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TERM PAPER

(COURSE :HEAT AND MASS TRANSFER) (COURSE CODE : MEC_302 )

TOPIC : COMPUTRE CHIPS HEAT DISPOSAL SYSTEM

SU BMITTED BY DIPAK KUMAR

Acknowledgment
I take this opportunity to express my sincere thanks to all those people who helped me in completing this project successfully; this work of creation would not have been possible without their kind help, cooperation and extended support. First and foremost sincere thanks to my project guide for his valuable guidance for completion of this work and also for providing the necessary facilities and support. Also I would sincerely like to thanks all my friends, faculty members and coordinators whose valuable suggestions and motivational words provided me required strength for completion of this term paper. I also thank the educational websites from which I have taken help.

DIPAK KUMAR

Contents

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(1) Introduction 4-4 (2) Generations of computer chips. 5-5 (3) Fabrication of computer chips6-6 (4) Insulation system of computer chips...7-8 (5) Method and apparatus for individually cooling components of electronic systems .8-8

(6) Causes of heat build up in computer9-9 (7) Different Types of Heat disposal system ..10-10 (a) Air cooling10-10 (b) Liquid submersion cooling..11-11 (d) Conductive and radiative cooling12-12 (e) Spot cooling...12-14 (f) Active heat-sink cooling14-14 (g) Peltier cooling or thermoelectric cooling14-15 (h) Heat pipe.15-15 (i) Phase-change cooli..15-15 (j) Soft cooling..16-16 (8) conclusion.16-16 (9) Refrence17-17

(1)Introduction

Integrated circuits were made possible by experimental discoveries which showed that semiconductor devices could perform the functions of vacuum tubes and by mid-20th-century technology advancements in semiconductor device fabrication. The integration of large numbers of tiny transistors into a small chip was an enormous improvement over the manual assembly of circuits using electronic components. The integrated circuit's mass production capability, reliability, and building-block approach to circuit design ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. There are two main advantages of ICs over discrete circuits: cost and performance. Cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, much less material is used to construct a packaged IC die than a discrete circuit. Performance is high since the components switch quickly and consume little power (compared to their discrete counterparts) because the components are small and positioned close together.

(2)Generations of computer chips

In the early days of integrated circuits, only a few transistors could be placed on a chip, as the scale used was large because of the contemporary technology. As the degree of integration was small, the design was done easily. Later on, millions, and today billions, of transistors could be placed on one chip, and to make a good design became a task to be planned thoroughly. This gave rise to new design methods.

(3)Fabrication of computer chips

Semiconductor fabrication

Rendering of a small standard cell with three metal layers (dielectric has been removed). The sand-colored structures are metal interconnect, with the vertical pillars being contacts, typically plugs of tungsten. The reddish structures are polysilicon gates, and the solid at the bottom is the crystalline silicon bulk.

The semiconductors of the periodic table of the chemical elements were identified as the most likely materials for a solid state vacuum tube. Starting with copper oxide, proceeding to germanium, then silicon, the materials were systematically studied in the 1940s and 1950s. Today, silicon monocrystals are the main substrate used for integrated circuits (ICs) although some III-V compounds of the periodic table such as gallium arsenide are used for specialized applications like LEDs, lasers, solar cells and the highest-speed integrated circuits. It took decades to perfect methods of creating crystals without defects in the crystalline structure of the semiconducting material. The main process steps are supplemented by doping and cleaning. Mono-crystal silicon wafers (or for special applications, silicon on sapphire or gallium arsenide wafers) are used as the substrate. Photolithography is used to mark different areas of the substrate to be doped or to have polysilicon, insulators or metal (typically aluminium) tracks deposited on them. Integrated circuits are composed of many overlapping layers, each defined by photolithography, and normally shown in different colors. Some layers mark where various dopants are diffused into the substrate (called diffusion layers), some define where additional

ions are implanted (implant layers), some define the conductors (polysilicon or metal layers), and some define the connections between the conducting layers (via or contact layers). All components are constructed from a specific combination of these layers.

(4)INSULATION SYSTEM OF COMPUTER CHIPS

The earliest computer chips were packaged in ceramic flat packs, which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by small-outline integrated circuit -- a carrier which occupies an area about 30 50% less than an equivalent DIP, with a typical thickness that is 70% less. This package has "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches. In the late 1990s, PQFP and TSOP packages became the most common for high pin count devices, though PGA packages are still often used for high-end microprocessors. Intel and AMD are currently transitioning from PGA packages on high-end microprocessors to land grid array (LGA) packages. Ball grid array (BGA) packages have existed since the 1970s. Flip-chip Ball Grid Array packages, which allow for much higher pin count than other package types, were developed in the 1990s. In an FCBGA package the die is mounted upside-down (flipped) and connects to the package

balls via a package substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over the entire die rather than being confined to the die periphery. Traces out of the die, through the package, and into the printed circuit board have very different electrical properties, compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. When multiple dies are put in one package, it is called SiP, for System In Package. When multiple dies are combined on a small substrate, often ceramic, it's called an MCM, or MultiChip Module. The boundary between a big MCM and a small printed circuit board is sometimes fuzzy.

(5)Method and apparatus for individually cooling components of electronic systems

A cooling system is configured to supply individually metered amounts of cooling fluid to heat generating components, e.g., processors, micro-controllers, high speed video cards, disk drives, semi-conductor devices, and the like, of an electronic system. The cooling system includes at least one variable speed fan, e.g., blower, configured to supply fluid through a centralized plenum and thereafter through a plurality of nozzles to the components of the electronic system. Each of the nozzles contains a valve to control the amount of fluid flow through the each of the nozzles. A controller is provided to control the operation of the variable speed fan and the operation of each of the valves is also controlled by a controller. By substantially controlling the amount of cooling fluid supplied to each of the components based upon the amount of heat generated by each component, the cooling system of the present invention may operate in a more efficient manner, thereby requiring substantially less energy than conventional cooling systems.

(6)Causes of heat build up in computer.

The amount of heat generated by an integrated circuit (e.g., a CPU or ic), the prime cause of heat build up in modern computers, is a function of the efficiency of its design, the technology used in its construction and the frequency and voltage at which it operates.

The dust on the laptop CPU heat sink after three years of use has made the laptop unusable due to frequent thermal shutdowns. In operation, the temperature of a computer's components will rise until the heat lost to the surroundings is equal to the heat produced by the component, and thus the temperature of the component reaches equilibrium. For reliable operation, the equilibrium temperature must be sufficiently low for the structure of the computer's circuits to survive. Cooling can be hindered by: Dust acting as a thermal insulator and impeding airflow, thereby reducing heat sink and fan performance. Poor airflow including turbulence due to friction against impeding components, or improper orientation of fans, can reduce the amount of air flowing through a case and even create localized whirlpools of hot air in the case. Poor heat transfer due to a lack of, or poor application of thermal compounds and sufficient surface area of heat sinks to radiate off the heat.

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(7)Different Types of Heat disposal system

(a)Air cooling
Computer fan

Fans are most commonly used for air cooling. A computer fan may be attached to the computer case, or attached to a CPU, GPU, chipset, PSU, hard drive or PCI slot. Common fan sizes include 40, 60, 80, 92, 120, and 140 mm. Recently, 200mm fans have begun to creep into the performance market, as well as even larger sizes such as 230 and 240mm. In desktops

Typical airflow through a desktop ATX case. Desktop computers typically use one or more fans for cooling. Almost all desktop power supplies have at least one fan to exhaust air from the case. Most manufacturers recommend bringing cool, fresh air in at the bottom front of the case, and exhausting warm air from the top rear. If there is more air being forced into the system being pumped out (due to an imbalance in the number or strength of fans), this is referred to as a "positive" airflow, as the pressure inside the unit would be higher than outside. A balanced or neutral airflow is the most efficient[citation needed], although a slightly positive airflow results in less dust build up if dust filters are used. Negative pressure inside the case can create problems such as clogged optical drives due to sucking in air (and dust).

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(b)Liquid submersion cooling

An uncommon practice is to submerge the computer's components in a thermally conductive liquid. Personal computers that are cooled in this manner do not generally require any fans or pumps, and may be cooled exclusively by passive heat exchange between the computer's parts, the cooling fluid and the ambient air. Extreme component density supercomputers such as the Cray-2 and Cray T90 used additional liquid to chilled liquid heat exchangers in order to facilitate heat removal. The liquid used must have sufficiently low electrical conductivity in order for it not to interfere with the normal operation of the computer's components. If the liquid is somewhat electrically conductive, it may be necessary to insulate certain parts of components susceptible to electromagnetic interference, such as the CPU For these reasons, it is preferred that the liquid be dielectric. Liquids commonly used in this manner include various liquids invented and manufactured for this purpose by 3M, such as Fluorinert. Various oils, including but not limited to cooking, motor and silicone oils have all been successfully used for cooling personal computers. Evaporation can pose a problem, and the liquid may require either to be regularly refilled or sealed inside the computer's enclosure. Liquid may also slowly seep into and damage components, particularly capacitors, causing an initially functional computer to fail after hours or days immersed.[citation needed]

(c)Waste heat reduction

Where full-power, full-featured modern computers are not required, some companies opt to use less powerful computers or computers with fewer features. For example: in an office setting, the IT department may choose a thin client or a diskless workstation thus cutting out the heat-laden components such as hard drives and optical disks. These devices are also often powered with direct current from an external power supply brick which still wastes heat, but not inside the computer itself.

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The components used can greatly affect the power consumption and hence waste heat. A VIA EPIA motherboard with CPU typically generates approximately 25 watts of heat whereas a Pentium 4 motherboard typically generates around 140 watts. While the former has considerably less computing power, both types are adequate and responsive for tasks such as word processing and spreadsheets. Choosing a LCD monitor rather than a CRT can also reduce power consumption and excess room heat, as well as the added benefit of increasing available physical desk space.

(d)Conductive and radiative cooling

Some laptop components, such as hard drives and optical drives, are commonly cooled by having them make contact with the computer's frame, increasing the surface area which can radiate and otherwise exchange heat.

(e)Spot cooling
In addition to system cooling, various individual components usually have their own cooling systems in place. Components which are individually cooled include, but are not limited to, the CPU, GPU and the Northbridge chip. Some cooling solutions employ one or more methods of cooling, and may also utilize logic and/or temperature sensors in order to vary the power used in active cooling components. Passive heat-sink cooling

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Passive heatsink on an Intel GMA graphics chip. Passive heat-sink cooling involves attaching a block of machined or extruded metal to the part that needs cooling. A thermal adhesive may be used. More commonly for a personal-computer CPU, a clamp holds the heat sink directly over the chip, with a thermal grease or thermal pad spread between. This block usually has fins and ridges to increase its surface area. The heat conductivity of metal is much better than that of air, and it radiates heat better than does the component that it is protecting (usually an integrated circuit or CPU). Until recently, fan-cooled aluminium heat sinks were the norm for desktop computers. Today, many heat sinks feature copper base-plates or are entirely made of copper, and mount fans of considerable size and power. Dust buildup between the metal fins of a heat sink gradually reduces efficiency, but can be countered with a gas duster by blowing away the dust along with any other unwanted excess material. Passive heat sinks are commonly found on older CPUs, parts that do not get very hot (such as the chipset), and low-power computers.
ADVANTAGE :-Passive cooling involves no fan noise.

(f)Active heat-sink cooling

Active heat sink with a 120-mm fan inside the unit, with attached fan controller in background. Active heat-sink cooling uses the same principle as passive, with the addition of a fan that blows over or through the heat sink. The air movement increases the rate at which the heat sink can

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exchange heat with the ambient air. Active heat sinks are the primary method of cooling modern processors and graphics cards. The buildup of dust is greatly increased with active heat-sink cooling, because the fan continually takes in the dust present in the surrounding air.

(g)Peltier cooling or thermoelectric cooling

Thermoelectric cooling

In 1821 T. J. Seebeck discovered that different metals, connected at two different junctions, will develop a micro-voltage if the two junctions are held at different temperatures. This effect is known as the "Seebeck effect"; it is the basic theory behind the TEC (thermoelectric cooling). Modern TECs use several stacked units each composed of dozens or hundreds of thermocouples laid out next to each other, which allows for a substantial amount of heat transfer. A combination of bismuth and telluride is most commonly used for thermocouples. As active heat pumps, TECs can cool the surface of components below ambient temperatures. This is impossible with common radiator cooled water cooling systems and heatpipe

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(h)Heat pipe
Heat pipe

A heat pipe is a hollow tube containing a heat transfer liquid. As the liquid evaporates, it carries heat to the cool end, where it condenses and then returns to the hot end (under capillary action, or, in earlier implementations, under gravitation). Heat pipes thus have a much higher effective thermal conductivity than solid materials. For use in computers, the heat sink on the CPU is attached to a larger radiator heat sink. Both heat sinks are hollow as is the attachment between them, creating one large heat pipe that transfers heat from the CPU to the radiator, which is then cooled using some conventional method. This method is expensive and usually used when space is tight (as in small form-factor PCs and laptops), or absolute quiet is needed (such as in computers used in audio production studios during live recording). Because of the efficiency of this method of cooling, many desktop CPUs and GPUs, as well as high end chipsets, use heat pipes in addition to active fan-based cooling to remain within safe operating temperatures. A new design wrinkle is known as HDT for Heatpipe Direct Touch. In this usage, the heat pipe is in direct contact with the CPU chip skin Heatpipe Direct Touch was first introduced in the Zaward ZikaRay ZIKA-01 heatsink on February 2007, using a patent obtained from Golden Sun News Techniques Corporation in Taiwan.

(i) Phase-change cooli

Phase-change cooling is an extremely effective way to cool the processor. A vapor compression phasechange cooler is a unit which usually sits underneath the PC, with a tube leading to the processor. Inside the unit is a compressor of the same type as in a window air conditioner. The compressor compresses a gas (or mixture of gases) which condenses it into a liquid. Then, the liquid is pumped up to the processor, where it passes through an expansion device, this can be from a simple capillary tube to a

16 more elaborate thermal expansion valve. The liquid evaporates (changing phase), absorbing the heat from the processor as it draws extra energy from its environment to accommodate this change (see latent heat). The evaporation can produce temperatures reaching around 15 to -150 degrees Celsius. The gas flows down to the compressor and the cycle begins over again. This way, the processor can be cooled to temperatures ranging from 15 to 150 degrees Celsius, depending on the load, wattage of the processor, the refrigeration system (see refrigeration) and the gas mixture used. This type of system suffers from a number of issues but mainly one must be concerned with dew point and the proper insulation of all sub-ambient surfaces that must be done (the pipes will sweat, dripping water on sensitive electronics). This type of cooling is seen as a more extreme way to cool components, since the units are relatively expensive compared to the average desktop. They also generate a significant amount of noise, since they are essentially refrigerators, however the compressor choice and air cooling system is the main determinant of this, allowing for flexibility for noise reduction based on the parts chosen.

(j)Soft cooling
Softcooling is the practice of utilizing software to take advantage of CPU power saving technologies to minimize energy use. This is done using halt instructions to turn off or put in standby state CPU subparts that aren't being used or by underclocking the CPU.

(8) conclusion
In computer chips ,heat commenly generate but it is injurious for the applicayion so apply different phenomenon ot avoid the heating effect . We are going to apply different process for avoiding the heating effect After long time computer chips get the very heat. so by the heat disposal system neglect the heating effect Heat pipe cooling are commonly used,It is very chief. Active heat cooling is only applicable for high application.it is costly process.

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(8) RAFRENCE
http://en.wikipedia.org/wiki/Computer_cooling http:// ^ Verari Systems uses vertical air flow for cooling http://www.theinquirer.net/default.aspx?article=29958 web.mit.edu/newsoffice/2010/self-assembly-0316.html www.nanowerk.com/spotlight/spotid=15292.php www.tradeindia.com/manufacturers/.../computer-cooling-pad.html