ENVIRONMENTAL SENSING &

LOGGING PLATFORM (ESLP)

Assembly Manual

English
ESLP v1.1
This manual serves as a step-by-step assembly and
troubleshooting guide for the Environmental Sensing and Logging
Platform. All rights reserved OneMaker Group Pte Ltd 2015

2015 Edition

INTRODUCTION
The ESLP is a weather-resistant sensor pack that is powered by 5 AAA alkaline batteries and
logs the following five parameters into an SD Card ...
- Air Temperature (15-60C, 0.5C )
- Relative Humidity (0-100% R.H., 2% R.H.)
- Ambient Noise Level (40-100 dBA, 5 dbA)
- Ambient Light Intensity (0-140 kLux, 2% for 250 Lux, 5% above 250 Lux)
- Ambient Carbon Monoxide (CO) Levels (0-4000 ppm, 5%)
Temperature, Humidity, Noise Level and Light Intensity will be logged at 10-second intervals,
while CO levels are logged at 5-minute intervals. Environmental parameters other than those
listed above will *NOT* be logged by the ESLP.

Objectives
To use this guide effectively, please follow the manual accordingly for pages and objectives:
- Item Checklist
- Soldering Tips and Techniques.
- ESLP Printed Circuit Board (PCB) Layout
- ESLP Assembly Guide

BEFORE YOU BEGIN

As there are approximately 30 types of components within the hack
pack, please ensure that you have a clear table before opening and
going through the checklist.
Please contact our instructors if you encounter any problems.

ESLP KIT CHECK LIST

The following list consists of the entire set of items required to put together the ESLP. Please
ensure you have the following items, and their respective quantity before proceeding for
assembly.

Base PCB Board

Resistors (R)

Resistors (R)

Qty : 1

220 - Qty: 1
1 k - Qty: 2
4.7 k - Qty: 3

10 k - Qty: 12
100 k - Qty: 2

Diode / 1N4148

Capacitors

32.768kHz Oscillator

Qty : 1

1 F - Qty: 7
10 F - Qty: 1

Qty : 1

Integrated Circuit (IC)

Transistor (Q1)

MQ7 CO Sensor

IC1 (78L33) - Qty:1

IC2 (LM358) - Qty:1
IC3 (DS1307) - Qty:1

BS170 : Qty : 1

Qty : 1

ITEM CHECK LIST 2

Microphone (M1)

Bi-Color LED

Header Pins

Qty : 1

Qty: 1

Single Row - Qty: 2

Dual Row - Qty: 1

2 Way Male Header

Humidity / Temp Sensor

Switch

Qty : 3

Qty : 1

Qty : 1

SD Cardslot
Qty : 1

SOLDERING TIPS & TECHNIQUES

Here are some tips that will help improve your soldering techniques.

Strip the wire and dip it into the soldering paste lightly.
Angle the soldering iron onto the wire that you plan to solder.
Solder small amount of soldering wire onto the metal connectors of the

switch.

Do not use the tip to solder as it has the least contact with the wire.
NOTE: soldering for too long will melt the wire insulator and the switch

casing!

Remove the soldering wire first then the soldering iron.

INSTRUCTIONS
Displayed below is the layout of the ESLP Printed Circuit Board (PCB). During the assembly
process, please take note of the components from the checklist and solder the leads to the
respective pin numbers, as indicated in the following guide.
As you work with the instructions, there will be plenty of references to the left, top and right side
of board. Please note of the orientation of the PCB following the images below.
TOP

LEFT

RIGHT

PCB and Pin Diagram

ACTUAL PCB LAYOUT WITH SOME COMPONENTS - FOR

COMPARISON AND IDENTIFICATION OF PINS.

ASSEMBLY GUIDE - SOLDER IN SEQUENCE

1. Resistors
In the following order, solder the resistors to the pin
numbers.
a) 220 to R1
d) 10k for R7 to R18
b) 1k to R2, R3, R21
e) 100k to R19 & R20
c) 4.7k to R4, R5, R6

2. Diode / 1N4148
Solder diode to D1

3. 1uF Capacitor
Solder the 1F Capacitors onto pins C1 to C6.

4. 32.768 kHz Oscillator

Solder the Oscillator to X1.

NOTE: Bend the joints 90 degrees and prevent it from
touching the metal cylinder. Double check everything to
prevent short circuiting! Prevent it from touching the SD
Card, make sure it is behind the white line.

5. Integrated Circuits LM358P

LM358P to IC2
NOTE: Find the correct position by looking out for the notch
as indicated. Double check the chip name and the notch!

SOLDER IN SEQUENCE 2
6. Integrated Circuits DS1307
DS1307 to IC3
NOTE: Find the correct position by looking out for the
notch. Double check the chip name and the notch!

7. Integrated Circuits 78L33

78L33 to IC1
NOTE: Flat side upwards of the board. Double check the
position of the IC1!

8. M1 and LED1
BS170 to Q1
NOTE: Flat side facing to the left of the board

9. SD Cardslot
SD Card slot to J2.

10. MQ7 (CO SENSOR)

MQ7 CO Sensor to MOD 4 Pin.

SOLDER IN SEQUENCE 3
11. Microphone
Microphone to M1
NOTE : Make sure the 3 stripes are on the left side

12. LED
LED to LED1
NOTE: Make sure the LEDs FLAT side (colored black) is facing
down

13. HeaderPins
Solder to position, the respective single-row and doublerow header pins.

14. 2-way Male Headers

Solder the 2-way Male Headers to J1 , J3 and J4.

15. 10F Capacitor

10uF CAPACITOR to C8
NOTE : Make sure the (-) minus-sign grey strip is facing to the
right of the board.

SOLDER IN SEQUENCE 4
16. HUMIDITY/TEMP SENSOR
HUMIDITY/TEMPERATURE SENSOR to MOD2

THIS MARKS THE COMPLETION OF THE ESLP

10

Technical support

Prototyping Lab@NDC, 111 Middle Road, #01-02, S188969

Tel.: +65 6694 5521
info@onemakergroup.com www.onemakergroup.sg

Company 2014