2
0
0
5
I
n
n
o
v
a
t
i
v
e
E
l
e
c
t
r
o
n
i
c
s
TIANMA MICROELECTRONICS CO., LTD
1/22
REVISION RECORD
Date Ref. Page Revision No. Revision Items
Check &
Approval
1. General Specifications:
1.1 Display type: STN
1.2 Display color*:
Display color: Blue-Black
Background: Yellow-Green
1.3 Polarizer mode: TransIlective/Positive
1.4 Viewing Angle: 6:00
1.5 Driving Method: 1/16 Duty 1/5 Bias
1.6 Backlight: LED
1.7 Controller: S6A0069X01-C0CX (KS0066UP-00CC)
1.8 Display Fonts: 5 x 7 dots 5 x 1 Cursor (1 Character)
1.9 Data TransIer: 8 Bit Parallel
1.10 Operating Temperature: 0----50
Storage Temperature: -20----60
1.11 Outline Dimensions: ReIer to outline drawing on next page
1.12 Dot Matrix: 16 Characters X 2 Lines
1.13 Dot Size: 0.55X0.50(mm)
1.14 Dot Pitch: 0.60X0.55 (mm)
1.15 Font Size: 2.95X4.35(mm)
1.16 Font Pitch: 3.65X5.05 (mm)
1.17 Weight: 32g
3/22
2. Outline Drawing
T M 1 6 2 A B C 6 - 2
OPTIONAL IC INDICATOR
(EOR EACTORY USE)
MODIEICATION CODE DESIGNATOR
BACKLIGHT TYPE
C: TRANSELECTIVE,
LED BACKLIGHT
LCD TYPE
B: Y-G MODE STN, POSITIVE
MODULE SERIES
MODULE TYPE
3 DIGITS INDICATING 16
CHARACTERS X 2 LINES
T: TIANMA
M: MODULE
5/22
4. Circuit Block Diagram
6/22
5. Absolute Maximum Ratings
Item Symbol Min. Max. Unit Remark
Power Supply Voltage V
DD
V
SS
-0.3 7.0
LCD Driving Voltage V
LCD
-0.3 13.0
V
Operating Temperature
Range
T
OP
0 50
Storage Temperature
Range
T
ST
-20 60
No
Condensation
7/22
6. Electrical Specifications and Instruction Code
6.1 Electrical characteristics
Item Symbol Min. Typ. Max. Unit
Supply Voltage
(Logic)
VCC VSS
4.5 5.0 5.5 V
Supply Voltage
(LCD Drive)
VLCD
- 4.7 - V
High
V
V
CC
5.0
0.7V
DD
- V
DD
0.3 V
Input
Signal
Voltage
Low
V
V
CC
5.0
-0.3 -
0.2V
DD
V
Supply current
(Logic)
I
VCC VSS
5.0
- 1.5 -
mA
Supply current
(LCD Drive)
I
- 0.40 -
mA
Supply current
(LED Drive)
I
VLED
4.2
- - 138.6
mA
8/22
6.2 InterIace Signals
Pin No. Symbol Level Description
1 Vss 0V Ground
2 Vcc 5.0V Power supply voltage Ior logic and LCD()
3 Vee 0.3V Power supply voltage Ior LCD(-)
4 RS H/L Selects registers (H: Data L: Instruction)
5 R/W H/L Selects read or write
6 E H/L Data read/write enable signal
7 DB0 H/L Data bit0
8 DB1 H/L Data bit1
9 DB2 H/L Data bit2
10 DB3 H/L Data bit3
11 DB4 H/L Data bit4
12 DB5 H/L Data bit5
13 DB6 H/L Data bit6
14 DB7 H/L Data bit7
!
A 4.2V Power supply voltage Ior LED()
7
Mode Characteristic SymboI Min. Typ. Max. Unit
Write Mode
(Refer to Fig-6)
E Cycle Time tc 500 - -
ns
E Rise / Fall Time t
R
,t
F
- - 20
E Pulse Width (High, Low) tw 230 - -
R/W and RS Setup Time tsu1 40 - -
R/W and RS Hold Time t
H1
10 - -
Data Setup Time tsu2 80 - -
Data Hold Time t
H2
10 - -
Read Mode
(Refer to Fig-7)
E Cycle Time tc 500 - -
ns
E Rise / Fall Time t
R
,t
F
- - 20
E Pulse Width (High, Low) tw 230 - -
R/W and RS Setup Time tsu 40 - -
R/W and RS Hold Time t
H
10 - -
Data Output Delay Time t
D
- - 120
Data Hold Time t
DH
5 - -
NOTE: When an MPU program with checking the Busy Flag(DB7) is made, it must be necessary 1/2Fosc is
necessary for executing the next instruction by the falling edge of the 'E' signal after the Busy Flag (DB7)
goes to "Low.
Instruction TabIe
Instruction
Instruction Code
Description
Execution
time (fosc=
270 kHz)
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Clear
Display
0 0 0 0 0 0 0 0 0 1
Write "20H to DDRAM and set
DDRAM address to "00H from AC
1.53 ms
Return
Home
0 0 0 0 0 0 0 0 1 -
Set DDRAM address to "00H
from AC and return cursor to its
original position if shifted.
The contents of DDRAM are not
changed.
1.53 ms
Entry Mode
Set
0 0 0 0 0 0 0 1 /D SH
Assign cursor moving direction
and enable the shift of entire display.
39 Ps
Display ON/
OFF Control
0 0 0 0 0 0 1 D C B
Set display(D), cursor(C),
and blinking of cursor(B) on/off
control bit.
39 Ps
Cursor or
Display
Shift
0 0 0 0 0 1 S/C R/L - -
Set cursor moving and display
shift control bit, and the direction,
without changing of DDRAM data.
39 Ps
Function Set 0 0 0 0 1 DL N F - -
Set interface data length (DL:
8-bit/4-bit), numbers of display line
(N: 2-line/1-line) and, display
font type (F:5u11dots/5u8 dots)
39 Ps
Set CGRAM
Address
0 0 0 1 AC5 AC4 AC3 AC2 AC1 AC0
Set CGRAM address in address
counter.
39 Ps
Set DDRAM
Address
0 0 1 AC6 AC5 AC4 AC3 AC2 AC1 AC0
Set DDRAM address in address
counter.
39 Ps
Read Busy
Flag and
Address
0 1 BF AC6 AC5 AC4 AC3 AC2 AC1 AC0
Whether during internal operation
or not can be known by reading BF.
The contents of address counter
can also be read.
0 Ps
Write Data to
RAM
1 0 D7 D6 D5 D4 D3 D2 D1 D0
Write data into internal RAM
(DDRAM/CGRAM).
43 Ps
Read Data
from RAM
1 1 D7 D6 D5 D4 D3 D2 D1 D0
Read data from internal RAM
(DDRAM/CGRAM).
43 Ps
* "-": don't care
C2
0 -30 -- 30
Deg
Contrast Ratio C
0
0
4.0 - -
Turn
on
T - - 250
Response
Time
Turn
oII
T
0
0
- - 250
ms
14/22
7.2 DeIinition oI Optical Characteristics
7.2.1 DeIinition oI Viewing Angle
Top Top
Bottom Bottom
7.2.2 DeIinition oI Contrast Ratio
brightness state selected
brightness state unselected
B2/B1 Ratio Contrast
Measuring Conditions:
1) Ambient Temperature: 25 ; 2) Frame Irequency: 64Hz
7.2.3 DeIinition oI Response time
Turn on time:
d
r
Turn oII time:
d
I
Measuring Condition:
1) LCD Operating Voltage: 4.7V 2) Frame Irequency: 64Hz
15/22
8. Reliability
8.1 Content oI Reliability Test Ta25
No. Test Item Content oI Test
Test condition
1
High Temperature
Storage
Endurance test applying the high
storage temperature Ior a long time
60
96H
2
Low Temperature
Storage
Endurance test applying the low
storage temperature Ior a long time
-20
96H
3
High Temperature
Operation
Endurance test applying the
electric stress (voltage current)
and the thermal stress to the
element Ior a long time
50
96H
4
Low Temperature
Operation
Endurance test applying the
electric stress under low
temperature Ior a long time
0
96H
5
High Temperature
/Humidity Storage
Endurance test applying the high
temperature and high humidity
storage Ior a long time
40
90RH
96H
6
Temperature
Cycle
Endurance test applying the low
and high temperature cycle
-20 25 60 25
30min 5min 30min 5min
1 cycle
-20 /60
10 cycles
7
Vibration Test
(package state)
Endurance test applying the
vibration during transportation
10Hz~150Hz,
50m/s
2
,
40min
8
Shock Test
(package state)
Endurance test applying the shock
during transportation
HalI- sine wave,
100m/s
2
,
11ms
9
Atmospheric
Pressure Test
Endurance test applying the
atmospheric pressure during
transportation by air
40kPa
16H
16/22
8.2 Failure Judgment Criterion
Test Item No.
Criterion
Item
1 2 3 4 5 6 7 8 9
Failure Judgement Criterion
Basic
SpeciIication
Out oI the basic SpeciIication
Electrical
speciIication
Out oI the electrical
speciIication
Mechanical
SpeciIication
Out oI the mechanical
speciIication
Optical
Characteristic
Out oI the optical speciIication
Note For test item reIer to 8.1
Remark
Basic speciIication Optical speciIication Mechanical
speciIication
17/22
9. QUALITY LEVEL
Inspection
Examination
or Test
At Ta25
(unless otherwise stated)
Min. Max. Unit IL AQL
External
Visual
Inspection
Under normal illumination
and eyesight condition, the
distance between eyes and
LCD is 25cm.
See Appendix A II
Major
1.0
Minor
2.5
Display
DeIects
Under normal illumination
and eyesight condition,
display on inspection.
See Appendix B II
Major
1.0
Minor
2.5
Note: Major deIects: Open segment or common, Short, Serious damages, Leakage
Miner deIects: Others
Sampling standard conIorms to GB2828
18/22
10. Precautions for Use of LCD Modules
10.1 Handling Precautions
10.1.1 The display panel is made oI glass. Do not subject it to a mechanical
shock by dropping it Irom a high place, etc.
10.1.2 II the display panel is damaged and the liquid crystal substance inside it
leaks out, be sure not to get any in your mouth, iI the substance comes
into contact with your skin or clothes, promptly wash it oII using soap
and water.
10.1.3 Do not apply excessive Iorce to the display surIace or the adjoining areas
since this may cause the color tone to vary.
10.1.4 The polarizer covering the display surIace oI the LCD module is soIt and
easily scratched. Handle this polarizer careIully.
10.1.5 II the display surIace is contaminated, breathe on the surIace and gently
wipe it with a soIt dry cloth. II still not completely clear, moisten cloth
with one oI the Iollowing solvents:
Isopropyl alcohol
Ethyl alcohol
Solvents other than those mentioned above may damage the polarizer.
Especially, do not use the Iollowing:
Water
Ketone
Aromatic solvents
10.1.6 Do not attempt to disassemble the LCD Module.
10.1.7 II the logic circuit power is oII, do not apply the input signals.
10.1.8 To prevent destruction oI the elements by static electricity, be careIul to
maintain an optimum work environment.
a. Be sure to ground the body when handling the LCD Modules.
b. Tools required Ior assembly, such as soldering irons, must be properly
ground.
c. To reduce the amount oI static electricity generated, do not conduct
assembly and other work under dry conditions.
d. The LCD Module is coated with a Iilm to protect the display surIace.
Be care when peeling oII this protective Iilm since static electricity may
be generated.
19/22
10.2 Storage precautions
10.2.1 When storing the LCD modules, avoid exposure to direct sunlight or to
the light oI Iluorescent lamps.
10.2.2 The LCD modules should be stored under the storage temperature range.
II the LCD modules will be stored Ior a long time, the recommend
condition is:
Temperature : 0 40
Relatively humidity: 80
10.2.3 The LCD modules should be stored in the room without acid, alkali and
harmIul gas.
10.3 The LCD modules should be no Ialling and violent shocking during
transportation, and also should avoid excessive press, water, damp and
sunshine.
20/22
Appendix A
Inspection items and criteria Ior appearance deIects
21/22
Appendix B
Inspection items and criteria Ior display deIects
Items Contents Criteria
Open segment or open common Not permitted
Short Not permitted
Wrong viewing angle Not permitted
Contrast radio uneven According to the limit specimen
Crosstalk According to the limit specimen
Not counted Max.3 dots allowed
X0.1mm 0.1mm X 0.2mm
X(ab)/2
Not counted Max.2 dots allowed
Pin holes
and cracks
in segment
(DOT)
A0.1mm
0.1mm A 0.2mm
D0.25mm
Max.3
dots
allowed
Not counted Max.3 spots allowed
X0.1mm 0.1mm X 0.2mm
Black spot
(in viewing
area)
X(ab)/2
Not counted Max.3 lines allowed
Black line
(in viewing
area)
a0.02mm
0.02mm a 0.05mm
b 0.5mm
Max.3
spots
(lines)
allowed
22/22
Appendix B
Inspection items and criteria Ior display deIects (continued)
Items Content Criteria
Not counted Max. 2 deIects allowed
x 0.1mm 0.1mm x 0.2mm
x(ab)/2
Not counted Max. 1 deIects allowed
a 0.1mm
0.1mm a 0.2mm
D~0
Max.3
deIects
allowed
TransIor-
mation
oI segment
Max.2 deIects allowed
0.8W a 1.2W
ameasured value oI width
Wnominal value oI width
MAX232, MAX232I
DUAL EIA232 DRIVERS/RECEIVERS
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (N) Tube of 25 MAX232N MAX232N
SOIC (D)
Tube of 40 MAX232D
MAX232
0C to 70C
SOIC (D)
Reel of 2500 MAX232DR
MAX232
0C to 70C
SOIC (DW)
Tube of 40 MAX232DW
MAX232 SOIC (DW)
Reel of 2000 MAX232DWR
MAX232
SOP (NS) Reel of 2000 MAX232NSR MAX232
PDIP (N) Tube of 25 MAX232IN MAX232IN
SOIC (D)
Tube of 40 MAX232ID
MAX232I
40C to 85C
SOIC (D)
Reel of 2500 MAX232IDR
MAX232I
40 C to 85 C
SOIC (DW)
Tube of 40 MAX232IDW
MAX232I SOIC (DW)
Reel of 2000 MAX232IDWR
MAX232I
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinASIC is a trademark of Texas Instruments.
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
V
S+
C1
C2+
C2
V
S
T2OUT
R2IN
V
CC
GND
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
MAX232 . . . D, DW, N, OR NS PACKAGE
MAX232I . . . D, DW, OR N PACKAGE
(TOP VIEW)
MAX232, MAX232I
DUAL EIA232 DRIVERS/RECEIVERS
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of T
J
(max),
JA
, and T
A
. The maximum allowable power dissipation at any allowable
ambient temperature is P
D
= (T
J
(max) T
A
)/
JA
. Operating at the absolute maximum T
J
of 150C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN NOM MAX UNIT
V
CC
Supply voltage 4.5 5 5.5 V
V
IH
High-level input voltage (T1IN,T2IN) 2 V
V
IL
Low-level input voltage (T1IN, T2IN) 0.8 V
R1IN, R2IN Receiver input voltage 30 V
T
A
Operating free-air temperature
MAX232 0 70
C T
A
Operating free-air temperature
MAX232I 40 85
C
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYP
MAX UNIT
I
CC
Supply current
V
CC
= 5.5 V,
T
A
= 25C
All outputs open,
8 10 mA
MAX UNIT
V
OH
High-level output voltage T1OUT, T2OUT R
L
= 3 k to GND 5 7 V
V
OL
Low-level output voltage
T1OUT, T2OUT R
L
= 3 k to GND 7 5 V
r
o
Output resistance T1OUT, T2OUT V
S+
= V
S
= 0, V
O
= 2 V 300
I
OS
The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage
levels only.
MAX UNIT
V
OH
High-level output voltage R1OUT, R2OUT I
OH
= 1 mA 3.5 V
V
OL
Low-level output voltage
R1OUT, R2OUT I
OL
= 3.2 mA 0.4 V
V
IT+
Receiver positive-going input
threshold voltage
R1IN, R2IN V
CC
= 5 V, T
A
= 25C 1.7 2.4 V
V
IT
Receiver negative-going input
threshold voltage
R1IN, R2IN V
CC
= 5 V, T
A
= 25C 0.8 1.2 V
V
hys
Input hysteresis voltage R1IN, R2IN V
CC
= 5 V 0.2 0.5 1 V
r
i
Receiver input resistance R1IN, R2IN V
CC
= 5, T
A
= 25C 3 5 7 k
The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage
levels only.
NOTE 4: Test conditions are C1C4 = 1 F at V
CC
= 5 V 0.5 V.
switching characteristics, V
CC
= 5 V, T
A
= 25C (see Note 4 and Figure 1)
PARAMETER TYP UNIT
t
PLH(R)
Receiver propagation delay time, low- to high-level output 500 ns
t
PHL(R)
Receiver propagation delay time, high- to low-level output 500 ns
NOTE 4: Test conditions are C1C4 = 1 F at V
CC
= 5 V 0.5 V.
MAX232, MAX232I
DUAL EIA232 DRIVERS/RECEIVERS
C1
C2
C3
C4
C3 can be connected to V
CC
or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
+
Figure 4. Typical Operating Circuit
MECHANICAL
MPDI002C JANUARY 1995 REVISED DECEMBER 20002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE
BB AC AD
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
Gauge Plane
0.015 (0,38)
0.430 (10,92) MAX
20
1.060
(26,92)
0.940
(23,88)
18
0.920
0.850
14
0.775
0.745
(19,69)
(18,92)
16
0.775
(19,69)
(18,92)
0.745
A MIN
DIM
A MAX
PINS **
(23,37)
(21,59)
Seating Plane
14/18 PIN ONLY
20 pin vendor option
4040049/E 12/2002
9
8
0.070 (1,78)
A
0.045 (1,14)
0.020 (0,51) MIN
16
1
0.015 (0,38)
0.021 (0,53)
0.200 (5,08) MAX
0.125 (3,18) MIN
0.240 (6,10)
0.260 (6,60)
M 0.010 (0,25)
0.100 (2,54)
16 PINS SHOWN
MS-100
VARIATION
AA
C
D
D
D
0.030 (0,76)
0.045 (1,14)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001, except 18 and 20 pin minimum body lrngth (Dim A).
D. The 20 pin end lead shoulder width is a vendor option, either half or full width.
MECHANICAL DATA
MSOI002B JANUARY 1995 REVISED SEPTEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
8
0.197
(5,00)
A MAX
A MIN
(4,80)
0.189 0.337
(8,55)
(8,75)
0.344
14
0.386
(9,80)
(10,00)
0.394
16
DIM
PINS **
4040047/E 09/01
0.069 (1,75) MAX
Seating Plane
0.004 (0,10)
0.010 (0,25)
0.010 (0,25)
0.016 (0,40)
0.044 (1,12)
0.244 (6,20)
0.228 (5,80)
0.020 (0,51)
0.014 (0,35)
1 4
8 5
0.150 (3,81)
0.157 (4,00)
0.008 (0,20) NOM
0 8
Gage Plane
A
0.004 (0,10)
0.010 (0,25) 0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
MECHANICAL DATA
MSOI003E JANUARY 1995 REVISED SEPTEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
16 PINS SHOWN
0.419 (10,65)
0.400 (10,15)
0.291 (7,39)
0.299 (7,59)
16
0.400
(10,16)
A MIN
A MAX
(10,41)
0.410 0.462
(11,73)
(11,51)
0.453
18
0.610
(15,49)
(15,24)
0.600
24
DIM
PINS **
4040000/E 08/01
0.104 (2,65) MAX
0.004 (0,10)
0.012 (0,30)
Seating Plane
0 8
0.016 (0,40)
0.050 (1,27)
16
0.050 (1,27)
1
A
8
9
0.014 (0,35)
0.020 (0,51)
0.010 (0,25) NOM
Gage Plane
0.010 (0,25)
28
0.710
(18,03)
0.700
(17,78) (12,70)
(12,95)
0.500
20
0.510
0.010 (0,25)
0.004 (0,10)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-013
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DSP dsp.ti.com Broadband www.ti.com/broadband
Interface interface.ti.com Digital Control www.ti.com/digitalcontrol
Logic logic.ti.com Military www.ti.com/military
Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork
Microcontrollers microcontroller.ti.com Security www.ti.com/security
Telephony www.ti.com/telephony
Video & Imaging www.ti.com/video
Wireless www.ti.com/wireless
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PROFILE PENULIS
ADIB KARISMA PUTRA
Penyusun lahir di Madiun, pada tanggal 7
Juni 1984. Sebagai anak pertama dari 3
bersaudara seorang ibu bernama Sri
Handayani dan ayah bernama Waris Susanto.
Saat ini bertempat tinggal di Jl Raya
Ponorogo No. 56, Geger, Madiun.
Riwayat pendidikan formal yang pernah ditempuh:
SD Negeri 1 Slambur, Geger, Madiun lulus tahun 1997.
SMP Negeri 1 Geger, Madiun lulus tahun 2000.
SMK Telekomunikasi Darul Ulum Jombang lulus tahun
2003.
D3 Jurusan Telekomunikasi, Politeknik Elektronika
Negeri Surabaya, Institut Teknologi Sepuluh Nopember
Surabaya (ITS).
Pada tanggal 2 Agustus 2003 mengikuti Seminar Proyek Akhir
sebagai salah satu persyaratan untuk mendapatkan gelar Ahli
Madya (A.Md.) di Politeknik Elektronika Negeri Surabaya,
Institut Teknologi Sepuluh Nopember Surabaya (ITS).