website:http://biz.LGservice.com
MODELO : 32LG60UR
ATENCIN
32LG6U0R-MA
Antes de dar servicio al chasis, lea las PRECAUCIONES DE SEGURIDAD en este manual.
CONTENTS
CONTENTS .............................................................................................. 2 SAFETY PRECAUTIONS ..........................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION .................................................................9 TROUBLE SHOOTING ............................................................................14 BLOCK DIAGRAM...................................................................................19 EXPLODED VIEW .................................................................................. 20 EXPLODED VIEW PARTS LIST ..............................................................21 REPLACEMENT PARTS LIST ............................................................... 22 SVC. SHEET ...............................................................................................
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
-2-
SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Replacement Parts List. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
AC Volt-meter
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
1.5 Kohm/10W
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500F to 600F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500F to 600F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500F to 600F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
-4-
IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
-5-
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This specification is applied to LP81A chassis.
3. Test method
(1) Performance : LGE TV test method followed (2) Demanded other specification Safety : CE, IEC Specification EMC : CE, IEC
St-By (Red) 1.0 W (All) LCD Module (Maker : AUO, CMO, CPT, LPL, SHARP) Maker CMO(HD)
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
-6-
5. Model Specification
Item Market Broadcasting system Available Channel Specification Central and South America PAL SECAM B/G/D/K, PAL I/II, NTSC-M BAND VHF UHF CATV Receiving system Video Input (2EA) AV Output (1EA) S-Video Input (1EA) Component Input (2EA) RGB Input (1EA) HDMI Input 2EA 3EA Audio Input (5EA) RS-232C USB Input PC Audio, Component (2EA), AV (2EA) Remote control, Commercial Divx, MP3, JPEG NTSC 2~13 14~69 1~125 Remark
Upper Heterodyne NTSC, PAL-M/N NTSC, PAL-M/N NTSC, PAL-M/N Y/Cb/Cr, Y/ Pb/Pr RGB-PC, S/W Upgrade HDMI-DTV, Only PCM MODE Rear 1EA, Side 1EA Rear Side (S-Video Priority) Rear Rear LG30 Tool, 32LG60 LG50, LG70 Tool L/R Input Side(1EA)-LG30 Tool only (LG50, LG60, LG70 not Support) Side(1EA) - LG60, LG70 Tool Only (LG30, LG50 Not Support)
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
-7-
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
-8-
ADJUSTMENT INSTRUCTION
1. Application Range
This spec. sheet is applied all of the 32/37/42/47/52 LCD TV, LP81A chassis (HURRICANE 5) by manufacturing LG TV Plant all over the world. (2) Click the connect button and confirm Dialog Box.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. 2) Adjustment must be done in the correct order. 3) The adjustment must be performed in the circumstance of 255C of temperature and 6510% of relative humidity if there is no specific designation. 4) The input voltage of the receiver must keep 100-220V, 50/60Hz. 5) Before adjustment, execute Heat-Run for 15 minutes at RF no signal.
(3) Click the Config button and Change speed E2PROM Device setting : over the 350Khz
(4) Read and write bin file Click (1)Read tab, and then load download file(XXXX.bin) by clicking Read.
(1)
- FHD
f i l ex x x .bi n
(5).Click Auto(2) tab and set as below (6).click Run(3). (7).After downloading, check OK(4) message.
(2) f i l ex x x .bi n (4) .......... OK
Double click
(3)
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
-9-
(1) Confirmation - We confirm whether 0xF1 (offset), 0xF2 (gain) address of EEPROM 0xBC is 0xAA or not. - If 0xF1, 0xF2 address of EEPROM 0xBC isnt 0xAA, we adjust once more - We can confirm the ADC values from 0x00~0x05 addresses in a page 0xBC * Manual ADC process using Service Remocon. After enter Service Mode by pushing ADJ key, execute Auto-RGB by pushing _ key at Auto-RGB.
- Adjust by commanding AUTO_COLOR_ADJUST (0xF1) 0x00 0x02 instruction 3) Select Start Button and press ok button Updating is staring. (2) Confirmation - We confirm whether 0xF3 (offset), 0xF4 (gain) address of EEPROM 0xBC is 0xAA or not. - If 0xF3, 0xF4 address of EEPROM 0xBC isnt 0xAA, we adjust once more. - We can confirm the ADC values from 0x06~0x0B addresses in a page 0xBC. * Manual ADC process using Service Remocon. After enter Service Mode by pushing ADJ key, execute Auto-RGB by pushing _ key at Auto-RGB.
4) Finishing the version updating, you have to put out USB stick and AC Power off. 5) After putting AC Power on and check updated version on your TV.
** TOOL Option, Area Option change and AC off Before PCBA check, you have to change the Tool option, Area option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally)
4. ADC Process
* Required Equipments - Remote controller for adjustment - MSPG-925F Pattern Generator
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 10 -
6. EDID (The Extended Display Identification Data ) /DDC (Display Data Channel) download
* Caution Use the proper signal cable for EDID Download
- Detail EDID Options are below (A, B, C, D, E, F) A. Product ID B. Serial No: Controlled on production line C. Month, Year: Controlled on production line: ex) Monthly: 09 09 Year: 2007 11 D. Model Name(Hex):
Model name Model Name(HEX) LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
D D E
<HDMI 1 : 256bytes> / <HDMI 2 : 256bytes> The data is same without Physical address
A C B
D D E
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 11 -
(1) Enter the adjustment mode of DDC - Set command delay time : 50ms - Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run (Maintain after AC off/on in status of Heat-run pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode (3) Enter the adjust mode of white balance - Enter the white balance adjustment mode with aging command(F3, 00, FF) * Luminance min value is 200cd/m2 in the cool mode (For LCD)
(3) x > target , y < target 1) First decrease B, so make y a little more than the target. 2) Adjust x value by decreasing the R (4) x < target , y > target 1) First decrease B, so make x a little more than the target. 2) Adjust x value by decreasing the G
- Standard color coordinate and temperature when using the CA100+ or CA210 equipment
Mode Color coordinate X Cool Warm 0.2760.002 0.3130.002 Y 0.2830.002 0.3290.002 11,000K 0.000 6,500K 0.003 Temp uv
0x21 : AV2 0x40 : Component1 0x41 : Component2 0x60 : RGB 0x90 : HDMI1 0x91 : HDMI2 R GAIN G GAIN B GAIN R GAIN G GAIN B GAIN R GAIN G GAIN B GAIN CSM mode 16 18 1A 16 18 1A 16 18 1A F2 00 02 01 00 00 - C0 00 - C0 00 - C0 00 - C0 00 - C0 00 - C0 00 - C0 00 - C0 00 - C0 00 01 02 AUTO ADC F1 00 0, 1, 2 COOL NORMAL WARM 0: Offset adjustment 1: Gain adjustment 2: Offset and Gain adjustment EEPROM Read EEPROMWrite E7 E8 00 00 00 data EEPROM read EEPROM write GAIN adjustment CSM WARM GAIN adjustment CSM NORMAL GAIN adjustment CSM COOL
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 12 -
Delay 20m
LEN : 84h+Bytes CMD : E8h ADH : E2PROM Slave Address (A0,A2,A4,A6), Not 00h (Reserved by BufferToEEPROM) ADL : E2PROM Sub Address(00~FF) Data : Write data Delay : 20ms (2) Command Set
Adjustment contents EEPROM WRITE CMD(hex) E8h LEN 94 (84+n)h Details 16-Byte Write n-byte Write
* Purpose 1) EDID write : 16-byte by 16-byte, 8 order (128-byte) write(TO 00 7F of EEPROM Page A4). 2) FOS Default write : 14-mode data write (SyncFlags, HPeriodH, HPeriodL, VtotalH, VtotalL, SrcHTotalH, SrcHTotalL, SrcHStartH, SrcHStartL, SrcVStartH, SrcVStartL, HsyncPhase). 3) Random Data write : write the appointment Address of E2PROM. (3) E2PROM Data Read 1) Signal TABLE
Delay 150ms
128 Bytes
2) COMMAND SET
Adjustment contents CMD(hex) ADH(hex) ADL(hex) EEPROM READ E7 A0 0 80 A2 0 80 A4 0 80 A6 0 80 Details 0-Page 0~7F Read 0-Page 80~FF Read 1-Page 0~7F Read 1-Page 80~FF Read 2-Page 0~7F Read 2-Page 80~FF Read 3-Page 0~7F Read 3-Page 80~FF Read
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 13 -
TROUBLESHOOTING
1. No power
(1) Symptom
1) It is not discharged minutely from module. 2) Light does not come into the front LED.
No
Yes
No
Yes
No
Yes
No
Yes
After all cables connect is removed to PSU, the AC voltage marking is authorized on manual. When ST-BY 5V is not operated. replace PSU.
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 14 -
2. No Raster
(1) Symptom
1) No OSD and image occur at screen. 2) It maintains the condition where the front LED is green.
No
Yes
No
No
Yes
Block A
Is the LVDS Cable connected? well Yes No Cable inserts well.
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
Yes
Same as Block A.
Yes
Same as Block A.
Yes
Same as Block A.
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 16 -
Yes
Change IC801.
Yes
Change IC801.
Yes
Change IC801.
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 17 -
10. No Sound
(1) Symptom
1) LED is green 2) Screen display but sound is not output.
No
No
Yes
Yes
No
No
Yes
Yes
No
No Replace IC600
Yes
No Replace IC801
Yes
No Replace IC601
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 18 -
RF (Tuner)
MAIN NVM x0.55 PART_I2C x4 LINE OUT LINE OUT CVBS IN Y/C IN x0.55 LINE_MUTE Mstar Romeo LGE6891CD AUDIO_SW LINE IN LVDS x0.55 S_VIDEO_DET LM324 X4 AMP SERIAL FLASH DDR MEM
TUNER_I2C CVBS IN
LINE IN
SIF IN CVBS IN
AV1 in
LINE IN
CVBS OUT
AV out
LINE_MUTE
DISPLAY MODULE
Y/Pb/Pr IN
LINE IN
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
x0.55 ROM_I2C DSUB_DDC x0.55 LINE IN UART_Rx/Tx HDMI_SEL PART_I2C SW_RESET I2S OUT MC74HC4066 Audio SW
Comp1 in
Y/Pb/Pr IN
LINE IN
Comp2 in
LINE IN
RGB in (D/L)
R/G/B/HS/VS IN
BLOCK DIAGRAM
- 19 TMDS(HDMI in) DDC/HPD/CEC [CEC not through HDMI MUX, direct JACK to MAIN IC] EDID NVM DDC EDID NVM MPEG RX/TX MPEG RESET I2S IN 656 IN
PC Audio in
EDID NVM
RS-232C
Rx/Tx
MX3232
TMDS(HDMI in)
HDMI1
HDMI2
DDC
DDC/HPD/CEC
DDC
HDMI3
TMDS(HDMI in)
DDC/HPD/CEC
USB
+5V
BD2041 Protect IC
EXPLODED VIEW
521
400
821
540
803
910 804 530 802 200N 560 500 122 120 123 510 801 532 535 550 805 900
200T 200
800
Copyright 2008 LG Electronics. Inc. All right reserved. Only for training and service purposes
300
121
- 20 -
COMPONENT1
[RD]O_SPRING 3E [RD]CONTACT 4E [RD]1P_CAN2 2E [WH]C_LUG_L 5D [WH]1P_CAN 2D [RD]C_LUG_L 5C [RD]1P_CAN1 2C [BL]C_LUG_L 5B [BL]1P_CAN 2B [GN]O_SPRING 3A [GN]CONTACT 4A [GN]1P_CAN 2A
D119 SD05 R123 75
D118 SD05 R122 75 D116 5.6V
R147 0 R146 0
JK100 PPJ209-02
R138
C113 1000pF READY
COMPONENT2
3E [RD]O_SPRING
D103 5.6V
R106 220K
R148 0 C115 1000pF READY
JK103 KCN-DS-1-0088
COMP1_R
COMP2_R +5V_ST
D115 5.6V
R119 220K
4E [RD]CONTACT 2E [RD]1P_CAN2
1
C110 0.1uF 16 15 14 13 12 11 10 9 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 R130 100 C111 OPT D120 CDS3C30GTH 30V
IC101 MAX3232CDR
R149 0
6 2 7 3 8
IR_OUT
R140 10K
C114 1000pF READY
5D [WH]C_LUG_L
COMP1_L
R141 12K
R120 220K
D104 5.6V
R108 220K
SIGN1420
COMP2_L
C1+ V+ C1C2+
1 2 3 4 5 6 7 8
C107 0.1uF
COMP1_Pr
D117 SD05
R121 75
COMP2_Pr
D105 SD05 R109 75
C106 0.1uF
C2V-
2C 5B
COMP1_Pb
4 9 5
C108 0.1uF
DOUT2 RIN2
READY
COMP2_Pb
D106 SD05
R110 75
+3.3V_MST +5V_ST
R150 4.7K
READY
IR_OUT
R151 4.7K
2B 3A
COMP1_Y
COMP2_Y
D107 SD05 R111 75
RXD TXD
10
4A [GN]CONTACT 2A [GN]1P_CAN
*RS232C TX
MAIN : EAN41348201(TI) SUB : 0IMCRSG010A(STM)
PC
JK104 KCN-DS-1-0089
6630TGA004K
+5V_MULTI
C100 0.1uF C101 0.1uF C102 0.1uF
PC SOUND
D108 ENKMC2837-T112
D109 ENKMC2837-T112
D111 ENKMC2837-T112
AC
AC
AC
6 1 7 2 8 3 9 4 10 5 15 14 13 12 11
RED_GND GND_2 RED GREEN_GND DDC_DATA GREEN BLUE_GND H_SYNC BLUE NC V_SYNC GND_1 SYNC_GND DDC_CLOCK DDC_GND D110 30V CDS3C30GTH R112 D112 30V 4.7K CDS3C30GTH R114 68 R115 68 D114 30V CDS3C30GTH
PC_R
R116 75
JK102 PEJ024-01 3 E_SPRING T_TERMINAL1 B_TERMINAL1 R_SPRING T_SPRING B_TERMINAL2 T_TERMINAL2 SHIELD_PLATE
D123 5.6V CDS3C05GTA R133 220K L101 1000-ohm R144 10K R145 12K D122 5.6V CDS3C05GTA R132 220K
L100 1000-ohm
R143
PC_AUD_R
7A 4 5 +5V_ST
PC_VS
C104 68pF IC100
PC_AUD_L
R113 4.7K
C103 68pF
7B 6B
DSUB_SCL
D113 30V CDS3C30GTH A0 A1 1 2 3 4
AT24C02BN-10SU-1.8
8 7 6 5
R126 4.7K
R127 4.7K
C105 0.1uF
16
SHILED A2 GND
DSUB_SCL DSUB_SDA
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D201 SD05
R208 75
CVBS_VIN
C207 OPT
R222 0
R218
D202 5.6V
R209 220K
CVBS_LIN
R220
R212 220K
CVBS_RIN
R227
R213 0
MNT_VOUT
2C [YL]1P_CAN1 3B [WH]0_SPRING1
NON HOTEL_OPT
SPK_R-_HOTEL
NON HOTEL_OPT
R236
1K
NON HOTEL_OPT
D208 5.6V
MNT_LOUT
NON HOTEL_OPT
R237
NON HOTEL_OPT
1K
NON HOTEL_OPT
SIDE AV
JK204 PPJ218-01 4A 5A 2A 3B 2B 4C 5C 2C [YL]O_SPRING
READY
2A [RD]1P_CAN1
D209 5.6V
R230 C 470K E
D214 SD05
R241 75
SIDE_V
PPJ150-09 JK200
HOTEL_OPT R214 0
SPK_R+_HOTEL
CVBS
R251 0
R247
D215 5.6V
R242 220K
SIDE_LIN
R252 0
R249
10K
SIDE_RIN
R250 12K
D216 5.6V
R244 220K
SIDE_Y
D217 SD05 R245 75
C_LUG_S_2
4D
4C
C_LUG_L_2
4B
C_LUG_S_1
D218 SD05
R246 75
SIDE_C
4A
C_LUG_L_1
O_SPRING
S_VIDEO_DET
D219 SD05
C210 OPT READY
SHIELD 7
INPUT2 : CVBS,SIDE AV
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. MSTAR N-EU INPUT2 2007/12/20
11
HPD_S/W_3
+5V_HDMI_3 R344 1K
SIDE_HDMI
+5V_ST
+5V_HDMI_3
OPTION
A2 KDS184 A1
D303 KDS184S
HPD_MST_2
Q300
RT1C3904-T112
A2 KDS184
A1
D300 KDS184S
HPD_MST_3
R335 10K
SIDE_HDMI
Q307C 2SC3875S
B RT1C3904-T112 E A0
IC303 AT24C02BN-10SU-1.8
1 8 VCC
R301 10K
C B E
A1
WP
C313 0.01uF
50V
A1
C301 0.01uF
50V
A2
SCL
+3.3V_MULTI_MST
GND 4 5 SDA
R348 100
A2
. 22 19 HPD 18 +5V_POWER
GND
SCL
CEC_C
30V
R334 R383 0
READY
30K
SDA
16 SDA 15 SCL 14 NC
JP1115
16 SDA 15 SCL
JP1117
14 NC 13 CEC 12 CLK-
JP1118
TMDS2_RX1+ TMDS2_RX1-
11 CLK_SHIELD 10 CLK+ 9 DATA08 DATA0_SHIELD 7 DATA0+ 6 DATA15 DATA1_SHIELD 4 DATA1+ 3 DATA22 DATA2_SHIELD 1 DATA2+ 20 JACK_GND 21 .
TMDS2_RX0+ TMDS2_RX0-
R351 10K
HDMI2_5V_DET
D302 30V
CDS3C30GTH
HDMI3_5V_DET
+5V_MULTI +5V_ST
D305 KDS184S
KDS184
0 R359 READY
A1
0.01uF
READY
READY
C311
C314
R382
GND_7
VCC_8
HPD3
SDA2
64
63
62
61
60
59
58
57
56
55
54
53
52
51 50
49
VDD
A24
A23
A22
A21
B24
B23
B22
B21
JK302 QJ41193-FEE2-7F
HPD2
SCL2
SIDE_HDMI
VCC_7
R381
SIDE_HDMI
R370 0
R369 0
DC1R019NBH JK303
0.01uF
22
22
A2
READY
17 DDC/CEC_GND
JP1116
DDC_SDA3 DDC_SCL3
READY
R376 0
C MMBD301LT1G D304
Q306 BSS83
D B S G
CEC
R332 200
R373 0
+3.3V_HDMI_SW
+5V_HDMI_1
R377 22 R378 22
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
48 47 46 45 44
A14 B14 VCC_6 A13 B13 GND_6 A12 B12 VCC_5 A11 B11 SCL1 SDA1 HPD1 EQ S2
R379 22 R380
R368 0 READY
HPD_MST_1
R300 10K
B
R310 1K Q301C
RT1C3904-T112 E
D301 KDS184S
C309
0.01uF
A1
WP
IC302 TMDS351PAG
43 42 41 40 39 38 37 36 35 34 33
A2
SCL
SDA
JP1119
14 NC 13 CEC 12 CLK-
JP1120
DDC_SDA1 DDC_SCL1
+5V_HDMI_1 R324 10K R325 10K
TMDS3_RX2TMDS3_RX2+
C308
0.01uF
22
Z4
Z3
Z2
Y4
Y3
Y2
Y1
Z1
SCL_SINK
VCC_3
GND_4
VCC_4
GND_5
SDA_SINK
HPD_SINK
S1
R372 4.7K 1%
HDMI1_5V_DET
HDMI_SEL2
C310 0.01uF
C312 0.01uF
R345 R346 0 0
2 DATA2_SHIELD 1 DATA2+
R347 R350 0 0
R355 R356 0 0
R357 R358 0 0
+3.3V_MULTI_MST
+3.3V
4.7K
20 JACK_GND 21 .
4.7K
+3.3V
R361
HDMI_SEL1
R365 READY 0
R362
HDMI_0+ HDMI_0-
HDMI_1+ HDMI_1-
HDMI_C+ HDMI_C-
JK301 QJ41193-FEE2-7F
HDMI_2+ HDMI_2-
R371 47K
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
HDMI_SCL HDMI_SDA
2007/12/20 3 11
HD_ATN
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKETXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCLKE+,TXCLKEP403-*1 SMAW200-24C
FHD
HD_NORMAL
1 3 5 7 9 11 13 15 17 19
2 4 6 8 10 12 14 16 18 20 22 24
P402 SMAW200-40C
P403 SMW200-26C
VCC_LCD
VCC_LCD
PANEL WAFER
1 3 5 7 9
R407 HD FHD X 4.7K R424 O X
TXCE0TXCE1TXCE2TXCLKE+3.3V TXCE3TXCE4R407 4.7K FHD R424 0 HD TXCO0TXCO1TXCO2TXCLKOTXCO3TXCO4-
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
FHD 8BIT:NC
TXCO0+ TXCO1+ TXCO2+ TXCLKO+ TXCO3+
TXCO4+ R408 0
1 3
R438 HD 0
2 4 6 8 10 12 14 16 18 20 22 24 26
R432 0 READY TXCE0+ TXCE1+ TXCE2+ TXCLKE+ TXCE3+ R428 CPT 0
21 23
5 7 9
TXCE0TXCE1TXCE2TXCLKETXCE3-
FHD 8BIT:NC
11 13 15 17 19 21 23 25
FHD 8BIT:NC
11 13 15 17 19
NC
21 23 25
NC
FHD 8BIT:NC
27 29 31 33 35 37 39
R415 0 READY
R402 X 0 0 0 X
HD
L410-*1 0 R_USE LG50_60_70 BEAD_USE LG50_60_70 L411 BG1608B501F USE LG50_60_70 R422 0
FHD
TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
SCL_LED SDA_LED
+3.3V_MST
R420 BG1608B121F 4.7K L403 EAM38769502 L406 EAM38769502
KEY2
USE LG50_60_70
R421 4.7K
KEY1
P400 12505WS-15A00
+3.3V_MST
1 USE LG50_60_70 ZD401 5.6B 5.6B ZD402 USE LG50_60_70 L407 USE LG50_60_70 120OHM UBW2012-121F USE LG50_60_70
R405
+5V_ST
NOT LG60 R404 0
C412 470pF
C404 470pF
C411 0.1uF
C408 0.1uF
Q406 2SA1530A-T112-1R
+5V_ST_SW
R404 O O X O
R444 X X 3.3K X
R445 X X 3.3K X
Q406 X X O X
L410 L411 L407 X X X BEAD BEAD BEAD BEAD BEAD BEAD BEAD BEAD BEAD
R414 X X 10K X
READY
LED_R_PWM_Big EYEQ_RESET
IR
+5V_ST
8 IR-OUT
R443 10K
IR-OUT
+5V_ST
R442 IR-OUT 22 C
R440 10K
IR-OUT
IR_OUT
Q404 2SC3052
10
L402
ZD400 5.6B READY
READY
C402 OPT
E IR-OUT
11
12
13
14
C400 0.1uF
SPK-N
LED_G
15 16
NOT LG60
NOT LG60
+5V_ST
R434 10K
NOT LG60 C
NOT LG60 C
AC_DET
LED_R/PWM
Q403 KRC102S
NOT LG60 E
CONTROL KEY
MSTAR LVDS,CTR KEY 2007/12/20 4 11
NOT LG60 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
NON EU TUNER
TU500-*1 TAFT-H703F
NTSC TUNER
1 2 3 4
NC_1 GND_1 +B[5V] NC_2 RF_AGC TP[33V_OPTION] NC_3 GND_2 DATA CLOCK AS NC_4 V-OUT AFT A-OUT SIF-OUT NC_5 NC_6 NC_7 NC_8
R514 0
C521 10uF 16V
5 6 7 8 9
R507
100
READY
10 READY
READY
6 TP[33V_OPTION] 7 NC_3 8 GND_2 9 DATA 10 CLOCK 11 AS 12 NC_4 13 V-OUT 14 AFT 15 A-OUT 16 SIF-OUT 17 NC_5 18 NC_6 19 NC_7 20 NC_8 21 SHIELD
C507 0.01uF
11
+5V_TUNER
12 13 14 15 16
R504 4.7K
R508 4.7K
17
18 19 20 21
SDA_TUNER
L501 UBW2012-121F
120OHM
SCL_TUNER
C520 0.1uF
SHIELD
TV_MAIN
C513 270pF READY +5V_TUNER
R503 4.7K
MAIN_SIF
READY
R513 1K
AM_AUDIO
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MSTAR TUNER
2007/12/20 5 11
+16V_NTP
P601
C622 1000pF
L614
120OHM
SMAW250-04
UBW2012-121F
R609 3.9
L603 2S DA-8580 2F 1S 1F
R624 4.7K
C639 0.01uF
SPK_L+
SPK_RSPK_R+ SPK_LSPK_L+
C632 0.47uF
C636 0.1uF R623 4.7K
C611
22000pF
C616 22000pF
C618 1uF
R608 3.9
R610 3.9
EAP38319001
+1.8V_DVDD
3
UBW2012-121F EAM38769505
PGND1A_2
PGND1A_1
PVDD1A_2
PVDD1A_1
PVDD1B_2
PVDD1B_1
PGND1B_2
PGND1B_1
OUT1A_2
OUT1A_1
OUT1B_2
OUT1B_1
C619 1000pF
C621 1000pF
SPK_L-
56
55
54
53
52
51
50
49
48
47
46
45
44
43
VDR1B
BST1B
BST1A C608 READY 1uF D602 30V VDR1A /RESET AD VSS_IO CLK_I C642 100pF
READY
1 2 3 4 5 6 7 8 9 10 11 12 13 14
42 41 40 39 38 37
NC_2 VDR2A BST2A PGND2A_2 PGND2A_1 OUT2A_2 OUT2A_1 PVDD2A_2 PVDD2A_1 PVDD2B_2 PVDD2B_1 OUT2B_2 OUT2B_1 PGND2B_2 R617 3.9 C630 1000pF R621 3.9 C634 1000pF R605 L612 BG2012B121F EAM38769506
HOTEL_OPT 30V D600 READY
+16V_NTP
C635 1000pF +16V_NTP
0.1uF
SW_RESET I2S_MCLK
+1.8V_AVDD C603 1000pF C601 100pF R600 3.3K +3.3V
C606 1000pF
R601 100
R622 3.9
JP600 C646
CLK_O VDD_IO
IC600 NTP3000A
36 35 34 33 32 31 30 29
+16V_NTP
READY
SPK_R-
10K R648
C626 0.1uF
C629 0.1uF
1S
1F
EAP38319001
C605 0.1uF
DGNDPLL
L607 2S DA-8580 2F
SPK_R+
+3.3V +3.3V
AUDIO_R
JP601
SW_RESET
+3.3V_1
DVDDPLL NC_1
R632 200
AMP_MUTE_HOTEL
SPK_R-_HOTEL
9 10
15
16
17
18
19
20
21
22
23
24
25
26
27
28
SCL
WCK
DVSS
BCK
SDA
FAULT
DVDD
PGND2B_1
SDATA
PROTECT
VDR2B
PWM_3B/PWM_HP2
PWM_3A/PWM_HP1
READY
+1.8V_DVDD
C623 22000pF
C614 1uF
0 HOTEL_OPT
AMP_MUTE_HOTEL R642
C610 0.1uF
R602 100
R603 100
R606
0
E
Q608 2SA1530A-T112-1R
C
100 R651
AC_DET
AMP :GAIN X 4
+12V
+12V
+5V_MULTI
R611 680K
IC602 MC74HC4066ADR2G
IC601
HOTEL_OPT C B
+5V_MULTI
XA 1 14 VCC
+5V_MULTI
R633 4.7K
C641 0.1uF
R616-*1 15K
R645 1K NON HOTEL_OPT
SIDE_LIN
C662
Q606 RT1C3904-T112 E
SW_L
+5V_MULTI
R629 680K
YA
13
CONTROL_A
C B
MNT_LOUT
R641 10K
R647 4.7K
C649 6800pF
YB
12
CONTROL_D
+5V_MULTI
R637 680K
Q600 RT1C3904-T112 E
AUDIO_SW MNT_L_AMP
+12V
+12V
R615 5.6K
XB
COMP2_L
11
XD
L606
120OHM
SIDE_RIN MNT_R_AMP
+12V
GND 11
CONTROL_B
+5V_MULTI
R634 4.7K
10
YD
SW_R
+5V_MULTI
R639 680K C665 2.2uF R640 680K
CONTROL_C
AUDIO_SW
for COMP2
YC
NON HOTEL_OPT
R613 10K
HOTEL_OPT C
R613-*1 15K
B E R646 1K
GND
XC
COMP2_R
Q607 RT1C3904-T112
7 OUT2
C650 6800pF
OUT3 8
MNT_ROUT
R649 4.7K
2007/12/20 6 11
+3.3VDDP
L711
120OHM
+1.8V
+3.3VDDP
READY C754 10nF 50V C713 0.1uF
L713
120OHM
C714 47uF
16V C717 0.1uF
+1.8VDDC
+3.3VDDA
UBW2012-121F
+3.3VDDP
TOP SIDE! FLASH_WP_ZORAN
7 HOLD# 6 5 SCLK SI
50V
C726 0.1uF
50V
C727 0.1uF
50V
C728 0.1uF
50V
C729 0.1uF
50V
C730 0.1uF
50V
C731 0.1uF
50V
C732 0.1uF
L714 L712
120OHM 120OHM
C715 22uF
C716 0.1uF
+1.8VDDA
R740 0
Download S/W DEBUG TEST OPTION JK700 12505WS-04A00
R704 1K
+3.3VDDA
UBW2012-121F
SFDI
16V
+3.3VDDP
+3.3VDDP
1 JP700
R741 0
Download S/W
R705 1K
1/10W 5%
50V
C735 0.1uF
50V
C736 0.1uF
50V
C737 0.1uF
50V
C738 0.1uF
50V
C739 0.1uF
50V
C740 0.1uF
50V
C741 0.1uF
50V
C742 0.1uF
50V
C743 0.1uF
50V
C744 0.1uF
SFCLK
JP701
DUPRD0 For Initial Download +1.8VDDA +1.8VDDC C747 0.1uF C748 0.1uF C749 0.1uF C750 0.1uF C751 0.1uF C752 0.1uF C753 0.1uF DEC_656[0] DUPTD0
JP702
4 5
JP703
50V
50V
50V
50V
50V
50V
50V
DEC_656[0] : DUPTD0
L717
READY 120OHM
+5V_MULTI
DEC_656[7]
Connect to Main IC(CCIR656 Interface) DEC_656[6] DEC_656[5] DEC_656[4] DEC_656[3] DEC_656[2] DEC_656[1] DEC_656[0]
DEC_656[0-7]
OCP_EN DEC_656_CLK 22 0 +1.8VDDA +3.3VDDP R726 15K 1% C734 0.1uF +1.8VDDC +3.3VDDA
L718
120OHM
L715 MBW3216-501TF
16V
0 0
C724 10uF
50V
R718 R719
R717
UBW2012-121F
R744 R725
50V
USB
P701 1
** 1A Design
KJA-UB-4-0004
R700 27 R701 27
IC705 MIC2009YM6-TR
C725 0.1uF
VIN
* Analog Video Option * R732 Video Output Level Reference Originally 392 ohm 1%
5 4
READY
R709 1K
ZR36966PQCG-XD
54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39
C719 C720
18pF 18pF
12MHz
R738
0
1/10W 5%
118 119 120 121 122 123 124 125 126 127 128
MPEG_RESET C746
L719
220K
R715
6.19K X702
R727 1K
R732
USB_DP USB_DN
112
IC707
5% 1/10W
RAMDAT[8]
RAMDAT[9] RAMDAT[10]
RAMDAT[11] RAMDAT[12]
RAMDAT[13]
RAMDAT[14]
RAMDAT[15]
R706 4.7K
IPCLK
VDDQ3
VSSQ3
VDDQ4
VSSQ4
RAMADD[0] RAMADD[8] RAMADD[10] RAMADD[9] RAMADD[11] RAMBA[1] RAMBA[0] RAMCS RAMRAS RAMCAS RAMWE RAMDQM IPCLK
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
VSS1
NC1
NC2
VSS2
DQ14
DQ10
DQ11
DQ12
UDQM
DQ8
CKE
28
29
30
31
32
33
34
35
36
37
38
CLK
39
DQ9
DQ13
51
52
40
53
DQ15
A4
A5
A6
A7
A8
A9
A11
41
42
43
44
45
46
47
48
49
IC704 HY57V641620FTP
26
27
25
22
24
21
20
19
23
18
16
15
14
13
12
11
17
10
A10/AP
VDDQ2
VSSQ2
VSSQ1
LDQM
RAS
CAS
WE
DQ7
DQ6
DQ5
DQ4
VDD3
VDD2
DQ3
BA1
BA0
A3
A1
A0
CS
A2
50
54
VSS3
38
RAMDAT[7]
RAMDAT[6] RAMDAT[5]
RAMDAT[4] RAMDAT[3]
RAMDAT[2]
RAMDAT[1]
RAMADD[3]
RAMADD[2] RAMADD[1]
RAMADD[0-3]
RAMADD[0]
RAMDAT[0]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
RAMWE RAMDQM
RAMRAS RAMCAS
VOUT
ILIMIT
GND
R733 390
64 63 62 61 60 59 58 57 56 55
102
101
100
R703 5.1K
R708 180
SFCS
ENABLE
0 0 0 0
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
75 75 75 75
FAULT/
OCP_EN
22pF
X703 27MHz
22pF
R739
0 150
DUPRD0
R728
+3.3VDDP RAMADD[11]
RAMDAT[0] RAMDAT[15] RAMDAT[1] RAMDAT[14] RAMDAT[2] RAMDAT[13] RAMDAT[3] RAMDAT[12] RAMDAT[4] RAMDAT[11] RAMDAT[5] RAMDAT[10] RAMDAT[6] RAMDAT[9] RAMDAT[7] RAMDAT[8] RAMDAT[0-15]
RAMDAT[0-7]
2007/12/20 7 11
SCL_TUNER
SDA_TUNER
H/W OPTION #3
<Mode Selection>
MX25L1605AM2C-15G
CS# 1 8 VCC +3.3V_MST
#8. MSTAR
HWRESET 20pF HDMI1_5V_DET HDMI2_5V_DET HDMI3_5V_DET HDMI_SEL2 +3.3V_MULTI_MST
+3.3V_MST FLASH_WP_ZORAN
R8001 0 READY
R8187 10K
IC803
SPI_DO
SO
HOLD#
120HZ: H Normal: L
R8005
WP#
GND
R8108 3.3K
R8110 3.3K
HDMI_SEL1
R8079
R8080
R8099 10K
R8112 READY
FLASH_WP
R8067
10K
Q803
IC803
AVDD_33_254
AVDD_MPLL
VDDC_240
VDDC_193
VDDP_221
VDDP_235
VDDP_207
VDDP_194
GPIOE[0]
GPIOE[1]
GPIOE[2]
GPIOE[3]
HWRESET
I2S_MCLK
GND_241
GND_222
GND_208
LVACKM
LVBCKM
RXBCKN
RXBCKP
LVACKP
LVBCKP
IVSYNC
IHSYNC
NC_210
NC_209
NC_196
NC_195
DI[13]
DI[12]
DI[11]
DI[10]
LVA0M
LVA1M
LVA2M
LVA3M
LVB0M
LVB1M
LVB2M
LVB3M
RXB0N
RXB0P
LVA0P
LVA1P
LVA2P
LVA3P
LVB0P
LVB1P
LVB2P
LVB3P
DI[9]
DI[8]
DI[7]
DI[6]
DI[5]
DI[4]
DI[3]
DI[2]
DI[1]
DI[0]
XOUT
ICLK
I2S_SDO
I2S_SCK
XIN
IDE
RXB1N RXB1P GND_3 RXB2N RXB2P HPLUGB DDCDB_DA DDCDB_CK RXACKN RXACKP GND_11 RXA0N RXA0P AVDD_33_14 RXA1N RXA1P GND_17 RXA2N RXA2P HPLUGA REXT DDCDA_DA DDCDA_CK HSYNC1 VSYNC1 VCLAMP REFP REFM BIN1P SOGIN1 GIN1P RIN1P VCOM3 BIN0P VCOM2 GIN0P SOGIN0 RIN0P AVDD_33_39 GND_40 HSYNC0 VSYNC0 VSYNC2 BIN2P SOGIN2 GIN2P RIN2P C1 Y1 C0 Y0 CVBS3 CVBS2 CVBS1 VCOM1 CVBS0 VCOM0 AVDD_33_58 CVBSOUT1 CVBSOUT0 GND_61 SIP0P AVDD_SIF SIF1P
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17
I2S_WS
0.1uF
20pF
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKETXCE3TXCE2TXCE1TXCE0-
TXD
100 RS232C
C838
C841
IC802 AT24C64AN-10SU-2.7
A0 VCC
TXCE4TXCE3+
TXCE2+
TXCE1+
C882
DDCA_DA
0.1uF
0.1uF
0.1uF
TXCLKO+
TXCLKO-
0.1uF
TXCLKE+
TXCLKE-
TXCO4TXCO3+
TXCO3-
TXCO2-
TXCO1-
TXCO4+
TXCO2+
TXCO1+
TXCO0+
TXCO0-
TXCE4+
TXCE0+
+3.3V_MST
39 40 41 42 43 44 45 46 47 48 49 50 51
AVDD_MPLL
3.3K
3.3K
R8023
VDDC_240
VDDC_193
VDDP_235
VDDP_221
VDDP_207
VDDP_194
GPIOE[0]
GPIOE[1]
GPIOE[2]
GPIOE[3]
HWRESET
GND_241
GND_222
GND_208
LVACKM
LVBCKM
RXBCKN
RXBCKP
LVACKP
LVBCKP
IVSYNC
IHSYNC
NC_210
NC_209
NC_196
NC_195
10K
AVDD_33_254
IC801-*1 LGE6891DD HD
18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 52 53 54 55 56 57 58 59 60 61 62 63 64 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99
100 100
100
100 100
100
0.1uF
100
100
100
0.1uF
+3.3V_MST
A1
R8077
R8082
R8085
R8087
R8089
R8092
R8094
C850
C852
C859
C865
R8065
R8066
R8015
0 READY 0 READY 0
C866
R8064 1M
R8074
R8095
C862
WP
A2
SCL R8175 0
SCL_Part
GND
SDA
SDA_Part R8176 0
DI[13]
DI[12]
DI[11]
DI[10]
LVA0M
LVA1M
LVA2M
LVA3M
LVB0M
LVB1M
LVB2M
LVB3M
LVA0P
LVA1P
LVA2P
LVA3P
LVB0P
LVB1P
LVB2P
LVB3P
DI[9]
DI[8]
DI[7]
DI[6]
DI[5]
DI[4]
DI[3]
DI[2]
DI[1]
DI[0]
XOUT
ICLK
R8157
R8158
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
VDDM_135
0 READY 0 READY 0
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64
192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166
PWM3 PWM2 NC_190 NC_189 GPIOB[6] GPIOB[5] GPIOB[4] VDDC_185 GND_184 VDDP_183 IRIN INT DDCA_CK DDCA_DA DDCR_CK DDCR_DA PWM1 PWM0 SAR3 SAR2 SAR1 SAR0 SDO CSZ SDI SCK GND_166 VDDP_165 ALE RDZ WRZ AD[7] AD[6] AD[5] AD[4] AD[3] AD[2] AD[1] AD[0] MADR[11] MADR[10] MADR[9] MADR[8] VDDC_149 GND_148 VDDM_147 MADR[7] MADR[6] MADR[5] MADR[4] MADR[3] MADR[2] MADR[1] MADR[0] WEZ CASZ AVDD_MEMPLL VDDM_135 GND_134 RASZ BADR[0] BADR[1] MCLK MCLKZ R8178 C869 0.1uF C868 0.1uF
NOT LG60
R8102
PWM2 PWM3
READY
XIN
IDE
GPIOF[0]
GPIOF[1]
GPIOF[2]
GPIOF[3]
GPIOF[4]
GPIOF[5]
GPIOF[6]
GPIOF[7]
GPIOF[8]
GPIOF[9]
GND_100
GND_105
MDATA[15]
MDATA[14]
MDATA[13]
MDATA[12]
MDATA[11]
MDATA[10]
VDDP_99
MDATA[9]
MDATA[8]
GND_113
GND_66
MDATA[7]
MDATA[6]
MDATA[5]
MDATA[4]
MDATA[3]
MDATA[2]
MDATA[1]
VDDC_101
VDDM_108
VDDM_114
VDDM_119
MDATA[0]
DQS[0]
DQS[1]
SIFM
AUL0
AUL1
AUL2
AUR0
AUR1
AUR2
AUL3
AUR3
AUVREF
MVREF
L Q D M
AUOUTL3
AUOUTL2
AUOUTL1
AUOUTL0
AUOUTR3
AUOUTR2
AUOUTR1
AUVRADN
AUVRADP
AVDD_AU
AUOUTR0
A C M UO
A M N U O O
MCLKE
UQ DM
HPD_MST_1
READY 0 RXB2P READY HPLUGB READY R8053 22 DDCDB_DA R8052 22 DDCDB_CK RXACKN RXACKP GND_11 RXA0N RXA0P AVDD_33_14 RXA1N RXA1P GND_17 RXA2N RXA2P HPLUGA C805 0.1uF R8054 R8055 R8056 C806 C807 C808 0.1uF 0.1uF 0.1uF C810 C811 C812 C813 C814 C815 C816 C817 C818 47 C819 0.047uF 1000pF 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF 0.047uF C809 0.1uF 390 22 22 REXT DDCDA_DA DDCDA_CK HSYNC1 VSYNC1 VCLAMP REFP REFM BIN1P R8030 R8031 R8032 R8033 R8034 R8035 R8036 R8037 R8038 47 47 47 47 47 47 47 47 47 R8039 SOGIN1 GIN1P RIN1P VCOM3 BIN0P VCOM2 GIN0P SOGIN0 RIN0P GND_40 HSYNC0 VSYNC0 R8181 R8012 R8017 R8011 R8013 47 47 47 47 C820 C821 C822 C823 4.7K 0.047uF 1000pF 0.047uF 0.047uF VSYNC2 BIN2P SOGIN2 GIN2P RIN2P C1 Y1 READY
MPEG UART
H/W OPTION #1
+3.3V_MST
R865 4.7K
HD
HDMI_SDA HDMI_SCL
R867 4.7K
FHD
H/W OPTION #2
+3.3V_MST
SPI_CLK
165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129
R8137
MUTE_LINE
R8063 4.7K
8BIT
0 . 0 4 7 u F AVDD_33_39
DONT USE(156,157)
MADR[11] RL_ON C883 0.47uF 25V
AR802
C871 C872
0.1uF 0.1uF MADR[7] MADR[6] AR801 100 MADR[5] MADR[4] MADR[3] MADR[2] AR800 100 MADR[1] MADR[0] MADR[0-11]
NON_EU OPTION
CVBS_V
SIDE_C SIDE_Y SIDE_V CVBS_VIN TV_MAIN +3.3V_MULTI_MST MNT_VOUT_T PIP_VOUT MAIN_SIF 0.1uF +3.3V_MULTI_MST R8048 TW9910 block R8049 47 47 R8041 R8042 R8043 R8044 R8045 R8046 R8047 47 47 47 47 47 47 47
AVDD_33_58
C832
0.1uF
R8143 R8144 R8145 R8146 R8147 R8148 R8149 R8150 R8151 R8152 R8153 R8154
100 100 100 100 100 39 39 100 100 100 100 100
WEZ CASZ RASZ SBA1 MCLK MCLKZ CKE UDQM LDQM DQS0 DQS1
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
5 1 READY 3 D800 1N4148W 100V R8010 100 READY C804 0.1uF C800 4.7uF 10V D801 KDS181 R8018 R8016 100 33K R8002 0 +3.3V_MST AC_RST R8019 100
MDATA[15]
MDATA[14]
MDATA[13]
MDATA[12]
MDATA[11]
MDATA[10]
MDATA[9]
MDATA[8]
MDATA[7]
MDATA[6]
MDATA[5]
MDATA[4]
MDATA[3]
MDATA[2]
MDATA[1]
100
100
DEC_656[0]
DEC_656[1]
DEC_656[2]
DEC_656[3]
DEC_656[4]
DEC_656[5]
DEC_656[6]
R8073
R8075
C839
C840
C842
C843
C847
READY
READY
C848
R8078
C836
C837
HWRESET
DEC_656[7]
1uF
100
KDS181
MDATA[0]
D802 0.1uF 2.2uF 2.2uF 2.2uF 2.2uF 0.1uF 2.2uF 2.2uF 2.2uF 2.2uF
R8003
100
+3.3V_MULTI_MST
C861 0.1uF
C863 0.1uF
C864 0.1uF
+2.5V_VDDM_MST
TW9910 block
R8081 0 E B C Q804 C B E Q805 RT1C3904-T112 R8051 68 1608 PIP_VOUT R8050 470 R8060 100 TW9910 block MSTAR Recommand : over 8V
+1.2V_VDDC_MST
2.2K 2.2K C860 0.1uF 1000pF 1000pF 1000pF 10K C875 10uF 16V
READY R8071
22K
R8183
22K
+2.5V_VDDM_MST
R8076
C851
R8084
R8088
C853
COMP1_R
COMP1_L
SW_L
SW_R
C854
+3.3V_MST
AM_AUDIO
CVBS_LIN
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SPK-N
GAIN X 4
CVBS_RIN
GAIN X 4
MNT_R_AMP
MNT_L_AMP
PC_AUD_R
PC_AUD_L
DDR SDRAM
C881
GPIOF[0]
GPIOF[1]
GPIOF[2]
GPIOF[3]
GPIOF[4]
GPIOF[5]
GPIOF[6]
GPIOF[7]
GPIOF[8]
GPIOF[9]
DQS[1]
GND_100
GND_105
MDATA[15]
MDATA[14]
MDATA[13]
MDATA[12]
MDATA[11]
MDATA[10]
VDDP_99
MDATA[9]
MDATA[8]
GND_113
GND_66
MDATA[7]
MDATA[6]
MDATA[5]
MDATA[4]
MDATA[3]
MDATA[2]
MDATA[1]
VDDC_101
MDATA[0]
DQS[0]
SIFM
AUL0
AUL1
AUL2
AUR0
AUR2
AUR1
AUL3
AUR3
LDQM
AUCOM
UDQM
MVREF
VDDM_108
VDDM_114
VDDM_119
AUVREF
AUMONO
AUOUTL3
AUOUTL2
AUOUTL1
AUOUTR3
AUOUTR2
AUOUTR1
AUOUTL0
AUVRADN
AUVRADP
AVDD_AU
AUOUTR0
MCLKE
SBA0
2007/12/20 8 11
#9.DDR
MDATA[0-15] MDATA[0-15]
+2.5V_VDDM_MST
MDATA[0-15] MDATA[7] MDATA[6] MDATA[5] MDATA[4] MDATA[3] MDATA[2] MDATA[1] MDATA[0]
IC900 HYB25DC256163CE-4
AR902 56 1/16W
MDATA[8] MDATA[9] MDATA[10] MDATA[11] C903 0.1uF MDATA[12] MDATA[13] MDATA[14] MDATA[15] C902 0.1uF VDD_1 DQ0 VDDQ_1 DQ1 DQ2 VSSQ_1 DQ3 DQ4 VDDQ_2 DQ5 DQ6 VSSQ_2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 VSS_3 DQ15 VSSQ_5 DQ14 DQ13 VDDQ_5 DQ12 DQ11 VSSQ_4 DQ10 DQ9 VDDQ_4 DQ8 NC_8 VSSQ_3 UDQS DQS0 NC_7 VREF VSS_2 UDM LDQM CK CK CKE CKE NC_6 A12/NC_5 A11 A9 A8 A7 A6 A5 A4 VSS_1 MADR[11] MADR[11] MADR[9] MADR[9] MADR[8] MADR[8] MADR[7] MADR[7] MADR[6] MADR[6] MADR[5] MADR[5] MADR[4] MADR[4] READY R903 150 R905 150 MCLK MCLKZ C907 1000pF C909 0.1uF R906 1K R909 1K C906 0.1uF C908 0.1uF
AR901 56 1/16W
AR903 56 1/16W
C904 0.1uF
AR900 56 1/16W
+2.5V_VDDM_MST
DQS1 C905 0.1uF A13/NC_2 VDD_2 NC_3 C900 0.1uF UDQM WE WEZ CAS CASZ RAS RASZ CS NC_4 BA0 SBA0 BA1 SBA1 MADR[10] MADR[0] MADR[1] MADR[11] MADR[10] MADR[9] MADR[8] MADR[7] MADR[6] MADR[5] MADR[4] MADR[3] MADR[2] MADR[1] MADR[0] MADR[0-11] MADR[0-11] MADR[11] MADR[10] MADR[9] MADR[8] MADR[7] MADR[6] MADR[5] MADR[4] MADR[3] MADR[2] MADR[1] MADR[0] C901 0.1uF MADR[2] MADR[3] MADR[10] MADR[0] MADR[1] MADR[2] MADR[3] A10/AP A0 A1 A2 A3 VDD_3 LDM
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MSTAR DDR
2007/12/20 9 11
C1005 22pF
C1007 22pF
VD[0]/SIAD0
VSSE_2
VSS_2
VD[1]
VD[2]
VD[3]
VD[4]
VD[5]
C1000 0.1uF
48
47
XTI
+3.3V
46
45
44
43
42
41
40
39
38
37
VD[6]
NC_4
XTO
DEC_656[0-7]
VDDE_1
+3.3V READY
1 2 3 4 5 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
36 35 34 33
VD[7] VD[8] VD[9] VD[10] VDD NC_3 VD[11] VD[12] VD[13] VD[14] VD[15] VDDE_2
SCL_Part SDA_Part
R1001 4.7K
R1003 R1002
100 100
AR1000 51
C1012 0.01uF
+1.8V_AVD
DEC_656[0-7]
SW_RESET
R1004
100
C1001 0.01uF
R1006 4.7K
IC1000 32 6 TW9910DANA2-GR 31
30 29 28 27 26 25
+1.8V_AVD
AVD_1
C1003 C1004 0.1uF 0.1uF
AR1001 51
PIP_V
R1000 75
C1002
0.1uF
CIN0
VSS_1
VS
HS
YMUX0
MPOUT
VSSE_1
R1009
AVS_1
AVD_2
AVS_2
NC_2
CLKX2
0.1uF
C1008 0.1uF
51 C1013 10pF
READY
C1006
C1009
0.1uF
DEC_656_CLK
+1.8V_AVD
TW9910
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MSTAR TW9909
2007/12/20 10 11
LED Block
*PANEL OPTION
R1197 R1122 C1114 R1127 R1183 R1155 R1103 R1185 R1186 R1187 R1104 Sharp 52" O X X O O O X X X X X AUO O O O O X X X X X X X CMO 32/42/47 4.7K 0.47uF O X O O X X X X O X X CMO 57" X X O O O O 4.7K 0.47uF X Sharp 32" X O X X X X X X X X X the rest X O O X X X X 4.7K 0.47uF O X P_12V
P_5V
PANEL_STATUS
RL_ON I_DIMMING
CMO R1155 0
16V GND 12V GND 5V 5V GND GND Error out Power ON A.Dim Select
R1191 0 READY
1 3 5 7 9 11 13 15 17 19 21 23
P1100
2 4 6 8 10 12 14 16 18 20 22 24
16V P_16V GND 12V P_12V GND 5V P_5V 5V GND R1125 0 R1126 2.7K AGND ACD Inverter ON R1187 PWM Dim R1132 0 R1104 0 CMO 57" 0 NOT CMO SYNC
READY
+5V_ST
+5V_MULTI
R1189 10K
R1190 1.2K
AC_DET
+5V_ST
R1138 4.7K C B E Q1106 RT1C3904-T112
D1106 SAM2333
R1133 10K
AC_RST
C1121 0.47uF
+5V_ST 0 R1129 10K READY R1196 10K 3 Q1102 2 2SC3875S 1 R1135 10K
C1137 47uF25V
C1139 0.1uF
*12V AUDIO and PANEL L1112 +12V MBW3216-501TF +12V EAM30764101 C1144 0.01uF
R1105
DISP_EN E_DIMMING
*SHARP 32" : DC DIMMING
P_5V
L1107 C1138 220uF 16V C1140 0.1uF C1146 0.01uF UBW2012-121F R1163 0 C1123 0.1uF
+5V_ST
R1188 0 READY
+5VST_MST
SMAW200-24C
R1103 0 R1185 0 R1186 0 CMO CMO 32,42,47 CMO 57"
P_5V
P_5V
0
+12V
120OHM L1111
R2
R1
R1107 5.6K
+3.3V_MST
120OHM L1110
R1115
32 Sharp UBW2012-121F
+5VST_MST
R1140 33K
R1141 33K
Q1101 SI4925DY 0TF492509AA 8 D1_2 7 D1_1 6 D2_2 5 D2_1 0.1uF L1105 UBW2012-121F C1135 EAM38769505 C1141 100uF 16V L1104 UBW2012-121F EAM38769505 C1136 0.1uF R1152 2.2K R1153 2.2K R1154 2.2K C1149 100uF 16V
VCC_LCD
C1109 100uF6V 1
C1152 10uF
D1103 MBRS190T3G 90V
PANEL_ON
P_5V
R1134 10K
S2 3 G2 4
C1128 100uF6V 1
+1.2V_VDDC_MST
C1118 100uF 16V
R1130 22K
+5V_MULTI
C1142 0.1uF
OUT:1.25V
ST 5V->3.3V->1.2V
RL_ON
R1128 10K
C B E Q1107 RT1C3904-T112
DC-DC CONVERTER
equal to 220uF pad size
DCDC_7.22V_PIP
(8)
IC1104 AZ1117H-ADJTRE1(EH11A)
IC1105 AZ1117H-3.3
R2
ADJ/GND
USB
L1103
C1129
USB
C1130
USB
+5V_MULTI
R1124 330 1% R1123 110 1%
INPUT
MAX 1A 1 2
+3.3V_SDRAM
OUT:UNDER 7.22V
INPUT
3 2
ADJ/GND
+5V_MULTI
L1108 120OHM
IC1101 AZ1117H-ADJTRE1(EH11A)
0.1uF
OUTPUT READY
R1
R1167 OPT
IC1102 MP2355DN-LF-Z
R1111 59K SS R1102 47 1 8 RUN C1112 0.1uF
C1115 0.1uF
OUTPUT
READY
L1109
COMP
C1154 0.1uF
IC1106 AZ1117H-1.8TRE1(EH13A)
BST
MBW3216-501TF
C1119 100uF 16V IC1107
+12V
+5V_TUNER
C1106 0.01uF
+5V_MULTI
INPUT
MAX 1A 1 2
ADJ/GND
IC1108
R1149 0 R2
ADJ/GND
INPUT
3 2
ADJ/GND
VIN
110mA 20mA
INPUT
C1131 0.1uF
C1132 0.01uF
R1151 0 5%
OUTPUT READY
LX
GND
R1
OUT:2.6V +2.5V_VDDM_MST
R1
C1108 0.01uF
R1110 12K
R1120 7.5K
USB
INPUT
3 2
ADJ/GND USB
USB
C1120 0.1uF
OUTPUT
12V->5V_TUNER
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_USB
SWITCH 5V->3.3V->1.8V
MSTAR
2007/12/20
POWER
11
11
P/NO : MFL41394417