Metal Core PCB

Metal Core PCB Fabrication Heat Sinks & Heat Pipes Enclosures (Plastic and Metal Alloys) SMT
& Through Hole PCB Assembly Final Integration & Test Services
with Concurrent Engineering
COFAN PCB
A Subsidiary of Cofan USA
www.cofan-pcb.com
T able of Contents
About the Company ............................................................................ 3 Typical Metal Core PCB Assembly ....................................................... 4 Typical Applications ....................................................................... 5~11 Typical Construction Methods..................................................... 12~17 Materials & Capabilities .................................................................... 18 Concurrent Engineering Services ................................................ 19~22 MCPCB Application Examples...................................................... 23~25 Metal Fabrication .............................................................................. 26 Heat Sink & Heat Pipes Assemblies ................................................... 27 Copper or Aluminum Extrusion Proles ............................................ 28 Mounting Hardware .......................................................................... 29 Contact Us ......................................................................................... 30
COFAN PCB
1-800-766-6097 info@cofan-usa.com
Cofan USA was founded in 1994. Our main oce is located in Fremont, CA. Cofan has manufacturing facilities in Shenzhen, China and in Taipei, Taiwan. Also, we have sales oce in Toronto, Canada. All of our facilities are ISO 9000:2001 certied for consistent management of our processes. Cofan oers design and manufacturing services for enclosures, heat sinks, and other customized mechanical parts. Our services include custom sheet metal, die-casting, Aluminum and Copper extrusions, CNC machined parts, and injection molded parts. We use industrial standard design software, such as Flowtherm, ANSYS Icepak, SolidWorks, Pro/E to support your design needs. We have been in mainstream in energy saving LED lighting industry for 5 years, oering FR-4, MCPCB, thermal solutions and assemblies. We are focused in developing and producing new technologies at Light Guide Panels and Chip-on-Board. We pride ourselves in giving the best possible customer service, the highest quality products with the shortest lead time in the industry at competitive pricing.
COFAN PCB
Electronic Components
Solder Mask Circuit Layer Copper Layer Dielectric Layer Metal Core Layer Heat Sink
COFAN PCB
Top Layer
High Density Power Conversion
Top Layer Thermally Conductive Pre-Preg Metal Base
Thermal Vias Thermally Conductive Pre-Preg
Top Layer
Bottom Layer
COFAN PCB
1-800-766-6097 Metal Base info@cofan-usa.com
Motor Control
COFAN PCB
Flat Panel Displays
COFAN PCB
General Lighting
COFAN PCB
Automotive
COFAN PCB
10
Hybrid & Electric Vehicles
COFAN PCB
11
Solar & Alternative Energy
COFAN PCB
12
Single Layer Construction

Single-Sided with Metal Base Wide Selection of Thermally Conductive PP One Layer of Pre-Preg (4,6 or 8 mm) Copper Weight 1~6oz Metal Base, Copper or Aluminum, 10~10mm Fully Automation Production Line
Top Layer Thermally Conductive Layer Metal Base
Thermal Vias
Top Layer
1-800-766-6097
COFAN PCB
Thermally Conductive A Subsidiary of Cofan USA Pre-Preg
Bottom info@cofan-usa.com Layer
13
Two Layer Construction

Thermally Surface Conductive Mounting on Top Layer Pre-Preg All connectivities are done on second layer.
Top Layer
Single side SMT with Metal Base
Metal Base
Thermal Vias Thermally Conductive Layer
Top Layer
Bottom Layer
Metal Base
A Layer TopSubsidiary of Cofan USA
COFAN PCB
Thermal Vias
Electrical Vias
Thermal Vias Thermally Four Layer Construction Conductive Pre-Preg
Top Layer
14
Bottom Layer
Single side SMT with Metal Base Surface Mounting on Top Layer All connectivities are done on 2nd and 3rd layer EMI is applied on fourth layer Thermal Vias, Electrical Vias, and Chasis Viasayer.
Metal Base
Thermal Vias Top Layer Layer 2 Layer 3 Layer 4 Bottom Layer
Electrical Vias
Thermally Conductive Layers
Metal Base
COFAN PCB
4 Layer
Pre-Preg
15
Double-Sided / Single Layer Construction

Double-sided surface mounting Metal can be isolated or connected to electrical vias
Metal Base
Chasis Vias and thermal interface can be interfaced with the heat sink.
Electrical Vias Isolated from Metal Base Top Layer
Mounting Hole Metal Base
Thermally Conductive Layers
Electrically connected to base
Isolated from Base
Bottom Layer Heatsink attached at exposed baseplate

COFAN PCB
16
Concept on Metal Base Grounded to 2nd Layer
COFAN PCB
17
Concept on Metal Base Grounded to 2nd Layer & Heat Sink
COFAN PCB
18
Thermal Pre-Preg Material Selection T-lam (Thermagon) Sekisui Customized by Cofan Taiwan Bergquist Denka PCB Lamination Thermagon 3.5W/m-k 1KA series Bergquist Doosan Metal Core Material Selection Aluminum Copper Heat Sink Heat Sink with Heat Pipes and Heat Spreaders
Layer Count Single-sided through 6-layer Blind/Buried Vias Thermal Vias Chassis Vias Copper Weight Accommodate up to 10 oz. PCB Thickness Inner layer dielectrics 0.004~0.25 Surface Finish Solder (63/37 Tin-Lead) SN100C OSP Carbon Ink Im Au
COFAN PCB
19
Our Concurrent Engineering service is what truly separates Cofan from other Fabricators. Our Applications Engineering Team oers 10+ years of experience in the design and manufacturing of Metal Core PCBs, assisting our customers during the design and ongoing manufacturing processes of PCB assemblies to ensure the highest level of performance at the lowest possible cost. We can review your Gerber les and recommend the best possible Design for Manufacturing practices including appropriate dielectric insulation characteristics and current carrying capacity. Before proceeding with the procurement, identifying what can be improved at the earlier stage will save substantial time and money for the prototypes. Moreover, we oer thermal simulation service for your nal PCB integration to predict the thermal characteristics of your design. After getting the results, our team can check what components can be simplied and rearranged for the feasible layouts. The customized thickness of the baseplate or any additional direct integration components (i.e., heat sink) can be specied. Either way, Cofan will eliminate the need for multiple prototypes, reducing the time it takes to get your project on the market.
COFAN PCB
20
Thermal Modeling Flowchart
CA D
CA M
NO
NO
YES
YES
COFAN PCB
21
Thermal Simulation
BOARD THICKNESS: 1.5MM BOARD SIZE: 120 MM X 120 MM MAXIMUM TEMPERATURE: 87.36 C
BOARD THICKNESS: 2.0 MM BOARD SIZE: 120 MM X 120 MM MAXIMUM TEMPERATURE: 83.44 C
BOARD THICKNESS: 3.0 MM BOARD SIZE: 120 MM X 120 MM MAXIMUM TEMPERATURE: 79.19 C
COFAN PCB
22
Tools for Assisting Product Development

Top Layer Layer 2 Layer 3 Layer 4 Bottom Layer Computer Aided Design
Thermal Vias
Electrical Vias
Thermally Conductive Pre-Preg
AutoCAD Pro/E SolidWorks
CAD
Metal Base
Simulation Software FloTHERM ANSYS Icepak COSMOS Computer Aided Manufacturing Electrical Vias Isolated Mastercam from Metal Base CAM 350
CAE
CAM
Top Layer
COFAN PCB
1-800-766-6097
Thermally Conductiv Pre-Preg
info@cofan-usa.com
Metal Base
23
Example 1
The customer contacted us with a plan for a 3-layer design. After reviewing their requirements and the sensitivity of their application, Cofan advised an additional layer to act as a ground plane to reduce EMI. The nal design utilizes a Copper Base for improved thermal conductivity and enables grounding of all the capacitors. The design includes both thermal and electrical vias lled with DuPonts CB100 for improved conductivity. Electrical Vias Isolated
from Metal Base Top Layer
Electrically connected to base
Isolated from Base
Bottom Layer Heatsink attached at exposed baseplate
COFAN PCB
Mounting Hole
24
Example 2 Metal Base
The customer contacted us with a plan for MCPCB assembly that would need to be attached to a Heat Sink assembly.
Bottom Cofan developed a new lamination process, which would allow us to mount the MCPCB directly to a Heat Sink with Electrically Isolated Sink assembly that costs less and minimizes Layer T-Lam PP material. The end result is a stand-alone MCPCB and Heat connected from Base manufacturing processes. Also, it improves the thermal management characteristics. to base Heatsink attached at exposed baseplate
COFAN PCB
25
Example 3
The customers MCPCB was experiencing a thermal issue and did not get any suggestions/improvements from another fabricators Application Engineer. The client assumed their maximum height was limiting their options and was close to scrapping entire project. By taking some time to review and understand their application, Cofan was able to increase the base-plate thickness from .062 to .0125, which was made possible by using counter-bore mounted screw holes. Cofan was also able to implement the improved thermal lamination to maximize the heat dissipation. Cofan helped resolve their issues beyond their expectations.
COFAN PCB
Metal Fabrication
Cofan USA operates along with Cofan CN (China based facilities) to fabricate the simplest to most complex sheet metal part for a quick-turn prototype or for a production stage. Cofan oers competitive pricing. Cofans procurement items range from simple at metal plate with a single hole to the complex larger assemblies, consisting various components that have been punched, formed, machined, welded, sanded, plated, painted, silk-screened, and installed along with hardware together. The assembly can include the rivets or welding. Majority of the parts require additional operations, such as nishing operation on painting or plating before packaging.
26
Trumpf, Fanuc CNC, Fanuc Wirecut, Charmille Wirecut, Ona Wirecut Sheet Metal operations Bending Ironing Laser Cutting Press Brake Forming Punching Roll Forming Stamping NC Routing Welding Full line Machining operation including CNC Tapping / Drill Center CNC Lathe Double/Single-Sided Grinding Measuring Instruments CMM, Microscope, etc. Full line metal nishing Wet/powder coat painting Anodizing Nickel plating, etc.
COFAN PCB
Heat Sink & Heat Pipes Assemblies

Cofan has stock units of standard heat pipes with various diameters that can be integrated into custom heat pipe assemblies. It can be tailored for your application needs. Cofans exible solutions At the copper heat pipe, multiple plating options are available. Nickel plated heat pipes can be used at outdoor. Custom bending can be done in-house for use in any hardware layout. Various heat pipe diameters. Small diameters can be used at constrained environments, and larger diameters can be utilized for maximum performance. Various heat pipe lengths (up to 400mm) O-shelve lengths for readily available stock. Customized lengths. Cofans services - Custom bending can be done in-house at our Fremont, CA facility. - The work can be ready in less than one week. Cofan oers 100% inspection on all of the heat pipes before and after bending. - All heat pipes must pass the stringent heat transfer tests to reach a minimum temperature gradient within a minimal time period (T < 4 C, time period 7 seconds). - ISO9001 Certied Facilities. - Capacity: 500,000 heat pipes/month with lead time of less than one week. R&D team dedicated to continuous improvement and product development. Design at active or passive forms.
27
COFAN PCB
Copper or Aluminum Extrusion Proles
50.80 2.00
UNLESS OTHERWISE SPECIFIED:

DRAWN CHECKED ENG APPR. MFG APPR.
PROPRIETARY AND CONFIDENTIAL THE INFORMATION CONTAINED IN THIS DRAWING IS THE SOLE PROPERTY OF COFAN USA. ANY REPRODUCTION IN PART OR AS A WHOLE W/O THE WRITTEN PERMISSION OF COFAN USA IS PROHIBITED. INTERPRET GEOMETRIC TOLERANCING PER: MATERIAL FINISH
NAME
DATE
JMJ
DIMENSIONS ARE IN INCHES TOLERANCES: FRACTIONAL ANGULAR: MACH BEND TWO PLACE DECIMAL 0.02 THREE PLACE DECIMAL 0.005
7/1/08 IVAN.C 7/1/08
COFAN USA
TITLE:
Q.A. COMMENTS:
46177 WARM SPRINGS BLVD. FREMONT, CA 94539
EXTRUSION PROFILE FOR 495.3X50.8MM

AL 6063-T5
NEXT ASSY APPLICATION USED ON
SIZE DWG. NO.

NONE
DRAWN NOT TO SCALE
7.11 0.28
REV
* DIMENSIONS IN INCHES AND (MILLIMETERS) * DEBURR AND BREAK ALL SHARP EDGES
COFAN PCB
8.38 0.33 12.19 0.48 495.30 19.50

SCALE: 1:3 WEIGHT:
5 4 3 2 1

A 21-1074
01
SHEET 1 OF 1
1-800-766-6097
28
info@cofan-usa.com
29
COFAN PCB
30
Cofan USA 46177 Warm Springs Blvd Fremont, CA 94539 Tel: 1-800-766-6097 Fax: 1-510-490-7931 Web site: www.Cofan-USA.com www.Cofan-PCB.com Chang Han, President chang@cofan-usa.com Ben Finn, Sales Engineer ben@cofan-usa.com John Lin, Purchasing Manager john@cofan-usa.com Emily Lee, Sales emily@cofan-usa.com Ivan Cho, Mechanical Engineer ivan@cofan-usa.com
Cofan Canada Tel: 1(905) 761-8887
Cofan Taiwan Tel: 011 886-2-7716-0080 x68
Cofan China
James Cho, General Manager james.cho@cofan-usa.com Lac Nguyen, Field Application Engineer lac@cofan-usa.com David How, Account Manager david@cofan-usa.com Helmut Mattler, Account Manager hmattler@cofan-usa.com
David Lin, Sales Director david.lin@cofan.com.tw Cathy Chan, VP Sales cathy.chan@cofan.com.tw
Chico Su, General Manager chico@cofan-cn.com
COFAN PCB

Metal Core PCB

Diunggah oleh

Informasi Dokumen

Judul Asli

Hak Cipta

Format Tersedia

Bagikan dokumen Ini

Bagikan atau Tanam Dokumen

Opsi Berbagi

Apakah menurut Anda dokumen ini bermanfaat?

Apakah konten ini tidak pantas?

Hak Cipta:

Format Tersedia

Metal Core PCB

Diunggah oleh

Hak Cipta:

Format Tersedia

Metal Core PCB Fabrication Heat Sinks & Heat Pipes Enclosures (Plastic and Metal Alloys) SMT

with Concurrent Engineering

High Density Power Conversion

Top Layer Thermally Conductive Pre-Preg Metal Base

Thermal Vias Thermally Conductive Pre-Preg

1-800-766-6097 Metal Base info@cofan-usa.com

Flat Panel Displays

Hybrid & Electric Vehicles

Solar & Alternative Energy

Single Layer Construction

Top Layer Thermally Conductive Layer Metal Base

Thermally Conductive A Subsidiary of Cofan USA Pre-Preg

Bottom info@cofan-usa.com Layer

Two Layer Construction

Single side SMT with Metal Base

Thermal Vias Thermally Conductive Layer

A Layer TopSubsidiary of Cofan USA

Thermal Vias Thermally Four Layer Construction Conductive Pre-Preg

Thermal Vias Top Layer Layer 2 Layer 3 Layer 4 Bottom Layer

Thermally Conductive Layers

Double-Sided / Single Layer Construction

Mounting Hole Metal Base

Thermally Conductive Layers

Electrically connected to base

Isolated from Base

Bottom Layer Heatsink attached at exposed baseplate

Concept on Metal Base Grounded to 2nd Layer

Concept on Metal Base Grounded to 2nd Layer & Heat Sink

Thermal Modeling Flowchart

Tools for Assisting Product Development

Thermally Conductive Pre-Preg

AutoCAD Pro/E SolidWorks

Mounting Hole Metal Base

Thermally Conductiv Pre-Preg

Mounting Hole Metal Base

Thermally Conductive Pre-Preg

Electrically connected to base

Isolated from Base

Bottom Layer Heatsink attached at exposed baseplate

Example 2 Metal Base

Thermally Conductive Pre-Preg

Heat Sink & Heat Pipes Assemblies

Copper or Aluminum Extrusion Proles

UNLESS OTHERWISE SPECIFIED:

7/1/08 IVAN.C 7/1/08

46177 WARM SPRINGS BLVD. FREMONT, CA 94539

EXTRUSION PROFILE FOR 495.3X50.8MM

SIZE DWG. NO.

8.38 0.33 12.19 0.48 495.30 19.50

A Subsidiary of Cofan USA

Cofan Canada Tel: 1(905) 761-8887

Cofan Taiwan Tel: 011 886-2-7716-0080 x68

David Lin, Sales Director david.lin@cofan.com.tw Cathy Chan, VP Sales cathy.chan@cofan.com.tw

Chico Su, General Manager chico@cofan-cn.com

Anda mungkin juga menyukai