10SM11 MATHEMATICAL PHYSICS 4004

VECTOR ANALYSIS: Differentiation of vector functions, Integration Greens theorem, Stokess theorem and Gauss divergence theorem, curvilinear coordinates Grad, Div, Curl and 2 operators in Rectangular, Cylindrical and Spherical Coordinates. (9) TENSOR ANALYSIS: Contravariant and Covariant tensors Addition Subtraction Outer and inner products Contraction Metric tensor Hookes law stressstrain Piezoelectricity and dielectric susceptibility Moment of inertia tensor. Electric polarization General relations, differences between electric polarization and magnetization, the relation between D,E and P in a parallel plate condenser, the energy of a polarized crystal, the force and the couple on a crystal in an electric field (10) GROUP THEORY: Theory of group representation symmetry elements classification of groups conditions multiplication table for C2V, C3V, D4 reducible and Irreducible representation Great Orthogonality theorem Classification of molecules according to symmetry Character table (C2V, C3V). (9) SPECIAL FUNCTIONS & HAMILTONIAN: Beta and Gamma functions, Legenders, Hermite and Laguerre polynomials and Bessel functions Generating function, Rodirgues formula, orthogonal properties and recurrence relations. (9)

INTEGRAL TRANSFORMS: Fourier series, Fourier integral theorem, Fourier transform, Parsevals identity related problems, convolution theorem, transform of derivates, application to ordinary differential equation. (9) COMPLEX ANALYSIS: Functions of complex variable, derivative and Cauchy-Riemann differential equations, Cauchys integral theorem and integral formula, Taylors and Laurents series, Cauchys residue theorem, singular points of an analytic function, evaluation of residues, evaluation of definite integrals. (10) Total: 56 REFERENCES: 1. .Ghatak A.K , Goyal I C and S.H.Chua, Mathematical Physics, Macmillan India, New Delhi, 2002. 2. Arfken G and Weber H J, Mathematical Methods for Physicists, Academic Press, SanDiego, 2001. 3. Sathya Prakash, Mathematical Physics, Sultan Chand & Sons, 2000. 4. Kreyszig E, Advanced Engineering Mathematics, 8th Edition. Wiley, New York, 1999. 5. Joshi A W, Elements of Group Theory for Physicists, 4th Edition, New Age international, New Delhi, 1997. 6. Cotton F A, Chemical Applications of Group Theory, Addison Wiley, 1970.

10SM12 MATERIALS SCIENCE 4004

CRYSTAL STRUCTURE : Atomic structure- Atomic bonding in solids- Crystalline state of solids- Unit cells and Space lattices Crystal structures- Crystal planes and directions- Miller Indices - Diffraction of X-rays by crystal - Bragg's equation - Correction to Bragg's equation - Reciprocal lattice- Crystal Defects- point, line and surface defects. (12) DIFFUSION IN METALS: Fick's 1st and 2nd law - equation - vacancy mechanism - Arrhenious equation - Kirkendall effect - diffusion along dislocation, surface and grain boundary. (7) ELASTIC, ANELASTIC AND VISCOELASTIC BEHAVIOUR: Atomic model of elastic behavior- Rubber like elasticityAnelastic behavior- Viscoelastic behavior. (7) PLASTIC DEFORMATION: Plastic deformation - Slip - twinning - Critical resolved shear stress - theoretical shear strength of perfect crystal - role of dislocation in plastic deformation - methods of strengthening crystalline materials strain hardening - grain size - solid solution strengthening - precipitation strengthening - fibre reinforced materials whiskers - creep - creep curves - mechanism of creep - creep resistant materials (12) FRACTURE Ductile and brittle fracture - Theoretical cohesive strength of materials - Griffith's theory - Methods of protection against fracture - Fatigue. (7) THERMAL BEHAVIOUR OF MATERIALS: Various theories of lattice specific heat - classical theory, Einstein's theory and Debye's theory - Lattice vibration - one dimensional lattice of identical atoms - specific heat of one dimensional lattice - diatomic linear lattice - thermal conductivity of insulators. (11) Total 56

REFERENCES 1. James F Shackelford, Introduction to Materials Science for Engineers, 7th Edition,Pearson Prentice Hall, 2009 2. Callister W D, "Materials Science and Engineering : An Introduction", 7th Edition, John Wiley & Sons, Inc., 2007. 3. Vernon John, Introduction to Engineering Materials, 3rd Edition, Palgrane Publication, 2003. 4. Raghavan V, Materials Science and Engineering: A First Course", 5th Edition, Prentice Hall of India Pvt. Ltd., 2004. 5. Dekker A J, "Solid State Physics", Macmillan and Co., 2000. 6. Van Vlack L H, "Elements of Materials Science and Engineering", 5th Edition, Addison Wesley, New York, 1989.

10SM13 ANALOG AND DIGITAL ELECTRONICS 4004

BASIC CONCEPTS OF ANALOG CIRCUITS AND SIGNALS: Analog Electronics, analog signals, periodic signals, time domain and frequency domain signals. Amplifiers, linear amplifiers non linear amplifiers (8) BIPOLAR JUNCTION TRANSISTORS (BJTs): Structure of bipolar junction transistors, BJT bias circuits, common base, common collector and common emitter amplifier, bipolar transistor as a switch, transistor packages and terminal identification. TTL logic circuits. (10) FIELD EFFECT TRANSISTOR (FET):Structure of field effect transistors, JFET characteristics, JFET biasing, MOSFET characteristics, MOSFET biasing, FET linear amplifiers, FET switching amplifiers. MOS logic circuits. (8) OSCILLATORS: General theory of feedback-Barkhausen criterion. Negative feedback and positive feedback. Loop gain. Hartley oscillator, Phase shift oscillator. (treatment and scope as in text book). Astable, monostable and bistable multivibrator-working. (8) OPERATIONAL AMPLIFIERS: Introduction to operational amplifiers, the differential amplifier, negative feedback, operational amplifier configurations with negative feedback. Basic operational amplifier circuits, summing amplifier, integrators and differentiators. Instrumentation amplifier (6) DIGITAL ELECTRONICS: Combinational logic circuits, multiplexer, demultiplexer, encoder and decoder. Sequential logic circuits. Flip-flops, RS, D, JK and T flip-flops. Counters, synchronous, asynchronous, MOD-3, MOD-5 and decade counters. Shift registers serial and parallel shift registers. (10) DATA CONVERSION CIRCUITS: Digital to analog converters, binary weighted and R-2R ladder types. Analog to digital converter, flash type, counter type, continuous and successive approximation register (6) REFERENCES 1. Thomas L.Floyd and David Buchla, Fundamentals of Analog Circuits, Prentice Hall, 2007. 2. Albert Paul Malvino and Donald P.Leach, Digital Principles and Applications, TMH, 2009. 3. Malvino Albert, Basic Electronics, McGraw Hill, 2007. 4. Gothamann H, "Digital Electronics: An Introduction to theory and Practice", Prentice Hall, 2001. 5 Mottershed A, "Electronic Devices and Circuits", Prentice Hall, 2006.

10SM14 CLASSICAL MECHANICS 4004

LAGRANGIAN FORMULATION: Mechanics of a system of particles constraints, Principle of virtual work, generalized coordinates, DAlemberts principle and Lagrangian equations conservation theorems and symmetry properties applications of Lagrangian formulation: LHO, simple pendulum, particle moving under central force, Atwood machine, electrical circuits. (10) CENTRAL FORCE PROBLEM : Reduction to one body problem, equation of motion and first integral, one dimensional problem and classification of orbits, Kepler problem and planetary motion, scattering in central force field, transformation to laboratory frames. (9) RIGID BODY AND VIBRATING SYSTEM : Euler angles tensor of inertia kinetic energy of a rotating body symmetric top and applications. Vibrating string solution wave equation normal vibrations dispersion coupled vibrating system. (9) HAMILTONIAN FORMULATION : Hamiltons principle, Lagranges and Hamiltons equations from Hamiltons principle, Hamiltons equation of motion from variational principle, physical significance of Hamiltonian, principle of least action, applications LHO, simple pendulum, particle moving under central force, Atwood machine, Poisson bracket. (10) HAMILTON JACOBI THEORY AND THEORY OF SMALL OSCILLATIONS: Hamilton Jacobi equations Linear Harmonic Oscillator Problem by Hamilton Jacobi method Action Angle Variables Application to Keplers problem.

Oscillatory motion Theory of small Oscillation Linear Triatomic Molecule stability of Oscillatory motion Forced Harmonic Oscillator non-linear Oscillation in a symmetric potential. (10) SPECIAL RELATIVITY: Principles and postulates of relativity, Lorentz transformations, length contraction, time dilation and Doppler effect, velocity addition formula, four vector notation, energymomentum four-vector for a particle, relativistic invariance of physical laws. (8) Total 56 REFERENCES 1. Tom W B Kibble, Frank H Berkshire, Classical Mechanics, Imperial College press. 2004. 2. Srinivasa Rao K N, Classical Mechanics, University press, , Ist Edition, 2003. 3. Gupta S L, Kumar V and Sharma H V, Classical Mechanics, Pragati Prakashan, Meerut, 2003. 4. Goldstein H, Poole C and .Safko J, Classical Mechanics, , Pearson Education, 3rd Edition ,Asia, New Delhi, 2002 5. Biswas S N, Classical Mechanics, Books and Allied Ltd., Kolkatta, 1998.

10SM15 ENGINEERING PHYSICAL METALLURGY 4004

SOLIDIFICATION OF PURE METALS: Formation of equi-axed, columnar and chil crystals. Applications to casting methods. Alloying behaviour: Solid solutions and intermetallic compounds, Hume Rothery rules, electron compounds. (10) BINARY PHASE DIAGRASM: Phase rule, one component system, two component system - isomorphous, eutectic, eutectoid, peritectic systems in detail - other phase reactions in brief. Discussion of typical binary phase diagrams illustrating these reactions - lever rule, nonequilibrium solidification, coring. Fe-C diagram. (9) PLASTIC DEFORMATION AND ANNEALING: Effect of cold work on mechanical properties, recovery, recrystallisation and grain growth - recrystallisation temperature - control of grain size. (6) MECHANICAL TESTING OF METALS: Tensile, hardness, fatigue and creep tests and their interpretation. NON DESTRUCTIVE TESTING: X(5)

-ray and ultrasonic testing, magnetic particle inspection, liquid penetrant testing. (7)

HEAT TREATMENT OF ALLOYS: Basic Principles - T-T-T diagrams and CCT diagrams and their use. Heat treatment processes - Annealing, normalising, hardening and tempering. Special heat treatment processes - austempering and martempering - Applications. Surface hardening processes - Carburising, nitriding & boriding and their applications. Flame and Induction hardening - principle and processes - Elementary discussion of Laser Surface hardening. (10) METALLOGRAPHY: Fundamentals of metallography - Metallurgical microscopy - specimen preparation techniques Types of illumination - Use of polarised light - Introduction to Electron microscopy - applications. (9) Total 56 REFERENCES 1. Reed Hill R, "Physical Metallurgy Principles", Affiliated East West Press, New Delhi, 1992. 2. Van Vlack L H, "Elements of Materials Science and Engineering", 6th Edition, Addison Wesley, New York, 1989. 3. Smith C O "Science of Engineering Materials", 3rd Edition, Prentice Hall, Inc., NJ, 1986. 4. Avner S H, "Introduction to Physical Metallurgy", 2nd Edition, Mc Graw Hill, 1982. 5. Baldev Raj Y Jayakumar M and Thavasimuthu, Practical Non-Destructive Testing, 2ndEdition, Alpha Science International Ltd, UK, 2002.

10SM16 PROFESSIONAL COMMUNICATION 0021

READING COMPREHENSION: Reading for Critical purposes SCIENTIFIC STYLE: clarity simplicity exactness brevity unity coherence objectivity. Formal and Informal Writing. Presentation Skills Introduction to soft skills (2)

(4) (2) (1)

Interpersonal Intrapersonal Communication Meetings Professional Report Writing Professional Values and Ethics Workshop PRACTICALS Short speeches Group Discussions Meetings

(2) (2) (3) (4) (8)

Total 28 TEXTBOOK Teaching Material prepared by the Faculty, Department of English. REFERENCES 1. Rodney Huddleston and Geoffrey K. Pullam., Student s Introduction to English Grammar, Cambridge University Press. U.K. 2005. 2. Bert Decker, Art of Communicating . Decker Communications, Inc., USA 2004. 3. Meenakshi Raman and Sangeeta Sharma, Technical Communication Principles and Practice, Oxford University Press, UK 2004. 4. Ajay Rai, Effective English for Engineers and Technologies : Reading, Writing & Speaking, Crest Publishing House, New Delhi 2003. 5. Paul V Anderson, Technical Communication: A Reader centered Approach, Asia Pte. Ltd., Singapore, 2003. 6. Albert Joseph, Writing Process 2000, Prentice Hall, New Jersey.

10SM17 C PROGRAMMING AND DATA STRUCTURES

3024
INTRODUCTION TO C: Introduction to Problem Solving - Algorithm / pseudo code, flowchart - program development steps - structure of C program - identifiers, basic data types and sizes, Constants, variables, operators, expressions, type conversions, conditional expressions, precedence and order of evaluation. (4) CONTROL STATEMENTS: While statement do while statement for nested loops if else switch break continue conditional operator go to statement programs. (3) FUNCTIONS: Designing structured programs - defining a function accessing a function passing arguments to functions specifying arguments data types function prototypes storage classes auto static extern and register variables. (4) ARRAYS: Defining a array processing array types of arrays - passing array to a function multi dimensional array array & strings. (3) POINTERS: pointers- concepts, initialization of pointer variables, pointers and function arguments, address arithmetic, Character pointers and functions, pointers to pointers, pointers and multidimensional arrays, dynamic memory managements functions, command line arguments, c program examples. (6) STRUCTURES AND UNIONS: Derived types- structures- declaration, definition and initialization of structures, accessing structures, nested structures, arrays of structures, structures and functions, pointers to structures, self referential structures, unions, typedef, bit fields, C program examples (5) INTRODUCTION TO DATA STRUCURES : Data structures - abstract data Types - primitive data structures - analysis of algorithms - notation. (3) STACKS: primitive operations - sequential implementation - applications: Recursion : definition, process and implementation using stacks; Parentheses matching; Evaluation of expressions Infix, prefix, postfix operations. (3) QUEUES: primitive operations - sequential implementation - priority Queues - dequeues - Applications. (3)

LISTS: Linked List -Insertion and deletion of nodes Types of Linked lists - Singly linked lists, Doubly linked lists, Circular lists, Multiply linked lists - Applications: Addition of Polynomials; Sparse Matrix representation ,Linked stacks - Linked queues - Linked Priority queues. (4)

TREES: Terminologies - Implementation - BINARY TREE: Properties - sequential and linked representation - binary tree operations - traversals - Expression trees - Threaded trees . (4) Total 42 REFERENCES 1. Aaron M Tanenbaum Moshe J Augenstein and Yedidyah Langsam, "Data structures using C and C++", Pearson Education, 2004.. 2. Robert L Kruse , Bruce P Leung and Clovin L Tondo , Data Structures and Program Design in C, Pearson Education, 2004. 3. Deitel and Deitel, C- How to Program, Pearson Education, 2003. 4. Herbert Schildt, C The Complete Reference, McGraw Hill, 2001. 5. Kernighan B W and Ritchie D M, C Programming Language, Pearson Education, 2000.. 6. Sahni Sartaj, "Data Structures, Algorithms and Applications in C++", WCB / Mc Graw Hill, 2000. 7. Mark Allen Weiss, Data Structures and Algorithm Analsysis is C , Pearson Education, 2003

C PROGRAMMING AND DATA STRUCTURES LAB

Implementation of the following problems: 1. Simple programs to understand the concepts of data types. 2. Familiarizing conditional, control and repetition statements 3. Usage of single and double dimensional arrays including storage operation 4. Implementation of functions, recursive functions 5. Defining and handling structures, array of structures and union 6. Implementation of pointers, operation on pointers, dynamic storage allocation 7. Various types of Matrices and operations 8. Library of string operations 9. Stacks: Operations and applications 10. Queues: Operations and applications. 11. Linked Lists: Implementation of Singly linked, doubly linked and Circular lists 12. Implementation of Binary trees and Threaded trees Total 28

10SM18 MATERIALS SCIENCE LABORATORY I 0032

1. 2. 3. 4. 5. 6. 7. 8. Simulation and study of reciprocal lattice Determination of Youngs modulus of glass elliptical fringes. Optical microscope specimen preparation and observation Study of unetched grey cast iron and spheroidal graphite cast iron. Study of etched grey cast iron and spheroidal graphite cast iron. Study of etched white iron and plain carbon steels. Multiplexer and demultiplexer Decoder and encoder

Demonstration: 9. Direct shear test on metal rods, Compression test on concrete cube tensill test

10. Vickers pyramid hardness test, Brinell test on cast iron rods, Izod impact test.

10SM21 APPLIED THERMODYNAMICS 4004

REVIEW OF THE LAWS OF THERMODYNAMICS: The first law of thermodynamics. State functions. Enthalpy. Calculation of the first law quantities. The second law of thermodynamics Kelvin-Planck statement and Clausius statement. Carnots principle Carnots cycle and its efficiency. Entropy, calculation of entropy changes. Entropy reversibility and irreversibility. (10) MATERIAL EQUILIBRIUM: Thermodynamic properties of non-equilibrium systems. Entropy and equilibrium. The Gibbs and Helmholtz functions. Gibbs equations for a system of constant composition. Maxwells relations. Chemical potential. Condition for phase equilibrium and reaction equilibrium. (9) REACTION EQUILIBRIUM IN IDEAL GAS MIXTURES: Chemical potentials in an ideal gas mixture. Ideal gas reaction equilibrium. Temperature dependence of the equilibrium constant. Shifts in ideal gas reaction equilibria. (8) THERMODYNAMICS OF PHASE TRANSITION: Thermodynamic classification of phase transitions Thermodynamic relations at the phase transition Thermodynamic theories of phase transitions Landaus theory of second order transitions, Tizzas theory of Lambda transitions Hysteresis in phase transformations Irreversible phase transformations and stabilities of polymorphs Phase transitions in glasses. (11) MAXWELL BOLTZMANN STATISTICS: Phase space. Microstates, macrostates, thermodynamics probability. MaxwellBoltzmann distribution. Partition function. (6) B-E AND F-D STATISTICS: Thermodynamic probability for Bose-Einstein statistics, Bose-Einstein distribution. Thermodynamic probability for Fermi-Dirac statistics, Fermi-Dirac distribution. (6) ENGINEERING APPLICATIONS: (Basic only). Open systems, control volumes. First law applied to flow process. Carnots theorems. Heat engines efficiency calculations. Availability and irreversibility. PVT behaviour of simple compressible substances. TdS relations. Joule-Thomson coefficient. Air-water vapour mixtures. (6) Total 56 REFERENCES 1. Rao K J and Rao C N R, Phase Transitions in Solids, McGraw Hill, 2002. 2. Jena A K and Chaturvedi M C, Phase Transformations in Materials, Prentice Hall, NJ, 1992 3. Ira N Levine, Physical Chemistry , McGraw Hill Book Company, Second Edition, 1988. 4. Nag P K, Engineering Thermodynamics, Tata McGraw Hill, 1981. 5. Sears F W, Introduction to Thermodynamics : Kinetic Theory of Gases and Statistical Mechanics, Addison Wesley, 1956.

10SM22 CRYSTAL GROWTH AND CHARACTERIZATION 4004

FUNDAMENTALS OF CRYSTAL GROWTH: Materials preparation: Liquid liquid extraction, ion exchange, gas and liquid chromatography. The crystalline state classification of crystal growth methods Generation of reactants Transport of reactants to the growth surface Theories of nucleation Classical theory Gibbs Thomson equation for vapour solution and melt energy of formation of a nucleus Adsorption at the growth surface Nucleation homogeneous and heterogeneous nucleation Growth surface. (9) THEORIES OF CRYSTAL GROWTH : Surface energy theory, Diffusion theory and Adsorption layer theory concepts of Volmer theory, Bravais theory, Kossel theory and Stranskis treatment Two-dimensional nucleation theory: Free energy of formation, Possible shapes and Rate of nucleation nucleation Mononuclear, Polynuclear and Birth and Spread modles Modified Birth and Spread model Crystal growth by mass transfer processes: Burtaon, Cabrera and Frank (BCF) bulk diffusion model, Surface diffusion growth theory. (10) MELT GROWTH TECHNIQUES: Basics of melt growth Heat and mass transfer Conservative growth processes : Bridgman Stockbarger method Czochralski pulling method Kyropolous method Non-conservative processes: Zone-refining Vertical and horizontal float zone methods Skull melting method Vernueil flame fusion method (8) SOLUTION GROWTH TECHNIQUES: Growth from low temperature solutions: Selection of solvents and solubility Meirs solubility diagram Saturation and supersaturation Metastable zone width Growth by restricted evaporation of solvent, slow cooling of solution and temperature gradient methods Crystal growth in Gel media: Chemical reaction and solubility reduction methods Growth from high temperature solutions: Flux growth principles of flux method Choice of flux Growth by slow evaporation and slow cooling methods Hydrothermal growth method. (10) VAPOUR GROWTH TECHNIQUES: Basic principles Physical Vapour Deposition (PVD): Vapour phase crystallization in a closed system Gas flow crystallization Chemical Vapour Deposition (CVD): Advantages and disadvantages growth

by chemical vapor transport reaction: Transporting agents, Sealed capsule method, Open flow systems Temperature profile and Oscillatory temperature profile. (10) CRYSTAL CHARACTERIZATION: Review of crystal systems orientation and planes. Orientation of crystals by optical and x-ray methods. Crystal cutting and polishing. Observation of defects in crystals. Etching: Dislocation density measurements. Thermal, optical and mechanical properties of crystals. (9) Total 56 REFERENCES 1. Ichiro Sunagawa, Crystals: Growth, Morphology and Perfection Cambridge University Press, Cambridge, 2005. 2. Mullin J W, Crystallization Elsevier Butterworth-Heinemann, London, 2004. 3. Christopher Hammond, Basics of X-ray crystallography and diffraction Oxford university press, USA. 2002. 4. Brice J C, Crystal growth processes, John Wiley and Sons, New York, 1986. 5. Willard H H, Instrumental methods of Analysis CBS Publishers, 1986.

10SM23 QUANTUM MECHANICS 4004

PHYSICAL BASIS OF QUANTUM MECHANICS: Wave particle duality - Uncertainty principle applications. Postulates of quantum mechanics Schrodinger equation time dependent and independent eigenfunction and eigenvalues probability density- Applications to one dimensional problems (Linear harmonic oscillator and tunnel effect)- Hydrogen atom: solution, eigen values, orbitals and quantum numbers. (9) VECTOR SPACES AND LINEAR OPERATORS: Representation of operators by matrix-adjoint of an operator Hermitian operator, unitary operator, similarity transformation, Hilbert space, Diracs Bra and Ket notation. Schrodinger, Heisenbergs and interaction representation equation of motion. Matrix theory of Harmonic Oscillator. (6) ANGULAR MOMENTUM: Eigen value and eigen function of L2 and Lz operator, ladder operator L+ and L-, Pauli theory of spins(Pauli matrices), angular momentum as generator of infinitesimal rotations, matrix representation of J in ljm basis. Addition of angular momenta, computation of Clebsch-Gordon coefficients in simple cases. (7) APPROXIMATION METHODS: Perturbation method time independent perturbation of non-degenerate and degenerate cases. First order correction, applications. Stark effect and Zeeman effect of Hydrogen atom harmonic oscillator, helium atom. (7) TIME DEPENDENT PERTURBATION THEORY: First order correction interaction between electromagnetic wave and atoms transition probabilities Einsteins coefficients selection rules for harmonic oscillator and hydrogen atom (rigorous derivation not included). (6) HARTREE FOCK APPROXIMATION: Hartree Fock equation Coulomb and exchange operators, Fock operators. (5) VARIATION METHOD: Principles of the variation method for ground state with proof. Application of variation method to He atom. Other simple examples. (4) THEORY OF MOLECULES: LCAO and variation method Hydrogen molecule Heitler London theory (rigorous derivation not included) general discussion of results. Discussion of molecular orbital theory and valence bond theory . SCF MO treatment of polyatomic molecules basis set LC STO molecular orbitals- gaussian type functions molecular electrostatic potential and atomic charges -molecular geometry potential energy surface- thermodynamic properties. (12) Total 56 REFERENCES 1. Arthur Beiser, Concepts of Modern Physics, Tata McGraw-Hill Publishing Company Limited, 2005. 3. Aruldhas G, Quantum Mechanics, Printice-Hall of India Pvt. Ltd.,, 2002 4. Atkins P W and Friedman R S, Molecular Quantum Mechanics, Oxford University Press, 1997. 5. Mathews P M and Venkatesan K, A Text book of Quantum Mechanics, Tata Mc Graw- Hill, New Delhi. 1976 6. Amit Goswami, "Quantum Mechanics", WCB Publishers, 1992.

10SM24 PROPERTIES OF MATERIALS 4004

ELECTRICAL PROPERTIES OF SOLIDS: Fermi Dirac distribution - density of states - electronic specific heat. Boltzmann transport equation - Sommerfeld's theory of electrical conductivity. Band theory of solids - Overlapping of energy bands - Kronig Penny model. The motion of electrons in one dimension according to band theory, Brillouin zones band model for metals, semiconductors and insulators. (10) SEMICONDUCTORS AND THEIR PROPERTIES: Band model of semiconductors - carrier concentrations in intrinsic and extrinsic semiconductors - Fermi level - variation of conductivity and mobility with temperature - law of mass action . Hall effect - Hall coefficients for intrinsic and extrinsic semiconductors - determination of Hall constant - Hall effect devices. Theory of P-N junctions - barrier potential - width of depletion region. (10) DIELECTRIC AND OPTICAL PROPERTIES: Static dielectric constant, electronic , ionic and orientation polarizations Internal or local fields in solid and liquids. Lorentz field in cubic materials - Clausius-Mosotti equation - complex dielectric constant - determination of dipole moment for polar substances - dielectric losses - frequency dependence of electronic, ionic, orientation polarisabilities - optical absorption, luminescence - Thallium activated alkali halides - electro luminescence. (11) FERRO ELECTRIC AND PIEZOELECTRIC MATERIALS: General properties - classification of ferro electric materials dipole theory of ferro electricity - ferro electric domains - applications - piezoelectric materials and applications. (8) MAGNETIC PROPERTIES: Langevin theory of paramagnetism - ferromagnetism - domain theory - Experiments to confirm domain - magnetic hysteresis , Weiss molecular field theory, Heisenberg's theory - magnetic anisotropy - domain walls - Exchange energy - antiferromagnetism - two sublattice theory - ferrites - properties - structure - magnetic moments - preparation and applications - hard and soft magnetic materials. Garnets magnetic bubbles - magnetic resonance EPR and NMR. (10) SUPERCONDUCTIVITY: Josephson effect, electronic specific heat in superconducting state - type I and II superconductors Thermodynamics of super conducing transition London equation Coherence length Single particle tunneling High temperature superconductors - applications. (7) Total 56 REFERENCES th 1. Callister W D, "Materials Science and Engineering : An Introduction", John Wiley & Sons, Inc., 7 Edition, 2007. 2. Kittel C, "Introduction to Solid State Physics" Wiley Eastern Ltd., 2005. 3. Dekker A J, "Solid State Physics" , Macmillan and Co., 2000. 4. Azaroff and Brophy, "Electronic Processes in Materials", McGraw Hill Co., 1990. 5. Michael Shur, "Physics of Semiconductor Devices", Prentice Hall of India, 1995.

10SM25 EXPERIMENTAL TECHNIQUES IN MATERIALS SCIENCE 4004

X-RAY DIFFRACTION METHODS: Stereographic projection - Wulff net- Measurement of angle between poles determination of Miller indices of an unknown pole. X-ray diffraction, under nonideal conditions - Scherrer formula for estimation of particle size. Laue method, rotating crystal method, powder method, Debye-Scherrer camera. Intensity of diffracted beams, scattering by an electron; scattering by an atom; scattering by a unit cell - structure factor - Structure factor calculations. (12) SPECTROSCOPIC TECHNIQUES: Mass spectroscopy and X-ray emission spectroscopy (Principle and limitations) Quadrapole mass spectrometer. Special surface techniques: Electron spectroscopy for chemical analysis (ESCA), ultraviolet photo electron spectroscopy (UPS), X ray photoelectron spectroscopy (XPS), Auger electron spectroscopy (AES), Electron energy analysers, , Secondary ion mass spectrometry, mass spectrometer types Applications, Laser Raman Spectroscopy,Fourier Transform Infrared Spectroscopy. (10) SURFACE STRUCTURE AND SURFACE STRUCTURE ANALYSIS: The need for surface study. Surface chemical composition: The extension of bulk techniques to surface studies - Unit meshes of five types of surface nets - diffraction from diperiodic structures. Surface methods using electron, low energy electron diffraction (LEED), reflection high energy electron diffraction (RHEED), Scanning Probe microscope. (8) ELECTRON BEAM TECHNIQUES: Transmission electron Microscopy (TEM), Scanning Transmission Electron Microscopy (STEM). Ion Beam Techniques: Rutherford Backscattering Spectrometry (RBS), Field Ion Microscopy (FIM). (8)

ADVANCED MICROSCOPIC TECHNIQUES: Scanning Tunnelling Microscopy, Constant current and constant height mode - Instrumentation - Atomic Force Microscopy, Imaging modes, Force sensor, Deflection detection. (4) THERMAL ANALYTICAL TECHNIQUES: Principles of differential thermal analysis, differential scanning calorimetry and thermogravimetric analysis - Instrumentation - determination of transition temperature, heats of transition of plastics, metals and alloys and other materials. (8) OPTICAL TECHNIQUES: Use of polarised light in the study of transparent materials. Polarised light microscopy, conoscopy. Compensator techniques Babinet-soblei compensator, Berek compensator, measurement of birefringence, elasto-optic coefficients. Measurement of birefringence in fused silica masks for microlithography. (6) Total 56 REFERENCES 1. Treatise on Materials Science and Technology, Volume 27, "Analytical Techniques for Thin Films", Academic Press, Inc.Newyork, 1991. 2. Prutton M, "Surface Physics", Clarenden Press Oxford, 1975. 3. Rodriquez F, "Principles of Polymer Systems", Tata McGraw Hill Co., 1974. 4. Edward A Colline, Jan Bares and Fred W.Billmeyer, "Experiments in Polymer Science", Jr Wiley - Interscience, 1973. 5. Cullity B D, "Elements of X-ray Diffraction", Addison Wesley Publishing Co., 1967.

10SM27 THIN FILM TECHNOLOGY 3024

PREPARATION OF THIN FILMS: Study of thin film vacuum coating unit - Construction and uses of vapour sources-wire, sublimation, crucible and electron bombardment heated sources. Physical vapour deposition Thermal evaporation electron beam evaporation Sputtering - Study of glow Discharge - Physical nature of sputtering - Sputtering yield Experimental set up for DC and RF magnetron sputtering, Pulsed laser deposition and Ion beam assisted deposition. Chemical vapour deposition Thermodynamics of CVD - Atmospheric pressure CVD MOCVD and PECVD processes. Chemical methods: Qualitative study of preparation of thin films by Electroplating, vapour phase growth and anodization. (8) NUCLEATION AND GROWTH: Nucleation and growth of thin films four stages of film growth - Directionality of evaporation molecules - Cosine law of emission. Emission from a point source. Mass of material condensing on the substrate. (6) DEPOSITION MONITORING AND CONTROL: Microbalance, Crystal oscillator thickness monitor, optical monitor, Resistance Monitor. Thickness measurement: Multiple Beam Interferometer, Fizeau (Tolansky) technique - Fringes of equal chromatic order (FECO) method - Ellipsometry (qualitative only). (6) ELECTRICAL PROPERTIES: Sheet resistance - size effect - Electrical conduction in thin metallic films. Effect of ageing and annealing - Oxidation - Agglomeration. (5) DIELECTRIC PROPERTIES: DC conduction mechanism - Low field and high field conduction. Breakdown mechanism in dielectric films - AC conduction mechanism. Temperature dependence of conductivity. (5) STRUCTURE AND OPTICAL PROPERTIES: Study of structure of thin films using x-ray diffraction method, Optical constants of thin films spectrophotometer- Transmittance, absorption, determination of band gap (5) APPLICATION OF THIN FILMS: Thin film resistors: Materials and Design of thin film resistors (Choice of resistor and shape and area) - Trimming of thin film resistors - sheet resistance control - Individual resistor trimming. Thin film capacitors: Materials - Capacitor structures - Capacitor yield and capacitor stability. Thin film field effect transistors: Fabrication and characteristics - Thin film solar cells antireflection coatings. (7) Total 42 REFERENCES 1. Milton Oring, Materials Science of Thin Films, Academic Press, 2002. 2. Icha Elshabini-Riadaud Fred D Barlow III "Thin Film Technology Hand book", Mc Graw Hill Company, 1997. 3. Goswami A, "Thin Film Fundamentals", New Age International (P) Ltd., 1996. 4. Donald Smith, Thin Film Deposition , McGraw Hill, 1995. 5. Maissel L I and Glang R, "Hand Book of Thin Film Technology", McGraw Hill, 1970. Laboratory 1. Preparation of thin films hot wall deposition technique 2. Preparation of thin films RF and DC magnetron technique

3. 4. 5. 6. 7. 8.

Preparation of thin films electron beam evaporation technique Determination of surface roughness surface profilometer Determination of thickness multiple beam interferometry Laser micromachining of thin films Study of dip coating and spin coating techniques Determination of sheet resistance four probe method Total : 28

10SM28 MATERIALS SCIENCE LABORATORY II 0032

1. 2. 3. 4. 5. 6. 7. 8. Determination of Magnetic susceptibility Quinkes method. Determination of Band gap of silicon and its Hall co-efficient. Determination of Dielectric constant of liquids and solids. Study of dielectric behaviour of ferroelectric materials during the phase transition. Determination of resistivity. Growth of a crystal using slow evaporation technique Study of birefringence. Determination of corrosion rate.

Demonstration: 9. XRD 10. DSC

10SM31 CERAMIC MATERIALS 4004

STRUCTURE OF CERAMIC CRYSTAL: Paulings rules oxide structures Silicate structures the clay minerals polymorphism: displacive transformations, reconstructive transformation, Silica. (7) STRUCTURE OF GLASSES: Glass formation Random network model structure of oxide glasses glass formation composition as a variable, heat flow and precipitation from glasses growth controlled by diffusion of solutes crystalline glazes opacified enamels photosensitive and photochromic glasses. (9) CERAMIC FORMING METHODS: Solid state sintering: Local driving force for sintering, atomic mechanisms occurring during sintering sintering kinetics: initial stage sintering, densification kinetics, coarsening and grain growth kinetics factors affecting solid state sintering hot iso static processing sol gel processing CVD plasma spraying (qualitative treatment only) (11) THERMAL PROPERTIES: Heat capacity thermal expansion of crystals,glasses and compoite bodies thermal conduction processes phonon conductivity of single phase crystalline ceramics phonon conductivity of single phase glasses photon conductivity conductivity of multiphase ceramics. (9) MECHANICAL PROPERTIES: Modulus of elasticity of 2-phase and porous ceramics Griffths theory abrasives Knoops scale ceramic cutting tools cermets. (6) ELECTRICAL PROPERTIES: Conductivity of ceramic materials ceramic semiconductors and their uses as fixed resistors, heating elements, thermistors and varistors piezoelectric ceramics insulators. (6) REFRACTORIES: Fundamentals of refractory science and Engineering- Gap grading Continuous grading Fabrication and firing Importance of phase diagram in refractors. Manufacturing, properties and application of refractories. (8) Total 56 REFERENCES 1. William F Smith, Foundations of Materials Science and Engineering, McGraw Hill Book Co., 2000. 2. Michel W Barsoum, Fundamentals of Ceramics, McGraw Hill Book Co., 1997. 3. Kingery, Introduction to Ceramics, John Wiley Publications, 1991. 4. Kwan Chi Kao Dielectric Phenomena in Solids, Elsevier Academic Press, 2004. 5. Charles A. Schacht, Refractories Handbook, Marcel Dekker Inc., 2004

10SM32 COMPOSITE MATERIALS 4004

INTRODUCTION: Reinforcement Fibres Glass fibre, Aramid fibre, Carbon fibre, boron fibre Fabrication Properties Applications Comparison of fibres Particulate and whisker reinforcements. Matrix materials Properties. (7) REINFORCEMENT MATRIX INTERFACE: Wettability Effect of surface roughness Interfacial bonding Methods for measuring bond strength. (5) POLYMER MATRIX COMPOSITES: Types Processing Thermal matrix composites Hand layup and spray technique, filament winding, Pultrution, resin transfer moulding, autoclave moulding Thermoplastic matrix composites Injection moulding, film stacking Diaphragm forming Thermoplastic tape laying. Glass fibre/polymer interface. Mechanical properties Fracture. Applications. (9) METAL MATRIX COMPOSITES: Types. Important metallic . Processing Solid state, liquid state, deposition, insitu. Sic fibre / Titanium interface. Mechanical properties. Applications. (7) CERAMIC MATRIX COMPOSITES: Ceramic matrix materials Processing Hot pressing, liquid infiltration technique, Lanxide process, insitu chemical reaction techniques CVD, CVI, solgel process. Interface in CMCs. Mechanical properties Thermal shock resistance Applications. (8) CARBON FIBRE COMPOSITES: Processing. Properties. Interface. Surface treatment Chemical vapour deposition. Applications. (4) GEOMETRICAL ASPECTS: Unidirectional laminas Volume fraction and weight fraction Woven roving, in-plane random fibres Fibre length and fibre orientation distribution Voids Fibre orientation during flow. (5) MICROMECHANICS: Micromechanics models for stiffness Micromechanics models for strength Thermal and moisture effects. (6) FATIGUE AND CREEP IN COMPOSITE MATERIALS: Fatigue S-N curves Fatigue behaviour of CMCs Fatigue of particle and whisker reinforced composites Hybrid composites Thermal fatigue Creep. (5) Total 56 REFERENCES 1. Mathews F L and Rawlings R D, Composite Materials: Engineering and Science, CRC Press and Woodhead Publishing Limited, 2002. 2. Krishnan K Chawla, Composite Materials Science and Engineering, Springer, 2001. 3. Derek Hull, Introduction to Composite Materials, Cambridge University Press, 1988. 4. Handbook of Composites American Society of Metals, 1990.

10SM33 POLYMERIC MATERIALS 4004

INTRODUCTION TO POLYMER SCIENCE: Basics of polymer - classification of polymers. Polymerisation - mechanism of free radical, ionic and coordination Polymerisation. Step Polymerisation polycondensation, polyaddition, ring openning polymerisations. (8) KINETICS AND POLYMERISATION TECHNIQUES: Kinetics of free radical, ionic polymerisations, kinetics of acid catalysed and non-catalysed polyesterifications. Free radical copolymerisation kinetics. Polymerisation Techniques for Chain and Step polymerisation. (8) MOLECULAR WEIGHT OF POLYMERS: Molecular weight distribution, fractination of polymers. Molecular weight determination Ebulliometry, Cryometry, Osmometry, Light scattering, Ultracentrifugation, End group analysis and GPC. (8) SOLID STATE AND THERMAL PROPERTIES: Amorphous, Crystalline state degree of crystallinity, factors affecting crystalisability. Glass transition temperature - factors affecting Tg, measurements by DSC, DTA, TMA. Thermal stability thermogravimetric analysis. (8) TESTING AND CHARACTERIZATION OF POLYMERS: Stress Strain relationships. Physical tests tensile strength, flexural strength, impact strength, abrasion resistance. Electrical properties dielectric strength. Spectronic Characterization of polymers IR, UV. (8)

POLYMER PROCESSING: Compounding of plastics fillers, reinforcements, plasticizers, stabilizers, flame retardants, colorants. Moulding techniques - compression, injection, extrusion and blow mouldings. Thermo forming and foamings. Calendering, film castings, fibre spinnings. (8) SPECIALITY POLYMERS AND POLYMER WASTE MANAGEMENT: Polymers for electronic applications - conducting polymer, photonic polymers, liquid crystalline polymers. Flame retardant polymers, heat resistant polymers. Polymer waste management: Recycling, incineration and biodegradation biodegradable polymers. (8) Total 56 REFERENCES 1. Gowarikar V R, Viswanathan N V and Jayadev sreedhar, Polymer Science, New Age International, 2003. 2. George Odian Principles of Polymerization, John Wiley and sons, Inc, 2002. 3. Joel R Friend, Polymer Science and Technology, Prentice-Hall of India Pvt. Ltd.,1999. 4. Brydson J A., Plastic Materials, Butterworth Heinmann, 1995. 5. Billmeyer, Text book of Polymer Science, John Wiley and Sons, 1994. 6. Raymond B Seymour and Charles E Carraher. Polymer Chemistry, Marcel Dekkar, Inc., 1981. 7. Ya.Malkin A, Askadsky A A, Kovriga V V, Chalykh A E, Experimental Methods of Polymer Physics, Mir publishers, Moscow, 1983.

10SM34 MICRO ELECTRO MECHANICAL SYSTEMS 4004

MEMS AND MICROSYSTEMS: MEMS and microsystem products. Evaluation of microfabrication. Microsystem and microelectronics. Applications of microsystem. Working principles of microsystem - microsensors, microactuators, MEMS and microactuators, microaccelerometers. (6) SCALING LAWS IN MINIATURIZATION: Introduction. Scaling in geometry. Scaling in rigid body dynamics. The Trimmer force scaling vector scaling in electrostatic forces, electromagnetic forces, scaling in electricity and fluidic dynamics, scaling in heat conducting and heat convection. (6) MATERIALS FOR MEMS AND MICROSYSTEMS: Substrates and wafers. Silicon as a substrate material. Ideal substrates for MEMS. Single crystal Silicon and wafer crystal structure. Mechanical properties of Si. Silicon compounds - SiO2, SiC, Si3N4 and polycrystalline Silicon. Silicon piezoresistors. Gallium arsenside. Quartz piezoelectric crystals. Polymers for MEMS. Conductive polymers. (10) BASICS OF FLUID MECHANICS IN MACRO AND MESO SCALES: Viscosity of fluids. Flow patterns Reynolds number. Basic equation in continuum fluid dynamics. Laminar fluid flow in circular conduits. Computational fluid dynamics. Incompressible fluid flow in microconducts - Surface tension, capillary effect and micropumping. Fluid flow in submicrometer and nanoscale rarefied gas, Knudsen and Mach number and modelling of microgas flow. Heat conduction in multilayered thin films . Heat conduction in solids in submicrometer scale. Thermal conductivity of thin film, heat conduction equation for thin films. (7) MICROSYSTEM FABRICATION PROCESS AND MICROMANUFACTURING: Photolithography. Photoresist and applications. Light sources. Ion implantation. Diffusion process. Oxidation thermal oxidation. Silicon diode. Thermal oxidation rates. Oxide thickness by colour. Chemical vapour deposition principle, reactants in CVD. Enhanced CVD physical vapour deposition. Sputtering. Deposition by epitaxy. Etching chemical and plasma etching. Bulk micromachining. Isotropic and anisotropic etching - wet etchants, etch stops, dry etching comparison of wet and dry etching. Dry etching physical etching reactive ion etching, comparison of wet and dry etching. Surface micromachining - process in general, problems associated in surface micromachining. The LIGA process description, materials for substrates and photoresists, electroplating, the SLIGA process. (13)

MICRODEVICES AND MICROSYSTEM PACKAGING: Sensors classification of sensors signal conversion ideal characterisation of sensors mechanical sensors measurands displacement sensors pressure and flow sensors accelerometers . The three levels of microsystem packaging die level, device level and system level. Essential packaging technologies die preparation surface bonding, wire bonding and sealing. Three dimensional packaging. Assembly of microsystems selection of packaging materials. (14) Total 56 REFERENCES 1. Tai-Ran Hsu, MEMS and Microsystems Design and Manufacture, Tata McGraw Hill Publishing Co. Ltd., New Delhi, 2002. 2. Julian W Gardner, Microsensors: Principles and Applications, John Wiley and Sons, New York, 2001.

3. 4.

Kovacs G T A, Micromachined Transducers Sourcebook, McGraw Hill, New York, 1998. Mark Madou Fundamentals of Microfabrication, CRC Press, New York, 1997.

10SM35 NANOMATERIALS AND NANOTECHNOLOGY 4004

INTRODUCTION AND CLASSIFICATION: Classification of nanostructures, nanoscale architecture Effects of the nanometre length scale Changes to the system total energy, changes to the system structures, vacancies in nanocrystals, dislocations in nanocrystals Effect of nanoscale dimensions on various properties Structural, thermal, chemical, mechanical, magnetic, optical and electronic properties effect of nanoscale dimensions on biological systems. (9) NANOMATERIALS AND CHARACTERIZATION: Fabrication methods Top down processes Milling, lithography, machining process Bottom-up process Vapour phase deposition methods, plasma-assisted deposition process, MBE and MOVPE, liquid phase methods, colloidal and solgel methods Methods for templating the growth of nanomaterials Ordering of nanosystems , self-assembly and self-organisation Preparation, safety and storage issues -STM and AFM Techniques (9) INORGANIC SEMICONDUCTOR NANOSTRUCTURES: Quantum confinement in semiconductor nanostructures Quantum wells, quantum wires, quantum dots, superlattices, band offsets and electronic density of states Fabrication techniques Requirements, epitaxial growth, lithography and etching, cleared edge overgrowth Growth on vicinal substrates, strain-induced dots and wires, electrostatically induced dots and wires, quantum well width fluctuations, thermally annealed quantum wells and self-assembly techniques. (10) PROCESSING AND PROPERTIES OF INORGANIC NANOMATERIALS: Introduction and classification Thermodynamics and kinetics of phase transformation, homogenous nucleation, heterogeneous nucleation, Growth Synthesis methods Rapid solidification, devitrification, Inert gas condensation, factors influencing nucleation and growth of fine particles Electrodeposition Mechanical methods Microstructure Grain and matrix strain, microstructural stability, grain growth, zener pinning, solute drag Power consolidation Compaction of nanopowders, sintering, role of impurities, porosity, non-conventional processing Mechanical properties, ferromagnetic properties, catalytic properties Applications. (11) SELF ASSEMBLING NANOSTRUCTURED MOLECULAR MATERIALS AND DEVICES: Introduction Building blocks Principles of self-assembly, non-covalent interactions, intermolecular packing, nanomotors Self assembly methods to prepare and pattern nanoparticles Nanopartcles from micellar and vesicular polymerization, functionalized nano particles, colloidal nanoparticles crystals, self-organizing inorganic nano particles, bio-nanoparticles nanoobjects. (9) NANODEVICES AND APPLICATIONS: Nanomagnetic materials Particulate nanomagnets and geometrical nanomagnets Magneto resistance Probing nanomagnetic materials Nanomagnetism in technology Carbon nanotubes fabrication- applications Injection lasers, quantum cascade lasers, optical memories, electronic applications, colulomb blockade devices. (8) Total 56 REFERENCES 1. Kelsall Robert W, Ian Hamley and Mark Geoghegan, Nanoscale Science and Technology, Wiley Eastern, 2004. 2. Bharat Bhushan, Springer Handbook of Nanotechnology, 2004. 3. Michael Kohler, Wolfgang and Fritzsche, Nanotechnology: Introduction to Nanostructuring Techniques, Wiley VcH, 2004. 4. Charles P Poole, Frank J Owens, Introduction to Nanotechnology, John Wiley and Sons, 2003. 5. Gregory Timp, Nanotechnology, Springer-Verlag, 1999.

10SM37 MATERIALS SCIENCE LABORATORY III 0032

1. 2. 3. 4. 5. 6. BaTiO3 Pelletisation and characterization. Fabrication of oxide glass via conventional melt-quench route Slip casting of porcelain/alumina slurries. Synthesis of ceramic nano particles by combustion Synthesis of semiconducting nano particles through chemical route characterization. Magnetic hysteresis Ferrites.

Testing of Polymer Samples: 7. 8. 9. Poly Ethylene, Poly Propylene. PVC, Chloroprene. SBR, Cellulose Nitrate.

10. PMMA, NBR. 11. Synthesize of polystyrene by bulk polymerization. 12. Determination of molecular weight of polymer by viscosity method.

ELECTIVES
10SM51 HIGH VACUUM TECHNOLOGY 4004
ELEMENTS OF HIGH VACUUM SYSTEM: Study of a system to produce high vacuum, pumping speed, conductance of an orifice and tube, losses in pumping speed and determination of pumping speed. (10) TYPES OF PUMPS: Rotary pump, diffusion pump, ejector pump, turbo molecular pump, roots blower pump, getter ion pump, sputter ion pump, cryosorption pump, cryocondensation pump - working principle, construction, operation pressure range, limitations and pumping characteristics. (12) PROBLEMS CONNECTED WITH HIGH VACUUM: Outgassing of materials - real and virtual leaks - methods of leak detection - sealing substance outside and pressure change inside - rate of pressure rise method - halogen leak detector and the helium leak detector. (7) VACUUM COMPONENTS: Baffles and traps: Some designs of baffles, inline trap, right angle trap, dished trap, re-entrant trap, spherical trap and sorption trap, pumping losses in baffles and traps (qualitative). vacuum valves: Gate valve, disc valve, flap valve, globe valve, needle valve and diaphragm valve. Some types of backable valves (Apart, Theorres and Nier tange valve). Vacuum seals: Common seals using elastomers, sliding and rotating seals, electrical lead throughs . (11) VACUUM MEASUREMENTS: Primary gauges: Viscosity gauge, radiometer types gauge, Mcleod gauge with construction and working principle. secondary gauges: Pirani gauge, thermocouple gauge, thermionic ionization gauge, cold cathode ionisation gauge (Penning gauge) - working principle, construction and operation limits. (9) ULTRA HIGH VACUUM GAUGES: X-ray limit of ionisation gauges, Baird Albert gauge, Klopfer gauge, Helmer gauge, Lafferty gauge, Red head gauge. (4) MATERIALS USED IN VACUUM SYSTEM: Metals and their alloys, elastomer, glasses, ceramics, vacuum greases, oils, cements and waxes, drying and sorption agents. (3) Total 56 REFERENCES 1. Rao V V, Ghosh T K and Chopra K L, "Vacuum Science and Technology', Allied publishers Ltd., 1998. 2. Leon I Maissel and Reinard Glang, "Hand Book of Thin Film Technology", McGraw Hill, 1970. 3. Green G L, "Design and Construction of Small Vacuum System", Chapman and Hall Ltd, 1968. 4. Albert E Barrington, "High Vacuum Engineering", Prentice Hall, 1964. 5. Andrew Guthrie, "Vacuum Technology", John Wiley, 1963.

10SM52 INTEGRATED CIRCUIT TECHNOLOGY 4004

OPERATIONAL AMPLIFIER AND OSCILLATORS: Review of basic electronics transistor as an amplifier and transistor biasing concepts - Circuit configuration operational amplifiers Characteristics and parameters - voltage level detectors Inverting, noninverting mode of operation with gain derivations - voltage followers, oscillators, square wave generator, saw tooth wave generator, triangular wave generator and voltage controlled oscillator. (11)

OPERATIONAL AMPLIFIERS FOR INSTRUMENTATION APPLICATIONS: Basic Differential amplifier, improving the basic differential amplifier, Instrumentation amplifier Input offsets and offset compensation, Chopper amplifier, Carrier amplifiers and lockin amplifiers. (9) ACTIVE FILTERS AND APPLICATIONS: Active low pass, high pass, band pass and band reject filters with their frequency response plots - phase locked loops , lock in range, capture range, PLL as FM detector, Frequency synthesizer and AM detector - Block diagram of IC PLL LM565 and its specifications. (9) A/D AND D/A CONVERTERS: Sample and hold circuits. D /A converter: Weighted resistance network type and R -2R ladder type. A /D converter: Simultaneous converter, counter type and continuous type, dual slope and successive approximation. (9) VOLTAGE REGULATORS: Output resistance and load regulation, three terminal regulators (fixed regulators), three terminal adjustable regulator with low quiescent currents - Switching voltage regulators - current waveforms - output ripple factor, step up switching voltage regulator. Applications of LM317 10 V regulator 50mA constant current battery charger. (9) IC TRANSDUCERS: IC temperature sensors: PTAT sensor, two terminal IC temperature sensor, IC magnetic field sensor, Hall effect sensors - pressure transducers: piezoelectric pressure sensors, charge coupled device (CCD), Buried channel CCDs, Charge transfer device, sampling rate, Applications of charge transfer device. (9) Total 56 REFERENCES 1. Joseph P J Karr, "Elements of Electronic Instrumentation and Measurement", Prentice Hall, 1996. 2. Robert F Coughlin and Frederick F Driscoll, "Operational Amplifiers and Linear Integrated Circuits", Prentice Hall of India, 1992. 3. Sidney Soclof, "Applications of Analog Integrated Circuits", Prentice Hall of India, 1990. 3. Application Notes for LM317, National Semiconductors, USA

10SM53 LASER TECHNOLOGY AND APPLICATIONS 4004

INTRODUCTION: Concepts of Absorption and Emission of Light, Einstein coefficients - negative absorption, shape and width of spectral lines, spontaneous and stimulated emission. Types of resonators, stability diagram - coherence - spatial and temporal (12) THRESHOLD CONDITION: Rate equations - optical excitation in three and four level lasers, standing waves in a laser, cavity theory, modes, diffraction theory of the Fabry - Perot interferometer. (12) TYPES OF LASERS: Gas lasers - He-Ne laser - Ar+, He-Cd+ lasers - N2 and CO2 lasers - Fabrication and excitation mechanisms. Liquid lasers, dye lasers, fabrication and excitation mechanisms. Solid state lasers - Ruby, Nd:YAG, glass semiconductor diode lasers, Excimer Laser , Erbium doped laser. (12) LASER Q SWITCHING: Mode-locking, second harmonic generation, theory and experiment, materials for optical SHG. (8) LASER APPLICATIONS: Industrial applications: laser welding, laser heat treatment, laser cutting, drilling, Laser marking, Surface hardening, Surface melting, Alloying and casting. Holography: Holography in data storing systems. LIDAR, Rayleigh and Raman scattering, Stimulated Raman effect, Coherent anti-Stoke's Raman scattering (CARS), Doppler free two-photon spectroscopy, Medical applications. Laser safety. (12) Total 56 REFERENCES 1. Breck Hitz C, James J. Ewing, Jeff Hecht, Introduction to Laser Technology , IEEE press, 2001 2. Laud B B, "Lasers and Non-Linear Optics", Wiley-Eastern Ltd., 2000. 3. William T Silfvast, Laser Fundamentals Cambridge University Press, 2003. 4. Alen Shotwell, Application of Laser and Laser Systems, Prentice Hall, 1993.

10SM54 CRYOGENICS AND SUPERCONDUCTIVITY 4004

CRYOGENICS: Cryogenic Fluids, their properties and Technology - Liquefaction of Oxygen, nitrogen, hydrogen and Helium - Low Temperature, resistance thermometry - Vapour pressure thermometry, resistance thermometry Thermoelectric thermometry - Magnetic thermometry. Low temperature insulation. Cryogenic storage vessels. (8) NORMAL METALS AND THE TRANSITION TO THE SUPER CONDUCTING STATE: The free electron gas excitations. The Energy gap in a superconductor. The electronic heat capacity, the phonon spectrum, lattice specific heat. Scattering of electrons by phonons. Electrical conductivity and resistivity - The superconducting state. The Meissner experiment. (8) BCS THEORY: Electron pairing, the cooper pair model. Attractive Electron-Electron interaction. Superconducting ground state, Excitations from the ground state. Occupation Statistics for pairs and Excitations for T = 0K Temperature dependence of the Gap parameter, Density of Excitation state, Tunnelling Barriers, tunnelling between a normal metal and superconductor and tunneling between superconductors. (11) QUANTIZATION OF MAGNETIC FLUX IN A SUPER CONDUCTING RING: Penetration depths for pure and impure Materials. Superconducting transmission lines, Superconducting microwave cavitations. (8) GINSBERG LANDAU THEORY : Type II superconductivity. Mixed state in Type II Superconductors - London model of the mixed state behaviour near Hc1 and Hc2 - flux penetration in thin films. (11) JOSEPHSON TUNNEL JUNCTIONS: Dependence of maximum zero voltage current on magnetic field. Dependence of Tc on shape and size of junction. Circuit applications. SQUID Magnetometers. High Temperature superconductors and their structure. (10) Total 56 REFERENCES 1. Subramanyan S V and Rajagopal E S, "High Temperature Superconductors", Wiley Eastern Ltd., 1988. 2. Narlikar A V and Edbote S N, "Superconductivity and Superconducting Materials", South Asian Pub., New Delhi, 1983. 3. Vance R W and Duke W M, "Applied Cryogenic Engineering", Wiley, 1982. 4. Van Duzer T and Tuner C W, "Principles of Superconductive Devices and Circuits", Edward Arnold Publishers 1981. 5. Tinkham M, "Introduction to Superconductivity", McGraw Hill, Kogakusha Ltd., 1975.

10SM55 LINEAR INTEGRATED CIRCUITS 4004

OPERATIONAL AMPLIFIER AND OSCILLATORS: Review of basic electronics transistor as an amplifier and transistor biasing concepts - Circuit configuration operational amplifiers Characteristics and parameters - voltage level detectors Inverting, noninverting mode of operation with gain derivations - voltage followers, oscillators, square wave generator, saw tooth wave generator, triangular wave generator and voltage controlled oscillator. (11) OPERATIONAL AMPLIFIERS FOR INSTRUMENTATION APPLICATIONS: Basic Differential amplifier, improving the basic differential amplifier, Instrumentation amplifier Input offsets and offset compensation, Chopper amplifier, Carrier amplifiers and lockin amplifiers. (9) ACTIVE FILTERS AND APPLICATIONS: Active low pass, high pass, band pass and band reject filters with their frequency response plots - phase locked loops , lock in range, capture range, PLL as FM detector, Frequency synthesizer and AM detector - Block diagram of IC PLL LM565 and its specifications. (9) A/D AND D/A CONVERTERS: Sample and hold circuits. D /A converter: Weighted resistance network type and R -2R ladder type. A /D converter: Simultaneous converter, counter type and continuous type, dual slope and successive approximation. (9) VOLTAGE REGULATORS: Output resistance and load regulation, three terminal regulators (fixed regulators), three terminal adjustable regulator with low quiescent currents - Switching voltage regulators - current waveforms - output ripple factor, step up switching voltage regulator. Applications of LM317 10 V regulator 50mA constant current battery charger. (9) IC TRANSDUCERS: IC temperature sensors: PTAT sensor, two terminal IC temperature sensor, IC magnetic field sensor, Hall effect sensors - pressure transducers: piezoelectric pressure sensors, charge coupled device (CCD), Buried channel CCDs, Charge transfer device, sampling rate, Applications of charge transfer device. (9) Total 56

REFERENCES 1. Joseph P J Karr, "Elements of Electronic Instrumentation and Measurement", Prentice Hall, 1996. 2. Robert F Coughlin and Frederick F Driscoll, "Operational Amplifiers and Linear Integrated Circuits", Prentice Hall of India, 1992. 3. Sidney Soclof, "Applications of Analog Integrated Circuits", Prentice Hall of India, 1990. 4. Application Notes for LM317, National Semiconductors, USA

10SM56 COMPUTATIONAL MATERIALS SCIENCE 4004

INTRODUCTION: Simulation as a tool for materials science, Modelling of Natural phenomena. Types of models QM, atomistic, microscopic, continuum Multiscale approaches. (10) ELEMENTS OF DIFFERENTIAL EQUATIONS: Differential equations in discrete and continuum simulation methods Ordinary differential equations for particle dynamics, partial differential equations, conduction / diffusion equation. (6) EMPIRICAL METHODS: Empirical methods of coarse graining, Reduction to classical potentials, Vander waals potential, potential for covalent bonds. Embedded atom potential, Connolly Williams approximations, potential renormalization . (8) BASICS OF MONTECARLO SIMULATION : Stochastic and deterministic process Markov process Ergodicity. Algorithms for Monte carlo simulations Random numbers, simple sampling technique Importance of simple sampling techniques Applications Perculation Polymer systems. (12) APPLICATIONS OF MONTE-CARLO Random walk, self-avoiding walk. Classical spin system- Ising model, nucleation, crystal growth, fractal system. (10) QUANTUM MONTE-CARLO METHODS: Introduction to Variational Monte-Carlo method (VMC). Diffusion Monte-Carlo method(DMC) Path Integral Monte-Carlo (PIMC) method and Quantum spin models. (10) Total 56 REFERENCES 1. Ohno K Esfarjani K and Kawazoe Y, Introduction to Computational Materials Science from ab initio to Monte Carlo Methods, Springer-Verlag, 1999. 2. Rabbe D, Computational Materials Science: Simulation of Materials Microstructure and Properties, Wiley-VCH, 1998. 3. Frenkel D and Smit B, Understanding Molecular Simulation from Algorithm to Applications, Academic press, 1996. 4. Meyer M and Pontikis V, Computer Simulation in Materials Science: Interatomic Potentials, Simulation Techniques and Applications, Kluwar, Academic Press, 1991. 5. Allen M P and Tildesley D J, Computer Simulation of Liquids, Clarendon press, Oxford, 1990.

10SM57 SEMICONDUCTING MATERIALS AND DEVICES 4004

PROPERTIES OF SEMICONDUCTORS: Density of states for a 3 dimensional system and in sub 3 dimensional system Holes in semiconductors, Band structures of some semiconductors. Modification of band structure by alloying and by hetero structures. Quantum well structures, Intrinsic carrier concentration, Defect levels in semiconductors. (8) DOPING AND CARRIER TRANSPORT: Doping: Extrinsic carrier density Heavily doped semiconductors Modulation doping (MODFET) Transport: Scattering of electrons Photon and ionised impurity scattering Low field and high field transport in Si and GaAs Transport of holes Very high field transport: Break down phenomena Avalanche break down (APD) Carrier transport by diffusion. (8) PN JUNCTIONS AND BIPOLAR JUNCTION TRANSISTORS: P-N junction under bias: Charge injection and current flow Minority and majority currents AC response of the p-n diode Small signal equivalent circuit of a diode BJT: minority carrier profiles current components and current gain Ebers Moll model Operating point and small signal equivalent circuits BJTs in integrated circuits Heterojunction BJTs Microwave transistor. (9) FIELD EFFECT DEVICES: The field effect Qualitative operation of the JFET and MOSFET Quantitative description of JFET and MOSFET a brief introduction of high electron mobility transistor (HEMT) MOSFET: Long channel devices Short channel effects in MOSFETs Alternating current operation of FETs Small signal equivalent circuit for a JFET and MOSFET Microwave performance Power frequency limitations. (11) OPTICAL PROPERTIES: Electrons in electromagnetic field, Inter band transitions in bulk semiconductors and quantum wells, Intra band transitions in bulk semiconductors in quantum wells, Charge injection and radiative recombination The continuity equation: Diffusion length, Charge injection and band gap recombination. Excitonic effects and modulation of

optical properties: Excitonic states in semiconductors, Optical properties with inclusion of excitonic effects, Excitonic states and excitonic absorption in quantum wells Exciton broadening effects. (9) OPTO ELECTRONIC DETECTORS AND LASER DIODES: Optical absorption in a semiconductor, Materials for optical detectors, Photo current in a p-n diode, Solar cell, Avalanche photo detector, Photo transistor, Quantum well inter subband detector. Laser diode, the laser structure, the optical cavity, optical absorption, Loss and gain, Laser below and above threshold. Advanced structures, Double hetero structure laser, Quantum well lasers, Quantum wire and quantum dot lasers. (11) Total 56 REFERENCES 1. Sze S M, Physics of Semiconductor Devices, John Wiley and Sons, 2001. 2. Kevin F Brennan, Physics of Semiconductors, Cambridge University Press, 1999. 3. Micheal Shur, Physics of Semiconductor Devices, Prentice Hall of India, 1999. 4. Jasprit Singh, Semiconductor Optoelectronics Physics and Technology, McGraw Hill Co., 1998.

10SM58 ELECTRO-OPTIC MATERIALS AND DEVICES 4004

BASICS OF LASER: Laser beam characteristics, modes, noise, types of solid lasers (brief). FUNDAMENTALS OF CRYSTALLOGRAPHY: Symmetry operations and symmetry elements, point groups, tensor properties, dielectric description of a crystal, crystal structure of KDP, BaTiO3 and LiNbO3 (7)

(9)

PROPAGATION OF ELECTROMAGNETIC WAVES: Anisotropic media - index ellipsoid, propagation in uniaxial crystals, Birefringence, wave plates and compensators, optical activity. (7) MATERIALS SELECTION FOR ELECTRO-OPTIC AND ACOUSTO-OPTIC DEVICES: Growth of single crystals Czochralski, Bridgmann and Zone refining techniques.

(8)

ELECTRO-OPTIC EFFECT: E-O effect in KDP E-O retardation, E-O modulation - longitudinal and transverse E-O effect in cubic crystals, E-O Q- switching (Experimental) Beam deflectors. (9) ACOUSTO-OPTIC AND ELASTO-OPTIC EFFECTS: Materials and devices based on these effects - modulators. NON LINEAR PHENOMENA: SHG, mode locking and frequency mixing - materials and devices. (4) (4)

NON LINEAR OPTICAL MATERIALS AND DEVICES: Semiconductors - measurement of third order optical nonlinearities in semiconductors. Optical switching devices employing optical non-linearities in semiconductors. Glasses orgin of non-linearity in glasses - SHG. (5) MOLECULAR CRYSTALS: Growth of molecular crystals by temperature difference method. Liquid crystal E-O devices (brief). (3) Total 56 REFERENCES 1. Munn R W and Ironsid C N, "Non - Linear Optical Materials", Blackie Academic & Professional, Glassgow, 1993. 2. Kochner W, "Solid State Laser Engineering", Springer-Verlag, New York, 1976. 3. Yariv A, "Quantum Electronics", John Wiley & Sons, 1975. 4. Ivan P Kaminov, " Introduction to Electro-Optic Devices", Academic press, New York, 1974.

10SM59 CORROSION SCIENCE AND ENGINEERING 4004

THERMODYNAMICS OF AQUEOUS CORROSION: Electrode processes - electrode potential, free energy, emf series, potential measurements with reference electrodes, three electrode systems, computation and construction of Pourbaix diagrams of Fe, Al, Ni, and Zn, practical use of E-pH diagrams. Chemical Vs electrochemical mechanism of corrosion reactions, corrosion rate expressions. (8)

KINETICS OF AQUEOUS CORROSION: Corrosion current density and corrosion rate, exchange current density. Polarization - activation control, Tafel equation, mass transport control, mixed potential theory and behavior of galvanic couples in acidic environments, effect of oxidizer, combined polarization, factors affecting polarizations and rate of corrosion. Passivity, potentiostatic polarization curves, factors affecting passivity, mechanism of action of passivators. (12) FACTORS AFFECTING AQUEOUS CORROSION: Effect of environmental variable - effect of pH, oxidation potential, temperature, velocity/fluid flow rate, concentration, biological effects. Effect of metallurgical variables - metals and their surfaces, alloys and their surfaces, effect of alloying on corrosion resistance, effect of heat treatment. (4) FORSM OF CORROSION: General corrosion - atmospheric corrosion, galvanic corrosion, general biological corrosion. Localised corrosion - filiform corrosion, crevice corrosion, pitting corrosion, localized biological corrosion. (4) METALLURGICALLY INFLUENCED CORROSION: Inter granular corrosion, de-alloying. Mechanically assisted corrosion - erosion corrosion, fretting corrosion, corrosion fatigue. Environmentally induced cracking mechanism of stress corrosion cracking and hydrogen embitterment. (8) PREVENTION AND CONTROL OF CORROSION: Corrosion control by design. Selection of corrosion resistant materials alloying, stainless steel and brass. Oxidation resistant materials, control of high temperature oxidation. Cathodic and anodic protection methods. Use of inhibitors-types, applications. Corrosion in cold water pipes - Langalier saturation index. (6) CORROSION MONITORING: Introduction - On-stream monitoring Electrical resistance, linear polarization, hydrogen test probe, ultrasonic testing, radiography and corrosion coupons. Off-stream monitoring equipments Acoustic emission testing, eddy current inspection, liquid penetration inspection. (7) CORROSION TESTING: Purpose and classification. Dimensional charge - Ultrasonic thickness measurements, eddy current, microscopic examination. Weight charge Specimen preparation, test conditions and evaluation of results for overall corrosion, SCC, IGC. Electrochemical techniques Polarization curves, Tafel extrapolation, linear polarization, AC impedance methods (EIS). (7) Total 56 REFERENCES 1. ASM hand book Vol 13: Corrosion, ASM International, 2001. 2. Denny A Jones, Principles and Prevention of Corrosion, Second edition, Prentice Hall Inc., 1996 3. Kenneth R Trethewey and John Chamberlain, Corrosion For Science and Engineering, second edition, Longman Inc., 1996. 4. Rajnarayan, Metallic Corrosion and Prevention , Oxford Publications, 1988. 5. Mars G Fontana, Corrosion Engineering, Third Edition, Mc Graw Hill Inc., 1987. 6. Herbert H Uhlig and Winston Revie R, Corrosion and Corrosion Control Introduction to Corrosion Science and Engineering, Third edition, John Wiley & Sons, 1985. 7. Philip A. Schweitzer, Corrosion and Corrosion Protection Handbook, USA, 1983.

10SM60 PLASMA PROCESSES 4004

GASES AND COLLISION PROCESS: Masses and Number of atoms, kinetic energy and temperature, mean speed , pressure, Avagadro Laws, number density of gasses, impingement flux, monolayer formation time, mean free path, probability of collision, energy transfer and collision frequency, gas flow types. Collision cross section, elastic and inelastic collision. Ionization, excitation, relaxation, recombination, dissociation, electron attachment. (10) GLOW DISCHARGE: Electron and Ion temperature, plasma potential, DC discharges, glow, arc, corona, RF, ECR discharges, conduction in ionized gases, Diffusion : Diffusion and mobility, free diffusion, ambipolar diffusion, transition diffusion, diffusion in magnetic field. General structures and feature; V-I characteristics, cathode layer, positive column, discharge in fast gas flow, glow discharge instabilities and their consequences, thermal instability. (10) ARC DISCHARGE: Definition and characteristics, features of arc discharge, types of arcs high intensity arcs, classification of arcs, free burning arc, wall, vortex, electrode, forced convention and magnetically stabilized arcs, Non thermal arcs, low pressure and low intensity arcs, initiation of arcs, low pressure arc with extremely heated cathode, plasma temperature, V-I characteristics, electron and gas temperatures. (10) THERMODYNAMICS OF PLASMA: Thermally induced random motion of particles - distribution of temperature and velocity in a gas - ionization of atoms and molecules - Saha equation - degree of ionization - electron concentration thermodynamic equilibrium of plasma in an electrical discharge - definition of thermodynamic properties of plasma. (10)

LABORATORY PLASMA SOURCES/DEVICES: Low temperature plasma generation, transferred and non-transferred arc torches, plasma torches. (6) PLASMA DIAGNOSTICS: Electrical probe techniques, spectroscopic methods, charged particle methods, energy balance techniques. (5) APPLICATIONS: Plasma spraying of ceramic, alloys and metals, vacuum spraying, plasma reduction of ores and minerals, plasma disassociation of compound oxides, plasma refining and remelting, plasma furnace in steel making, plasma cutting, sputtering, plasma enhanced chemical vapour deposition, plasma nitriding and surface cleaning, Plasma surface modification. (5) Demonstration: 1. Study of Vacuum unit. 2. Production of glow discharges 3. Characterization of DC glow discharge 4. Production of RF glow discharges 5. Characterization of RF glow discharges Total 56 REFERENCES 1. Francis F Chen, Introduction to Plasma Physics and Controlled Fusion, Springer Publications, 2006. 2. Reece Roth J, Industrial Plasma Engineering Vol.1 : Principles, Edition I, Taylor & Fransis, 1995. 3. Brian Chapman, Glow Discharge Processes: Sputtering and Plasma Etching, John Wiley and Sons, 1980. 4. Geroge Schmidt, Physics of High Temperature Plasma, Academic Press, 1979.

10SM61 FERROELECTRIC MATERIALS AND DEVICES 4004

INTRODUCTION: Maxwell equations Polarization Macroscopic electric field Local electric field at an atom Dielectric constant and polarizability Structural phase transitions Classification of ferroelectric crystals Displacive transitions Soft optical phonons Landau theory of the phase transition Second order transition First order transition Antiferroelectricity Ferroelectric domains Piezoelectricity Ferroelectricity Optical ceramics MATERIALS AND DEVICE DESIGNING AND FABRICATION PROCESSES:: Composition selection Dopant effects High power characteristics Ceramic powder preparation Sintering process Single crystal growth Device designing Single disks Multilayers Bimorphs/Moonies Flexible composites Thin/Thick films - Effect of grain sizeFerroelectric domains. (8) HIGH PERMITTIVITY DIELECTRICS: Ceramic capacitors. Chip capacitors. Hybrid substrate. Relaxor ferroelectrics High permittivity Diffuse phase transition Dielectric relaxation. (6) FERROELECTRIC MEMORY DEVICES: DRAM Ferroelectric DRAM Non volatile ferroelectric memory FRAM (inversion current type) MFSFET (5) PYROELECTRIC DEVICES: Pyroelectric materials pyroelectric effect responsitivity figures of merit. Temperature/infrared light sensors. Infrared image sensors. (5) PIEZOELECTRIC DEVICES: Piezoelectric materials and properties Figures of Merit. Single crystal polycrystalline materials relaxor ferroelectricspolymers composites Thin films. Pressure sensors, accelerometers, gyroscopes. Piezoelectric vibrators piezoelectric resonance equivalent circuits , ultrasonic transducers Resonators/filters. Surface acoustic wave devices. Piezoelectric transformers. Piezoelectric actuators. Ultrasonic motors. (6) ELECTRO-OPTIC DEVICES: Electro-optic effect, transparent electro-optic ceramics, bulk electro-optic devices. Waveguide modulators. (6) COMPOSITES: Composite piezoelectric materials, connectivity, composite effects. PZT polymer composites. (5)

Total 56 REFERENCES 1. Kenji Uchino, Ferroelectric Devices, Marcel Dekker, INC, 2000. 2. Gerhard R, "Electrets", Vol 2, Laplacian Press, 2000. 3. Moulson A L and Herberh J M, "Electroceramics Materials properties and Applications", Chapman & Hall, 2000. 4. Lines M E and Glass A M, "Principles and Applications of Ferroelectrics and Related Materials", Clarendon Press, 1977. 5. Jack C Burfoot, "Ferroelectrics Introduction to the Physical Principles", D Van Nostrand Co., 1967.

10SM62 MECHANICS OF SOLIDS 4004

STATICS OF PARTICLES AND RIGID BODIES: Particles: Concept of forces in plane - parallelogram law of forces rectangular components of forces - resultant of concurrent forces in plane - conditions of equilibrium - problems involving the equilibrium of a particle - free body diagram. Rigid Bodies: Two dimensional structure - moment of force about an axis - moment of a couple - equivalent systems of coplanar forces - Rigid body in equilibrium - problems involving equilibrium of rigid body - types of supports - reactions of beams and frames. (11) FRICTION: Introduction -angle of friction -coefficient of friction - laws of static friction -coefficient of friction-problems involving bodies on horizontal and inclined planes - wedge & ladder friction.

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STRESSES AND STRAINS: Stress and strain due to axial force - Elastic limit - Hooke's law - Factor of safety - Stepped bars - uniformly varying sections - stresses in composite bar due to axial force. Strain Energy due to axial force - proof resilience - stresses due to gradual load, sudden load and impact load. Lateral strain - Poisson's ratio - Volumetric strain changes in dimensions and volume - shear stress - shear strain - Relationship between elastic constants. (8) BENDING MOMENT AND SHEAR FORCE: Relationship between load, shear force and bending moment - shear force and bending moment diagrams for cantilever, simply supported and overhanging beams under concentrated loads, uniformly distributed loads - Maximum bending moment and point of contraflexure. (6) BENDING STRESSES: Centroid and Moment of Inertia of plane sections - Theory of simple bending and assumptions derivation of the bending equation - section modulus - calculation of normal stresses due to bending - application to simple problems. (7) TORSION: Theory of torsion and assumptions - Derivation of the torsion equation solid and hollow circular shafts - Power transmitted by a shaft. - Polar modulus - shear stresses in (4)

PRINCIPAL STRESSES AND PLANES: (Two dimensional only) State of stress at a point - Normal and tangential stresses on a given plane - Principal stresses and their planes - Plane of maximum shear stress - Analytical method Mohr's circle method - Application to simple problems. (8) BUCKLING OF COLUMNS: Columns - Behaviour of axially loaded short, medium and long column members - Buckling load - Euler's theory - Different end conditions - Rankine's formula. (6) Total 56 REFERENCES 1. Bansal R K, "Engineering Mechanics", Laxmi Publications, 2004. 2. Beer F P and Johnson E R, Vector Mechanics for Engineers, Statics & Dynamics", Tata Mc-Graw Hill Publishing Co., Ltd, NewDelhi, 2004. 3. Punmia B C and Jain A K, "Strength of Materials and Theory of Structures" - Vol.1, Laxmi Publications, New Delhi, 2000. 4. Bedi D S, "Strength of Materials", S Chand and Co. Ltd., New Delhi, 2000. 5. Ramamrutham S and Narayan R, "Strength of Materials", Dhanpat Rai and Sons, New Delhi, 1998.

10SM63 PROFESSIONAL ETHICS AND HUMAN VALUES 4004

PRINCIPLES OF MANAGEMENT: Management definition, meaning, Fayols principles of management, functions. (6)

PROFESSIONAL ETHICS: Characteristics of current business environment, professional ideals and virtues, right action, self-interest, customs, code of ethics (6) HUMAN VALUES: Contemporary Indian society, values of values, moral values, spiritual values, universal values, professional values (6) SOCIAL RESPONSIBILITY: Business environment, social commitment, views of social responsibility, economic and social objectives (6) RELATIONSHIP MANAGEMENT: Interpersonal skills, building better relationships, managing superior subordinate relationships, sense of control, tolerance (6)

LEADERSHIP: Definition, characteristics, leadership styles, Theories of leadership Tannenbaum Leadership continuum, Grid theory (6) STRESS MANAGEMENT: Causes of stress, organizational climate and causes of stress, consequences, symptoms, coping resources. (5) MOTIVATION: Meaning, definition, mechanism of motivation, Maslows need hierarchy, Theory X and Y, Two-factor theory (5) EMOTIONAL INTELLIGENCE: Meaning, importance, Identification of emotions, segregation of positive and negative emotions, managing emotions, emotional intelligence quotient (EQ) (5) HUMAN RESOURCE MANAGEMENT: Meaning, definition, importance, functions recruitment, selection, training, compensation, maintenance, organizational development (5) Total 56 REFERENCES 1. Barett and Jim, Test Yourself, Kogan Page India private Limited, 2004. 2. Bishop Sue, Assertiveness Skills Training A Source Book of Activities, Viva books Pvt Ltd, New Delhi, 2002 3. Tripathi A N, Human Values, New Age international Pvt Ltd., New Delhi, 2002 4. Harold Koontz and Heinz Weihrich, Essentials of Management, Mc Graw Hill Publishing Company, 1990 5. Kundu C L, Personality Development, Sterling Publishers Pvt Ltd., 1989

10SM64 PERSONALITY DEVELOPMENT 4004

Interpersonal Behaviour Introduction Self, Perception Disclosure Concept, Awareness, Monitoring, A-B Model Interpersonal Attraction Kinds of Interpersonal Behaviour, Typology of Social Behaviour. Activity: Attitude Tests - Stress Management Interpersonal Relationships Relationships, Dimensions of Interpersonal Relationships Content of Interaction, Diversity of Interaction, Qualities of Interaction, Relative Frequency and Patterning of Interaction, Reciprocity in Interaction, Complementarity in Interaction Interpersonal perception. Activity: Assertiveness development Creativity Skills Training Communication Process of Communication Functions Non-Verbal Communication Barriers of Effective Communication Current Issues in Communication Listing Skills and Feedback Skills. Activity: Body Language Relationship Management Motivation Skills Personality Determinants of personality Attributes Big Five Model Hollands Typology of personality. Activity: Personality Assessment Personality Management Emotional Intelligence - Components of Emotional Intelligence IQ Vs EQ Individual and Group Emotions Suggestions to Improve Emotional Intelligence. Activity: Emotional Intelligence Training Team Building Leadership Skills Training Total REFERENCES 1. Philip Burnard, Interpersonal Skills Training, Viva Publications, 2005. 2. Baron R A and Byran D, Social Psychology, Allyan and Bacon, New Delhi, 2000. 3. Daniel Goleman, Emotional Intelligence, Bantam Books, 1999. 4. Allan Pease, Body Language, Sheldon Press, London, 1998. (6)

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