Product Brief

X-GOLD 618
TM

Cost efficient HSPA Baseband for Multimedia enabled Cellular Phones

Main features THE InfInEOn X-GOLD 618 is a cellular system on chip comprising the 2G/3G digital and analog baseband and the power management functions monolithically integrated in 65nm CMOS technology. It is Infineons 3rd gernation of dual mode baseband taking the next step in bringing enhanced features such as HSDPA and HSUPA to the mass market.
TM

Modem HSDPA/HSUPA 7.2Mbps/2.9Mbps WCDMA: 384kbps DL/UL EDGE up to MSC33 with SAIC Speech: nB-AMR, WB-AMR

This chip is designed for cost optimized cellular phones addressing the feature phone market. With the enriched multimedia capabilities including parallel and MIPI interfaces for cameras and displays and on-chip HW for video and graphic acceleration it drives advanced features into the consumer price segment. The X-GOLDTM618 provides the complete modem functionality with HSDPA cat 8 (7.2Mbps), HSUPA cat 4 (2.9Mbps), EDGE multi slot class 33 and includes the latest OMTP security standards. The processing of the 2G/3G cellular protocol stack is handled by an ARM1176 Embedded Microcontroller. The physical layer and the voice processing are handled by dedicated hardware accelerators and DSP sub system. The X-GOLDTM618 is the main device of the XMMTM6180 platform solution, a reference design with the complete Rf engine, the integrated release 6 protocol stack and the universal software adaption layer UTA for customers application suites. The high integration level of baseband, PMIC and application functions and the combination with Infineons SMARTiTMUE Rf engine enables an PCB footprint, below 800mm2 for triple band 3G, quad band EDGE and offers optimized stand-by and talk times. The solution is verified through an inter-operability test program at infrastructure vendors and network operators, to reduce the time to market of the cellular phone significantly.

CPU ARM1176 @ 416MHz Memory LPDDR1-SDRAM nOR & nAnD flash eSD/eMMC

Multimedia and Applications Dual camera interface parallel 8-bit MIPI CSI-2 up to 5Mpxl Dual display interface parallel 16/18-bit MIPI high speed DSI-2 Video on-chip HW support Playback & streaming: MPEG4, H.263, H.264, VC-1, WMV9 with resolution VGA/D1 @ 30fps Record: MPEG4, H.263, H.264 with resolution VGA/D1 @ 30fps Audio functionality Digital and analog MIC I/f Stereo speaker support 2D graphic accelerator JPEG HW accelerator

Connectivity and Interfaces Digital Rf interface V3.09 High speed SIM card interface USB 2.0 HS 3 x USIf; 2xI2S; 2xI2C 3 x SD/MMC card interface

www.infineon.com/wireless

Product Brief

X-GOLD 618
TM

Cost efficient HSPA Baseband for Multimedia enabled Cellular Phones

Block Diagram
WVGA Display ETM MIPI TPI/SPT MIPI DSI & Parallel I/F MIPI CSI ISP Parallel I/F USB HS OTG 480Mbps USIF UART I2S I2C 2nd Display Multimedia Phone Platform

XMMTM6180

Test & Debug Stereo Headset Earpiece Handsfree Loudspeaker Analog/Digital Microphone

Blue Moon A-GPS XPOSYS

X-GOLDTM618
Video HW H.263/ H.264 ARM 1176 2G L1 DSP TEAKlite 2D Graphic HW Audio DSP TEAKlite 3G/HSPA Layer 1

Audio

SPI USB Digital RF Interface Power Supply Direct to Battery Power Supply

SMARTiTM-UE
2G/2.5G/3G RF 2G Tx FE Control 2G/3G Rx Control DAC 3G Tx CLK In
PA

SIM
1 4 7 * 2 5 8 0 3 6 9 #

Digital RF v3.09

FEM CTRL FEM 2G/3G RX

Key Pad SD/ MMC

Memories (RAM, ROM, Cache)

MMC SD Card

32kHz XO

External Memory Interface

PA

External Crystal

NAND/ NOR

LPDDR1

Battery

TCVCXO

XMMTM6180 Multimedia Platform Solution

Platform features

PCB Area < 8cm2; ~110 components Standby current 2G: 1.0mA; 3G: 1.2mA;

3GPP Release 6 Protocol stack HSDPA cat 8, HSUPA cat 4 Quad band HSPA, Quad band EDGE Optional up to 5 band HSPA possible Display WVGA (800 x 480) Still picture camera 5Mpxl Video PB, Rec. D1 H.264/30fps Video telephony and streaming A-GPS interfacing Bluetooth interfacing

TEAKlite is a registered trademark of ParthusCeva, Inc.

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Legal Disclaimer The information given in this Product Brief shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information for further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com).

Warnings Due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Order Number: B153-H9353-G1-X-7600 nB09-1000

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