Soldering

Definition Uses Ideal requirements Properties Composition Classification Procedures

If solder joint done properly there should be no fusion or alteration of the two components joined. Fusion welding is the process whereby the pieces that are joined are melted or fused together without solder (filler).

Prerequisites of soldering
To achieve Bonding Cleanliness Wetting of the surfaces

Ideal requirements of dental solder

Ability to resist tarnish and corrosion. Fusion temperature 100-150F (60C) below that of the parts to be joined. To be free flowing when melted.

Resistance to pitting. At least as strong as the parts being joined. Color compatible with parts to be joined.

Properties
Fusion Temperature. Strength Resistance to tarnish and corrosion. Solder gap. Free flowing.

Classification of Gold Solder

Fineness Carat Fusion Temperature

Carat
It is the amount of gold in parts per 24. an alloy that is 18 K is 18 parts gold per 24 (18/24) = 75% gold .

FLUX
Is placed on the surfaces to be soldered before they are heated. Added to the metal surface to
improve solder flow, prevent oxidation (actually flux dissolves oxides),

prevent contamination.

Oxidation of metal surfaces during soldering procedures can prevent both flow and wetting of solder.

FLUX
1st, displaces gases and removes oxides from surface by reduction or dissolution 2nd, is displaced by the solder

FLUX
Borax, Boric Acid, Silica, or Sodium tetraborate Used with noble alloys (gold alloys for crown and bridge and ceramo-metal alloys). Fluoride Fluxes are need for Chrome-Nickel metals (base metal alloys) since Borax based flux does not dissolve chromium oxide.

Anti-Flux
A material used to outline the area to be soldered in order to restrict the flow of solder (limit spreading of solder). Placed on casting before flux application. Most common types:
Soft graphite pencil Polishing rouge (Iron Oxide) Whiting compound (a calcium based compound).

Soldering Procedure
Indexing Investing Soldering

Pre-soldering
Preveneer soldering. Refers to soldering the metal framework before the addition of porcelain. A high fusing solder (1100C) is used because the solder joint must withstand subsequent heating during the addition and firing of porcelain.

Post-soldering
Refers to soldering after the porcelain is added. A low fusing solder is used because soldering must be done at a lower temperature than the maturation of porcelain. All staining and glazing of ceramic units must be done prior to soldering. The porcelain should not contact the investment or flux, and the units should not be quenched.

3. Make soldering index : fast-setting impression plaster in impression carrying tray or tongue depressor. 4. Make soldering block:
Box index and pour soldering investment Trim to uniform shape and notch soldering block , Flush boiling water, Place flux and antiflux

REPAIRING CASTING VOIDS

Solder cannot be used to repair deficient margins or occlusal holes. CAN be used to repair PITS and HOLES in axial surfaces. Platinum foil over hole on inside of casting: acts as matrix for solder.