Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA Phone +1.201.343.8983 | Fax +1.201.343.2132 | WhitePaper@masterbond.com
Master Bond potting/encapsulation compounds offer easy application and high performance.
operation. Engineers who focus only on the maximum temperature and ignore its short dwell time will tend to end up with a more expensive potting compound than they actually need. Failing to account for ramp times, or the speed of temperature changes, can likewise lead to the wrong potting compound. Fast ramp times and thermal shock go hand in hand. Engineers who ignore ramp times may end up with a potting compound that can meet the high and low temperature requirements but not hold up to thermal cycling without cracking.
There are also products available that meet speciality requirements such as low outgassing, thermal conductivity, cryogenic serviceability, and more. Still, there are currently some property trade-offs that are difficult to reconcile given todays technology. One example is thermal conductivity and optical clarity because the fillers that make the compound conductive also interfere with clarity.
Potting Applications
Potting and encapsulation compounds are widely used whenever electronic components require protection from damaging thermal, environmental or mechanical conditions. These applications include: Printed circuit boards Medical electronics Power electronics LED lighting Transformers Transducers and other sensors Capacitors Surge protection devices Electronic assemblies Cable components Solenoids
Shrinkage isnt all bad. A bit of controlled shrink can actually be helpful in thermal cycling applications. When the potting compounds coefficient of thermal expansion (CTE) does not match that of the substrate, a bit of shrinkage can create just enough clearance to relieve stresses caused by differential expansion and contraction.
are many good one-part potting compounds, including Master Bond EP2RRLV. Just keep in mind that one-part products require a heat cure that may push extremely heat sensitive components past their thermal limits. One-component potting compounds also have a more limited range of properties available, so applications that need maximum performance properties should consider two-part systems.
Make It Stick
Like any bonding product, potting compounds work best if they have good adhesion to their substrates. The problem is that many of the polymers used for electronics housings and potted components frequently have low surface energies and do not bond easily. Poor adhesion with the substrate materials can be fixed early in the design process through the use of surface treatments and primers. Engineers can combat poor adhesion with part features, such as undercuts that let the cured potting compound lock itself into the electronic housing. For further information on this article, for answers to any adhesives applications questions, or for information on any Master Bond products, please contact our technical experts at Tel: +1 (201) 343-8983.
Color Code
Applications
EP21FL
100:25
A amber B amber
120-180
-60 to +250F
Flexibilized version of EP21. Superior thermal cyclability, shock and impact resistance. Excellent potting/ encapsulation compound. Lower exotherm, suitable for moderate size castings. Fully meets UL94V.0 for flame retardancy. Excellent physical and electrical insulation properties. Superb chemical resistance. Toughened system. Withstands rigorous thermal cycling. Superior thermal shock resistance. Allows for repairability. Cryogenically serviceable. Marvelous thermal & mechanical shock resistance. Excellent thermal cycling durability. Cryogenically serviceable. Lower viscosity than EP30DP. Less rigid. Low viscosity, low exotherm, long working life system. Excellent for potting capacitors. Superior dielectric properties. Rigid. Thermally conductive, electrically insulating version of EP37-3FLF. High flexibility and low viscosity. Meets NASA low outgassing specifications. Clear system for optical and fiber optic bonding & sealing. Superb chemical resistance. Transparent. Rigid. Meets NASA low outgassing requirements. Cryogenically serviceable. Unsurpassed combination of temperature resistance, flexibility and electrical insulation properties. Easily repairable. Versatile silicone system. Special version of EP29LP. Resists cryogenic temperatures & shocks. NASA low outgassing approved. Transparent.
EP21FRSPLV
100:100
A red B white
30-60
-60 to +250F
EP30DP
100:10
60-90
4K to +250F
EP30FL
100:25
25-30
24 hrs @ RT 1-2 hrs @ 200F 48-72 hrs @ RT 3-4 hrs @ 200F 4-5 days @ RT 4-6 hrs @ 200F
EP30M3LV
100:50
130-150
EP37-3FLFAO
100:100
3 hrs
EP30-2
100:10
A clear B clear
20-25
-60 to +250F
MasterSil 151
100:10
A clear B clear
30-60
-75 to +400F
EP29LPSP
100:65
A clear B translucent
>6 hrs
4K to +250F
Applications
EP36
tan
-100 to 500F
Unique B-stage system. Combines superb temperature resistance with high flexibility & elongation. Capable of resisting rigorous thermal cycling. Thermally conductive, electrically insulating version of EP36. Semiflexible. Good mechanical and thermal shock resistance.
EP36AO
light tan
-100 to 500F
Color Code
Applications
UV15-7DC
colorless, transparent
-60 to +300F
UV curable. Low viscosity. Rigid. Requires 125C for secondary cure in shadowed out areas.
UV15DC80
clear, transparent
-60F to 300F
High viscosity, dual cure UV. Requires 80C for secondary cure in shadowed out areas.