Anda di halaman 1dari 7

IDT MOBILE WINCHIP PROCESSOR MODULE

ADVANCE INFORMATION IDT7M9602

Integrated Device Technology, Inc.

FEATURES:
IDT WinChip Processor technology with internal/bus frequencies of 180/60 or 200/66 512K Secondary level cache of pipeline burst SRAM Burst read/write at 3-1-1-1-1; back-to-back burst reads at 3-1-1-1-1-1-1-1 Supports up to 64MB of cacheable system memory (non-PCI memory) Supports ZZ snooze mode power management Thermal transfer "TopHat" system for processor heat dissipation Active thermal feedback (ATF) sensing Internal A/D - digital signaling (SMBUS) across the module interface

Intel 430TX system controller DRAM controller supports EDO and SDRAM at 3.3V Provides PCI CLKRUN# signal to control memory clock on the PCI bus SDRAM clock enable support and self refresh of EDO or SDRAM during Suspend mode Compatible SMRAM (C_SMRAM_ and Extended SMRAM (E_SMRA) mode supports write-back cacheable SMRAM up to 1MB 3.3V PCI bus control, Rev 2.1 complaint 280 position MMC-1 connector interface

BLOCK DIAGRAM
ATF Sense

Processor Core Voltage Host Bus Processor Voltage Regulator PIPELINED BURST SRAM

IDT Winchip
HCLK_1

HCLK_0 TAG MEMORY Southbridge Sidebands Signals

System Controller

Memory Bus

5V-21V V_CPUIO PCLK_5 PCI Bus

280-Pin Board-to-Board Connector

4268 drw 01 The IDT logo is a registered trademark of Integrated Device Technology, Inc. All others are property of their respective companies.

COMMERCIAL TEMPERATURE RANGE


1998 Integrated Device Technology, Inc.

May 1998

IDT7M9602 IDT MOBILE WINCHIP PROCESSOR MODULE

ADVANCE INFORMATION

FUNCTIONAL DESCRIPTION
The IDT Mobile WinChip Processor Module is an integrated building block for system integrators and manufacturers of notebook computers. The module consists of the IDT WinChip processor with MMX technology, a system controller, second level cache, a voltage regulator and a thermal sensor. The IDT Mobile WinChip Processor Module interfaces to the notebook motherboard PCI and memory buses through the system controller. The Block Diagram illustrates interconnect of the components within the module and system interfaces. Heat is transferred from the processor through IDT's TopHat thermal transfer system. The TopHat is configured to provide a standard thermal attach point which can be used to connect additional heat dissapation devices.

SIGNAL DESCRIPTIONS
Table 1 provides a list of signals for the IDT Mobile WinChip Processor Module by category and the corresponding number of signals in each category.

Table 1. Signal Categories


Signals Memory PCI Processor/Southbridge Sideband Power Management Clocks Voltage: V_DC Voltage:V_3S Voltage:V_5S Voltage:V_3 Voltage:V_CPUIO ITP/JTAG Misc. & Module ID Ground No Connects Total Number 108 56 9 8 8 10 20 1 5 3 7 5 32 7 280
4268 tbl 1

IDT MOBILE WINCHIP PROCESSOR MODULE

INFORMATION

MODULE PIN ASSIGNMENTS


Table 2 lists the signals for each pin of the connector from the IDT Mobile WinChip Processor Module to the I/O Module. See figure 2 for row assignments.

Table 2. Pin Assignments


Pin# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Row A Gnd MD40 MD41 MD42 MD43 V_3S MD44 MD45 MD46 MD47 Gnd CAS0#/DQM5 CAS1#/DQM1 MA00 CKEA V_3S MA02 MA03 MD08 MD09 Gnd MD10 MD11 MD12 MD13 Row B Gnd MD00 MD04 MD02 MD03 V_3S MD01 MD05 MD06 MD07 Gnd CAS4#/DQM0 CAS5#/DQM2 MA01 CKEB V_3S MA04 MA05 MD17 MD16 Gnd MD18 MD19 MD20 MD21 Row C Gnd MID0 Reserved V-DC V-DC V_DC V_DC V_DC Reserved MID2 Gnd AD00 AD01 AD02 AD03 V_3S AD04 AD05 AD06 AD07 Gnd AD08 AD09 AD10 AD11C Row D Gnd MID1 Reserved V_DC V_DC V-DC V-DC V-DC Reserved MID3 Gnd FRAME# LOCK# DEVSEL# IRDY# V_3S TRDY# STOP# PHLD# PHlDA# Gnd PCI_RST# PAR SEER# REQ0#

IDT7M9602 IDT MOBILE WINCHIP PROCESSOR MODULE

ADVANCE INFORMATION

Pin# 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51

Row A V_3S MD14 MD15 SRASA# SRASB# Gnd MWEA# MWEB# RAS0#/CS0# RAS1#/CS1# V_3S MD36 MD39 MD37 Gnd MD35 MD34 MD38 MD33 V_3S MD32 MA06 MA07 MA08 Gnd MA09

Row B V_3S MD22 MD23 SCASA# SCASB# Gnd MPD0 MPD4 MPD1 MPD5 V_3S MPD2 MPD6 MPD3 Gnd MPD7 MD48 MD50 MD49 V_3S MD51 MD52 MD53 MD54 Gnd MD55

Row C V_3S AD12 AD13 AD14 AD15 Gnd AD16 AD17 AD18 AD19 V_3S AD20 AD21 AD22 Gnd RAS2#/CS2# RAS3#/CS3# RAS4#/CS4# RAS5#/CS5# V_3 AD23 AD24 AD25 AD26 Gnd AD27

Row D REQ1# REQ2# REQ3# GNT0# GNT1# Gnd GNT2# GNT3# L2_ZZ Reserved V_3S Reserved PPP_PP# CLKRUN# Gnd SM_CLK SM_DATA ATF_INT# SUSCLK V_3 SUS_STAT# V_3 OEM_PU VR_ON Gnd VR_PWRGD

IDT MOBILE WINCHIP PROCESSOR MODULE

INFORMATION

Pin# 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70

Row A CAS2#/DQM4 CAS3#/DQM3 MA10 V_3S MA11 MD25 MD24 MD26 Gnd MD27 MD28 MD31 MD30 MD29 V_3S OEM_PD FQS0 HCLK1 Gnd

Row B CAS6#/DQM6 CAS7#DQM7 MA12 V_3S /MA13 MD56 MD60 MD58 Gnd MD57 MD61 MD59 MD62 MD63 V_3S PCLK FQS1 HCLK0 Gnd

Row C AD28 AD29 AD30 V_3S AD31 C/BE0# C/CBE1# C/BE2# Gnd C/BE3# IGNNE# FERR# A20M# V_CPUIO TDO ITP0 ITP1 CPU3.3_2.5# Gnd

Row D V_3 V_3 Reserved Reserved INIT# V_CPUIO INTR CPURST Gnd STPCLK# SMI# NMI V_5S V_CPUIO TRST# TDI# TMS TCLK Gnd
4268 tbl 2

NOTE: Pins B54 and C43 are connected together on the IDT WinChip Mobile Processor Module, and Pins C56 and C44 are connected together on the IDT WinChip Mobile Processor Module.

IDT7M9602 IDT MOBILE WINCHIP PROCESSOR MODULE

ADVANCE INFORMATION

CONNECTOR FOOTPRINT
Figure 2 shows the connector pad assignment for the system manufacture I/O module. This footprint is viewed from the primary side of the I/O Module (side of the printed circuit board on which the 280-pin connector is soldered).

Connector Footprint OEM Pad Assignments


(Viewed from bottom side of Mobile Processor Module)

A1 B1 C1 D1

A70 B70 C70 D70

4268 drw 2

Figure 2. 280-Pin Connector Footprint Pad Numbers, I/O Module Primary Side

CONNECTOR SPECIFICATIONS
The IDT Mobile WinChip Processor Module connector is a surface mount, 0.6 mm pitch, 280-pin connector. Table 3 describes the connector specifications in detail.

Table 3. Connector Specifications


Parameter Material Electrical Condition Contact Housing Current Voltage Insulation Resistance Termination Resistance Capacitance Mating Cycles Connector Mating Force Contact Un-mating Force Specification Copper Alloy Thermo Plastic Molded Compound: LCP 0.4A 50 VAC 100M min. @ 500 VDC 20M max. @ 20mV open circuit with 10 mA 5pF max. Per contact 50 cycles 0.9N (90gf) max. Per contact 0.1N (10gf min. Per contact
4268 tbl 3

Mechanical

IDT MOBILE WINCHIP PROCESSOR MODULE

INFORMATION

ORDERING INSTRUCTIONS
IDT XXXXX Device Type X Power X Speed X Package X Process/ Temperature Range Blank Commercial (0C to +55C)

280-Position MMC-1 Connector

180 200

Processor Core Frequency (MHz)

Standard Power

7M9602
4268 drw 3