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U.S. patent 7115021: Abrasive, method of polishing target member and process for producing semiconductor device. Granted to Yoshida et. al. (7 total) on 2006-10-03 (filed 2002-01-11) and assigned to Hitachi Chemical Company, Ltd.. Currently involved in at least 1 patent litigation: Hitachi Chemical Co., Ltd. v. K.C. Tech Co., Ltd. (Texas). See http://news.priorsmart.com for more info.
Judul Asli
Abrasive, method of polishing target member and process for producing semiconductor device (US patent 7115021)
U.S. patent 7115021: Abrasive, method of polishing target member and process for producing semiconductor device. Granted to Yoshida et. al. (7 total) on 2006-10-03 (filed 2002-01-11) and assigned to Hitachi Chemical Company, Ltd.. Currently involved in at least 1 patent litigation: Hitachi Chemical Co., Ltd. v. K.C. Tech Co., Ltd. (Texas). See http://news.priorsmart.com for more info.
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Public Domain
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Unduh sebagai PDF, TXT atau baca online dari Scribd
U.S. patent 7115021: Abrasive, method of polishing target member and process for producing semiconductor device. Granted to Yoshida et. al. (7 total) on 2006-10-03 (filed 2002-01-11) and assigned to Hitachi Chemical Company, Ltd.. Currently involved in at least 1 patent litigation: Hitachi Chemical Co., Ltd. v. K.C. Tech Co., Ltd. (Texas). See http://news.priorsmart.com for more info.
Hak Cipta:
Public Domain
Format Tersedia
Unduh sebagai PDF, TXT atau baca online dari Scribd