The PCB surface finish forms a critical interface between the component to be assembled and the bare printed circuit board. The surface finish has two essential functions: - To protect the exposed copper circuitry. g( g) - To provide a solderable surface when assembling (soldering) the components to the board. Most surface finishes are considered SMOBC (Solder Mask Over Bare Copper). Copper) Solder Mask Surface Finish
Laminate
Traces
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ThePCBSolutionThat'sRightForYourSupplyChain
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SurfaceFinishes
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ThePCBSolutionThat'sRightForYourSupplyChain
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SurfaceFinishes
HASL Lead Free HASL Immersion Tin Immersion Silver OSP / E t k Entek Gold ENIG Full Body Flash Gold Hard Gold (Tabs) Hard Gold (Selective) Wire Bondable Gold
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SurfaceFinishes
Typical Process Flow: P Fl Clean
FluxApply
Typicalthickness:70microinch 200microinch. IPCspeccallsforonlycompletecoverageofcopperpads. Advantages: Low cost Lowcost Widelyavailable Reworkable Disadvantages: Uneven surfaces Unevensurfaces Notgoodforfinepitch Pb (WithnonleadfreeHASL) Thermalshock SolderBridging PluggedorreducedPTHs
SolderDip S ld i
AirKnife Leveling
Rinsing http://www.pcbsolutions.com 4
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SurfaceFinishes
Typical Process Flow: P Fl Clean
Immersion Tin
Microetch
PreDip
Typicalthickness:20microinch 50microinch. l h k h h Advantages: Flat surface Flatsurface NoPb Willnottarnish Reworkable Disadvantages: Easy to cause handling damage Easytocausehandlingdamage Processusesacarcinogen(Thiourea) Exposedtinonfinalassemblycancorrode TinWhiskers Notgoodformultiplereflow/assembly processes Difficulttomeasurethickness
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ApplyTin l i
PostDip
ThePCBSolutionThat'sRightForYourSupplyChain
2009PCBSOULTIONS.ALLRIGHTSRESERVED.
SurfaceFinishes
Typical Process Flow: P Fl Clean
Immersion Silver
Microetch
PreDip
Typicalthickness:4microinch 12microinch l h k h h Advantages: Flat surface Flatsurface Simpleprocess NoPb Reworkable Easytomeasure Disadvantages: Handling sensitive Handlingsensitive Exposedsilveronfinalassemblymay corrode Tarnishing
ApplySilver l Sil
PostDip
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SurfaceFinishes
Typical Process Flow: P Fl Apply Resist/Tape
Clean
Electrolytic Gold
Rinse
Strip Resist/Tape
Clean http://www.pcbsolutions.com
ThePCBSolutionThat'sRightForYourSupplyChain
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SurfaceFinishes
Typical Process Flow: P Fl Clean
Gold (ENIG)
Microetch
Rinse
Immersion Gold
Rinse
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ThePCBSolutionThat'sRightForYourSupplyChain
2009PCBSOULTIONS.ALLRIGHTSRESERVED.
SurfaceFinishes
Typical Process Flow: P Fl Clean
OSP/Entek
Microetch
PreDip
Typicalthickness:4microinch 24microinch.Notusuallyspecified. l h k h h ll f d Advantages: Flat surface Flatsurface NoPb Simpleprocess Reworkable Disadvantages: No way to measure thickness Nowaytomeasurethickness NotgoodforPTH Veryshortshelflife CancauseICTissues ExposedCuonfinalassembly Handlingsensitive
FloodOSP l d OS
Rinse /Clean
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ThePCBSolutionThat'sRightForYourSupplyChain
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SurfaceFinishes
Summary:
Cost RoHS
No Yes Yes Yes Yes Y Yes Yes
HASL Lead Free HASL Immersion Tin Immersion Silver OSP/Entek Immersion Gold Hard (Tab/Selective) Gold
$ $ $ $$ $$ $$$ $$$$
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ThePCBSolutionThat'sRightForYourSupplyChain
2009PCBSOULTIONS.ALLRIGHTSRESERVED.