24-Bit Analog-to-Digital Converter For Bridge Sensors: Features Description

Input
Mux
DS ADC
REFP REFN
PGA
Gain =
1, 2, 64, or 128
CAP DVDD
DGND AGND A1/TEMP
(1)
A0
NOTE: (1) A1 for ADS1234, TEMP for ADS1232.
AINP1
AINN1
AINP2
AINN2
AINP3
AINN3
AINP4
AINN4
ADS1234
Only
SCLK
SPEED
DRDY/DOUT
PDWN
GAIN [1:0]
AVDD
CAP
External Oscillator
Internal Oscillator
CLKIN/XTAL1 XTAL2
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DVDD
DGND
CLKIN/XTAL1
XTAL2
DGND
DGND
A1
A0
CAP
CAP
AINP1
AINN1
AINP3
AINN3
DRDY/DOUT
SCLK
PDWN
SPEED
GAIN1
GAIN0
AVDD
AGND
REFP
REFN
AINP2
AINN2
AINP4
AINN4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
ADS1234
DVDD
DGND
CLKIN/XTAL1
XTAL2
DGND
DGND
TEMP
A0
CAP
CAP
AINP1
AINN1
DRDY/DOUT
SCLK
PDWN
SPEED
GAIN1
GAIN0
AVDD
AGND
REFP
REFN
AINP2
AINN2
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
ADS1232
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Time (Reading Number)

O
u
t
p
u
t
C
o
d
e
(
L
S
B
)
6
5
4
3
2
1
1
2
3
4
5
6
200 400 600 800 1000 0
PGA = 1
Data Rate = 10SPS
O
u
t
p
u
t
C
o
d
e
(
L
S
B
)
25
20
15
10
5
0
5
10
15
20
25
200 400 600 800 1000 0
PGA = 128
Data Rate = 10SPS
Output Code (LSB)
O
c
c
u
r
r
e
n
c
e
300
250
200
150
100
50
0
4 2 0 2 4
PGA = 1
Data Rate = 10SPS
Output Code (LSB)
O
c
c
u
r
r
e
n
c
e
100
90
80
70
60
50
40
30
20
10
0
16 16 8 0 8
PGA = 128
Data Rate = 10SPS
O
u
t
p
u
t
C
o
d
e
(
L
S
B
)
22.5
17.5
12.5
7.5
2.5
2.5
7.5
12.5
17.5
22.5
200 400 600 800 1000 0
PGA = 1
Data Rate = 80SPS
O
u
t
p
u
t
C
o
d
e
(
L
S
B
)
70
50
30
10
10
30
50
70
200 400 600 800 1000 0
PGA = 128
Data Rate = 80SPS
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Output Code (LSB)
O
c
c
u
r
a
n
c
e
180
160
140
120
100
80
60
40
20
0
12 6 12 6 0
PGA = 1
Data Rate = 80SPS
Output Code (LSB)
O
c
c
u
r
a
n
c
e
50
45
40
35
30
25
20
15
10
5
0
40 20 0 20 40
PGA = 128
Data Rate = 80SPS
Offset Drift (nV/ C)
-
6
0
0
-
5
0
0
-
4
0
0
-
3
0
0
-
2
0
0
-
1
0
0 0
1
0
0
2
0
0
3
0
0
4
0
0
5
0
0
6
0
0
35
30
25
20
15
10
5
0
C
o
u
n
t
s
PGA = 1
Data Rate = 10SPS
90 Samples from 3 Lots
-
5
0
0
-
4
0
0
-
3
0
0
-
2
0
0
-
1
0
0 0
1
0
0
2
0
0
3
0
0
4
0
0
5
0
0
35
30
25
20
15
10
5
0
C
o
u
n
t
s
PGA = 1
Data Rate = 10SPS
Gain Drift (ppm/ C)
-
1
.
2
-
1
.
1
-
1
.
0
-
0
.
9
-
0
.
8
-
0
.
7
-
0
.
6
-
0
.
5
-
0
.
4
-
0
.
3
-
0
.
2
-
0
.
1 0
0
.
1
0
.
2
0
.
3
0
.
4
0
.
5
0
.
6
0
.
7
0
.
8
0
.
9
1
.
0
1
.
1
1
.
2
18
16
14
12
10
8
6
4
2
0
C
o
u
n
t
s
PGA = 1
Data Rate = 10SPS
Gain Drift (ppm/ C)
-
1
.
0
-
0
.
9
-
0
.
8
-
0
.
7
-
0
.
6
-
0
.
5
-
0
.
4
-
0
.
3
-
0
.
2
-
0
.
1 0
0
.
1
0
.
2
0
.
3
0
.
4
0
.
5
0
.
6
0
.
7
0
.
8
0
.
9
1
.
0
20
18
16
14
12
10
8
6
4
2
0
C
o
u
n
t
s
PGA = 1
Data Rate = 10SPS
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-
5
0
-
4
0
-
3
0
-
2
0
-
1
0 0
1
0
2
0
3
0
4
0
5
0
30
25
20
15
10
5
0
C
o
u
n
t
s
PGA = 128
Data Rate = 10SPS
-
3
0
-
2
5
-
2
0
-
1
5
-
1
0
-
5 0 5
1
0
1
5
2
0
2
5
3
0
20
18
16
14
12
10
8
6
4
2
0
C
o
u
n
t
s
PGA = 128
Data Rate = 10SPS
Gain Drift (ppm/ C)
0
0
.
5
1
.
0
1
.
5
2
.
0
2
.
5
3
.
0
3
.
5
4
.
0
4
.
5
5
.
0
25
20
15
10
5
0
C
o
u
n
t
s
PGA = 128
Data Rate = 10SPS
Gain Drift (ppm/ C)
0
0
.
5
1
.
0
1
.
5
2
.
0
2
.
5
3
.
0
3
.
5
4
.
0
4
.
5
5
.
0
5
.
5
6
.
0
20
18
16
14
12
10
8
6
4
2
0
C
o
u
n
t
s
PGA = 128
Data Rate = 10SPS
Temperature (_C)
O
f
f
s
e
t
(
n
V
)
1000
500
0
500
1000
110 50 30 10 10 30 50 70 90
PGA = 128
Data Rate = 10SPS
Temperature (_C)
G
a
i
n
E
r
r
o
r
(
%
)
0.04
0.03
0.02
0.01
0
0.01
0.02
110 50 30 10 10 30 50 70 90
PGA = 128
Data Rate = 10SPS
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V
IN
(V)
R
M
S
N
o
i
s
e
(
n
V
)
1000
900
800
700
600
500
400
300
200
100
0
2.5 2.5 2.0 1.5 0.5 1.0 1.0 0 0.5 1.5 2.0
PGA = 1
Data Rate = 10SPS
V
IN
(mV)
R
M
S
N
o
i
s
e
(
n
V
)
50
45
40
35
30
25
20
15
10
5
0
19 19 14.25 9.5 4.75 4.75 0 9.5 14.25
PGA = 128
Data Rate = 10SPS
V
IN
(V)
I
N
L
(
p
p
m
o
f
F
S
R
)
I
N
L
(
V
)
5
4
3
2
1
0
1
2
3
4
5
25
20
15
10
5
0
5
10
15
20
25
2.5 2.5 2.0 1.5 0.5 1.0 1.0 0 0.5 1.5 2.0
PGA = 1
V
IN
(mV)
I
N
L
(
p
p
m
o
f
F
S
R
)
I
N
L
(
n
V
)
10
8
6
4
2
0
2
4
6
8
10
390.625
312.5
234.375
156.25
78.125
0
78.125
156.25
234.375
312.5
390.625
19 19 14.25 9.5 4.75 4.75 0 9.5 14.25
PGA = 128
Temperature (_C)
A
n
a
l
o
g
C
u
r
r
e
n
t
(
A
)
2000
1600
1200
800
400
0
110 50 30 10 10 30 50 70 90
Normal Mode, PGA = 64, 128
Temperature (_C)
D
i
g
i
t
a
l
C
u
r
r
e
n
t
(
A
)
120
100
80
60
40
20
0
110 50 30 10 10 30 50 70 90
Sleep Mode, All PGAs
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Temperature (_C)
D
a
t
a
R
a
t
e
(
S
P
S
)
10.06
10.01
9.96
9.91
9.86
110 50 30 10 10 30 50 70 90
SPEED = LOW
CLKIN/XTAL1 = LOW (Internal Oscillator)
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A0 A1
AINP
AINP1
AINN1
AINP2
AINN2
AINP3
AINN3
AINP4
AINN4
10I 1I
1X 8X
AINN
ADS1232 Only
AVDD
ADS1234 Only
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Z
EFF
+
1
2f
MOD
C
BUF
R
INT
R
INT
R
F1
R
1
R
F2
ADC A3
Gain of 1 or 2
CAP
AINP
AINN
CAP
A2
A1
450W
18pF
450W
18pF
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Z
EFF
+
1
(2)(76.8kHz)(13fF)
+500MW
CLK_DETECT
Internal
Oscillator
MUX
To ADC
S
S0 S1
EN
Crystal
Oscillator
CLKIN/XTAL1
XTAL2
AVDD
(1) f
MOD
= 76.8kHz
Z
EFF
= 500M
(1)
VREFP VREFN
AVDD
ESD
Protection
C
BUF
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Frequency (kHz)
G
a
i
n
(
d
B
)
0
20
40
60
80
100
120
140
160
180
200
38.4 76.8 0
f
CLK
= 4.9152MHz
Frequency (Hz)
G
a
i
n
(
d
B
)
0
50
100
150
0 10 20 30 40 50 60 70 80 90 100
(a)
Frequency (Hz)
(b)
G
a
i
n
(
d
B
)
50
100
150
49 48 46 47 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
Data Rate = 10SPS
Data Rate = 10SPS
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A1 or A0
t
1
DRDY/DOUT
t
S
Toggled TEMP Pin or Abrupt Change in External V
IN
V
IN
DRDY/DOUT
Start of
conversion.
1st conversion;
includes
unsettled V .
IN
2nd conversion;
V settled, but
IN
digital filter
unsettled.
3rd conversion;
V settled, but
IN
digital filter
unsettled.
4th conversion;
V settled, but
IN
digital filter
unsettled.
5th conversion;
V and digital
IN
filter both
settled.
Conversion
Time
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DRDY/DOUT 23 22 21
1 24
0
LSB MSB
Data
Data Ready
SCLK
t
2
t
7
t
3
t
3
t
6
New Data Ready
t
4
t
5
23
1 24 25
22 21 0
Data
25th SCLK to Force DRDY/DOUT High
Data Ready New Data Ready
DRDY/DOUT
SCLK
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23 DRDY/DOUT
SCLK 1 24
t
8
25 26
23 22 21 0
Data Ready After Calibration
Calibration Begins
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DRDY/DOUT 23 22 21
1 24
0 23
SCLK
Standby Mode
Start Conversion
Data Ready
t
9
t
10
t
11
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Standby Mode
Begin Calibration
Data Ready After Calibration
t
10
t
12
DRDY/DOUT 23
1 24 25
22 21 0 23
SCLK
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AVDD
DVDD
PDWN
m 10 s
DVDD
(1)
Connect to
ADS1232/34
pin PDWN
1kW
2.2nF
NOTE: (1) AVDD must be powered up at least
10 s before goes high. m PDWN
Data Ready
Start
Conversion
DRDY/DOUT
SCLK
CLK Soure
Wakeup Power-Down Mode
PDWN
t
13
t
11
t
14
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NoiseFree Counts +

2
(18.4)1)
10mV
39mV
+ 177, 385
NoiseFree Counts +

2
BIT
Eff
FS
LC
FS
AD
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ADS1232
16
9
10
11
12
14
13
15
20
19
24
23
22
4
3
21
8
7
REFP
CAP
CAP
AINP1
AINN1
AINP2
AINN2
REFN
GAIN0
AVDD DVDD
AGND DGND
DRDY/DOUT
SCLK
PDWN
XTAL2
CLKIN/XTAL1
SPEED
A0
TEMP
0.1 F m
0.1 F m
5V 3V
GAIN1
+ -
17 2, 5, 6
18 1
MSP430x4xx
or Other
Microprocessor
VDD
GND
Gain = 128
ADS1232
16
9
10
11
12
14
13
15
20
19
24
23
22
4
3
21
8
7
REFP
CAP
CAP
AINP1
AINN1
AINP2
AINN2
REFN
GAIN0
AVDD DVDD
AGND DGND
DRDY/DOUT
SCLK
PDWN
XTAL2
CLKIN/XTAL1
SPEED
A0
TEMP
0.1 F m
0.1 F m
5V 3V
GAIN1
17 2, 5, 6
18 1
MSP430x4xx
or Other
Microprocessor
VDD
GND
Gain = 128
R
1
50kW
REF1004- 2.5V
2
1
Thermocouple Type k
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ADS1232
16
9
10
11
12
14
13
15
19
20
24
23
22
4
3
21
8
7
REFP
CAP
CAP
AINP1
AINN1
AINP2
AINN2
REFN
GAIN1
AVDD DVDD
AGND DGND
DRDY/DOUT
SCLK
PDWN
XTAL2
CLKIN/XTAL1
SPEED
A0
TEMP
0.1 F m
0.1 F m
5V 3V
GAIN0
17 2, 5, 6
18 1
MSP430x4xx
or Other
Microprocessor
VDD
GND
Gain = 2
R
1
50kW
REF1004- 2.5V
2
1
Thermocouple Type k
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ADS1232
16
9
10
14
11
13
12
15
20
19
24
23
22
4
3
21
8
7
REFP
CAP
CAP
AINP2
AINP1
AINN2
AINN1
REFN
GAIN0
AVDD DVDD
AGND DGND
DRDY/DOUT
SCLK
PDWN
XTAL2
CLKIN/XTAL1
SPEED
A0
TEMP
0.1 F m
0.1 F m
5V 3V
GAIN1
17 2, 5, 6
18 1
MSP430x4xx
or Other
Microprocessor
VDD
GND
Gain = 128
R
1
33kW
R
2
33kW
R
L
R
L
R
L
RTD
NOTE: R is lead resistance. L
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DRDY/DOUT
SCLK
23 22 21 0
MSB LSB
1 24
DRDY/DOUT
SCLK
23 22 21 0
1 24 25
DRDY/DOUT
SCLK
23 22 21 0
1 24 25 26
Calibration Begins
Data Ready
After Calibration
DRDY/DOUT
SCLK
Data Ready
Start
Conversion
Standby Mode
23 22 21 0
1 24
DRDY/DOUT
SCLK
23 22 21 0
1 24 25
Data Ready
After Calibration
Calibration Begins
(a) Data Retrieval
(b) Data Retrieval with DRDY/DOUT Forced High Afterwards
(c) OffsetCalibration Timing
(d) Standby Mode/Single Conversions
(e) Standby Mode/Single Conversions with Offset Calibration
Standby Mode
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PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
ADS1232IPW ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
ADS1232IPWG4 ACTIVE TSSOP PW 24 60 Green (RoHS &
no Sb/Br)
ADS1232IPWR ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br)
ADS1232IPWRG4 ACTIVE TSSOP PW 24 2000 Green (RoHS &
no Sb/Br)
ADS1234IPW ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br)
ADS1234IPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br)
ADS1234IPWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br)
ADS1234IPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 3-Apr-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
ADS1232IPWR TSSOP PW 24 2000 330.0 16.4 6.95 8.3 1.6 8.0 16.0 Q1
ADS1234IPWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ADS1232IPWR TSSOP PW 24 2000 346.0 346.0 33.0
ADS1234IPWR TSSOP PW 28 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
MECHANICAL DATA

MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
M 0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
20 16
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
08
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153

24-Bit Analog-to-Digital Converter For Bridge Sensors: Features Description

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24-Bit Analog-to-Digital Converter For Bridge Sensors: Features Description

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