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KNOWN: Surface-mount transistor with prescribed dissipation and convection cooling conditions. FIND: (a) Case temperature for mounting arrangement with air-gap and conductive paste between case , subject to the constraint that T = 40C. and circuit board, (b) Consider options for increasing E g c SCHEMATIC:
ASSUMPTIONS: (1) Steady-state conditions, (2) Transistor case is isothermal, (3) Upper surface experiences convection; negligible losses from edges, (4) Leads provide conduction path between case and board, (5) Negligible radiation, (6) Negligible energy generation in leads due to current flow, (7) Negligible convection from surface of leads. PROPERTIES: (Given): Air, k g,a = 0.0263 W/mK; Paste, k g,p = 0.12 W/mK; Metal leads, k A = 25 W/mK. ANALYSIS: (a) Define the transistor as the system and identify modes of heat transfer.
E E in out + E g = Est = 0
Tc = hAsT + k g As /t + 3 ( k A Ac /L ) Tb + Eg / hAs + k g As /t + 3 ( k A Ac /L ) Substituting numerical values, with the air-gap condition ( k g,a = 0.0263 W/mK)
Tc = 50W/m 2 K 32 106 m 2 20D C + 0.0263W/m K 32 106 m 2 /0.2 103 m 8 2 3 D 3 3 3 +3 25 W/m K 25 10 m /4 10 m 35 C / 1.600 10 + 4.208 10 + 4.688 10 W/K
{
(
Tc = 47.0D C .
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Continued..
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As indicated by the energy balance, the power dissipation increases linearly with increasing h, as well as with increasing k A . For h = 250 W/m2K (enhanced air cooling) and k A = 400 W/mK (copper leads), the transistor may dissipate up to 0.63 W.
COMMENTS: Additional benefits may be derived by increasing heat transfer across the gap separating the case from the board, perhaps by inserting a highly conductive material in the gap.
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