Content
Introduction s Static CMOS logic s Important components s Modern VLSI design methodology s DSP system design
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References
N. Weste and K. Eshraghian, Principle of CMOS VLSI Design: A System Perspective, Addison-Wesley Published, 1993. s Kai Hwang, Computer Arithmetic: Principles, Architecture, and Design, 1989.
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Introduction
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Physical Structure
field-oxide p-well n-substrate
thin-oxide
p-well n-substrate
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Physical Structure
poly-oxide
p-well n-substrate
p+
p+
p-well n-substrate
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Physical Structure
p+ p+ n+ n+
p-well n-substrate
p+
p+
n+
n+
p-well n-substrate
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Physical Structure
p+
p+
n+
n+
p-well n-substrate
VLSI design is a 3-D structure s Mask amount is critical to cost s Design rules for specific process
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Scaling Effects
W/ L/ tox/ polysilicon gate
n+ or p+
p- or n- substrate
n+ or p+
Xj/
Na(d)
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Scaling Effects
Parameter Length: L Width: W Gate oxide thickness: tox Junction depth: Xj Substrate doping: Na Supply voltage: Vdd Electric field across gate oxide: d Parasitic capacitance: WL/tox Gate delay: VC/I DC power dissipation: Ps Dynamic power dissipation: Pd Power-delay product Gate area Power density (VI/A) Current density (I/A) Transconductance: gm Scaling 1/ 1/ 1/ 1/ 1/ 1 1/ 1/ 1/ 1/ 2 1/ 2 1/ 3 1/ 2 1 1
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MOS Behavior
a b c PMOS a b c 1 0 1 0 0 1 1 1 z 0 1 z b c NMOS a b c 1 0 z 0 0 z 1 1 1 0 1 0 a
CMOS Logic
Vdd A X X A B Vdd A B
B (AB)
(A+B) B
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F=AD+AB+BCD
F=(A+D)(A+B)(B+C+D)
F B A D
A D
A C B D B
D
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Important Components
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Adder
carry-propagate; carry-save; carry-select
Multiplier
Booths multiplier
Adder Design
A B A 0 0 0 0 1 1 1 1 B 0 0 1 1 0 0 1 1 C SUM Carry 0 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 0 1 1 1 1
Carry
SUM=ABC+ABC+ABC+ABC Carry=AB+AC+BC
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Cout
Cin
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Parallel Multiplier
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X2
X2Y0 X1Y1 X0Y2
X1
X1Y0 X0Y1
X0
X0Y0
P6
P5
P4
P3
P2
P1
P0
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General solution:
input Programmable Logic Array z registers X0 X1 X2
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output
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Behavior level
describe the behavior of the module
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RTL level
describe the logic between registers, including the clock timing information
x[n] a1 y[n]
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a2
a3
a4 0
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Gate level
describe the structure of the whole architecture in terms of logical gates
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Circuit level:
describe the electronic behavior of all the components, such as capacitance, resistance, conductance, MOS, etc.
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Layout level:
describe the circuit geometric polygon directly. Layout can be used for mask generation directly.
Vss
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SPW
Behavior Simulation
cell library
architecture: HDL code
Design Compiler
gate-level: HDL code Gate-level Simulation verilog or VHDL and Altera simulator simulator
OPUS, Altera
physical: Layout or FPGA Physical Simulation Cadence, Avant!, Altera....
product
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Full-custom design:
Most efforts are put on circuit level design Iterative circuit - layout design flow size matching, impedance matching, noise are issues
Parameter-based design
some standard components are built-in A-verilog are under development EDA tools are still in primary stage
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Specifications:
frequency domain time domain
a2
a3 0
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Memory
RAM, ROM, Buffers, registers, Shift registers
Control
FSM, counters, etc.
Arithmetic unit
Bit-sliced datapath (adder, multiplier, ALU, etc.) Bit-serial datapath
Interconnect
Switches, arbiters, bus, ....
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About 95% of data stream operations can be covered by the following hardware
Registers Adders Multipliers Comparators Logic operations Multiplexers Buffers
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Approaches:
Use the fastest logic (carry ripple v.s. lookahead)
Balance resource
Time-share, routing strategy
Automatic synthesis
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Pipelining
clock data s logic logic logic
Asynchronous approach
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Re-Timing Technique
x[n] a1 y[n] x[n] a1 y[n]
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a2
a3
a4 0
a2
a3
a4 0
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Multiplication
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Booth algorithm:
1 0 0 1 1 1 0 1 (0) 0 1
1 0
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1 0
0 1
1 0 1 0 0 1 0 1
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Other Functions
Division and square-root: iterative operation s Log, sin, cos: table look-up
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interpolation can be used to reduce table size Taylor series expansion: numerical problems
C language compiler
Application Specific Embedded software Signal Processing (ASSP) for p, CPU, or DSP : ASIC or FPGA
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System-on-a-chip
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VLSI design extended from cell-based to macroblock-based design s System level knowledge and integration s Verification and testing RAM p s Internal v.s external I/O DSP ASSP s Process compatibility
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