Anda di halaman 1dari 2

1 | Page

SYLLABUS Mold Design MPE-4700:427 Spring Semester 2013 Mondays & Wednesdays: 5:10 6:25pm Room: Schrank S 112 Labs: ASEC 123/124/125 Instructor: Edwin C. Goyzueta E-Mail: egoyzuet@gmail.com Text: Polymer Processing Fundamentals, Tim Osswald (ISBN-13:9781569902622) Course Description: This course will review basic knowledge for designing molds with an emphasis on the injection molding process. It will cover mold design issues along with mold filling simulation with computer-aided mold design tools. Students with polymer rheology and processing knowledge will develop more advanced skills and knowledge for application to an important, commercial significant area for polymers. Introduction to polymer processing techniques and mechanical behavior of polymers will also be reviewed. Objectives: The objective of this course is to provide the engineering student with a basic understanding of the principles of polymer processing as well as the mechanical / rheological behavior of polymers. Quiz 1 thru 3 = 30% Mold Flow Labs = 25% Polymer Processing Labs = 25% Final Exam = 20%
Assigned Date 14-Jan 21-Jan 28-Jan 4-Feb 11-Feb 18-Feb 25-Feb 4-Mar 11-Mar 18-Mar 1-Apr 8-Apr 15-Apr 22-Apr 29-Apr Material Rubber Processing Intro 1 & 2 Lect1A Lect1B Lect2A Lect2B Lect3 Lect4 Lect5 Lect6 Lect 7 Lect 8 Lect9 Lect10 Review Items due 1 week from assigned date MFL1 HW 1A, PPL1 MFL2, HW1B, MFL3, HW2 HW2, PPL2 MFL4, Quiz 1 MFL5, HW3 PPL3, HW4 MFL6, Quiz 2 MFL7, HW5 PPL4, HW6 MFL8, Quiz 3 MFL9 PPL5 FinaL

2 | Page

Topics Include: Introduction to Polymers Molding Process Mold functions, Mold requirements General Mold Design Guidelines Shrinkage, Tolerances Gates & Runners, Venting Hot Runners & Injection Mold materials, mechanics, and fatigue Mold filling analysis Cooling, cooling analysis, part warp and distortion Part design for molds, mold machining techniques Blow molds, rotational molds, compression & transfer molds
3359-41-02 DEFINITION OF STUDENT MISCONDUCT. The University of Akron defines student misconduct as behavior on property owned, leased or operated by the university that violates codified or explicitly stated university rules and regulations. Minor sanctions may be assessed informally under prescribed procedures (see paragraph (A)(1) of this rule), university records, but the types of misconduct described below may result in the sanctions of formal disciplinary probation, suspension, or dismissal. Student misconduct includes: (A) Plagiarism, cheating, or other forms of academic dishonesty. 1) Working together by solving problems is an effective way to learn. However, copying solutions from one another or out of the solutions manual is not acceptable and may constitute academic dishonesty. Copying solutions from one another or from the solutions manual may result in a one letter grade reduction for the course. 2) Any form of plagiarism is unacceptable and may result in disciplinary action. 3) All students are expected to behave in a respectful and appropriate manner in class. Students acting in a manner that is disruptive or impedes learning may be asked to leave the class. Students that are asked to leave will be required to meet with the instructor and may be referred to Student Judicial Affairs for review and possible disciplinary action. 4) The use of cell phones, pagers and other electronic devices is prohibited during class. Cell phones need to be placed into silent / vibrate mode during class or turned off. Laptops are permitted for the purpose of taking notes, software training and performing in-class assignments only and are not to be used for e-mail, instant messaging or other non-class activities. 5) Examinations are conducted as means to assess student learning and understanding of the course material. During examinations, students are expected to have no communication with others in or outside of class. Such communication or the copying of another students exam solutions will result in a grade of F for the examination and an F for the final course grade.