CHAPTER - 19

THERMAL PROPERTIES
Problems to be practiced : Problems related to thermal stress & strain, heat flux and heat capacity
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ISSUES TO ADDRESS...

How does a material respond to heat? How do we define and measure... --heat capacity --coefficient of thermal expansion --thermal conductivity --thermal shock resistance
How do ceramics, metals, and polymers rank?
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HEAT CAPACITY
General: The ability of a material to absorb

heat.

Quantitative: The energy required to increase the temperature of the material.

heat capacity (J/mol-K)

dQ C= dT

energy input (J/mol) temperature change (K)

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Two ways to measure heat capacity:

-- Cp : Heat capacity at constant pressure. -- Cv : Heat capacity at constant volume.

Heat Capacity Vs Temp

Heat capacity... --increases with temperature --reaches a limiting value of 3R

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Heat capacity, C v
3R gas constant = 8.31 J/mol-K D C v = constant

T (K)
Debye temperature (usually less than T room )

Atomic view:

--Energy is stored as atomic vibrations. --As Temperature goes up, so does the avg. energy of atomic vibration.
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HEAT CAPACITY: COMPARISON

cp (J/kg-K) material at room T Polymers Polypropylene 1925 cp: (J/kg-K) 1850 Polyethylene Cp: (J/mol-K) 1170 Polystyrene 1050 Teflon Ceramics Magnesia (MgO) 940 Alumina (Al2O3) 775 Glass 840 Metals Aluminum Steel Tungsten Gold 900 486 128 138

cp significantly larger for polymers.

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increasing cp

THERMAL EXPANSION

Materials change size when heating.

T L L init T final final init

L final

L initial L initial

= ( T final

T initial

coefficient of thermal expansion (1/K)

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Atomic view:
Mean bond length increases with Temp.
Bond energy
r(T1) r(T5)

increasing T

Bond length (r)

bond energy vs bond length curve is asymmetric

T5 T1

THERMAL EXPANSION: COMPARISON

at room T Polymers 145-180 Polypropylene 106-198 Polyethylene 90-150 Polystyrene 126-216 Teflon Metals Aluminum 23.6 Steel 12 Tungsten 4.5 Gold 14.2 Ceramics Magnesia (MgO) 13.5 Alumina (Al 2O 3) 7.6 Soda-lime glass 9 Silica (cryst. SiO 2) 0.4 Material

(10 -6/K)

Q: Why does generally decrease with increasing bond energy?

increasing

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THERMAL CONDUCTIVITY
General: The ability of a material to transfer heat. Quantitative: temperature dT gradient q = k heat flux dx
(J/m2-s) thermal conductivity (J/m-K-s)

T1 x1
heat flux

T2 > T 1 x2

Atomic view: Atomic vibrations in hotter region carry

energy (vibrations) to cooler regions.

K = Kl+Ke

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THERMAL CONDUCTIVITY: COMPARISON

Material
Metals
Aluminum Steel Tungsten Gold

k (W/m-K)
247 52 178 315

Energy Transfer
By vibration of atoms and motion of electrons By vibration of atoms

increasing k

Ceramics
Magnesia (MgO) 38 Alumina (Al 2O3) 39 1.7 Soda-lime glass Silica (cryst. SiO 2) 1.4

Polymers
Polypropylene Polyethylene Polystyrene Teflon

0.12 By vibration/ 0.46-0.50 rotation of chain 0.13 molecules 0.25

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THERMAL STRESS

Occurs due to: --uneven heating/cooling --mismatch in thermal expansion.

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 Example Problem 19.1, p. 666, Callister 6e. --A brass rod is stress-free at room temperature (20C). --It is heated up, but prevented from lengthening. --At what T does the stress reach -172MPa?
T room Lroom

L T

L L room

= thermal = (T Troom )
100GPa 20 x 10-6 /C

= E( thermal ) = E (T Troom ) compressive keeps L = 0

-172MPa

Answer: 106C

20C

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THERMAL SHOCK RESISTANCE

Occurs due to: uneven heating/cooling.

Ex: Assume top thin layer is rapidly cooled from T1 to T2:

rapid quench

tries to contract during cooling doesnt want to contract

T2 T1

Tension develops at surface

= E ( T1 T2 )
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Thermal shock can be prevented by: Reducing the thermal gradient by

changing its temperature more slowly increasing the material's thermal conductivity

Reducing the material's coefficient of thermal expansion Increasing its strength Increasing its toughness

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Temperature difference that can be produced by cooling:

Critical temperature difference for fracture (set = f)

quench rate (T1 T2 ) = k

set equal

f (T1 T2 ) fracture = E

Result:
(quench

rate ) for fracture

fk E
f k is E

Large thermal shock resistance when

large.
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THERMAL PROTECTION SYSTEM

Application:
Space Shuttle Orbiter

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Re-entry T Distribution

reinf C-C silica tiles nylon felt, silicon rubber (1650C) (400-1260C) coating (400C)

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Silica tiles (400-1260C): --large scale application

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--

microstructure:

100 m
~90%

porosity Si fibers bonded to one another during heat treatment.

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SUMMARY
A material responds to heat by: --increased vibrational energy --redistribution of this energy to achieve thermal equilibrium. Heat capacity: --energy required to increase a unit mass by a unit Temp. --polymers have the largest values.
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Coefficient of thermal expansion: --the stress-free strain induced by heating by a unit Temp. --polymers have the largest values. Thermal conductivity: --the ability of a material to transfer heat. --metals have the largest values.

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Thermal shock resistance: --the ability of a material to be rapidly cooled and not crack. f k Maximize E

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