RAM TESTING
Christian LANDRAULT
landraul@lirmm.fr
SUMMARY
Introduction
Memory
modeling
Failure mechanisms and fault
modeling
Test algorithms for RAM
Introduction
Memories (esp. RAM) are at the
forefront of commercial electronic
designs
DRAMs are the technology driver for
the semiconductor industry
Memories are the most numerous
IPs used in SOC designs (hundreds !
and >90% of an SoC in 2010)
(DRAM)
1G
1G
128M
256M
possible
density
Highest
Slow access
16Mtime
(typically 20ns)
64M
10M
Information
stored as charge on capacitor
1M
4M
and should be refreshed
1M
100M
Static256k
Random
100k
82
86(typically
90
94 2ns)
98
Fastest
02
06
Information stored in cross coupled latches
Memory testing
Memory
Parametric (electrical)
AC Parametric
testing
testing
DC Parametric
testing
Contact test
Power
consumption
Leakage test
Threshold test
Output drive
current test
Output short
current test
Zero defect
approach
Use to detect some
defects not handle
by functional testing
SUMMARY
Introduction
Memory
modeling
Failure mechanisms and fault
modeling
Test algorithms for RAM
Refresh
WL
WL
Write
Column decoder
BL BL
BL
BL
Refresh logic
Vss
Vss
BL
BL
RAM write
6-devices
SRAM
cell
6-device
6-deviceSRAM
SRAMcell
Two dimensional
circuit decoding scheme
poly
cell depletion
Memory
(saves
decoder and
wiring area)
Row
Write driver
CMOS
Cell
Array
decoder
row decoder
select row of cells
WL
via WL
C
column
decoder
BL
single-device
DRAM cell
Sense amplifiers
Data register
R/W
and
CE
Row
decoder
Refresh
Column decoder
Refresh logic
Memory
Cell Array
Write driver
Sense amplifiers
Data register
R/W
and
CE
Row
decoder
Column decoder
Memory
Cell Array
Write driver
Sense amplifiers
Data register
R/W
and
CE
SUMMARY
Introduction
Memory
modeling
Failure mechanisms and fault
modeling
Test algorithms for RAM
Failure Mechanisms
Corrosion
Electromigration (burning out of wires due to
collision of electrons and Al grains)
Bonding deterioration (open due to interdiffusion
of materials i.e. Au-Al)
Ionic contamination (modification of threshold
voltages due to ion diffusion into transistor gate)
Alloying (Al atom migration into Si)
Radiation and cosmic rays (soft memory errors,
)
.
Either a
memory cell
or a data Any wiring
registerconnection in
Functional faults
the memory
Address line stuck
Cell stuck
Open in address line
Driver stuck
Shorts between address
Read/write line stuck
lines
Chip-select line stuck Open decoder
Data line stuck
Wrong access
Multiple access
Open in data line
Shorts between data Cell can be set to 0 and
not to 1 (or vice versa)
lines
Pattern sensitive
Crosstalk between
interaction between
data lines
cells
Refresh
Column decoder
Refresh logic
Memory
Cell Array
Write driver
Sense amplifiers
Data register
R/W
and
CE
Address
Address decoder
Read/write logic
Data
Cx
Cx
multiple cells
Ax
Cy
Ax
Cx
multiple addresses
Ay
Fault A: 1+2
Ax
Fault B: 1+3
Fault C: 2+4
Ax
Cx
Ay
Cy
Ax
Cx
Ay
Fault D: 3+4
Cx
Ax
Ay
Cy
Cx
Cy
Taxonomy of Functional
Memory Faults
Fault Primitive
C: Number of Cells
C=1
C>1
Single Cell Fault Coupling Fault
C=2
C=3
2-Coupling Fault 3-Coupling Fault
O: Number of Operations
0=<1
Static Fault
O>1
Dynamic Fault
O=2
2-op Fault
0=3
3-op Fault
To
TFrise : w0 w1 r1
TFfall : w1 w0 r0
r0
r1
r0r0
r1r1
r0
r1
0w0r0
1w1r1
><; >
There
There
AND-type (ABF): the shorted cells/lines take the AND value of their fault-free
values (four possible ABFs)
OR-type (OBF): the shorted cells/lines take the OR value of their fault-free
values (four possible OBFs)
"Cell x is the victim of cell y" and "Cell y is the victim of cell x"
The faults are linked. It is possible that they will hide each other.
For each memory cell: the effect of all the possible combinations
(28) of the adjacent cells should be tested.
Base cell
Type-1 neighborhood cell
Type-1
Base cell
Type-2 neighborhood cell
Type-2
The content of the base cell is forced to a certain state due to a certain
neighborhood pattern
Each base cell must be read in state 0 and in state 1, for all
permutations in the neighborhood pattern
(DRF)
A cell loses its value due to leakage current: the cell lose
its charge due to this leakage current
Linked faults are two or more faults (coupling faults) that affect
the same cell
<;1>
<;1>
<;0>
2 CFid faults
<;0>
Relation between
functional
faults
and
fault
CF
Shorts between
address lines
Open decoder AF
Wrong access
Multiple access
Cell can be set to 0
and not to 1 (or vice
TF
versa)
Pattern sensitive
interaction between
NPSF
cells
(examples)Vdd
WL
3
Vss
2
BL
BL
1, 2, 3: SA0
4: AF for cells after
the open
5, 6: State
Coupling Faults
7: SAF (depending
on the cell content
and the
technology)
BLB
BL
WL
Defect 1
Tp2
COLUMN
DECODER
Tn2
SB
Tn3 S
Tn4
Tp1
DECODER
ROW
Tn1
Defect
Fault
Model
Min
Res(k )
dRDF
~130
RDF; DRDF
~8
RDF; DRDF
~3
TF
~25
IRF; TF
~100
TF
~2000
MEMORY
ARRAY
I / O DATA
w0
r0
r0
r0
r0
r0
10
R (MOhm)
8
6
4
2
0
1,6 1,8
2,5
3,5
10
SizeAnalysis
<2m
m
Use of Inductive Spot
Fault
at<9the
SAF
51,3%
49,8%
layout level
SOF location
21,0% and11,9%
Generate defect sizes,
layers
0% happen
7,0%in the
(according to what TF
may really
fab.)
SCF
9,9%
13,2%
Place the defect onICF
a model0%
of the layout
3,3%
Extract the schematic
electrical
parameters
DRF and17,8%
14,8%
for the defective cell
Deduce and check possible fault models
SUMMARY
Introduction
Memory
modeling
Failure mechanisms and fault
modeling
Test algorithms for RAM
Test algorithms
Full
Classical
n (zero-one, checkerboard, )
O(n) test
Fault coverage:
Test algorithm:
Checkerboard
O(n) test
Fault coverage:
0000
GALPAT
00
Walking 1/0
0 0
1 0
1
0 0 0
1
All SAFs are detected and
1 located
0
0 0
All TFs are detected and1
0located
0
1 0
All AFs are detected and located
0
1
0
1
0
1
0
0
0
1
0
1
0
1
Sliding diagonal
GALCOL
n.log2n
n2 (hr!!)
1Mb
0.063
1.26
18.33
16Mb
1.01
24.16
4691.3
256Mb
16.11
451
1200959.9
2Gb
128.9
3994.4
76861433.7
8774 Years !!
March tests
The
Write 0 in cell Ci
Read cell Ci and check its content (0 expected)
Write 0 in cell Ci
For i=n-1 to 0
AF
MATS
Al
l
Some
4.n
MATS+
Al
l
All
5.n
MATS+
+
Al
l
All
All
March
X
Al
l
All
All
All
March
C-
Al
l
All
All
All
March
A
Al
l
All
All
All
15.n
March Y
Al
l
All
All
All
8.n
TF
CF CFi
in
d
CF
dy
n
Operat
ion
count
S
A
F
SC
F
Linked faults
6.n
6.n
All
All
10.n
All
TF
W
DF
RD
F
DR
DF
IRF
CF
st
CF
ds
CF
tr
CF
wd
CF
rd
CF
drd
CF
ir
Operat
ion
count
MATS+
10
0
50
10
0
10
0
50
25
25
50
50
5.n
March
B
10
0
10
0
10
0
10
0
75
62
50
50
50
17.n
March
U
10
0
10
0
10
0
10
0
10
0
66
10
0
10
0
10
0
13.n
March
C-
10
0
10
0
10
0
10
0
10
0
66
10
0
10
0
10
0
10.n
March
LR
10
0
10
0
10
0
10
0
10
0
66
10
0
10
0
10
0
14.n
March
SR
10
0
10
0
10
0
10
0
10
0
10
0
66
10
0
10
0
75
10
0
14.n
March
SS
10
0
10
0
10
0
10
0
10
0
10
0
10
0
10
0
10
0
10
0
10
0
10
0
10
0
22.n
Algorith
m
Testing of Neighborhood
Pattern-Sensitive Faults
Each base cell must be read in state 0 and in state 1, for all
possible transitions in the neighborhood pattern
(k-1).2k possible patterns, (type-1: k=5, type-2: k=9)
Each base cell must be written and read in state 0 and in
state 1, for all permutations in the neighborhood pattern
2k possible patterns
Each base cell must be read in state 0 and in state 1, for all
permutations in the neighborhood pattern
2k possible patterns
Testing of Neighborhood
Pattern-Sensitive Faults
It is essential to minimize the number of
writes during NPSF testing
SNPSF patterns are produced following
an Hamiltonian sequence (hamiltonian
distance of 1 between patterns, Gray
code for example): k+2k-1 writes
ANPSF and PNPSF patterns are produced
following an Eulerian sequence : k+k.2k
writes
Testing of Neighborhood
Pattern-Sensitive Faults
B b
c
Group 1
Group 2
TLAPNPSF1G
TLAPNPSF2T
TLAPNPSF1T
TLSNPSF1G
or Y2Group
Y
method
195.5 n
5122 n
194 n
43.5 n
TLSNPSF1T
39.2 n
TLSNPSF2T
569.8 n
TDSNPSF1G
36.125 n
Test of Word-Oriented
Memories
Test of Word-Oriented
Memories