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INTRODUCTION
GiFi stands for Gigabit Wireless. GiFi is a wireless technology which promises high speed short range data transfers with speeds of upto 5 Gbps within a radius of 10 meters. The GiFi operates on the 60GHz frequency band. This frequency band is currently mostly unused. The Gifi measures 5mm square and it is manufactured using existing complementary metal-oxide-semiconductor (CMOS) technology. The same GiFi system is currently used to print silicon chips. This new wireless technology is named GiFi . The GiFi Chip developed by the Australian researchers. In theory this technology would transfers GBs of our fav high definition movies in seconds. So GiFi can be considered as a challenger to Bluetooth rather than Wi-Fi and could find applications ranging from new mobile phones to consumer electronics. GiFi allows a full-length high definition movie to be transferred between two devices in seconds. to the higher megapixel count on our cameras, the increased bitrate on our music files, the higher resolution of our video files, and so on. We demand more than ever, but we also want this content to be transfered in the most expedient manner possible. 802.11g and 802.11n are fine and all, but some people want to push the envelope even further. This chip is 5mm per side and it can operate at a frequency of 60GHz while wifi chip can operate only at 2.4GHz. This have low power conception of 2 watt comes and comes with 1mm antenna.

Fig.1 High speed indoor data transmissiom

The GiFi chip is a good news for personal area networking because there is no internet infrastructure available to cop it with. It can have a span of 10 meters. The usable prototype may be less than a year
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away. With the help of gifi chips the videos sharing can be possible without any hurdles. The GiFi chip is one of Australia's most lucrative technology. This chip is 5mm per side and it can operate at a frequency of 60GHz while wifi chip can operate only at 2.4GHz. This have low power conception of 2 watt comes and comes with 1mm antenna.The complete GIFI index is contained in the CRA'sGuide To The General Index Of Financial Information (GIFI) For Corporations which you can download or get in a paper or diskette version from your nearest tax services office.You will find links to both the Guide To The General Index Of Financial Information (GIFI) For Corporations and the GIFI .

Fig 1. Use of spectrum in GiFi The Cost of GiFi chip is only $10. The purpose of the GIFI is to allow the CRA to collect and process financial information more efficiently; for instance, the GIFI lets the CRA validate tax information electronically rather than manually. Short-range wireless technology is a hotly contested area, with research teams around the world racing to be the first to launch such a product.Professor Skafidas said his team is the first to demonstrate a working transceiver-on-a-chip that uses CMOS (complementary metal-oxide-semiconductor) technology the cheap, ubiquitous technique that prints silicon chips. This means his team is head and shoulders in front of the competition in terms of price and power demand. His chip uses only a tiny one-millimetre-wide antenna and less than two watts of power, and would cost less than $10 to manufacture.It uses the 60GHz "millimetre wave" spectrum to transmit the data, which gives it an advantage over WiFi (wireless internet).

WiFi's part of the spectrum is increasingly crowded, sharing the waves with devices such as cordless phones, which leads to interference and slower speeds.But the millimetre wave spectrum (30 to 300 GHz) is almost unoccupied, and the new chip is potentially hundreds of times faster than the average home WiFi unit. However, WiFi still benefits from being able to provide wireless coverage over a greater distance.Victoria's minister for information and communication technology, Theo Theophanous, said it showed Victoria was at the cutting edge of IT innovation. He praised the 27member team which worked on the development of the chip. The high-powered team included 10 PhDs students from the University of Melbourne and collaborated with companies such as computer giant IBM during the research. The worlds first transceiver integrated on a single chip that operates at 60GHz on the CMOS (complementary metaloxidesemiconductor) process, the most common semiconductor technology, was announced today by NICTA, Australias Information and Communications Technology (ICT) Research Centre of Excellence. The development will enable the truly wireless office and home of the future. As the integrated transceiver developed by NICTA is extremely small, it can be embedded into devices. The breakthrough will mean the networking of office and home equipment - without wires - will finally become a reality. Researchers from NICTAs Gigabit Wireless Project, which is based out of NICTAs Victoria Research Laboratory, are the first in the world to have developed an integrated transceiver, a complete transmitter and receiver, on a single chip at 60GHz on CMOS. This technology breakthrough will enable the wireless transfer of audio and video data at up to 5 gigabits per second, ten times the current maximum wireless transfer rate, at one-tenth the cost.Our team, which includes 10 PhD students from the University of Melbourne, has overcome some significant challenges in developing this breakthrough technology, NICTA Chief Executive Officer Dr David Skellern said. Developing very high frequency radio components in a standard CMOS process and then integrating those components on a single chip has posed challenges in dealing with the inherent limitations of that process for radio circuits.Now that NICTA researchers have successfully addressed these challenges, the ICT industry will soon have access to low cost, low power and high broadband chips that will be vital in enabling the digital economy of the future. NICTA Gigabit Wireless Project Leader Professor Stan Skafidas said the design and development of the worlds first 60GHz transceiver integrated on a single CMOS was the result of a three-year research effort.
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NICTAs research involved a close collaboration with leaders in the global semiconductor industry. The technology was developed using the IBM 130nm RF CMOS process. Our collaborators IBM, Synopsys, Cadence, Anritsu, Agilent, Ansoft and SUSS MicroTec have been critical to our success and we are grateful to have had their valuable support, Professor Skafidas said. Our innovative design methodology and access to leading design, test and measurement, and fabrication technology has allowed us to deliver this world-first success. NICTA researchers chose to develop this technology in the 57-64GHz unlicensed frequency band as the millimetre-wave range of the spectrum makes possible high component on-chip integration as well as allowing for the integration of very small high gain arrays. The availability of 7GHz of spectrum results in very high data rates, up to 5 gigabits per second to users within an indoor environment, usually within a range of 10 metres, Professor Skafidas said. NICTA Chief Technology Officer, Embedded Systems, Dr Chris Nicol said the availability of a single chip, low cost, very high speed wireless technology will transform the home entertainment industry. For example, consumers will be able to download a high definition DVD onto their personal digital assistants at a public kiosk in seconds, take it home and play it directly onto their high definition TV. Gi-Fi or Gigabit Wireless is the worlds first transceiver integrated on a single chip that operates at 60GHz on the CMOS process. It will allow wireless transfer of audio and video data at up to 5 gigabits per second, ten times the current maximum wireless transfer rate, at one-tenth the cost. NICTA researchers have chosen to develop this technology in the 57-64GHz unlicensed frequency band as the millimetre-wave range of the spectrum makes possible high component on-chip integration as well as allowing for the integration of very small high gain arrays. The available 7GHz of spectrum results in very high data rates, up to 5 gigabits per second to users within an indoor environment, usually within a range of 10 metres. The new technology is predicted to revolutionise the way household gadgets talk to each other. According to the University of Melbourne, Australiya, the

chip is very small at only 5 millimeters per side, has a 1mm antenna, uses just two watts of power and they estimate it would cost less than $10 each to build. It also uses the 60GHz millimetre wave spectrum which is not as crowded as the spectrum that Wi-Fi uses, competing with things like cordles.

2.HISTORY OF GIFI
Melbourne University researchers have achieved up to 5Gbps data transfer rates on a wireless chip. This is a lot faster than any current WiFi speeds. Dubbed GiFi, for obvious reasons, it can deliver the connection speed up to ten meters. To fully comprehend how fast GiFi is, one of the researchers said that a full-length high-def movie can be transferred from one device to another in a matter of seconds. The GiFi chips is only 5mm in size and use current CMOS technology. Cost is only $10. I say, lets begin mass producing it. Professor. Stan Skafidis of Melbourne University , Australiya is the inventor of GiFi chip. The GiFi chip uses only a tiny one-millimeter-wide antenna and less than two watts of power, and the GiFi chip would cost less than $10 to manufacture it . According to the website of Melbourne University , Australia by using GiFi an entire high-definition movie from a video shop kiosk could be transmitted to a mobile phone in a few seconds, and the phone could then upload the movie to a home computer or screen at the same speed, this statement about the GiFi was given by Nick Miller. GiFi uses the 60GHz millimetre wave spectrum to transmit the data from one part to the another part. It provides an advantage over WiFi (wireless internet),. WiFis part of the spectrum is increasingly crowded, sharing the waves with devices such as cordless phones, which leads to interference and slower speeds. But the millimetre wave spectrum (30 to 300 GHz) is almost unoccupied, and the new chip is potentially hundreds of times faster than the average home WiFi unit .The best part about this new technology GiFi is its cost effectiveness and power consumption, it only consumes 2 watts of power for its operation with antenna(1mm) included and the development of Gi-Fi chip costs approximately $10( Rs 380) to manufacture. In theory this technology would transfers GBs of our fav high definition movies in seconds. So GiFi can be considered as a challenger to Bluetooth rather than Wi-Fi and could find applications ranging from new mobile phones to consumer electronics. GiFi promises some serious game-changing wireless transfer speeds for all types of consumer gadgets. The tiny silicon chip invented by professor Stan Skafidas is able to move data through the air as fast as 5 gigabits per second at a distance of just over 30 feet. The GiFi uses the short-range wireless technology would potentially be a competitor or more than likely a replacement for WiFi, and things like Bluetooth might want to look out as well. The transfer speeds combined with the constantly increased storage capacities of small handheld devices could really take media down some new avenues as well. The Age newspaper uses an example of transferring a high-definition movie from a kiosk at a store to your mobile phone in seconds. Then that

same movie can be transferred just as quickly from the phone to our home computer or entertainment system to watch. According to the University of Melbourne, Australiya, the chip is very small at only 5 millimeters per side, has a 1mm antenna, uses just two watts of power and they estimate it would cost less than $10 each to build. It also uses the 60GHz millimetre wave spectrum which is not as crowded as the spectrum that Wi-Fi uses, competing with things like cordless phones. The world's first GiFi wireless network chip developed at Australia's peak federal technology incubator has entered its commercialisation phase. Nicta chief executive David Skellern confirmed that the research facility had formed a start-up around the new technology. "It's not up to me to announce it. It's up to the company that has formed, but there is an activity going on to spin out a company from Nicta that will take that technology to market," Dr Skellern said. The GiFi chip could become one of Australia's most lucrative technology. The Nicta gigabit wireless chip is 100 times faster than current WiFi chips and can be built for a tenth of their cost. The team behind it picked up a gong at the international Innovic's Next Big Thing Award for Innovation Excellence last July. Its development has been part of an international race to develop standards for a super-high-speed gigabit version of the CSIRO's WiFi wireless networking technology, used almost universally in laptops, mobile phones and home wireless network equipment.The fastest current WiFi standard is 802.11n. "There'll be a kind of bunfight between all the protagonists for all the different approaches and one will end up being a winner. We'll be in there proposing our solutions." The Australian contacted the CSIRO for comment on whether Nicta would need its co-operation to develop the chip or use its patents, but neither of the CSIRO's lead WiFi spokesmen, Tom McGinness and Nigel Poole, were available. A CSIRO spokeswoman said the organisation had not been told Nicta was planning a GiFi start-up. Nicta gigabit wireless project leader Stan Skafidas and some of his 15 staff were likely to join the startup when it began operating.Whether Professor Skafidas would join the new company permanently was yet to be determined, Dr Skellern said.

Gi-Fi or Gigabit Wireless is the worlds first transceiver integrated on a single chip that operates at 60GHz on the CMOS process. It will allow wireless transfer of audio and video data at up to 5 gigabits per second, ten times the current maximum wireless transfer rate, at one-tenth the cost. NICTA researchers have chosen to develop this technology in the 57-64GHz unlicensed frequency band as the millimetre-wave range of the spectrum makes possible high component on-chip integration as well as allowing for the integration of very small high gain arrays. The available 7GHz of spectrum results in very high data rates, up to 5 gigabits per second to users within an indoor environment, usually within a range of 10 metres.

3. TECHNOLOGY USED BY GIFI

3.1CMOS
GiFi uses CMOS technology. Complementary metaloxidesemiconductor (CMOS) is a technology for constructing integrated circuits. CMOS technology is used

in microprocessors, microcontrollers, static RAM, and other digital logic circuits. CMOS technology is also used for several analog circuits such as image sensors, data converters, and highly integrated transceivers for many types of communication. Frank Wanlass patented CMOS in 1967 (US patent 3,356,858). CMOS is also sometimes referred to as complementary-symmetry metaloxidesemiconductor (or COS-MOS). The words "complementary-symmetry" refer to the fact that the typical digital design style with CMOS uses complementary and symmetrical pairs of p-type and n-type metal oxide semiconductor field effect transistors (MOSFETs) for logic functions. CMOS (complementary metal-oxide semiconductor) is the semiconductor technology used in the transistors that are manufactured into most of today's computer microchips. Semiconductors are made of silicon and germanium, materials which "sort of" conduct electricity, but not enthusiastically. Areas of these materials that are "doped" by adding impurities become full-scale conductors of either extra electrons with a negative charge (N-type transistors) or of positive charge carriers (P-type transistors). In CMOS technology, both kinds of transistors are used in a complementary way to form a current gate that forms an effective means of electrical control. CMOS transistors use almost no power when not needed. As the current direction changes more rapidly, however, the transistors become hot. This characteristic tends to limit the speed at which microprocessors can operate

Two important characteristics of CMOS devices are high noise immunity and low static power consumption. Significant power is only drawn while the transistors in the CMOS device are switching between on and off states. Consequently, CMOS devices do not produce as much waste heat as other forms of logic, for example transistor-transistor logic (TTL) or NMOS logic, which uses all n-channel devices without p-channel devices. CMOS also allows a high density of logic functions on a chip. It was primarily this reason why CMOS won the race in the eighties and became the most used technology to be implemented in VLSI chips. The phrase "metaloxidesemiconductor" is a reference to the physical structure of certain field-effect transistors, having a metal gate electrode placed on top of an oxide insulator, which in turn is on top of a semiconductor material. Aluminum was once used but now the material is polysilicon. Other metal gates have made a comeback with the advent of high-k dielectric materials in the CMOS process, as announced by IBM and Intel for the 45 nanometer node and beyond.

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In CMOS (Complementary Metal-Oxide Semiconductor) technology, both N-type and P-type

transistors are used to realize logic functions. Today, CMOS technology is the dominant semiconductor technology for microprocessors, memories and application specific integrated circuits (ASICs). The main advantage of CMOS over NMOS and bipolar technology is the much smaller power dissipation. Unlike NMOS or bipolar circuits, a CMOS circuit has almost no static power dissipation. Power is only dissipated in case the circuit actually switches. This allows to integrate many more CMOS gates on an IC than in NMOS or bipolar technology, resulting in much better performance. The following applets demonstrate the N-type and P-type transistors used in CMOS technology, the basic CMOS inverter, NAND and NOR gates, and an AOI32 complex gate.

Finally, it demonstrates the CMOS transmission-gate and a transmisson-gate D-latch. The first applet illustrates the function of both N-type and P-type MOS transistors.

The source and gate contacts of the transistors to toggle the corresponding voltage levels and watch the resulting output value on the drain contacts. The applet uses colors to display the different voltages. (1) A logical '1' corresponding to electrical level VCC (typical values for current technolgies are +5V or +3.3V) is shown in red, (2) A logical '0' (corresponding to 0V or GND) in blue. (3) A floating wire (not connected to either VCC or GND) is shown in orange. N-type transistor is conducting when its input is '1', while the P-type transistor is conducting when its input is '0'. The applet displays the channel of a conducting transistor as a rectangle filled with the color of its source voltage. The channel of a nonconducting transistor is shown as rectangle outline in black. The most important CMOS gate is the CMOS inverter. It consists of only two transistors, a pair of one N-type and one P-type transistor. The applet demonstrates how the inverter works. If the input voltage is '1' (VCC) the P-type transistor on top is nonconducting, but the N-type transistor is conducting and provides a path from GND to the output Y. The output level therefore is '0'. On the other hand, if the input level is '0', the P-type transistor is conducting and provides a path from VCC to the output Y, so that the output level is '1', while the N-type transistor is blocked. If the input is floating, both transistors may be conducting and a short-circuit condition is possible.

3.2Transmission of image in GiFi

CMOS uses image sensor for transferring image and those image sensors can have much more functionality on-chip than CCDs. In addition to converting photons to electrons and transferring them, the CMOS sensor might also perform image processing, edge detection, noise reduction, and analog to digital conversion. What's more, sensor and digital camera designers can make the various CMOS functions programmable, providing for a very flexible device. This functional integration onto a single chip is CMOS' main advantage over the CCD. It also reduces the number of external components needed.

Fig 2. Image Sensor

Using an integrated CMOS sensor allows the digital camera to devote less space to other chips, such as digital signal processors (DSPs) and ADCs. In addition, because CMOS devices consume less power than CCDs, there's less heat, so thermal noise can be reduced. The breakthrough for CMOS sensor technology came in the early 1990s, when Active Pixel Sensors (APS) were successfully implemented by NASA's Jet Propulsion Laboratory (JPL). A theoretical technology that was understood for decades but not effectively used until 1993, APS adds a readout amplifier transistor to each pixel. This allows the conversion of the charge to voltage to happen at the pixel. It also provides for random access to the sensor's pixels, similar to the row-column memory cell access in RAM technology. The charge readout from the AP CMOS sensor is done using parallel circuitry, which allows the signal from single pixels or columns of pixels to be directly addressed. This direct random access ability allows a CMOS sensor to intelligently choose to readout select groups of pixel charges (rather than the entire sensor array). This is called window-of-interest or windowing readout. A CMOS sensor can intelligently subsample (reduce the size of) an image when it is captured. It also offers the potential of increased readout speed, as compared to CCD's, which must offload all its charge through a single horizontal shift register. In addition to amplification within the pixel site, amplifying circuitry may be placed elsewhere along the CMOS signal chain. This provides different, multiple gain stages throughout the sensor. Amplifiers can apply global gain to increase sensitivity in low light situations. Or selective gain can be applied to a specific color to assist in white balance algorithms or artistic effects. By adding all this extra circuitry to the chip, CMOS has traditionally experienced a great deal of difficulty with noise, including transistor leakage, diode leakage, and residual charge. Noise

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elimination continues to be an important area for continued CMOS research and development. But one advantage that CMOS has is that the sensor can have subtractive elements on the chip, to remove dark current noise from the charge before it is offloaded. Given the number of options of what functions you can put on the CMOS sensor, it's not surprising that there's considerable variety among various CMOS architectures.

3.3Color creation in GiFi

All image sensors are grayscale devices that record the intensity of light from full black to white, with the appropriate intervening gray. To add color to a digital camera image, a layer of color filters is bonded to the silicon using a photolithography process to apply color dyes.
3.3.1 Photolithography :

Photolithography (or "optical lithography") is a process used in micro fabrication to selectively remove parts of a thin film or the bulk of asubstrate. It uses light to transfer a geometric pattern from a photo mask to a light-sensitive chemical "photoresist", or simply "resist," on the substrate. A series of chemical treatments then either engraves the exposure pattern into, or enables deposition of a new material in the desired pattern upon, the material underneath the photo resist. In complex integrated circuits, for example a modern CMOS, a wafer will go through the photolithographic cycle up to 50 times. Photolithography shares some fundamental principles with photography in that the pattern in the etching resist is created by exposing it to light, either directly (without using a mask) or with a projected image using an optical mask. This procedure is comparable to a high precision version of the method used to make printed circuit boards. Subsequent stages in the process have more in common with etching than to lithographic printing. It is used because it can create extremely small patterns (down to a few tens of nanometers in size), it affords exact control over the shape and size of the objects it creates, and because it can create patterns over an entire surface cost-effectively. Its main disadvantages are that it requires a flat substrate to start with, it is not very effective at creating shapes that are not flat, and it can require extremely clean operating conditions. A single iteration of photolithography combines several steps in sequence. Modern cleanrooms use automated, robotic wafer track systems to coordinate the process. The procedure described here omits some advanced treatments, such as thinning agents or edge-bead removal.

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(i)Cleaning If organic or inorganic contaminations are present on the wafer surface, they are usually removed by wet chemical treatment, e.g. the RCA clean procedure based on solutions containing hydrogen peroxide (ii)Preparation The wafer is initially heated to a temperature sufficient to drive off any moisture that may be present on the wafer surface. Wafers that have been in storage must be chemically cleaned to removecontamination. A liquid or gaseous "adhesion promoter", such as Bis(trimethylsilyl)amine ("hexamethyldisilazane", HMDS), is applied to promote adhesion of the photoresist to the wafer. The phrase "adhesion promoter" is given because HMDS secures adhesion between the wafer and the photoresist. The surface layer of silicon dioxide on the wafer reacts with HMDS to form tri-methylated silicon-dioxide, a highly water repellent layer not unlike the layer of wax on a car's paint. This water repellent layer prevents the aqueous developer from penetrating between the photoresist layer and the wafer's surface, thus preventing so-called lifting of small photoresist structures in the (developing) pattern. (iii)Photoresist application The wafer is covered with photoresist by spin coating. A viscous, liquid solution of photoresist is dispensed onto the wafer, and the wafer is spun rapidly to produce a uniformly thick layer. The spin coating typically runs at 1200 to 4800 rpm for 30 to 60 seconds, and produces a layer between 0.5 and 2.5 micrometres thick. The spin coating process results in a uniform thin layer, usually with uniformity of within 5 to 10 nanometres. This uniformity can be explained by detailed fluid-mechanical modelling, which shows that the resist moves much faster at the top of the layer than at the bottom, where viscous forces bind the resist to the wafer surface. Thus, the top layer of resist is quickly ejected from the wafer's edge while the bottom layer still creeps slowly radially along the wafer. In this way, any 'bump' or 'ridge' of resist is removed, leaving a very flat layer. Final thickness is also determined by the evaporation of liquid solvents from the resist. For very small, dense features (<125 or so nm), thinner resist thicknesses (<0.5 micrometres) are needed to overcome collapse effects at high aspect ratios; typical aspect ratios are <4:1. (iv)Photoresist removal After a photoresist is no longer needed, it must be removed from the substrate. This usually requires a liquid "resist stripper", which chemically alters the resist so that it no longer adheres to the substrate.

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Alternatively, photoresist may be removed by a plasma containing oxygen, which oxidizes it. This process is called ashing, and resembles dry etching. (v)Etching In etching, a liquid ("wet") or plasma ("dry") chemical agent removes the uppermost layer of the substrate in the areas that are not protected by photoresist. In semiconductor fabrication, dry etching techniques are generally used, as they can be made anisotropic, in order to avoid significant undercutting of the photoresist pattern. This is essential when the width of the features to be defined is similar to or less than the thickness of the material being etched (i.e. when the aspect ratio approaches unity). Wet etch processes are generally isotropic in nature, which is often indispensable for microelectromechanical systems, where suspended structures must be "released" from the underlying layer. The development of low-defectivity anisotropic dry-etch process has enabled the ever-smaller features defined photo lithographically in the resist to be transferred to the substrate material. (vi)Light sources Photolithography has used ultraviolet light from gas-discharge lamps using mercury, sometimes in combination with noble gases such as xenon. These lamps produce light across a broad spectrum with several strong peaks in the ultraviolet range. This spectrum is filtered to select a single spectral line. From the early 1960s through the mid-1980s, Hg lamps had been used in lithography for their spectral lines at 436 nm ("g-line"), 405 nm ("h-line") and 365 nm ("i-line"). However, with the semiconductor industrys need for both higher resolution (to produce denser and faster chips) and higher throughput (for lower costs), the lamp-based lithography tools were no longer able to meet the industrys requirements.

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Fig 3. Graph for Lithography wavelength vs. Resolution requirement One of the evolutionary paths of lithography has been the use of shorter wavelengths. It is worth noting that the same light source may be used for several technology generations. The commonly used deep ultraviolet excimer lasers in lithography systems are the Krypton fluoride laser at 248-nm wavelength and the argon fluoride laser at 193-nm wavelength. The primary manufacturers of excimer laser light sources in the 1980s were Lambda Physik (now part of Coherent, Inc.) and Lumonics, but since the mid-1990s Cymer Inc. has become the dominant supplier of excimer laser sources to the lithography equipment manufacturers. Generally, an excimer laser is designed to operate with a specific gas mixture; therefore, changing wavelength is not a trivial matter, as the method of generating the new wavelength is completely different, and the absorption characteristics of materials change. For example, air begins to absorb significantly around the 193 nm wavelength; moving to sub193 nm wavelengths would require installing vacuum pump and purge equipment on the lithography tools (a significant challenge). Furthermore, insulating materials such as silicon dioxide (SiO2), when exposed to photons with energy greater than the band gap, release free electrons and holes which subsequently cause adverse charging. Optical lithography has been extended to feature sizes below 50 nm using the 193 nm ArF excimer laser and liquid immersion techniques. Also termed immersion lithography this enables the use of optics with numerical apertures exceeding 1.0. The liquid used is typically ultra-pure, deionised water,
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which provides for a refractive index above that of the usual air gap between the lens and the wafer surface. The water is continually circulated to eliminate thermally-induced distortions. Water will only allow NA's of up to ~1.4, but materials with higher refractive indices will allow the effective NA to be increased further. Experimental tools using the 157 nm wavelength from the F2 excimer laser in a manner similar to current exposure systems have been built. These were once targeted to succeed 193 nm lithography at the 65 nm feature size node but have now all but been eliminated by the introduction of immersion lithography. This was due to persistent technical problems with the 157 nm technology and economic considerations that provided strong incentives for the continued use of 193 nm excimer laser lithography technology. High-index immersion lithography is the newest extension of 193 nm lithography to be considered. In 2006, features less than 30 nm were demonstrated by IBM using this technique.

Fig 4. Graph for photon energy vs. resolution

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Image sensors that have micro lenses will put the color between the micro lens and the photodetector. With scanners that use trilinear CCDs (three adjacent linear CCDs using different colors, typically red, green, and blue) or high-end digital cameras that use three area array image sensors, it's a very simple issue of coating each of the three sensors with a separate color. (Note that some multi-sensor digital cameras use combinations of colors in their filters, rather than the three separate primaries). But for single sensor devices, such as the majority of consumer and prosumer digital still cameras used today, color filter arrays (CFAs) are used.

Fig 5. Color creation in image during transmission through GiFi

CFAs assign a separate primary color to each pixel by placing a filter of that color over the pixel. . As photons pass through the filter to reach the pixel, only wavelengths of that primary color will pass through. All other wavelengths will be absorbed. Primary colors are a small set of colors identified by science as being the building blocks for all other colors. Therefore, in the RGB color model, combining varying amounts of red, green and blue will create all the other colors in the spectrum Numerous types of CFAs have been developed for different applications. But in the vast majority of digital camera image sensors, the most popular CFA is the Bayer pattern. Kodak developed the Bayer pattern in the 1970s, based on work in spatial multiplexing. Using a checkerboard pattern with alternating rows of filters, the Bayer pattern has twice as many green pixels as red or blue. And they are arranged in alternating rows, of red wedged between green, and of blue wedged between green. This takes advantage of the human eye's predilection to see green luminance as the strongest influence in defining sharpness. What's more, it produces identical images regardless of how you hold the camera--in landscape or portrait mode. When a Bayer pattern sensor's charge is read out, the colors are recorded sequentially line by line. One line would be BGBGBG, followed by a line of GRGRGR and so forth. This is known as sequential RGB.

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In CCD cameras, the compositing (demosaicing) of all these colors into a picture is done off the sensor, in the image processing stage, after the ADC has converted the analog data to digital. CMOS sensor-based cameras have the advantage of being able to perform the demosaicing on the sensor itself. In either case, the primary colors of each pixel are mathematically interpolated by factoring in the color values of neighboring pixels. (In reality, few points of light in any picture are true primary red, green or blue; they are a combination of the three colors.) For instance, a linear interpolation will look at a 3x3 square of pixels and compare values from neighboring pixels to determine how many of the neighbor component colors should be added to the center pixel. In a simple case of three pixels with blue, red, and blue color filters lined up in a horizontal row, assume you are trying to derive the actual color of a pixel with the red filter. If you assume there are no weighted averages at play and all pixels are treated equally, then the true color of the pixel location using the red color filter would be derived mathematically by giving two parts weight to the blue pixels and one part weight to red. The actual algorithms of even simple linear interpolation are much more complex than that, taking into account all the neighboring pixels of any one pixel. When this interpolation isn't done well, color aliasing (or artifacts of inappropriate colors) are introduced, especially at color change edges.

4.BEHAVIOR OF GiFi
No longer just fuzzy recordings to youtube (see Spies Like Us), kids will be able to live stream from cell phone to HD tv's around the world. It can also be used as cyberbullying, hacking, and other behaviors, is because most schools largely ignore technology and relegate it to the "computer teacher's job." As cell phones, computers, digital paper, and even computing surfaces integrate fully with our lives, we will see that these are part of everything we do and should indeed be a part of every subject. Hardware (and to some extent software) is becoming a commodity. Increasingly, its presence does not guarantee that a school will be "leading edge." It is the USE of technology that determines the success of a school and the future success of its students. Too many IT directors bemoan the dusty smartboards and unused laptops . It is a never-ending hunger for bandwidth is driving the market. The exploding use of web video services, Web 2.0 and social networking sites and enterprise applications is filling fixed broadband access is access networks and backbones. Spare capacity is shrinking at the same time mobile Internet taking off and spreading like wildfire to the mass market, driven by Internet brousing.
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Our research shows that the personal computer remains the most used device for accessing the Internet at home. Yet, 13 percent of all Internet users in mature markets go online via a mobile phone when they are at home. In the near future, 44 percent of online users in mature markets and 54 percent in emerging markets will increase their existing (fixed) bandwidth.

Clear broadband trends are emerging. Any Communications Service Provider (CSP) broadband strategy will be based on one or more of three focal points - speed, simplicity and services . This shortrange wireless technology would potentially be a competitor or more than likely a replacement for WiFi, and things like Bluetooth might want to look out as well. The transfer speeds combined with the constantly increased storage capacities of small handheld devices could really take media down some new avenues as well. The Age newspaper uses an example of transferring a high-definition movie from a kiosk at a store to your mobile phone in seconds. Then that same movie can be transferred just as quickly from the phone to your home computer or entertainment system to watch. According to the U. of Melbourne, the chip is very small at only 5 millimeters per side, has a 1mm antenna, uses just two watts of power and they estimate it would cost less than $10 each to build. It also uses the 60GHz millimetre wave spectrum which is not as crowded as the spectrum that Wi-Fi uses, competing with things like cordless phones.The chip still has about a year of work left on it before it becomes a reality. Skafidas says they still needs to work on transceiver.

5.FEATURES

OF GIFI

1. Multi-gigabit wireless technology that removes the need for cables between consumer electronic devices. 2. More than 100 times faster than current short-raqnge wireless technologies. 3. Allows wireless streaming of uncompressed high-definition content. 4. Operates over a range of 10 metres without interference. 5. Entire transmission system can be built on a cost effective single silicon chip. 6. Operates in the unlicensed, 57-64 GHz spectrum band.

6. BENEFITS
1. Removes need for cables to connect consumer electronics devices 2. Low-cost chip allows technology to be readily incorporated into multiple devices 3. Secure encryption technology ensures privacy and security of content
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4. Simple connection improves the consumer experience 5. Enhancements to next generation gaming technology

7. USES OF GIFI
(A) Wireless video transmission using GiFi chip
Electrical Engineerings Professor Stan Skafidas (BE Elec. Eng) 1993; MEngSc 1996; PhD 1998) has successfully demonstrated a transmission of wireless video using the world-first Gigabit Wireless (GiFi) technology. The demonstration, attended by Victorian Government Minister for Innovation, Gavin Jennings earlier this year, was the first time it has been on public.display. The GiFi chip is the worlds first transceiver integrated on a single chip operating at 60GHz on the CMOS (complementary metaloxidesemiconductor) process, the most common semiconductor technology. The breakthrough will lead to wirelessly connected environments that will enjoy audio and video transfer rates of up to 5 gigabits per second, ten times the current maximum wireless transfer rate, at one-tenth the cost.

In the future, Gigabit wireless technology will be used to show DVD movies on High Definition Digital TV without a wired connection and for very fast downloads of content from devices such as PDAs, games consoles and wireless digital cameras.

The Gigabit Wireless Project was recently selected as a finalist in the INNOVIC 2009 Next Big Thing Award .

(B) For communication process

GiFi provides 5 Gbits per second it better be able to transmit 10 videos without buffer delays.

(C) GiFi wireless chip to bring 5Gb per second speed

The University of Melbourne announced on Friday a new technology they are calling GiFi, which promises some serious game-changing wireless transfer speeds for all types of consumer gadgets. The tiny silicon chip invented by professor Stan Skafidas is able to move data through the air as fast as 5 gigabits per second at a distance of just over 30 feet.

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This short-range wireless technology would potentially be a competitor or more than likely a replacement for WiFi, and things like Bluetooth might want to look out as well. The transfer speeds combined with the constantly increased storage capacities of small handheld devices could really take media down some new avenues as well. The Age newspaper uses an example of transferring a highdefinition movie from a kiosk at a store to your mobile phone in seconds. Then that same movie can be transferred just as quickly from the phone to your home computer or entertainment system to watch

(D) Provides high resolation

The higher megapixel count on our cameras, the increased bitrate on our music files, the higher resolution of our video files, and so on. We demand more than ever, but we also want this content to be transfered in the most expedient manner possible. 802.11g and 802.11n are fine and all, but some people want to push the envelope even further. Melbourne University researchers are working on a wireless chip that can effectively offer data speeds of up to 5 gigabits per second. This 5Gbps technology has been named GiFi and it seems to only be able to support that speed at a distance of up to 10 meters. This rate, however, would allow a fulllength high definition movie to be transferred between two devices in seconds. Seconds! The 5mm chip itself makes use of currently existing CMOS technology and would cost about $10 manufacture. GiFi operates over the 60GHz frequency, a band that has largely gone unused thus far.

(e)GiFinew wireless high speed communication standard

The Melbourne University-based laboratories (Australia) unveiled a new wireless technology called GiFi. This is a short range technology, effective within 10 meters. However it features impressive data transfer speeds 5 gigabits per second, it can transmit stream video online without buffer delays. The developers have already held a demo of GiFi in action. They introduced a 5-mm CMOS-chip that uses a one-millimeter antenna and consumes mere 2 Watt. GiFi works in 60 GHz spectrum and would have a production cost less than $10. The final GiFi version is expected in 2009 or later. The developers believe the new wireless technology will be widely applied in household electronics like TVs and mobile phones.

(F) Low power consumption

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Australian researchers from National ICT Australia (NICTA) have developed a lower power, shortrange chip for wireless communications that can achieve up to 5Gbps -- allowing them to transfer a complete DVD in a matter of seconds.

(G) Provides short-range wireless A new wireless technology has been developed that should serve as an extremely fast replacement for technologies such as Bluetooth and ultra-wideband (UWB), says Australian research group NICTA. Nicknamed GiFi, the process would use a chip (not pictured) that transmits at an extremely high 60GHz frequency versus the 5GHz used for the fastest forms of Wi-Fi. The sheer density of the signal would allow a chip to send as much as five gigabits per second. While the spectrum would limit the device to the same 33-foot range as Bluetooth or UWB, it could theoretically transfer an HD movie to a cellphone in seconds, the researchers claim. The technology could also be used for beaming full HD video in real-time and could be used by notebooks and other computers to wirelessly connect virtually all the expansion needed for a docking station, including a secondary display and storage. Mixing and signal filtering would keep the signal strong versus the longer-ranged but slower and more drop-prone Wi-Fi option of today. NICTA does not expect a production-grade chip to leave the development stage until early 2009 but notes that any future chip would likely cost about $10 or less to build. This and a small design would allow cellphones and other small devices to add the technology without significantly drive up the price, according to the company. The change opens the possibility of a successor to UWB and its related technology Wireless USB, which matches the same range but roughly the same 480Mbps peak speed of its wired equivalent.

(H) A Tiny GiFi Chip provides Big Wireless Capabilities

The "GiFi" chip, which measures 0.2 of an inch on each side, was developed at Melbourne Universitybased labs of the National Information and Communications Technology research center, The Age reported. The high transmission rate of the chip would make it possible, for example, to transfer a high-definition movie from a video kiosk to a mobile device in a few seconds. Skafidas and his team claim to be the first to demonstrate a working transceiver-on-a-chip that uses CMOS, or complementary metal oxide semiconductor. CMOS is a particular style of digital circuitry design used in microprocessors. The chip uses an antenna 0.04 of an inch wide, less than two watts of power, and would cost about $9.20 U.S. The device transmits over the 60-GHz spectrum, which the researchers said is nearly

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unused. Wi-Fi technology, in contrast, shares its spectrum with other devices such as cordless phones, which can cause disruptions. In addition, GiFi is faster than the average Wi-Fi device. However, Wi-Fi can transmit over longer distances. The chip is about a year away from being ready for market, Skafidas told the newspaper. As to its uses, the researcher said the processor could be used to transfer video and other data-intensive content between storage and display devices in the home. It also could be used to turn a mobile device into a "shopping cart" for digital movies and other content that could be bought elsewhere and played in the home.The 27-member team developing the new chip worked with companies such as IBM in the research.

8.FUTURE ASPECTS:
1. The GiFi team is looking for partners interested in commercialising its 60GHz chips 2. Demonstrations of the technology can be arranged showing the huge potential it has to change the way consumers use their in-home electronic devices 3. With growing consumer adoption of highdefinition television, the anticipated worldwide market for this technology is vast.

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9.Conclusion
GiFi is a wireless technology which promises high speed short range data transfers with speeds of upto 5 Gbps within a radius of 10 meters. The GiFi operates on the 60GHz frequency band. The Gifi measures 5mm square and it is manufactured using existing complementary metal-oxidesemiconductor (CMOS) technology. Two important characteristics of CMOS devices are high noise immunity and low static power consumption. The same GiFi system is currently used to print silicon chips. The GiFi Chip developed by the Australian researchers. GiFi allows a full-length high definition movie to be transferred between two devices in seconds. to the higher megapixel count on our cameras, the increased bitrate on our music files, the higher resolution of our video files, and so on. The GiFi chip is one of Australia's most lucrativee technology.

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10.Refrences
[1] J. N. Tsitsiklis, Decentralized detection, in Advances in Signal Processing, H.V.Poor and J. B. Thomas, Eds.JAI Press, 1993, vol. 2, pp. 297344. [2] R. R. Tenney and J. Sandell, N. R., Detection with distributed sensors, IEEE Transactions on Aerospace and Electronic Systems, vol. 17, pp. 501510, Aug 1981. [3] J.-F. Chamberland and V. Veeravalli, Asymptotic results for decentralized detection in power constrained wireless sensor networks, IEEE Journal on Selected Areas in Communications, vol. 22, no. 6, pp. 1007 1015, 2004. [4] S. Jayaweera, Large sensor system performance of decentralized detection in noisy, bandlimited channels, in Proc. Vehicular Technology Conference, 2005, vol. 2, May 2005, pp. 1096 1100. [5] T. Quek, M. Win, and M. Chiani, Distributed diversity in ultrawide bandwidth wireless sensor networks, in Proc. Vehicular Technology Conference, 2005, vol. 2, May 2005, pp. 1355 1359. [6] S. Wei, Spreading sequence-based non-coherent sensor fusion and its resulting large deviation exponents, in Proc. Acoustics, Speech and Signal Processing, 2007, vol. 3, 2007, pp. III177III180. [7] M. Gastpar and M. Vetterli, Source-channel communication in sensor networks, in 2nd International Workshop on Information Processing in Sensor Networks (IPSN03), L. J. Guibas and F. Zhao, Eds. New York: Springer, April 2003, vol. 2634, pp. 162177. [8] D. Cassioli, M. Win, and A. Molisch, The ultra-wide bandwidth indoor channel: from statistical model to simulations, IEEE Journal on Selected Areas in Communications, vol. 20, pp. 12471257, Aug. 2002. [9] http://www.dalsa.com/corp/markets/CCD_vs_CMOS.aspx [10] http://www.dalsa.com/shared/content/Photonics_Spectra_CCDvsCMOS_Litwiller.pdf [11] Alexander G. Dickinson et al., "Active pixel sensor and imaging system having differential mode", US 5631704 [12] Zimmermann, Horst (2000). Integrated Silicon Optoelectronics. Springer. ISBN 3540666621. [13] Lawrence T. Clark, Mark A. Beiley, Eric J. Hoffman, "Sensor cell having a soft saturation circuit"US 6133563 [1] [4] Kazuya Matsumoto et al., "A new MOS phototransistor operating in a non-destructive readout mode" Jpn. J. Appl. Phys. 24 (1985) L323 [15] a b Eric R. Fossum (1993), "Active Pixel Sensors: Are CCD's Dinosaurs?" Proc. SPIE Vol. 1900, p. 214, Charge-Coupled Devices and Solid State Optical Sensors III, Morley M. Blouke; Ed. [16] Peter J. W. Noble (Apr. 1968). Self-Scanned Silicon Image Detector Arrays. ED-15. IEEE. pp. 202209.
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[17] Savvas G. Chamberlain (December 1969). "Photosensitivity and Scanning of Silicon Image Detector Arrays". IEEE Journal of Solid-State Circuits SC-4 (6): 333342. [18] P. K. Weimer, W. S. Pike, G. Sadasiv, F. V. Shallcross, and L. Meray-Horvath (March 1969). "Multielement Self-Scanned Mosaic Sensors". IEEE Spectrum 6 (3): 5265.

doi:10.1109/MSPEC.1969.5214004. [19] R. Dyck and G. Weckler (1968). "Integrated arrays of silicon photodetectors for image sensing". IEEE Trans. Electron Devices ED-15 (4): 196201.

http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=1475068&isnumber=31645. [20] Richard F. Lyon (1981). "The Optical Mouse, and an Architectural Methodology for Smart Digital Sensors". In H. T. Kung, R. Sproull, and G. Steele. CMU Conference on VLSI Structures and Computations. Pittsburgh: Computer Science Press. [21] D. Renshaw, P. B. Denyer, G. Wang, and M. Lu (1990). "ASIC image sensors". IEEE International Symposium on Circuits and Systems 1990. [22] M. A. Mahowald and C. Mead (12 May 1989). "The Silicon Retina". Scientific American 264 (5): 7682. doi:10.1038/scientificamerican0591-76. PMID 2052936. [23] D. Passeri et al. (May 2010). "Characterization of CMOS Active Pixel Sensors for particle detection: Beam test of the four-sensors RAPS03 stacked system". Nuclear Instruments and Methods in Physical Research A 617 (1-3): 573-375. doi:10.1016/j.nima.2009.10.067.

http://meroli.web.cern.ch/meroli/CharacterizationofCMOSActivePixelSensors.html. [24] F. Taghibakhsh and k. S. Karim (2007). "Two-Transistor Active Pixel Sensor for High Resolution Large Area Digital X-Ray Imaging". IEEE International Electron Devices Meeting: 10111014.

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