The Effect of Solution Type, Concentration, Cell Voltage, and Electrode Size on the

Efficiency of Electroplating Copper onto Brass

Kenneth Braggs and Daniel Havern
Macomb Mathematics Science and Technology Center
AP Chemistry / Interdisciplinary Studies / AP Calculus 12B
Mrs. Hilliard, Mrs. Cybulski, Mr. Acre, and Mrs. Tallman
5 December 2014

The Effect of Solution Type, Concentration, Cell Voltage, and Electrode Size on the
Efficiency of Electroplating Copper onto Brass
Cellphones and computers play an enormous role in world today; they are used
for communication, work, and entertainment. But not everyone can afford these
expensive technologies because of the rather costly electroplated circuitry and electrical
components of the technology. Industries electroplate circuit boards and other
components to increase conductivity, durability, and anti-corrosiveness while maintaining
a light weight. The purpose of this research was to find the most efficient method of
electroplating copper onto brass, thus reducing the cost for all parties.
The method of experimentation was developed after an extensive amount of
research. A petri dish was filled with a specific amount of electrolyte solution. Electrodes
were washed, massed, and connected to a DC ammeter, which supplied and measured
voltage. The electrodes were submerged in the solution and the ammeter was turned on.
After running the current for five minutes, the electrodes were detached, washed, and
massed. The difference in mass of the electrodes was calculated and analyzed.
In order to analyze the data, a four factor DOE (Design of Experiment) was
completed. The hypothesis developed was the cell consisting of the copper (II) sulfate
solution, 1.0 molarity, 12.0 voltage, and the 1.5 electrode lengths (+,+,+,+) would
produce the greatest mass of copper plated. The hypothesis was rejected because analysis
concluded copper II chloride (CuCl2) solution, 1.0 molarity, 12.0 voltage, and 1.5
electrode lengths (-,+,+,+) produced the greatest mass of copper electroplated.

This research can be applied to reap real world benefits, utilizing the most
efficient method of electroplating would save a company resources and time, thus saving
money for both the producers and consumers.
Table of Contents
Introduction..............................................................................................................1
Review of Literature................................................................................................3
Problem Statement...................................................................................................9
Experimental Design..............................................................................................10
Data and Observations...........................................................................................12
Data Analysis and Interpretation............................................................................17
Conclusion.............................................................................................................26
Appendix A: Calculator Randomization................................................................31
Appendix B: Preparing Electrolyte Solutions........................................................32
Appendix C: Prediction Equations.........................................................................33
Works Cited

34

Braggs Havern 1
Introduction
From silver covered spoons, to gold covered firearms, and even copper covered
computer circuits, electroplating can be found all over the world given todays
technology. Electroplating is defined as the coating of a conductive metal by utilization of
electrolytic deposition. In simpler terms, electroplating is coating one metal with another
by usage of electrical charges. Electroplating, since its invention in 1805 by Italian
inventor Luigi Brugnatelli, has become a staple in the industrial world (Mittal).
Electroplating is found relevant in fields of circuitry, engineering, silverware, and even
jewelry. Electroplating can be conducted for a variety of reasons however in most
situations electroplating is done for the alteration of appearance, for protection, or for
desired properties in an object.
As stated above, electroplating can be used in the fields of jewelry and silverware,
chiefly an alteration in the appearance of a material. In some instances, a manufacturer
will use a cheaper or stronger metal as the base and simply plate the object with a desired
finish to give the appearance of another more valuable metal. In engineering, protective
properties are beneficial. For example, sometimes items are nickel plated because of its
anticorrosive properties. In circuitry, items are subject to electroplating to gain a special
electrical conductive capability. For example, a manufacturer may want to build a circuit
board with components of brass, however, the circuits themselves needs to be more
conductive; copper is applied to add this conductivity. The previously mentioned uses of
electroplating help make the electroplating process practical for industry because
factories are able to use cheaper, or at times better, metals for the base while simply
coating the outside for a protective or pretty finish (Mittal).

Braggs Havern 2
In this experiment, the main objective was to explore which combination of
factors, solution type, molarity voltage, and electrode size, produced the most efficient
method of electroplating. Using prior experiments and research on the topic, a new and
effective experiment was developed in order to analyze certain factors that affect the
electroplating process. Copper electroplating was chosen because many companies use
copper as a metal for electroplating. Copper is used for its strong conductivity, durability,
and anti-corrosive properties while maintaining a light weight and fairly cheap cost. In
many circuits and circuit boards, brass is plated with a thin coating of copper for these
properties (Rebecca). For the experiment, unique electrolytic cells were carefully
designed and created, each with varying factors of solution, molarity, cell voltage, and
electrode size. The electrodes were connected to a DC ammeter and submerged into an
electrolytic solution for five minutes. The difference in the mass of each electrode was
calculated in order to find how much copper was electroplated onto the brass. The results
for the cells were analyzed individually and collectively to determine the best electrolytic
cell design. This method was chosen because it provided an easy yet reliable method for
determining the mass of copper electroplated.
The analysis found information from this experiment can be capitalized upon by
industrial electroplating companies in order to make use of a more efficient electroplating
process, which in turn will save time and money. These savings for electroplating
companies are then reflected in the pricing for consumers.

Review of Literature

Braggs Havern 3
Electroplating is defined as the coating of one conductive metal onto another by
utilization of electrolytic deposition. In other words, electroplating is coating one metal
onto another using electrical charge. Since its invention in 1805 by Italian inventor Luigi
Brugnatelli, electroplating has become a staple in the modern industrial world
(Helmenstine). Electroplating is found extremely useful in many fields of work all over
the world. One of the most common applications of electroplating is in computer
circuitry. Circuits and circuit boards in computers and mobile devices need to be light, yet
they need to be conductive, strong and anti-corrosive (Rebecca). Circuit boards need to
be electroplated for these properties, and the process is expensive. Finding the method
that provides all of these properties and is most efficient method of electroplating would
benefit producers and consumers alike.
To achieve a better understanding of this electroplating process, one must first
understand the electrolytic cell and oxidation-reduction (redox) reactions. In an
electrolytic cell the reaction that occurs is spurred by an electric current unlike other
methods of electrochemistry. Such a current helps to instigate the creation of two half
cells the cathode and the anode, unlike the names suggest the charges are actually flipped
and are named such because of what they attract rather than what they are. Both of the
half cells are placed in an electrolyte solution, a substance that helps ionize the metals.
The electrolyte solution is usually dependent upon the metal that will be plating the
object for example, this experiment tests different salts of copper as the electrolyte in the
solutions.
When the cells are immersed in the solution, the process begins. The anode or the
metal used for plating is oxidized, therefore losing electrons. Meanwhile, the cathode or

Braggs Havern 4
the object being plated is reduced, consequently gaining electrons. As it is well known in
the field of physics, opposites attract hence, the ions from the anode are attracted to the
cathode and are plated to the metal. In other words, the metal ionizes in the electrolyte
solution. The current brings the ions from the anode, therefore depositing these ions onto
the other metal, the cathode (Zoski). This process is diagrammed below.

Figure 1. Electroplating Experiment

Figure 1 above shows the process of electroplating copper onto brass. The
diagram clearly expresses the explanation that follows; as stated above, the copper anode
is connected to the positive terminal of the battery while the brass cathode is attached to
the negative terminal. The electrons produced from the battery travel through the copper
electrode and oxidize it. These oxidized copper atoms are released into the electrolyte
solution. As they travel in the solution, electrodes flow to the cathode in order to
complete the circuit. Along with the electrons, the attached oxidized copper atoms travel
to the brass cathode. These copper ions are then reduced at the brass cathode, meaning
the electrons leave the copper and move to the brass. The brass is thus plated onto the
copper (Mittal). In essence, copper ions are deposited on the brass electrode as the
electrons travel through the cell.

Braggs Havern 5
This reaction between the electrons and the metal electrodes can be modeled
through a reaction equation. Half reactions explain what is happening at each electrode of
the cell, the anode and the cathode. These half reactions are seen below.
Oxidation (anode):
Reduction (cathode):

Cu(s) Cu2+(aq) + 2e
Cu2+(aq) + 2e Cu(s)

These reactions illustrate the reaction between ions and electrons. The oxidation equation
shows how the solid copper electrode is oxidized into an aqueous copper ion and two
electrons in the electrolyte solution. The reduction equation shows the reversal, or how
the electrons reduce the aqueous copper ion into a solid again (Briones).
There are a multitude of different methods and experiments used for
electroplating. This research experiment is labeled as electroplating metals with an
electrolytic cell. Essentially, the metals, anode and cathode separately, are connected to a
power source and placed into an electrolyte solution. This creates an electrolytic cell
suitable for electroplating one metal onto another.
This experiment was developed from a selection of other electroplating processes
and procedures. Prior research was used to develop the experimental design and to
improve upon these previous research concepts in the field. The Vernier Software and
Technology experiment played a large role in the design of this experiment. Vernier used
a DC Power source and acidic electrolyte solution. This acidic electrolyte solution,
CuSO4 in H2SO4, was used with the intention of ionizing the metal at a quicker pace than
non-acidic counterparts. This portion of the experiment was not used because of
limitations with the variation of electrolyte solutions.
Another simplistic experiment using a battery revealed that voltage of the cell, or
rather amplitude of the current, can play a big role in the speed at which the

Braggs Havern 6
electroplating process is completed (Electroplating: Copper-Plated Key). Amplitude is the
rate at which the electrons are passed through the cell. Quite simply, an increase in
amplitude results in more electrons passing through the electrode and the solution, more
of the metal ionizes, and a greater amount of ions are plated. The DC ammeter was the
tool used to adjust the voltage of the cell for each experiment, and by adjusting the
voltage, the amplitude was in turn altered.
Not all experiments were as simple as batteries attached to wires. Other
experiments involved very complex practices. These processes were the industrial
applications of electroplating (Osborne). Limitations of space and cost restricted
replication, but useful information was still drawn from these because these sources
provided information about the electrolyte solutions and the metals themselves. Although
dependent upon the item being plated, the size of the electrode does impact the
electroplating process. Put simply, a larger electrode has more surface area that can used
for plating therefore, there were more ions plated onto the cathode, Brass. More
importantly, all of these sources highlighted the idea that the electrolyte solution should
ionize the metals easily (The Industrial). For example, this research experiment utilizes
copper solutions, such as copper II sulfate and copper chloride, to ionize the copper
metal. Not only do the solutions affect the ability to electroplate, but the concentration of
the solution does also. Greater concentration means more available ions and a greater
amount of electroplated metal. Although, utilization of a large molarity appeared as an
ideal solution, the research was limited by materials so the molarities used were smaller
than they could have been. In all, these experiments were altered and developed into the
4 factor DOE experiment used in this research.

Braggs Havern 7
Utilizing ample information from these sources, the variables of this experiment
were determined. Four possible experimental factors were determined very influential in
the electroplating process. A very credible source and most other sources determined
voltage applied, reagents, and concentrations of reagents, which can have a huge impact,
are a few of the most important factors (Lebeau). Copper and brass electrodes were
chosen for multiple reasons including: their use in circuitry, their ability to ionize easily
in certain solutions, and the acceptability of copper to be plated onto the brass. And most
importantly, the immense value of the conductivity of Copper. More so, copper is
malleable, making it an excellent choice metal materials used in circuit boards. In
addition, copper will not separate from other metals even when it is bent (Copper
Electroplating). Electrolyte solutions of copper II sulfate (CuSO4), copper II acetate
(Cu(C2H3O2)2), and copper II chloride (CuCl2) were used because of their ability to ionize
copper easily and their differences in ionic charges. Voltages of 6, 9, and 12 volts were
chosen because they are of equal interval, but without getting too small to not plate
significantly or getting too large to burn the metal. Electrode sizes of 0.5, 1.0, and 1.5
in length were chosen because they are of equal intervals and result in significant varying
sizes. Increasing the length of each electrode, consequently increased the surface area of
the entire electrode. Essentially, these variables were all chosen after in depth research
was conducted on the topic, and prior experiments and their variables were taken into
consideration.
Electroplating is a simple experiment, but can involve extremely complex
designs. There is a multitude of applications for electroplating from industrial to art
designs. Simple, complex, and extremely intricate experiments all influenced this

Braggs Havern 8
experiment and allowed the researchers to develop an experiment studying all factors that
seem to deeply impact electroplating.

Problem Statement
Problem Statement:

Braggs Havern 9
What combination of the molarity of the solution, type of solution, voltage of cell,
and size of the electrodes will have the greatest effect on the efficiency of copper
electroplating?
Hypothesis:
It is believed that a solution of copper (II) sulfate at a molarity of 1M, with a
voltage of 12 V, and the largest size of the electrode, will provide the most efficient form
of copper electroplating.
Data Measured:
The variables concentration (M) 0.50 M, 0.75 M, 1.0 M, solution type, copper (II)
sulfate, copper (II) acetate, copper (II) chloride, voltage (V), 3.6V, 9V, 14.4 V, and
electrode size (cm), 0.5, 1.0, 1.5, as the independent variables for the trials. The
results of the experiment were mass of the dry electroplated electrodes in grams (g)
which demonstrated the amount of copper that has plated the brass at the electrode. To
analyze the trials, a 4-Factor DOE consisting of 19 total trials was conducted. This test
was appropriate because it simultaneously considers the multiple factors within the test,
and interaction between such factors. In addition, the 4 Factor DOE allows for prediction
of further experimentation.

Experimental Design
Materials:
(6) Brass strip (6"x1/2"x0.01")
(6) Copper strip (6"x1/2"x0.01")

Steel wool
Petri dish (100 mm x 15 mm)

Braggs Havern 10
250 ml beaker
50 ml Graduated Cylinder
Tongs
Balance (0.0001g)
DC Ammeter (Extech Digital DC Power
Supply)
Electrical wires with alligator clips
Metal shears
Distilled water (1 gal)
White Distilled Vinegar (16 oz)
Sodium chloride, NaCl (60 g)

1.00 M Copper (II) Sulfate (CuSO4)

electrolyte solution (160 ml)
0.50 M Copper (II) Sulfate (CuSO4)
electrolyte solution (160 ml)
0.75 M Copper (II) Acetate
(Cu(C2H3O2)2) electrolyte
solution (120 ml)
1.00 M Copper (II) Chloride (CuCl2)
electrolyte solution (160 ml)
0.50 M Copper (II) Chloride (CuCl2)
electrolyte solution (160 ml)

Braggs Havern

Procedures:
1.

Cut brass and copper strips at the specified length called for according to the DOE
trial specifications (2.0, 1.5, or 1.0) using the metal shears. Be careful with the
sharp metal. Clean the brass piece and the copper piece by scrubbing lightly with
steel wool.

2.

Mix 3 g sodium chloride (NaCl) with 15 mL of vinegar in a 250 mL beaker, only

if solution is not already made. Wash both the copper piece and the brass piece
with this solution by scrubbing again lightly. Rinse metals with distilled water and
dry. From this point on until disposal, only touch metals using clean metal tongs.

3.

Once clean and dry, measure and record the mass of each the copper and the brass
pieces separately using the precision scale.

4.

Measuring accurately using the graduated cylinder, pour 40 ml of the specific

electrolyte solution into petri dish. Electrolyte solution is based upon selected
DOE trial (See Appendix A).

5.

Plug in and set the DC Ammeter (Extech Digital DC Power Supply) to the
specific voltage called for based on the specific DOE trial. Connect the alligator
clips and set aside with easy access for later.

6.

Connect alligator wires to anode (brass and negative terminal) and cathode
(copper and positive terminal) respectively. Make sure the anode and cathode are
connected to the correct terminals of the power source.

7.

Submerge anode and cathode into electrolyte solution at opposite end of the petri
dish. Make sure as much as possible of the metal pieces are submerged in the
solution. The alligator clips can be attached the petri dish, pinching the metal to
the side wall. Do not submerge the clips into the electrolyte solution.

8.

Turn on the DC Ammeter. After 5 minutes, turn off power source and pull
alligator clips with metal pieces from electrolyte solution. Remove alligator clips
from electrodes.

9.

Rinse the electrodes with distilled water and dry. Measure and record the mass of
each individual metal piece.

10.

Dispose of electrolyte solution as directed according to MSDS sheet for specific

chemical. Clean the petri dish and the alligator clips with distilled water also.

11.

Repeat steps 2-10 for each DOE trial run each day.

Diagram:

Braggs Havern

DC Ammeter

Wires with Alligator Clips

Petri Dish with Electrolyte Solution

Figure 2. Experimental Setup

Figure 2 above shows the setup for the electroplating portion of the experiment.
As clearly seen above, the electrodes, copper and brass pieces, are submerged in the
electrolyte solution and connected to the power source. The reaction will run for about 5
minutes.

Data and Observations

Table 1
DOE Independent Factors and Levels
+
Standard
CuSO4
Cu(C2H3O2)2
CuCl2
Solution
1.00
0.75
0.50
Molarity (M)
12
9
6
Voltage (V)
1.5''
1.0''
0.5''
Electrode Size
Table 1 above shows the independent factors of this experiment, including the
levels at which these factors were administered to the solution and electrodes. Solutions
of copper II sulfate, (CuSO4), copper II acetate, (Cu(C2H3O2)2), and copper II chloride,

Braggs Havern
(CuCl2), were ordered based on their charges once ionized. Molarity was determined as
1.00 M, 0.75 M, and 0.50 M. The voltage is the total voltage of the electrolytic cell, as set
using the DC ammeter. The electrode size refers to the size of each the copper and the
brass electrode. The lengths in Table 1 refer to the length the metal was cut, knowing the
metals have the same height and width. The following photographs show the
experimental process for each trial.

DC Ammeter

Wires with Alligator Clips

Petri Dish with Electrolyte Solution

Figure3. Experimental Setup
Figure 3 above shows the experimental setup for each trial. As seen, the Petri dish
is filled with a specific electrolyte solution. The wires are attached to both the DC
ammeter and the metals respectively. No changes were visible from this point of view.
Alligator Clips
Electrodes
Petri Dish
Electrolyte Solution

Figure 4. Electroplating of Metals

Figure 4 above shows the electrodepositing of copper onto the brass electrode. As
seen, the portion of the brass that is submerged in the electrolyte solution has turned the

Braggs Havern
color of copper. At a closer glance, the copper is protruding from the side of the metal; in
other words, it is plating so much that it is mounding off of the brass.
Brass Electrode

Electroplated Copper

Copper Electrode
Figure 5. Finished Metals
Figure 5 above shows the metal pieces after they have been electroplated. The
metal on the left is the copper and the metal on the right, surrounded by the wet paper
towel, is the brass. As seen the copper has totally plated the portion of the brass that was
submerged in the solution. Once dry, these metals were massed and the change in mass
was calculated to determine which factors were significant in the electroplating process.
Table 2
First DOE Data
DOE Factors
Copper (g)
Brass (g)
DOE
Electrode
Trial
Solution
M V
Mas
Size
Initial Final Mass Initial Final
s
0.455
0.7
- 0.378 0.381
Cu(C2H3O2)2
9
1.0''
0.4540
0.0030
1
5
0.0013
1
1
3
0.596
1.0
- 0.497 0.517
CuSO4
12
1.5''
0.5785
0.0200
2
0
0.0180
3
3
5
CuSO4
0.312
1.0
- 0.246 0.258
12
0.5''
0.2990
0.0119
3
0
0.0139
8
7
9
CuSO4
0.599
1.0
0.485 0.494
1.5''
0.5880 -0.0115
0.0094
4
6
0
2
6
5
CuSO4
0.299
1.0
- 0.231 0.239
0.5''
0.2930
0.0077
5
6
0
0.0062
6
3
2
CuSO4
0.569
0.5
- 0.489 0.503
12
1.5''
0.5567
0.0139
6
0
0.0130
5
4
7
CuSO4
0.287
0.5
- 0.236 0.243
12
0.5''
0.2744
0.0064
7
0
0.0131
6
0
5

Braggs Havern

8
9

CuSO4
CuSO4

10

Cu(C2H3O2)2

11

CuCl2

12
13
14
15
16
17
18
19

CuCl2
CuCl2
CuCl2
CuCl2
CuCl2
CuCl2
CuCl2
Cu(C2H3O2)2

0.5
0
0.5
0
0.7
5
1.0
0
1.0
0
1.0
0
1.0
0
0.5
0
0.5
0
0.5
0
0.5
0
0.7
5

1.5''

0.5''

1.0''

12

1.5''

12

0.5''

1.5''

0.5''

12

1.5''

12

0.5''

1.5''

0.5''

1.0''

0.593
8
0.280
2
0.425
8
0.601
7
0.311
5
0.617
9
0.304
2
0.599
2
0.299
3
0.598
4
0.451
3
0.455
4

0.5881
0.2768
0.4246
0.5952
0.3003
0.6028
0.2922
0.5886
0.2961
0.5961
0.4453
0.4551

0.0057
0.0034
0.0012
0.0065
-0.0112
0.0151
0.0120
0.0106
0.0032
0.0023
0.0060
0.0003

0.484
3
0.252
7
0.380
0
0.507
5
0.250
1
0.489
0
0.256
4
0.497
2
0.266
4
0.503
4
0.365
9
0.370
1

0.491
0
0.258
1
0.383
3
0.531
1
0.263
3
0.511
9
0.275
3
0.524
9
0.277
6
0.521
6
0.379
6
0.374
0

Table 2 above shows the raw data collected during the DOE. The DOE list
determines the four independent factors of the solution and metals. The 1st, 10th, and 19th
trials were the standards of the experiment. All of the other electrolytic cells had varying
factors of solution, molarity, voltage, and electrode size. Not shown above due to spacing
issues, the trials were run in random order; see Appendix A. Each day tests were run, the
change in mass was calculated. This change in mass was calculated by simply subtracting
the final mass from the initial mass. It is important to note, as seen above, that each trial
included the copper electrode losing mass and the brass electrode gaining mass. The
change in mass of the brass electrode was used to determine the effect of each factor.
Table 3
DOE Observations
Trial

Observations

0.0067
0.0054
0.0033
0.0236
0.0132
0.0229
0.0189
0.0277
0.0112
0.0182
0.0137
0.0039

Braggs Havern
Run
Ord
er
1
2
3
4
5
6
7

8
9
10
11
12
13
14
15

16
17

Solution not completely dissolved in the bottom of beaker.

After electroplating, purplish tint to the metals.
Copper II chloride beaker was spilled. Meta was coated with a
white tint. In all, trial was ran well.
Solutions mixed for 2 minutes prior. Brass electrode seems
smaller, even though they're supposed to be the same.
Solution was very cloudy, but circled around electrodes after
trial was run for some time.
Timer may have been started a moment early. Solution is not
completely dissolved. Trial run well.
Solution was completely dissolved before even prepping
solution. Metal was almost completely coated. Again, metal
has a whitish coating.
Solution seemed to settle before trial began. Voltage was
slightly fluctuating before it settled at 12.0 volts.
Petri dish was not completely dry when solution was poured
into it. Metals were stuck to side of dish after plating, Extra
effort used to remove them. Again, metals produced a white
coating.
Small portion of the alligator clips were inserted into the
solution and plated as well. Other than that, trial was run
well.
The solution of copper II acetate was not completely
dissolved. Again, the clips were submerged in the solution
and took on some of the plating.
Metals were coated with an extremely white coating. Trial was
run extremely well otherwise.
Clips were plated again. Metals maintained the white finish
after the electroplating.
Metals appear to be burned around the edges. The copper ion
built up around the edge of the brass, and some fell off when
attempting to remove metals from petri dish.
The edges of the metals may be slightly burned. The solution
produced a hyperbolic shape with the ions within it.
Some of the solution was spilled out of the dish when
transferring from graduated cylinder to Petri dish. Metals had
somewhat of a white finish.
Solution is regularly blue, but this trial was completed with a
green solution formed around the cathode. Metals again had
a white plating finish.
There was a significant amount of solid chemical at the
bottom of the solution once in the Petri dish. The metals were
not placed directly across from one another. There was a
semicircle around the cathode of the cell.
The alligator clips took on some of the plating again. Pattern
created again at the bottom of the solution, but not as

Braggs Havern

18

apparent as other trials.

Trial was run extremely well, due to the expertise of the
researchers. The metals again had a white finish at the end of
the plating process.

Trial
Run
Ord
er

Observations

19

There was a significant amount of solid copper II acetate not

dissolved in the solution, even though the solution was mixed
for 3 minutes prior. Metals finished with a purplish tint.

Table 3 above shows the observations recorded during the electroplating DOE.
Trial number describes which combination of solution and metals were used in that
specific experiment, and trial run order describes the order in which the trials were run as
a byproduct of the randomization. As seen in the table above, there were only a few
reoccurring problematic themes in the experiment. These included: solutions not
completely dissolving and ionizing, metals being plated a certain color or burned, or
anything that would have affected the outcome of the experiment. The copper II acetate
trials always produced a purple tint on the metals, which was not expected. In all, the trial
most trials were run fairly well with a minimal amount of inaccuracy through human
error.

Data Analysis and Interpretation

Braggs Havern
In this experiment the question tested was what effect molarity, solution type,
voltage and size of the electrode would have on the amount of copper plated upon the
brass. To test these effects the researchers used the method of a Four Factor Design of
Experiment (DOE). This test was deemed appropriate because the researchers considered
such factors influential on the amount of copper plated onto the brass. In an effort to
make the results of the experiment as valid as possible, two of the three the basics for a
good statistical experiment were utilized: control and randomization. The control group
(standard) was utilized to help reduce the effect of lurking variables, or variables that are
not controlled such as the voltage shifting. A control group lowers the effect of such
variables by giving a comparison for the trials where lurking variable affect each equally.
In the case of a DOE a group of standards with common results help to show trendless
data and provide evidence that trials are ran properly. Randomization of the trials helps to
lessen the effect of bias, or the systematic favoring of one outcome over another (Refer to
Appendix A). Bias is reduced by randomization because the researchers are less likely to
make a routine and go through the motions with the trials or even target a certain value
for the trial. In other words, the researcher would not attempt to target a specific number
just because that has occurred in previous trials. Randomization also helps reduce the
effects of lurking variables, those variables that are unnoticed but may impact the results.

Table 4
Chart of Averages
DOE
Solution
Trial
1
Standard

Molarity

Voltage

Standar

Standar

Electrode
Size
Standard

Mass
(g)
0.0030

Braggs Havern

2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19

d
d
+
+
+
+
0.0200
+
+
+
0.0119
+
+
+
0.0094
+
+
0.0077
+
+
+
0.0139
+
+
0.0064
+
+
0.0067
+
0.0054
Standar
Standar
Standard
Standard
d
d
0.0033
+
+
+
0.0236
+
+
0.0132
+
+
0.0229
+
0.0189
+
+
0.0277
+
0.0112
+
0.0182
0.0137
Standar
Standar
Standard
Standard
d
d
0.0039
Table 4 above shows the average results of the experiment. Each of the four

factors makes up their own column in the table. For each trial, the values of these factors
are symbolized by a plus, minus, or standard. Values of low or high factors were
identified by simply matching the high values with a + and signifying the low values
with a -. This simple layout allows for easier analysis of the data.

Braggs Havern
Figure 6. The Effect of Solution Type on
the Amount of Copper Plated
Table 5
The Effect of Solution Type on the
Amount of Copper Plated

Effect of Solution Type (CuSO4,

CuCl2)
(-) VALUES :
(+) VALUES :
0.0236 0.0277
0.0200 0.0139
0.0132 0.0112
0.0119 0.0064
0.0229 0.0182
0.0094 0.0067
0.0189 0.0137
0.0077 0.0054
AVERAGE:

0.0187

AVERAGE:

0.0102

Figure 6 and Table 5 shows the correlation between the solution type and the
amount of copper plated. Because two different solutions were utilized the researchers
can determine that copper (II) chloride was a better plating electrolyte than its counterpart
of copper (II) sulfate. On average, the amount of copper plated onto brass decreased by
0.0085 grams as the solution changed from low, CuCl2 to high, CuSO4.
Table 6
The Effect of Molarity on the Amount of
Copper Plated
Effect of Molarity (M)
(-) VALUES :
(+) VALUES :
0.0139 0.0277
0.0200 0.0236
0.0064 0.0112
0.0119 0.0132
0.0067 0.0182
0.0094 0.0229
0.0054 0.0137
0.0077 0.0189
Figure 7. The Effect of Molarity on the
Amount of Copper Plated

AVERAGE:

0.0129

AVERAGE:

0.0160

Braggs Havern
Figure 7 and Table 6 depict the relation between the molarity of the solutions and the
amount of copper plated. Based upon the experiment the effect of molarity was 0.0031,
thus showing that on average as molarity increases the amount of copper plated increases
by 0.0031 grams.
Figure 8. The Effect of Voltage on the
Amount of Copper Plated
Table 7
The Effect of Voltage on the Amount of
Copper Plated

Braggs Havern
Effect of Voltage (V)
(-) VALUES :
(+) VALUES :
0.0094 0.0229
0.0200 0.0236
0.0077 0.0189
0.0119 0.0132
0.0067 0.0182
0.0139 0.0277
0.0054 0.0137
0.0064 0.0112
AVERAGE:

0.0129

AVERAGE:

Figure 9. The Effect of Electrode Size on

the Amount of Copper Plated
Table 8
The Effect of Electrode Size on the
Amount of Copper Plated

0.0160

Illustrated above are Figure 8 and Table 7 which explain the correspondence
between voltage used and the amount of copper plated. Based upon the experiment the
effect of voltage was 0.0031. The preceding graph shows that on average as voltage
increased the amount of copper plated increased by 0.0031 grams.

Braggs Havern
Effect of Electrode Size (cm)
(-) VALUES :
(+) VALUES :
0.0119 0.0132
0.0200 0.0236
0.0077 0.0189
0.0094 0.0229
0.0064 0.0112
0.0139 0.0277
0.0054 0.0137
0.0067 0.0182
AVERAGE:

0.0111

AVERAGE:

0.0178

Figure 9 and Table 8 displayed above articulate the association between electrode
Figure 10. The Interaction Effect of
size and the
amount
of copper
Solution
Type
and Molarity
onplated.
the The effect suggests that on average as electrode
Amount of Copper Plated
size increased the amount of copper plated increases by 0.0067 grams.
Table 9
The Interaction Effect of Solution Type
and Molarity on the Amount of Copper
Plated

Braggs Havern
Solution
(-)
(+)

Figure 11. The Interaction Effect of

Solid
Solution Type and Voltage on the
(+
Segme
0.01 0.012
Amount of Copper Plated
)
nt
97
3
Molarit
Table 10
y
Dotted
The Interaction Effect of Solution Type
Segme (-)
0.01 0.008
and Voltage on the Amount of Copper
nt
77
1
Figure 10 and Table 9 above show the interaction
Plated between solution type and
molarity on the amount of copper plated. Table 9 shows the solid segment is the high
molarity with both low and high values for Type of Solution on the horizontal axis. The
dotted segment is the low values of molarity again with low and high values for the Type
of solution. Shown on the graph when the molarity was high and type of solution was
CuCl2 (low), the average amount of copper plated was the greatest. The interaction effect
for this combination is 0.0011 which indicates that there may be little to no interaction
between these factors because it is so close to zero and because the lines are nearly
parallel.

Braggs Havern
Solution
(-)
(+)
Volta
ge

Solid
Segmen
t
Dotted
Segmen
t

(+)

0.01
89

0.01
31

(-)

0.01
84

0.00
66

Table 11
The Interaction Effect of Solution Type
and Electrode Size on the Amount of
Copper Plated
Solution
(-)
(+)
Solid

nt

Figure 11 and Table 10 above show the interaction between

solution
and 0.01
Segme
+ type
0.02
Electro

31

25

voltage
on The
the amount
of copper
Table 10 shows
the solid
segment is the high
de Size
Dotted
Figure 12.
Interaction
Effect plated.
of
(Segme
0.01
0.00
Solution Type and Electrode Size on the
)
nt
43
79
voltage
with
both
low
and
high
values
for
type
of
solution
on
the
horizontal
axis.
The
Amount of Copper Plated
dotted segment is the low values of voltage paired with low and high values for the type
Figure 12 and Table 11 above show the interaction between solution type and
of solution. Shown on the graph when the voltage was high and type of solution was
molarity on the amount of copper plated. Table 11 shows the solid segment is the high
CuCl2 (low), the average amount of copper plated was the greatest. Figure 11 displays the
value for electrode size with both low and high values for type of solution on the
two line segments where the solution is CuCl2 and the voltage is high and low. This is
horizontal axis. The dotted segment is the low value for electrode size with low and high
also shown in the value of the interaction effect of 0.0030. In regards to the data found in
values for the Type of Solution. Shown on the graph when the electrode size was high
this experiment this value strongly suggests that there is an interaction between the two
and type of solution was CuCl2 (low), the average amount of copper plated was the
factors. The large difference in slopes between the two lines reaffirms the idea of an
greatest. The interaction effect for this combination is -0.0021, which was quite large for
interaction.
this data set indicates that there is a good chance of having an interaction.
Table 12
The Interaction Effect of Molarity and
Voltage on the Amount of Copper Plated
Molarity
(-)
(+)
Volta
ge

Figure 13. The Interaction Effect of

Molarity and Voltage on the Amount of
Copper Plated

Solid
Segme
nt
Dotted
Segme
nt

(
+
)
()

0.01
48

0.01
72

0.01
1

0.01
65

Braggs Havern
Figure 13 and Table 12 depicts the interaction between molarity and
voltage upon the amount of copper plated. Table 12 shows the solid segment as
the high value for voltage with both low and high values for molarity on the
horizontal axis. The dotted segment is the low value for voltage coupled with low
and high values for molarity of solution. Shown on the graph when the voltage
was high and molarity was high, the average amount of copper plated was the
greatest, although it barely differed from the low voltage at a high molarity.
Furthermore this slight difference is seen in the effects because the variance in
slope is so miniscule. The interaction effect for this pair was

-0.00067 which

indicates that there may be little to no interaction between these factors simply
because it is so close to zero. Also, the very similar slopes of the two individual
lines reaffirm the little to no interaction that appears between the two factors.

Figure 14. The Interaction Effect of

Molarity and Electrode Size on the
Amount of Copper Plated
Table 13
The Interaction Effect of Molarity and
Electrode Size on the Amount of Copper
Plated

Braggs Havern
Molarity
(-)
(+)
Electro
de Size

Solid
Segme
nt
Dotted
Segme
nt

(
+
)
()

0.017
5

0.01
9

0.009
2

0.01
29

Figure 14 and Table 13 illustrate the interaction between molarity and electrode
size upon the amount of copper plated. Table 13 shows the solid segment as the high
value for electrode size with both low and high values for molarity on the horizontal axis.
The dotted segment is the low value for electrode size coupled with low and high values
for the molarity of the solution. Shown on the graph when the electrode size was high and
the molarity of the solution was high, the average amount of copper plated was the
greatest. The interaction effect for the pair was -0.0007 which indicates that there may
have been little to no interaction between these factors. The interaction effect was found
at such a low quantity because the slopes of the lines are so similar, again strongly
emphasizing that there is most likely no significant effect between the two factors.
Voltage
(-)
(+)

Figure 15. The Interaction Effect of

Voltage and Electrode Size on the
Amount of Copper Plated
Table 14
The Interaction Effect of Voltage and
Electrode Size on the Amount of Copper
Plated

Braggs Havern
Electro
de Size

Solid
Segme
nt

(+
)

0.01
43

0.02
13

Dotted
Segme
nt

(-)

0.01
14

0.01
07

Figure 15 and Table 14 convey the interaction between voltage and electrode size
upon the amount of copper plated. Table 14 shows the solid segment is the high value for
electrode size with both low and high values for voltage on the horizontal axis. The
dotted segment is the low value for electrode size with low and high values for the
voltage. Shown on the graph, when the electrode size was high and the voltage of the DC
ammeter was high, the average amount of copper plated was the greatest. From the
graphs pictured above, the slopes are vastly different which reassured the effect because
the calculated interaction effect for the pair was 0.0039. This indicates that there is likely
to be a significant interaction between the effects.

Mass of Copper Electroplating

Figure 16. Graph of Standards

Represented above in Figure 16, the charted values for the standards ran in the
experiment. These trials are presented in such a way which helped the researchers
determine if their data was consistent. The maximum standard trial was recorded at
0.0039, and the minimum at 0.0030, which produces a range of 0.0009. This nearly
horizontal trend and small range indicates little variability in the experiment and thus
supports reliable results. But the range of standards contains only three points, so the
accuracy of the results may not be as true as they would be with a larger number of trials.

(ST)

(M & ES)

(S & M)

(ST & ES)

-0.01

-0.01

-0.01

(M & V)

(V)
(M)

(V & ES)
(ST & V)

0.01

(ES)

0.01

Figure 17. Dot Plot of Effects

Figure 17 above displays the dot plot of effects. Each individual factor and
interaction factor are noted with their abbreviation: solution type (ST), molarity (M),
voltage (V), and electrode size (ES). This chart conveys which factors are deemed
significant. Significant factors must be greater than two times the ranges of standards
positive or negative (goal posts in above graph). Therefore the factors of molarity and
voltage, molarity and electrode size, and molarity and solution were deemed
insignificant. Significant factors included solution type, molarity, voltage, electrode size,
and the interactions between solution type and electrode size, solution type and voltage,
and voltage and electrode size. These significant factors are used to hypothesize what
would happen if factors were tested beyond the boundaries of this experiment. Refer to
Appendix C, the parsimonious prediction equation, which will aid in interpolating and
extrapolating data.

Conclusion

The objective of this experiment was to determine what combination of solution

type, molarity, voltage of cell, and size of electrode would produce the most efficient
method of electroplating copper onto brass. After an analysis utilizing a four factor DOE
(Design of Experiment), the data revealed that the optimal combination of the four factors
for plating was copper II chloride (CuCl2) solution, 1.0 molarity, 12 volt voltage, and 1.5
length electrode pieces (-,+,+,+). This result forced a rejection of the hypothesis that the
electrolytic cell with the copper II sulfate (CuSO4) solution, 1.0 molarity, 12 volt voltage,
and 1.5 length electrodes, (+,+,+,+), would have the greatest mass of copper deposited
onto the brass. An in-depth analysis of the data provided evidence that the results of this
experiment were conclusive.
Each of the factors were evaluated individually to reveal their overall impact on
the mass of copper plated. The effect of solution on the mass of copper electroplated was
a decrease of 0.0085 grams as the solution changed from copper II sulfate (CuSO4) to
copper II chloride (CuCl2). These results conflicted with the current research on types of
solutions used for electroplating, mostly due to experimental flaws discussed later. Once
ionized, copper II sulfate (CuSO4), would have the greatest differential in charge, thus
attracting electrons and plating the easiest. The effect of molarity on the mass of copper
electroplated was an increase of 0.0031 grams of copper electroplated as the molarity of
the solution increased from 0.5 M to 1.0 M. This is due to more copper ions available
allowing for a greater chance of copper to be plated onto the brass. The effect of voltage
on the mass of copper plated was an increase of 0.0031 grams as voltage increased from
6 V to 12 V values. This is because a greater voltage results in a greater amplitude, or a
faster flow of electrons through the cell, which marks a greater speed of electrons,

essentially meaning more copper ions traveling toward the brass cathode, as well as
electrons therefore, plating the brass electrode (Mittal). The effect of electrode size on the
mass of copper electroplated was an increase of 0.0067 grams as electrode size increased
from 0.5 to 1.5 in length. Quite simply, more copper available means more copper
plated onto the brass. Each of these individual factors were deemed significant and all
greatly impacted the conclusions drawn from this experiment.
As for the interactions of factors, only the interaction effects of solution type and
voltage, solution type and electrode size, and voltage and electrode size were deemed
significant. The interaction effect of solution type and voltage was a decrease of 0.0030
grams as the factors increased from low to high. As solution type and voltage increase,
the smaller differential in ionic charge, resulting from solution change, has a greater
influence than the increased flow of electrons, resulting from voltage increase.
Essentially, a smaller quantity of copper ions attracted to faster moving electrons results
in a decrease of the mass of copper electroplated. Although the amplitude increased the
lesser amount of copper ions available resulted in a decrease of copper plated. The
interaction of solution type and electrode size had a negative effect of 0.067 grams.
Similarly, a smaller differential in charge, resulting from change in solution type, has a
greater influence than the increase in the mass of copper available, the result of
increasing electrode size. Even with more copper available, there is less of an effect as
the ions become less attractive to the electrons. Oppositely, the interaction effect of
voltage and electrode size had a positive effect of 0.0039 grams on the electroplating of
copper onto brass. A greater flow of electrons combined with a greater availability of
copper from the electrode would increase the rate of the redox reaction. Basically more

copper ions are produced and flow to the brass electrode, resulting in more copper
electroplated onto the brass.
These results found the best combination of factors for the optimal method of
electroplating copper onto brass. The solution molarity, cell voltage, and electrode size
agreed with the hypothesis while solution type went against the hypothesis. Essentially,
an electrolytic cell including low solution type, high solution molarity, high cell voltage,
utilizing high electrode sizes would produce the greatest mass of copper electroplated
onto the brass. These results are useful as starting points for any future research, but some
design flaws need to be addressed first.
Errors in the design of the experiment could be the source of errors suspected in
the data analysis. The most prominent error in the experiment was the electrolyte
solutions. The select molarity solutions of copper II sulfate, (CuSO4), copper II chloride,
(CuCl2), and copper II acetate, (Cu(C2H3O2)2), were all created by the researchers
themselves. The crystalline substances were massed out, added to distilled water, and
mixed. After heating to great temperatures and mixing for an extensive period of time, the
copper II sulfate, (CuSO4), and the copper II acetate, (Cu(C2H3O2)2), never totally
dissolved to create one consistent solution. After some time, the chemicals would emerge
from the solution and settle on the bottom of the vessel. The calculated molarity was
based on the amount of chemical totally dissolved in the solution. Because the crystal
chemicals were not fully dissolved in the solution, the calculated molarity of the solution
was not correct. The researchers attempted to counter this issue by mixing the solution for
five minutes prior to the trial the solution was used in.

In addition to solution inaccuracies, the mass of the electrodes were not very
accurate. Once washed, the metal electrodes could not be touched by human skin because
the oils would prevent precise plating. Metal tongs were used to transfer the electrodes
from scale to solution, but they were odd shaped and difficult to use. The electrodes
would often fall from or get scratched by the tongs, which may have impacted the
measurements of the mass of the electrodes. Gloves are not a solution because human
hands are too large and bulky for the small scale experiment. Development of a special
electrode harness or holding tool would benefit the research greatly.
These design flaws made the overall results of the trials not necessarily reliable,
although differences between similar trials were minimal. The range of standards was
0.0009, which is very small, so the results can hypothetically be reiterated assuming
future trials are run under identical conditions. Furthermore, the rule of twice the range of
standards clearly reveals those effects that were significant and those that were not.
This experiment offered useful information for future research on the topic.
Factors that significantly impact the electroplating process are outlined in this research
and could be expanded on. Another experiment could explore other factors of an
electrolytic cell, such as mass of solution or temperature. This could be done by including
solution amount as a variable or altering the temperature of the electrolyte solution while
plating. Furthermore, only certain portions of this experiment could be used in another,
such as the process of testing in a petri dish or the method of incorporating multiple
factors. Likewise, future research would benefit from a large scale, more industrialized
method because the results would be more accurate. Electroplating is virtually all done
industrially, so it only makes sense to use industrial methods and industrial quantities. If

this experiment was expanded upon by future researchers, some modifications would be
needed. In all, future research based on this experiment would enhance the understanding
of factors of an electrolytic cell that influence the efficiency of electroplating copper.
Not only will the scientific community benefit from future research, but society as
a whole can reap benefits. The purpose of this experiment was to determine which
combination of factors of an electrolytic cell would produce the most efficient method of
electroplating copper onto brass. Engineers and those who design and run electroplating
business could use this research in the development of electroplating facilities and
equipment. Companies like Sharretts Plating Company (SPC) would benefit from
performing research like this. SPC specializes in electroplating copper for any needs,
from circuit boards to large machine parts, and is constantly researching improvements
for the plating process. SPC actually says, Our customer-focused processes are designed
to provide a cost-effective plating solution that delivers superior quality while increasing
your operating efficiency. This is exactly what this research project is attempting to do,
so SPC would significantly benefit from using this research.
This experiment revealed that the electrolytic cell with copper II chloride (CuCl2)
solution, 1.0 molarity, 12 volt voltage, and 1.5 length electrode pieces (-,+,+,+) would
produce the greatest mass of copper electroplated onto the brass and thus be the most
efficient. With this research, electroplating technology companies would be more cost
efficient benefitting all parties. Consumers would have to pay less for goods that were
electroplated (phones, computers, and other small circuits) because the company is
paying less to electroplate by using the most efficient method. Without a doubt, this
research is of utmost value to both the scientific community and consumers alike.

Appendix A: Randomization
1. Go to a calculator page on a TI-NSpire CX calculator and press menu, 5
(probability), 4 (random), and 2 (integer) in that order to set up the format for a
randomly generated number. See Figure 18 for a visual representation of the
screen.

Figure 18. Calculator Screen for

Randomization Function
Displayed in Figure 18 above
is the path taken on the calculator to utilize the randomization function.
2. Type a 1, 19, 19 in the parentheses (1, 19, 19) to randomize the order in which the
trials are run.
3. Leave the first, middle, and last trial for the three standard trials. Record the first
number that shows up on the screen, such as 4, in the first non-standard row of the
data table. This trial should now be run fourth during the trials. Continue filling
out the trial numbers for the rest of the table. Do not repeat numbers and do not
use 1, 10, or 19 as they are reserved for the standard runs. If there was already a
trial 4, do not put another trial 4. Instead, repeat the process for the few remaining
trials by hitting enter on the calculator again. Fill out the remaining trials with the
first unused numbers from the second randomization.
Appendix B: Preparing Electrolyte Solutions
Only 40 ml of each electrolyte solution was used in each trial. Each individual
trial requires a new electrolyte bath. These steps involve making each individual
electrolyte solution for each individual trial. Begin by gathering the required materials.

1.5M Copper (II) Sulfate (CuSO4): Measure about 9.5772 g CuSO4 and dispense into an
empty 50 ml beaker. Fill the beaker up to the 40 ml mark with distilled water. Mix
with a glass stirring rod until crystals are dissolved.
0.5M Copper (II) Sulfate (CuSO4): Measure about 3.1924 g CuSO4 and dispense into an
empty 50 ml beaker. Fill the beaker up to the 40 ml mark with distilled water. Mix
with a glass stirring rod until crystals are dissolved.
1.0M Copper (II) Acetate (Cu(C2H3O2)2): Measure about 7.2625 g Cu(C2H3O2)2 and
dispense into an empty 50 ml beaker. Fill the beaker up to the 40 ml mark with
distilled water. Mix with a glass stirring rod until crystals are dissolved.
1.5M Copper (II) Chloride (CuCl2): Measure about 8.0670 g CuCl2 and dispense into an
empty 50 ml beaker. Fill the beaker up to the 40 ml mark with distilled water. Mix
with a glass stirring rod until crystals are dissolved.
0.5M Copper (II) Chloride (CuCl2): Measure about 2.6890 g CuCl2 and dispense into an
empty 50 ml beaker. Fill the beaker up to the 40 ml mark with distilled water. Mix
with a glass stirring rod until crystals are dissolved.

Appendix C: Prediction Equations

Y =grand average+

0.0085
0.003
.0031
0 .007
0 .0011
0.0030
0.0
(S)+
(M )+
(V )+
( E)+
(SM )+
(SV )+
2
2
2
2
2
2
2

Figure 19. Prediction Equation

Figure 19 above shows the prediction equation for the experimental DOE. The
effect, Y, is the sum of the grand average, the average of every effect and interaction
effects divided by two and multiplied by their variables (S for solution, M for molarity, V
for voltage, and E for electrode size), and noise, or lurking variables. This equation is
used to predict what the product will be based upon experimental values and can be used
for interpolating and extrapolating data.

Y =grand average+

0.0085
0.003
.0031
0 .007
0 .0030
0.0021
0.0
(S)+
(M )+
(V )+
( E)+
(SV )+
( SE)+
2
2
2
2
2
2
2

Figure 20. Parsimonious Prediction Equation

Displayed above is the Parsimonious Prediction Equation. This equation accounts
for significant effects only. Since the range of standards for this experiment was so small,
the effects of solution type and molarity, molarity and voltage, and molarity and electrode
size have been removed. Although this equation is simpler, it is the most accurate for
extrapolating data that would appear out of the domain of the intended research.
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