DesigN Analysis - Infrastructure

Earl J. Lum
+1-650-430-2221
elum@ejlwireless.com

Ericsson W-CDMA Power Amplifier

Model KRB 1011048/60
March 2008

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2008 EJL Wireless Research LLC. All Rights Reserved

www.ejlwireless.com

TABLE OF CONTENTS
EXECUTIVE SUMMARY ....................................................................... 4

Active/Passive Component Summary ................................................................ 4

Important Note: ............................................................................................ 4

CHAPTER 1 ERICSSON W-CDMA RBS TECHNOLOGY................................... 5

1.1 Overview of Ericsson W-CDMA RBS Technology............................................. 5

CHAPTER 2 W-CDMA POWER AMPLIFIER PRODUCT .................................... 6

2.1
2.2
2.3
2.4
2.5
2.6
2.7

Mechanical Analysis .................................................................................. 6

System Architecture Analysis ....................................................................11
Digital Control Section..............................................................................12
DC/DC Power Supply Module Section ..........................................................15
RF Cavity Filter Section ............................................................................24
Small Signal RF Section ............................................................................27
High Power RF Section .............................................................................33

APPENDIX A - PASSIVE CASE SIZE ANALYSIS.......................................... 44

APPENDIX B - ACTIVE COMPONENT MARKET SHARE .................................. 46

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2008 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

TABLES
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1: Digital/RF Cable Bill of Materials ........................................................................................ 10

2: Digital Processing Section Bill of Materials .......................................................................... 14
3: Main PCB Emerson Part Number ROA 119 0696/1 R1B Bill of Materials................................... 20
4: Daughtercard 1 Emerson Part Number ROA 1190694/1 R1B Bill of Materials ........................... 22
5: Daughtercard 2 Emerson Part Number ROA 119 0695/1 R1A Bill of Materials .......................... 23
6: RF Cavity Filter Bill of Materials ......................................................................................... 26
7: High Power RF Driver Pallet Bill of Materials ........................................................................ 38
8: High Power RF Output Pallet Bill of Materials ....................................................................... 40
9: High Power RF Error Amplifier Pallet Bill of Materials ............................................................ 43
10: Active/Passive Component Distribution by System Subsection ............................................. 45

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2008 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com

EXHIBITS
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1: Ericsson RBS 3202........................................................................................................... 5

2: Power Amplifier System Case Dimensions........................................................................... 6
3: Power Amplifier Case Top Cover Top View Dimensions ......................................................... 7
4: Power Amplifier Case Top Cover Bottom View Dimensions .................................................... 8
5: Digital/RF Cables Component Diagram ............................................................................... 9
6: Power Amplifier Sub-System Diagram .............................................................................. 11
7: Basic Feed Forward Amplifier Block Diagram ..................................................................... 12
8: Digital Processing PCB Dimensions .................................................................................. 12
9: Digital Processing Section Component Diagram ................................................................. 13
10: Power Supply Module, Top View .................................................................................... 16
11: Power Supply Module, Bottom View ............................................................................... 17
12: DC-DC Converter PCB Dimensions ................................................................................. 18
13:DC-DC Converter Component Diagram, Top ..................................................................... 18
14: DC-DC Converter Component Diagram, Bottom ............................................................... 19
15: Daughtercard 1 Emerson Part Number ROA 1190694/1 R1B ............................................. 21
16: Daughtercard 2 Emerson Part Number ROA 119 0695/1 R1A ............................................ 21
17: RF Cavity Filter, Top..................................................................................................... 24
18: RF Cavity Filter, Bottom................................................................................................ 24
19: RF Cavity Filter Transmit Diagram.................................................................................. 25
20: RF Cavity Filter Component Diagram .............................................................................. 25
21: Small Signal RF Section ................................................................................................ 27
22: Small Signal RF Section w/ Standoff Shield ..................................................................... 28
23: Small Signal RF Cover Shield Top View ........................................................................... 29
24: Small Signal RF Cover Shield Bottom View ...................................................................... 29
25: Small Signal RF Transmit PCB Dimensions ...................................................................... 30
26: Small Signal RF PCB Bottom View .................................................................................. 30
27: Small Signal RF Transmit Chain ..................................................................................... 31
28: Small Signal RF Transmit Component Diagram ................................................................ 31
29: Small Signal RF Section Bill of Materials.......................................................................... 32
30: High Power RF Section Diagram..................................................................................... 33
31: High Power RF Transmit PCB Dimensions ........................................................................ 34
32: High Power RF Heat Sink Dimensions ............................................................................. 35
33: RF Main Amplifier Transmit Diagram .............................................................................. 36
34: Merrimac Industries Multi-Mix Splitter/Combiner.............................................................. 36
35: High Power RF Driver Pallet Component Diagram............................................................. 37
36: High Power RF Output Pallet Component Diagram............................................................ 39
37: High Power RF Error Amplifier Transmit Diagram ............................................................. 41
38: High Power RF Error Amplifier Pallet Component Diagram ................................................. 42
39: Component Distribution Analysis ................................................................................... 44
40: Passive Component Distribution Analysis ........................................................................ 45
41: Active Component Analysis by Pin Count ........................................................................ 46
42: Active Semiconductor Component Market Share .............................................................. 47

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2008 EJL Wireless Research LLC. All Rights Reserved
www.ejlwireless.com