LI lithography G built-up of a metal structure A replication by micro-moulding

Implementation of step-like sidewalls using a multiple exposure technique

Materials tailored to the individual function in application - Cu, Au electrical conductors - Ni, Fe softmagnetic materials - Polymers, ceramic materials insulators Flexible geometry (no restriction to specific crystallographic planes) High lateral precision (small shrinkage) 0.5 m Smooth structure at the side walls (roughness < 50 nm, optical quality) Very high aspect ratio 1 : 100 Moulding possible directly on the Si wafer Independent of the substrate Useful for low-cost mass production Reduction of fabrication costs by a simultaneous implementation of many elements Disadvantage: for fabrication of complex components micro mounting necessary; no possibility to implement electronic circuits; structures in the range 0.1 m down to few nm cannot be implemented