PCB Dimensions
Additional restriction
PCB thickness Base material Copper weight Surface finish Warp& Twist Trace width
Minimum 0.4mm Maximum 2.4mm Fr4 tg-130, FR4 High tg 0.5oz,1oz,2oz,3oz. HASL, HASL (lead free), Electrolytic Gold, OSP, Electroless Nickel/Immersion Gold 1%
6mil (0.15mm)
Ver1.2(05/11)
Trace clearance
6mil (0.15mm)
8mil (0.2mm)
Minimum
20mil (0.5mm)
24mil (0.6mm)
Minimum
7mil (0.18mm)
10mil (0.25mm)
Minimum
8mil (0.2mm)
Recommended
10mil (0.25mm)
Ver1.2(05/11)
Minimum
2mil (0.05mm)
Yellow: exposed pad; Green: trace covered by solder mask; Red: exposed base material; Black: base material covered by solder mask;
Recommended
3mil (0.08mm)
Minimum
6mil (0.15mm)
Minimum
3mil (0.08mm)
Recommended
Drill size (PTH)
4mil (0.1mm) 10 mil (0.25mm), tolerance : PTH+/-3mil NPTH:+/-2mil 1mil. If the drill size larger than 80mil, step value is 2mil (e.g., 82mil, 84mil, 86mil). 236mil (5.9mm)
Minimum Step
(NPTH)
Maximum
Ver1.2(05/11)
0.5oz: 6mil; 1.0oz; 6mil; 2.0oz; 8mil; 3.0oz: 10mil; 0.4/1.5, 0.5/1.5, 0.6/2.0, 0.8/2.5, 1.0/2.5, 1.2/3.0, 1.6/3.5, 2.0/4.0, 3.0/5.0.
Recommend hole/pad size pair (in mm) Plating Aspect Ratio (H:R)
R H
Maximum
10:1
Silkscreen height/width
32/32mil (0.8mm)
Silkscreen line width
5mil (0.13mm)
Ver1.2(05/11)
Core thickness after scoring process Minimum: 4mil (0.1mm), normal: 1/3 board thickness
V-scoring
30, 45 , 60 . Default is 45
Ver1.2(05/11)