5 1
IC3
4
220n
C9
V+
2 3
SUB-1 SUB-2
TDA2030V R1 10
10F/25v
C12
1 2
R5 10k
5 6 4
IC4B
7
+
C14 100n
VSS
10F/25v
C8
4.7k
2011 te1.com.br
R2
3
R7
NE5532N
22k
C7
GND
470
GND
GND
2011 te1.com.br
GND R8 GND VDD
V-
470
P1 10k
100n GND
R4
+
C11 47F/25v
GND
R10
10F/25v
100n
C20
C21
1-3
10F/25v
P2/1 10k
C19
C22
2n2
1-1
P2/2 10k
10k
2 3
R-IN-2
2-2
5 1 2 3
C15
2-3
1-2
100n
L-IN-2
R19
IC6 TDA2030V 10
R-IN-1
10k
L-IN-1
VDD IC5
4
GND
4.7k
R18
VSS
2011 te1.com.br
R17 GND C23 100n GND C18 10F/25v GND GND R16 470 33k
+
GND
2-1
GND
TDA2030V 10
GND
VSS
2011 te1.com.br
R12 33k GND R9 470 100n GND C13 10F/25v GND
+
4.7k
R13
GND C17
2011 te1.com.br
VDD
IN OUT GND
AC1
C4
B1
+
4700F/35v 100nF
2011 te1.com.br
AC2
GND
C3
C1
GND
IC1 7912
C6 10F/25v
4700F/35v 100nF
IN
GND OUT
VSS
V-
C4
2
+ -
L-OUT
+
2
L OUT
J6 J7 R12 100n R14 10 R13 R9 470 33k 4.7k C13 C11 47F/25v R6 33k NE5532N J5
J4
SUB
R2 22k 10 R1
C23
100n
R18
R4 470
4700F/35v
C7 100n IC2 C5 10F/25v
R-OUT
R-OUT
10k
C22
J3 C6 10F/25v
R5
C9
10F/25v 10k
IC1 7912 O I +
10k
C20
10F/25v
L-IN
2
R-IN 2
+ -
10k R3
C1
10F/25v P2
J2 P1
LIN
RIN
2011 te1.com.br
TRAFO
10F/25v C12
4700F/35v
100nF
IC4
220n
C8
C3
7812
AC
J1
C2 B2
100nF
2011 te1.com.br
SUB
2011 te1.com.br
+ TU O -R
TU O L
2011 te1.com.br
SUB
+ TDA2030 2.1 Verso 1.0
2011 te1.com.br
OFART
LIN
RIN
2011 te1.com.br
+ TU O -R
TU O L
2011 te1.com.br
SUB
+ TDA2030 2.1 Verso 1.0
2011 te1.com.br
OFART
LIN
RIN
2011 te1.com.br
TDA2030
14W Hi-Fi AUDIO AMPLIFIER
DESCRIPTION The TDA2030 is a monolithic integrated circuit in Pentawatt package, intended for use as a low frequency class AB amplifier. Typically it provides 14W output power (d = 0.5%) at 14V/4; at 14V or 28V, the guaranteed output power is 12W on a 4 load and 8W on a 8 (DIN45500). The TDA2030 provideshigh output current and has very low harmonic and cross-over distortion. Further the device incorporates an original (and patented) short circuit protection system comprising an arrangement for automatically limiting the dissipated power so as to keep the working point of the output transistors within their safe operating area. A conventional thermal shut-down system is also included. ABSOLUTE MAXIMUM RATINGS
Symbol Vs Vi Vi Io Ptot Tstg, Tj Supply voltage Input voltage Differential input voltage Output peak current (internally limited) Power dissipation at Tcase = 90C Stoprage and junction temperature Parameter
Pentawatt
Unit V V A W C
TYPICAL APPLICATION
June 1998
1/12
TDA2030
PIN CONNECTION (top view)
TEST CIRCUIT
2/12
TDA2030
THERMAL DATA
Symbol Rth j-case Parameter Thermal resistance junction-case max Value 3 Unit C/W
ELECTRICAL CHARACTERISTICS (Refer to the test circuit, Vs = 14V , Tamb = 25C unless otherwise specified) for single Supply refer to fig. 15 Vs = 28V
Symbol Vs Id Ib Vos Ios Po Parameter Supply voltage Quiescent drain current Input bias current Input offset voltage Input offset current Output power d = 0.5% Gv = 30 dB f = 40 to 15,000 Hz R L = 4 R L = 8 d = 10% f = 1 KHz R L = 4 R L = 8 d Distortion Gv = 30 dB 18 11 W W Vs = 18V (Vs = 36V) Test conditions Min. 6 12 40 0.2 2 20 Typ. Max. 18 36 60 2 20 200 Unit V mA A mV nA
12 8
14 9
W W
0.2
0.5
0.5
% Hz M dB
B Ri Gv Gv eN iN SVR
Power Bandwidth (-3 dB) Input resistance (pin 1) Voltage gain (open loop) Voltage gain (closed loop) Input noise voltage Input noise current Supply voltage rejection
Gv = 30 dB Po = 12W
R L = 4
f = 1 kHz B = 22 Hz to 22 KHz
29.5
30 3 80
30.5 10 200
dB V pA dB
40
50
Id
Drain current
900 500
mA mA
3/12
TDA2030
Figure 1. Output power vs. supply voltage Figure 2. Output power vs. supply voltage Fi gu re 3. Disto rtion vs. output power
Fig ure 8 . Fr eq uency response with different values of the rolloff capacitor C8 (see fig. 13)
4/12
TDA2030
Figure 10. Supply voltage rejection vs. voltage gain Figure 11. Power dissipation and efficiency vs. output power Figure 12. Maximum power dissipation vs. supply voltage (sine wave operation)
APPLICATION INFORMATION Figure 13. Typical amplifier with split power supply Figure 14. P.C. board and component layout for the circuit of fig. 13 (1 : 1 scale)
5/12
TDA2030
APPLICATION INFORMATION (continued)
Figure 16. P.C. board and component layout for the circuit of fig. 15 (1 : 1 scale)
Figure 17. Bridge amplifier configuration with split power supply (Po = 28W, Vs = 14V)
6/12
TDA2030
PRACTICAL CONSIDERATIONS Printed circuit board The layout shown in Fig. 16 should be adopted by the designers. If different layouts are used, the ground points of input 1 and input 2 must be well decoupled from the ground return of the output in which a high current flows. Assembly suggestion No electrical isolation is needed between the packageand the heatsinkwith single supplyvoltage configuration. Application suggestions The recommended values of the components are those shown on application circuit of fig. 13. Different values can be used. The following table can help the designer.
Component R1 R2 R3 R4
Purpose Closed loop gain setting Closed loop gain setting Non inverting input biasing Frequency stability
Larger than recommended value Increase of gain Decrease of gain (*) Increase of input impedance Danger of osccilat. at high frequencies with induct. loads Poor high frequencies attenuation
Smaller than recommended value Decrease of gain (*) Increase of gain Decrease of input impedance
R5 C1 C2 C3, C4 C5, C6 C7 C8
Upper frequency cutoff Input DC decoupling Inverting DC decoupling Supply voltage bypass Supply voltage bypass Frequency stability Upper frequency cutoff
Danger of oscillation Increase of low frequencies cutoff Increase of low frequencies cutoff Danger of oscillation Danger of oscillation Danger of oscillation
Smaller bandwidth
Larger bandwidth
D1, D2
7/12
TDA2030
SINGLE SUPPLY APPLICATION
Component R1 R2 R3 R4 Recomm. value 150 k 4.7 k 100 k 1 Purpose Closed loop gain setting Closed loop gain setting Non inverting input biasing Frequency stability Larger than recommended value Increase of gain Decrease of gain (*) Increase of input impedance Danger of osccilat. at high frequencies with induct. loads Power Consumption Increase of low frequencies cutoff Increase of low frequencies cutoff Danger of oscillation Danger of oscillation Danger of oscillation Smaller bandwidth Larger bandwidth Smaller than recommended value Decrease of gain (*) Increase of gain Decrease of input impedance
R A/RB C1 C2 C3 C5 C7 C8
Non inverting input Biasing Input DC decoupling Inverting DC decoupling Supply voltage bypass Supply voltage bypass Frequency stability Upper frequency cutoff
D1, D2
8/12
TDA2030
SHORT CIRCUIT PROTECTION The TDA2030 has an original circuit which limits the current of the output transistors. Fig. 18 shows that the maximum output current is a function of the collector emitter voltage; hence the output transistors work within their safe operating area (Fig. 2). This function can therefore be considered as being peak power limiting rather than simple current limiting. It reduces the possibility that the device gets damaged during an accidental short circuit from AC output to ground.
Figure 19. Safe operating area and collector characteristics of the protected power transistor
THERMAL SHUT-DOWN The presence of a thermal limiting circuit offers the following advantages: 1. An overload on the output (even if it is permanent), or an abovelimit ambient temperaturecan be easily supported since the Tj cannot be higher than 150C. 2. The heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no possibility of device damage due to high junction temperature.If for any reason, the junction temperature increases up to 150C, the thermal shut-down simply reduces the power dissipation at the current consumption. The maximum allowable power dissipation depends upon the size of the external heatsink (i.e. its thermal resistance); fig. 22 shows this dissipable power as a function of ambient temperature for different thermal resistance.
9/12
TDA2030
Figure 20. Output power and d r ai n c u rr e nt vs . c ase temperature (RL = 4) Figure 21. Output power and d r ai n c u rr e n t v s. ca s e temperature (RL = 8) Fi g ur e 22. Max imum allowable power dissipation vs. ambient temperature
Dimension : suggestion. The following table shows the length that the heatsink in fig.23 must have for several values of Ptot and Rth.
Ptot (W) Length of heatsink (mm) Rth of heatsink 12 60 8 40 6 30
( C/W)
4.2
6.2
8.3
10/12
TDA2030
PENTAWATT PACKAGE MECHANICAL DATA
DIM. MIN. A C D D1 E E1 F F1 G G1 H2 H3 L L1 L2 L3 L4 L5 L6 L7 L9 M M1 V4 Dia mm TYP. MAX. 4.8 1.37 2.8 1.35 0.55 1.19 1.05 1.4 3.6 7 10.4 10.4 18.15 15.95 21.6 22.7 1.29 3 15.8 6.6 4.75 4.25 40 (typ.) 3.65 3.85 0.144 0.152 MIN. inch TYP. MAX. 0.189 0.054 0.110 0.053 0.022 0.047 0.041 0.055 0.142 0.276 0.409 0.409 0.715 0.628 0.850 0.894 0.051 0.118 0.622 0.260 0.187 0.167
2.4 1.2 0.35 0.76 0.8 1 3.2 6.6 10.05 17.55 15.55 21.2 22.3 2.6 15.1 6 4.23 3.75
3.4 6.8
0.094 0.047 0.014 0.030 0.031 0.039 0.126 0.260 0.396 0.691 0.612 0.831 0.878 0.102 0.594 0.236 0.167 0.148
0.134 0.268
0.2 4.5 4
L L1 L8 V V1 V R R A B C D1 L5 L2 L3 D R V4 H2
F E
V4
V3 E M1
E1
G G1
V4
L9
11/12
TDA2030
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifi cation mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previous ly supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 1998 STMicroelectronics Printed in Italy All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
12/12
This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.