT Ipk(switch) 2I
out(max)
t on ) 1 t off
2I
out(max)
t on ) 1 t off
Rsc L(min)
on(max)
on(max)
on(max)
CO
ripple(pp)
ripple(pp)
Vsat = Saturation voltage of the output switch. VF = Forward voltage drop of the output rectifier. The following power supply characteristics must be chosen: Vin Nominal input voltage. Vout Desired output voltage, |V out| + 1.25 1 ) R2 R1 Iout Desired output current. fmin Minimum desired output switching frequency at the selected values of Vin and IO. Vripple(pp) Desired peaktopeak output ripple voltage. In practice, the calculated capacitor value will need to be increased due to its equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it will directly affect the line and load regulation.
NOTE: For further information refer to Application Note AN920A/D and AN954/D.
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For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. *NCV33063A: Tlow = 40C, Thigh = +125C. Guaranteed by design. NCV prefix is for automotive and other applications requiring site and change control.
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B
1
S
4
0.25 (0.010)
Y G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 75101 THRU 75106 ARE OBSOLETE. NEW STANDARD IS 75107. DIM A B C D G H J K M N S MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244
C Z H D 0.25 (0.010)
M SEATING PLANE
X 45 _
0.10 (0.004)
Z Y
SOLDERING FOOTPRINT*
1.52 0.060
7.0 0.275
4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. DIMENSION E IS MEASURED WITH THE LEADS RESTRAINED PARALLEL AT WIDTH E2. 4. DIMENSION E1 DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A A1 b C D D1 E E1 E2 E3 e L MIN 0.015 0.014 0.008 0.355 0.005 0.300 0.240 INCHES NOM MAX 0.210 0.018 0.022 0.010 0.014 0.365 0.400 0.310 0.325 0.250 0.280 0.300 BSC 0.430 0.100 BSC 0.115 0.130 0.150 MILLIMETERS MIN NOM MAX 5.33 0.38 0.35 0.46 0.56 0.20 0.25 0.36 9.02 9.27 10.02 0.13 7.62 7.87 8.26 6.10 6.35 7.11 7.62 BSC 10.92 2.54 BSC 2.92 3.30 3.81
E1
1 4
NOTE 5
F TOP VIEW
c E2 END VIEW
NOTE 3
e/2
L A1 e
8X
SEATING PLANE
E3 b 0.010
M
SIDE VIEW
C A
END VIEW
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0.15 C
0.15 C
DETAIL A
NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30MM FROM TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. 5. DETAILS A AND B SHOW OPTIONAL CONSTRUCTIONS FOR TERMINALS. DIM A A1 A3 b D D2 E E2 e K L L1 MILLIMETERS MIN MAX 0.80 1.00 0.00 0.05 0.20 REF 0.25 0.35 4.00 BSC 1.91 2.21 4.00 BSC 2.09 2.39 0.80 BSC 0.20 0.30 0.50 0.15
TOP VIEW
EXPOSED Cu
0.10 C
8X
0.08 C
NOTE 4
DETAIL B
A C
SEATING PLANE
MOLD CMPD
A1
A1
ALTERNATE CONSTRUCTIONS
DETAIL B
A3
DETAIL A
1 4
8X
SOLDERING FOOTPRINT*
2.21 0.63
8X
K e
8 5
8X
0.35
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC34063A/D