MEC VE 301 Industrial Training Report

CHAPTER 1 INTRODUCTION

NeST Group is a highly diversified business conglomerate, operating in the areas of manufacturing services, products and technologies, engineering, software and system integration. It is a global corporation operating in the IT Sector providing hardware and software solutions to customers worldwide.

1.1 COMPANY PROFILE

SFO Technologies, a NeST Group Company is an International Corporate group, of over 25 companies employing more than 3500 people worldwide, has a global export business turnover in excess of $ 200 million. The Group has a strong presence in futuristic Computer & Communication technology areas like Networking, Fiber Optics, RF & Microwave and Software. SFO Technologies has many hardware and software facilities spread across Trivandrum, Cochin, Bangalore and Mysore in India and in the USA. All of these units are ISO 9001 certified and the Group now aspires to reach Six Sigma status in quality. The software units of the group operating at Trivandrum and Cochin are assessed at CMMi Level 5. Apart from the software development facility in India, the Group has setup a number of world class manufacturing facilities and has established worldwide operations with offices which provides onsite consulting and development services in USA, CANADA, AUSTRALIA, JAPAN, UK & QATAR. The group offers turnkey solutions, product development and maintenance, R&D support, and custom services spanning diverse domains and technologies such as:

Embedded System Development, including hardware design and product development

Industrial and Process Automation

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Consumer Electronics Medical Instrumentation Broadband Network Management Solutions Multimedia and Networking Security Solutions Business Software

Domestic Software division is another novel concept launched by the NeST Group to create qualified and highly skilled professionals. It provides high quality training in the field of information technology. NeST established research and development in the year 2000 to provide total solution to worldwide customer. NeST R&D Center provides innovative product development solutions for customers in the networking and communications area. 1.2 VISION & MISSION Be the global leader in providing end-to-end solutions in Engineering and Manufacturing for both hardware and software products in the high value added markets NeST is a customer driven organization committed to deliver high quality cost-effective solutions that fit customer needs. NeST is currently exporting fiber optics and copper networking hardware to major Networking companies in the world. The accent on customer satisfaction had fetched NeST prestigious clients like ISO, AMP, AM Communications, Dialogic, Hitachi, Internet Imaging Inc, Toshiba and Yamaha. NeST is a unique company which is capable of executing total service from concept to product' partnerships. focused on delivering value by creating customized solutions using appropriate technology and processes, thus forging enduring

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1.3 LOCATIONS NeST has business operations in U.S, India, Canada, Japan, Europe, UAE, UK, Qatar and Australia. The main divisions of Nest in India are given in the table.
Table 1.1: Main divisions in India

Division Corporate office, India Digital Electronics division Opto-electronics division Power electronics division RF, Microwave & wireless division Mechanical division Software service division Software service division Electronics division Magnetics division

Location Kakkanad, Cochin Kakkanad, Cochin Kakkanad, Cochin Kakkanad, Cochin Kakkanad, Cochin Bangalore Kalamassery Trivandrum Bangalore Chennai

CHAPTER 2
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SFO TECHNOLOGIES A NeST GROUP COMPANY

SFO Technologies started its manufacturing operations in 1991 and presently we have eight manufacturing divisions, located in three places in India-Cochin, Bangalore and Mysore. Manufacturing services employ over 2500 personnel with excellent exposure & experience working in the field of engineering, manufacturing, finance , materials management, HR and administration. SFO Technologies offer a unique manufacturing services model. offering a comprehensive range of manufacturing services as a one stop solution to its customers for:

Digital Electronics RF/Microwave assemblies Wire Harness Fiber optics and Optronics assemblies Power supplies Magnetic Sheet Metal/plastic enclosures High level product assemblies

SFO Technologies is a knowledgeable and trustworthy partner that develops long-term relationships with its clients and guides them through processes that define the most effective solutions to meet their needs. Whether projects are completed solely at clients' sites or by utilizing companys in-house facilities, clients benefit from the company's pricing structures. Project models, including time and materials, turn-key operations, dedicated staffing plans, joint ventures, and structured R&D; ensure that company can comply with any business scenario. 2.1 Fiber Optics 35 Fiber Optic Research Engineers with varied expertise ISO 9001 Quality system, Reliability test facilities 20 Manufacturing Engineers, 500+ skilled technicians World class Manufacturing facilities, Manufacturing Engg. Support. Products manufactured:

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Fiber Optics Active Products

Laser transmitters/Receivers TOSA/ROSA EDFA Supervisory Control Modules

Fiber Optic Passives

Cable Assemblies 1x2, 1x4 Fused Couplers/WDM PLC Alignment and Packaging Attenuators

High Level assemblies

Patch panels Fiber Management Enclosures for FTTH

2.2 Cable & Wire Harness Capability Automatic Wire Cutting & Stripping Semi-Automatic Cable Cutting, Jacket Stripping Semi-Automatic Crimping Controlled-Temperature Soldering Pull Testing Over-Moldings On Cable Assemblies. Capable Of Doing Any Type Of Cable Assembly And Wire Harness. Mould Design Capability. Capable Of Getting Moulds And Fixtures Fabricated Economically With Minimum Lead Time.

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2.3 Digital Electronics Capability 9 Smt Assembly Lines Total Placement Capability 110,000cph Fine Pitch Placement Up To 12mil

1-24 Layer Board Assembly Board Size : 508 Mm X 460 Mm Board Types: Rigid, Flex & Ceramic Substrates Aqueous Cleaning ( Water Wash) Placement Machines-Siemens, Fuji, Philips, Yamaha, Juki, Tenryu, Screen Printers: Dek, Mpm, Hti Reflow Machines: Vitronics , Heller, Btu, Box Build, Packaging & Barcode Labelling. Functional Test Development & Functional Testing. Rf Test Development And Rf Testing.

Presently Manufacturing: PCB Assemblies and High Level Assemblies Health care products Cable TV Networking products Data Communication Products Aerospace Equipments Assemblies for printer &server

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2.4 Power Electronics Designs & Manufacture of Power Electronics ISO 9001 Certified facility World class large volume manufacturing facilities UL / CSA approved Designs and products.

Design Tools ACCEL software for PCB AUTOCAD for Mechanical design P Spice for circuit simulation

Plastic & Mechanical Fabrication Facility Turret Punch Presses CNC Press Brakes Mig,Tig,Nc Spot Welding,Arc Welding Set Up Key Products Ups Enclosures Battery Lids On/Off Buttons Light Pipes Cabinets, Consoles, Enclosures, Racks, Heat Sinks , Busbars

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CHAPTER 3 PRODUCT DEVELOPMENT CAPABILITIES

NeST is a one-stop shop for end-to ends IT solutions. Organization supplies the full range of capabilities and resources required to quickly take a product or application idea from concept to commercialization, allowing customers to expand into new markets and generate additional revenue. Product development expertise includes: Research & Development Design and development of hardware Firmware development System software Development Product Integration Hardware manufacturing Product Packaging Deployment and Maintenance

3.1

NeST PRODUCT DEVELOPMENT CYCLE

The product development cycle is shown in figure 3.1. Concept

Proof of Concept Detailed Design

Specification

Complaint Test

Pilot Production

Test

Prototype

Reliability Test

Manufacturing

Volume Production

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Figure 3.1: Product development cycle

The product development lifecycle consists of different stages and components starting right from conceptualization to commercialization consisting of design and development of hardware and software, prototyping, fabrication and mass production for the product. Once the conceptualization and design process is over, the prototype is developed and tested. The whole product development effort consists fairly large amount of product integration through progressive assembly of product components, in incremental stages, according to defined integration sequences and procedures. 3.2 RESEARCH AND DEVELOPMENT

NeST established research and development in the year 2000 to provide total solution to worldwide customer. NeST R&D center provides innovative product development solutions for customers worldwide in the networking and communications area. The core areas of expertise are in electronics hardware, embedded systems, VHDL, fiber optics components and systems, advanced power supplies and mechanical designs.

3.3

SOFTWARE DEVELOPMENT

The software arm of NeST Group, Network Systems & Technologies is an international systems engineering and application development firm committed to delivering high quality, cost effective solutions that fit customers' needs on time, and every time. The company is an ISO 9001:2000 certified and assessed 8th in the world at SEI-CMMI level 5 for software engineering, system engineering and integrated product development. With the range of expertise, NeST is focused at satisfying the software requirements of vendors in industrial automation, medical equipments, consumer electronics, networking equipments, pharmaceuticals manufacturing, broadband, security and commercial computing.

3.4

HARDWARE MANUFACTURING

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NeST having 14 years of manufacturing expertise, is one among the few Indian companies to have a Class 10,000 clean room environment. It has the largest fused coupler facility in the world. In electronics manufacturing, NeST has an SMT line with a capacity of 24,000 components per hour and an automated through-hole insertion line with15000 axial and 9000 radial components per hour. From PC manufacturing to transponders and other network elements, NeST has been successful in putting up a strong product development model over a couple of years. NeST has been recognized as the best supplier by General Electric and is the preferred vendor of its casings and power supplies. NeST has a state of the art facility for manufacturing of Lithium Ion batteries. On radio frequency front, NeST has specialized capability in hybrid thick film microcircuit assemblies and SMD and COB capabilities along with test, measurement and reliability evaluation capabilities. 3.5 TESTING

The testing team is capable of supporting the customer at multiple levels ranging from unit level to system level testing. The team follows the V model of testing if multi- level testing is involved. The team works in close association with the development team and focus on the testing activities throughout the entire project life cycle. The external testing follows an execution model of testing.

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CHAPTER 4 NEST SOFTWARE

NeST Software is the Software division of SFO Technologies and part of the NeST Group of companies. NeST Software (Network Systems & Technologies (P) Ltd), founded in 17 April 1995, is a technology company which offers customized software and hardware development services for engineering applications and product development services for customers worldwide. The NeST software Division is certified at ISO 9001 and ISO 27001. 4.1 Domestic Software Division This division is another novel concept launched by the NeST Group to create qualified and highly skilled professionals. It provides high quality training in the field of information technology. It focuses on delivering quality software training based on a comprehensive curriculum and industry experience with committed faculty and state of the art facilities. It provides training in embedded systems, VHDL, Java, J2EE, .Net, c-sharp etc. 4.2 Testing The testing team associates from the initial stages of development to define a customized workflow that facilitate a critical and objective evaluation of the product. Testing consultants has extensive experience in testing methodologies, full lifecycle testing and test automation which helps the team to deliver quality software, with less risk, at lower costs. 4.2.1 Multilevel Testing

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The testing team is capable of supporting the customer at multiple levels ranging from unit level to system level testing. The team follows the V model of testing if multi- level testing is involved. The team works in close association with the development team and focus on the testing activities throughout the entire project life cycle.

Figure 4.1: V-model of multilevel testing

Determine the user needs and formalize it to requirements. This is followed by design phase. The next phase is coding. Individual units and modules are tested. This is followed by integration of various modules and testing. This step is to ensure that the design works well. Final phase is acceptance testing .In this step it is required to ensure that whether the requirements of user is met or not. If the requirements are satisfied then the system is said to meet the acceptance criteria. 4.2.2 Execution model Figure4.2 shows the execution model of testing. The workflow for external testing of projects at NeST is as follows. The team performs an initial system analysis with the specification supplied by the customer. An initial estimate of the testing activities is prepared based on the system analysis. Test plan, which addresses the detailed estimates, schedule, resources (both
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hardware & software), test scenarios, skills needed and tools required, shall be prepared. During test design, the team shall be preparing test cases and scripts used for test execution.

Figure 4.2: Execution model of testing

In test execution phase, the team shall be performing various validation methods and reporting issues if any, using bug tracking system. During test results analysis phase, the team shall be analyzing the test results to check whether the customer specified acceptance criteria is met and will issue a test certificate.

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CHAPTER 5 INTRODUCTION TO ARM

The ARM is a Reduced Instruction Set Computer (RISC), as it incorporates these typical RISC architecture features: a large uniform register file a load/store architecture, where data-processing operations only operate on register contents, not directly on memory contents simple addressing modes, with all load/store addresses being determined from register contents and instruction fields only uniform and fixed-length instruction fields, to simplify instruction decode. In addition, the ARM architecture provides: control over both the Arithmetic Logic Unit (ALU) and shifter in most data-processing instructions to maximize the use of an ALU and a shifter auto-increment and auto-decrement addressing modes to optimize program loops Load and Store Multiple instructions to maximize data throughput conditional execution of almost all instructions to maximize execution throughput. These enhancements to a basic RISC architecture allow ARM processors to achieve a good balance of high performance, small code size, low power consumption, and small silicon area. The Thumb instruction set is a re-encoded subset of the ARM instruction set. Thumb is designed to increase the performance of ARM implementations that use a 16-bit or narrower
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memory data bus and to allow better code density than provided by the ARM instruction set. T variants of the ARM architecture incorporate both a full 32-bit ARM instruction set and the 16bit Thumb instruction set. Every Thumb instruction is encoded in 16 bits. Thumb support is mandatory in ARMv6. Thumb does not alter the underlying programmers model of the ARM architecture. It merely presents restricted access to it.

Thumb execution is flagged by the T bit (bit[5]) in the CPSR: T == 0 32-bit instructions are fetched (and the PC is incremented by four) and are executed as ARM instructions. T == 1 16-bit instructions are fetched (and the PC is incremented by two) and are executed as Thumb instructions. In ARMv6, the Thumb instruction set provides limited access to the CPSR with the CPS instruction. There is no direct access to the SPSRs. Earlier versions provided no direct access to the CPSR.

5.1 LPC 2138/48

The LPC2141/2/4/6/8 microcontrollers are based on a 32/16 bit ARM7TDMI-S CPU with real-time emulation and embedded trace support, that combines the microcontroller with embedded high speed flash memory ranging from 32 kB to 512 kB. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at the maximum clock rate. For critical code size applications, the alternative 16-bit Thumb mode reduces code by more than 30 % with minimal performance penalty. 5.1.1 Features

16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package. 8 to 40 kB of on-chip static RAM and 32 to 512 kB of on-chip flash program memory. 128 bit wide interface/accelerator enables high speed 60 MHz operation. In-System/In-Application Programming (ISP/IAP) via on-chip boot-loader software. Single flash sector or full chip erase in 400 ms and programming of 256 bytes in 1 ms.

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EmbeddedICE RT and Embedded Trace interfaces offer real-time debugging with the on-chip RealMonitor software and high speed tracing of instruction execution USB 2.0 Full Speed compliant Device Controller with 2 kB of endpoint RAM.

5.1.2 GPIO Every physical GPIO port is accessible via either the group of registers providing an enhanced features and accelerated port access or the legacy group of registers Accelerated GPIO functions: GPIO registers are relocated to the ARM local bus so that the fastest possible I/O timing can be achieved Mask registers allow treating sets of port bits as a group, leaving other bits unchanged All registers are byte and half-word addressable Entire port value can be written in one instruction Bit-level set and clear registers allow a single instruction set or clear of any number of bits in one port 5.1.3 ADC 10 bit successive approximation analog to digital converter (one in LPC2141/2 and two in LPC2144/6/8). Input multiplexing among 6 or 8 pins (ADC0 and ADC1). Power-down mode. Measurement range 0 V to VREF (typically 3 V; not to exceed VDDA voltage level). 10 bit conversion time 2.44 s. Burst conversion mode for single or multiple inputs. 5.1.4 UART 0 &1 16 byte Receive and Transmit FIFOs Register locations conform to 550 industry standard. Receiver FIFO trigger points at 1, 4, 8, and 14 bytes. Mechanism that enables software and hardware flow control implementation. 5.1.5 TIMER A 32-bit Timer/Counter with a programmable 32-bit Pre scaler. Counter or Timer operation.
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External Event Counting capabilities (LPC213x/01 devices only). Up to four 32-bit capture channels per timer, that can take a snapshot of the timer value when an input signal transitions. A capture event may also optionally generate an interrupt. Four 32-bit match registers that allow: Continuous operation with optional interrupt generation on match. Stop timer on match with optional interrupt generation. Reset timer on match with optional interrupt generation. 5.1.6 INTERRUPT ARM PrimeCell Vectored Interrupt Controller 32 interrupt request inputs 16 vectored IRQ interrupts 16 priority levels dynamically assigned to interrupt requests Software interrupt generation 5.1.7 USB The USB is a 4 wire bus that supports communication between a host and a number (127 max.) of peripherals. The host controller allocates the USB bandwidth to attached devices through a token based protocol. The bus supports hot plugging, un-plugging and dynamic configuration of the devices. All transactions are initiated by the host controller.

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