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Maxwell and HFSS Coupling to ANSYS 12.

Martin Vogel, PhD


Product Management

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Why couple simulators for electromagnetics and multi-physics?

Electronics produce heat, which can cause malfunctions. Courtesy of


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Existing Electromagnetics Multiphysics Links


Electromagnetic simulators: Maxwell SIwave

HFSS

ANSYS Mechanical Thermal Solvers

ANSYS FLUENT Thermodynamics and fluid flow

ANSYS ICEPAK cooling of electronics

ANSYS Mechanical Stress Solver

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Example 1 Raytheon High-Power Connector

Microstrip terminated by shorting diode Copper housing Kovar and glass More connector, gold, Teflon Semi-rigid coaxial cable, silver, Teflon, copper

Port

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Cross section of critical part:


Gold pin Kovar Glass Air Teflon Gold pin

Microstrip

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Before turning power on

Co-axial pin connecting to microstrip trace Courtesy of


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Soon after turning power on

Excessive heat has destroyed the connector. Courtesy of


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Analyze the model in HFSS

Pin connecting to trace

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Export info from HFSS

Geometry, e.g. in STEP format

Small file with link info


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Request thermal simulation(s) in Workbench. Import the geometry.

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Specify volume and surface losses. Workbench will access HFSS.

HFSS Volume loss HFSS Surface Loss

Simply picked all metal faces

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Add boundary conditions for convection and cooling.

Convection on many faces Cooling on bottom face

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Temperature reaches almost 300 deg C in kovar and glass.

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Transient simulation gives same final temperature after 20 seconds.

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Use one of the thermal solutions as input for a structural analysis.

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Deformation up to 2 m

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Stress mostly in inner conductor

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Finalize the design.

Kovar, responsible for the high temperatures, has been replaced by a different metal. Temperatures may still be high, which Teflon cannot handle. Accurate analysis wanted.

Involve CFD to analyze the cooling. Use the two-way thermal coupling to account for temperature-dependent materials.

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Use CFD to determine the film coefficient for the water cooling at the bottom.

Convection on many faces Cooling on bottom face

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Connector array with water cooling

Water, velocity 1 ft/s

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Mesh in Fluent

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Fluent velocity results

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Fluent temperature results

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Replace water cooling by film coefficients

Film coefficient ranges from 5700 to 2300 W/(m2 K) depending on position.


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Why two-way thermal?

Teflon loss tangent increases with temperature. Run-away effect possible.

Glass transition

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Two-way thermal link Ansoft Workbench Mechanical


Solve in Ansoft at initial temperature. Export electromagnetic loss to WB Mechanical. Determine temperatures in WB Mechanical. Export temperatures to HFSS. Material parameters change. T < threshold? Yes Done
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Solve in Ansoft with new temperatures.

No

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Two-way thermal analysis:

Final temperatures with normal Teflon

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EM Power Losses as function of two-way thermal iteration

Volume Loss in normal Teflon Surface Loss on metals

Volume Loss in low-loss Teflon

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Temperatures as function of two-way thermal iteration

Tmax Normal Teflon

Tmax Low-Loss Teflon Tmin Normal Teflon Tmin Low-Loss Teflon

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Two-way thermal analysis:

Final temperatures with low-loss Teflon

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Example 2, with Ansoft Maxwell: battery charger for medical implants


Battery Titanium case, implanted in body Coil outside body, on skin, powered by external source Coil in implant, inductively coupled, picks up power to charge battery

Electronics

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Induced current has maximum at 50 kHz.

Maximum

Limited by losses in coil

Limited by skin effect in titanium case

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Magnetic field coupling

Induced currents in second coil reduce the magnetic field here. This is the intended behavior.
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Final temperature at 50 kHz

Maximum 43.8 0C

Due to skin effect in titanium, temperature exceeds 43 deg C after a few minutes. This would be uncomfortable and probably violates safety regulations.
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Final temperature at 10 kHz

Maximum 38.4 0C

At 10 kHz, final temperature is safe. Secondary coil picks up about as much power, but skin effect heats the titanium case much less.
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Conclusions

Links between HFSS/Maxwell and ANSYS Workbench are available in the graphical user interfaces -> easy to set up. Advanced applications can be handled.

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