Features
Pb-Free Plus Anneal Available as an Option (RoHS Compliant) (See Ordering Info) 15kV ESD Protected (Human Body Model) Drop in Replacements for MAX3221, MAX3222, MAX3223, MAX3232, MAX3241, MAX3243, SP3243 ICL3221 is Low Power, Pin Compatible Upgrade for 5V MAX221 ICL3222 is Low Power, Pin Compatible Upgrade for 5V MAX242, and SP312A ICL3232 is Low Power Upgrade for HIN232/ICL232 and Pin Compatible Competitor Devices RS-232 Compatible with VCC = 2.7V Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V Latch-Up Free On-Chip Voltage Converters Require Only Four External 0.1F Capacitors Manual and Automatic Powerdown Features (Except ICL3232) Guaranteed Mouse Driveability (ICL324X Only) Receiver Hysteresis For Improved Noise Immunity Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/s Wide Power Supply Range . . . . . . . Single +3V to +5.5V Low Supply Current in Powerdown State. . . . . . . . . . .1A
Applications
Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - Digital Cameras - Cellular/Mobile Phones
TABLE 1. SUMMARY OF FEATURES NO. OF NO. OF PART NUMBER Tx. Rx. ICL3221 ICL3222 ICL3223 ICL3232 ICL3241 ICL3243 1 2 2 2 3 3 1 2 2 2 5 5 NO. OF MONITOR Rx. (ROUTB) 0 0 0 0 2 1 DATA RATE (kbps) 250 250 250 250 250 250 Rx. ENABLE FUNCTION? Yes Yes Yes No Yes No READY OUTPUT? No No No No No No MANUAL POWERDOWN? Yes Yes Yes No Yes Yes AUTOMATIC POWERDOWN FUNCTION? Yes No Yes No No Yes
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 1999-2006. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
*Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTES: 1. Most surface mount devices are available on tape and reel; add -T to suffix. 2. Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
EN 1 C1+ 2 V+ 3
C2+ 4 C2- 5 V6
R1IN 4 R2IN 5 R3IN 6 R4IN 7 R5IN 8 T1OUT 9 T2OUT 10 T3OUT 11 T3IN 12 T2IN 13 T1IN 14
T2OUT 7 R2IN 8
R1IN 4 R2IN 5 R3IN 6 R4IN 7 R5IN 8 T1OUT 9 T2OUT 10 T3OUT 11 T3IN 12 T2IN 13 T1IN 14
Pin Descriptions
PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT ROUTB INVALID EN SHDN System power supply input (3.0V to 5.5V). Internally generated positive transmitter supply (+5.5V). Internally generated negative transmitter supply (-5.5V). Ground connection. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. TTL/CMOS compatible transmitter Inputs. RS-232 level (nominally 5.5V) transmitter outputs. RS-232 compatible receiver inputs. TTL/CMOS level receiver outputs. TTL/CMOS level, noninverting, always enabled receiver outputs. Active low output that indicates if no valid RS-232 levels are present on any receiver input. Active low receiver enable control; doesnt disable ROUTB outputs. Active low input to shut down transmitters and on-board power supply, to place device in low power mode. FUNCTION
FORCEOFF Active low to shut down transmitters and on-chip power supply. This overrides any automatic circuitry and FORCEON (See Table 2). FORCEON Active high input to override automatic powerdown circuitry thereby keeping transmitters active. (FORCEOFF must be high).
ICL3222
C3 (OPTIONAL CONNECTION, NOTE) + 17 VCC 3 V+ 7 + + C3 0.1F C4 0.1F T1OUT T2OUT RS-232 LEVELS RS-232 LEVELS 14 R1 R2OUT 10 1 EN R2 5k 18 5k 9 R2IN R1IN GND 16 SHDN VCC
2 + 4
V- 7 13
T1IN R1OUT
16 10
R1OUT
13
ICL3223
+3.3V + 0.1F 2 + 4 5 + 6 13 12 C1+ C1C2+ C2T1 T2 19 VCC V+ 3 + C3 0.1F C4 0.1F + T1OUT T1IN RS-232 LEVELS T2OUT TTL/CMOS LOGIC LEVELS T2IN +3.3V
ICL3232
C3 (OPTIONAL CONNECTION, NOTE) + 16 VCC V+ 2 + C3 0.1F C4 0.1F + T1OUT T2OUT VT1 T2 6 14 7 13 R1 R2OUT VCC TO POWER CONTROL LOGIC 9 R2 GND 15 5k 5k 8 R2IN R1IN + 0.1F 1 + + 3 4 5 11 10 C1+ C1C2+ C2-
C1 0.1F C2 0.1F
V- 7 17 8
C1 0.1F C2 0.1F
R1OUT
15 R1 5k
16
R1IN
R2OUT
10 1 EN R2 5k
R1OUT
12
R2IN
20 11
(Continued) ICL3243
26 VCC 27 V+ 3 + C3 0.1F
C1 0.1F C2 0.1F
C1 0.1F C2 0.1F
24 1 2 14
VT1 T2 T3
3 9 10 11
VT1
T1IN
T2IN T3IN
13 12
T2
10 11
T2OUT T3OUT
T3
20
R2OUT
VCC
22 21
VCC
SHDN
GND 25
Thermal Information
Thermal Resistance (Typical, Note 3)
JA (C/W)
Operating Conditions
Temperature Range ICL32XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C ICL32XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40C to 85C
16 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . 90 18 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . 80 20 Ld PDIP Package* . . . . . . . . . . . . . . . . . . . . . . . 77 16 Ld Wide SOIC Package . . . . . . . . . . . . . . . . . . . 100 16 Ld Narrow SOIC Package. . . . . . . . . . . . . . . . . . 115 18 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 16 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135 20 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 122 16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 145 20 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . . 140 28 Ld SSOP and TSSOP Packages . . . . . . . . . . . . 100 Maximum Junction Temperature (Plastic Package) . . . . . . . 150C Maximum Storage Temperature Range . . . . . . . . . . . -65C to 150C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300C (SOIC, SSOP, TSSOP - Lead Tips Only) *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 3. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1F; Unless Otherwise Specified. Typicals are at TA = 25C TEST CONDITIONS TEMP (C) MIN TYP MAX UNITS
PARAMETER DC CHARACTERISTICS Supply Current, Automatic Powerdown Supply Current, Powerdown Supply Current, Automatic Powerdown Disabled
All RIN Open, FORCEON = GND, FORCEOFF = VCC (ICL3221, ICL3223, ICL3243 Only) FORCEOFF = SHDN = GND (Except ICL3232) All Outputs Unloaded, FORCEON = FORCEOFF = SHDN = VCC VCC = 3.15V, ICL3221-32 VCC = 3.0V, ICL3241-43
25 25 25 25
10 10 1.0 1.0
A A mA mA
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low Input Logic Threshold High TIN, FORCEON, FORCEOFF, EN, SHDN TIN, FORCEON, FORCEOFF, EN, VCC = 3.3V SHDN VCC = 5.0V TIN, FORCEON, FORCEOFF, EN, SHDN FORCEOFF = GND or EN = VCC IOUT = 1.6mA IOUT = -1.0mA ICL32XX Powers Up (See Figure 6) ICL32XX Powers Down (See Figure 6) IOUT = 1.6mA IOUT = -1.0mA Full Full Full Full Full Full Full 2.0 2.4 0.01 0.05 0.8 1.0 10 0.4 V V V A A V V
Input Leakage Current Output Leakage Current (Except ICL3232) Output Voltage Low Output Voltage High
AUTOMATIC POWERDOWN (ICL3221, ICL3223, ICL3243 Only, FORCEON = GND, FORCEOFF = VCC) Receiver Input Thresholds to Enable Transmitters Receiver Input Thresholds to Disable Transmitters INVALID Output Voltage Low INVALID Output Voltage High Full Full Full Full 2.7 0.3 0.4 V V V V
PARAMETER Receiver Threshold to Transmitters Enabled Delay (tWU) Receiver Positive or Negative Threshold to INVALID High Delay (tINVH) Receiver Positive or Negative Threshold to INVALID Low Delay (tINVL) RECEIVER INPUTS Input Voltage Range Input Threshold Low VCC = 3.3V VCC = 5.0V Input Threshold High VCC = 3.3V VCC = 5.0V Input Hysteresis Input Resistance TRANSMITTER OUTPUTS Output Voltage Swing Output Resistance Output Short-Circuit Current Output Leakage Current
25
30
Full 25 25 25 25 25 25
25 2.4 2.4 7
V V V V V V k
All Transmitter Outputs Loaded with 3k to Ground VCC = V+ = V- = 0V, Transmitter Output = 2V VOUT = 12V, VCC = 0V or 3V to 5.5V Automatic Powerdown or FORCEOFF = SHDN = GND
5.0 300 -
5.4 10M 35 -
60 25
V mA A
MOUSE DRIVEABILITY (ICL324X Only) Transmitter Output Voltage (See Figure 9) TIMING CHARACTERISTICS Maximum Data Rate Receiver Propagation Delay RL = 3k, CL = 1000pF, One Transmitter Switching Receiver Input to Receiver Output, CL = 150pF tPHL tPLH Full 25 25 25 25 Full Full CL = 200pF to 2500pF CL = 200pF to 1000pF 25 25 250 4 6 500 0.3 0.3 200 200 200 100 8.0 1000 500 30 30 kbps s s ns ns ns ns V/s V/s T1IN = T2IN = GND, T3IN = VCC, T3OUT Loaded with 3k to GND, T1OUT and T2OUT Loaded with 2.5mA Each Full 5 V
Receiver Output Enable Time Receiver Output Disable Time Transmitter Skew Receiver Skew Transition Region Slew Rate
Normal Operation (Except ICL3232) Normal Operation (Except ICL3232) tPHL - tPLH tPHL - tPLH VCC = 3.3V, RL = 3k to 7k, Measured From 3V to -3V or -3V to 3V
ESD PERFORMANCE RS-232 Pins (TOUT, RIN) Human Body Model ICL3221 - ICL3243 25 25 25 25 25 15 8 8 6 2 kV kV kV kV kV
IEC61000-4-2 Contact Discharge ICL3221 - ICL3243 IEC61000-4-2 Air Gap Discharge ICL3221 - ICL3232 ICL3241 - ICL3243 All Other Pins Human Body Model ICL3221 - ICL3243
Charge-Pump
Intersils new ICL32XX family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the 10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1F capacitors for the voltage doubler and inverter functions at VCC = 3.3V. See the Capacitor Selection section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings.
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip 5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. Except for the ICL3232, all transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (See Table 2). These outputs may be driven to 12V when disabled. All devices guarantee a 250kbps data rate for full load conditions (3k and 1000pF), VCC 3.0V, with one transmitter operating at full speed. Under more typical conditions of VCC 3.3V, RL = 3k, and CL = 250pF, one transmitter easily operates at 900kbps. Transmitter inputs float if left unconnected, and may cause ICC increases. Connect unused inputs to GND for the best performance.
Receivers
All the ICL32XX devices contain standard inverting receivers that three-state (except for the ICL3232) via the EN or FORCEOFF control lines. Additionally, the two ICL324X products include noninverting (monitor) receivers (denoted by the ROUTB label) that are always active, regardless of the state of any control lines. All the receivers convert RS-232 signals to CMOS output levels and accept inputs up to 25V while presenting the required 3k to 7k input impedance (See Figure 1) even if the power is off (VCC = 0V). The receivers Schmitt trigger input stage uses hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. 10
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE RS-232 SIGNAL PRESENT AT RECEIVER INPUT?
FORCEOFF (NOTE 4) ROUTB OR SHDN FORCEON EN TRANSMITTER RECEIVER INVALID INPUT INPUT INPUT OUTPUTS OUTPUTS OUTPUTS OUTPUT
MODE OF OPERATION
ICL3222, ICL3241 N.A. N.A. N.A. N.A. ICL3221, ICL3223 No No Yes Yes No No Yes Yes No No ICL3243 No Yes No Yes No NOTE: 4. Applies only to the ICL3241 and ICL3243. H H H L L H L L X X N.A. N.A. N.A. N.A. N.A. Active Active High-Z High-Z High-Z Active Active Active High-Z High-Z Active Active Active Active Active L H L H L Normal Operation (Auto Powerdown Disabled) Normal Operation (Auto Powerdown Enabled) Powerdown Due to Auto Powerdown Logic Manual Powerdown Manual Powerdown H H H H H H L L L L H H L L L L X X X X L H L H L H L H L H Active Active Active Active High-Z High-Z High-Z High-Z High-Z High-Z Active High-Z Active High-Z Active High-Z Active High-Z Active High-Z N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. N.A. L L H H L L H H L L Normal Operation (Auto Powerdown Disabled) Normal Operation (Auto Powerdown Enabled) Powerdown Due to Auto Powerdown Logic Manual Powerdown Manual Powerdown w/Rcvr. Disabled Manual Powerdown Manual Powerdown w/Rcvr. Disabled L L H H N.A. N.A. N.A. N.A. L H L H High-Z High-Z Active Active Active High-Z Active High-Z Active Active Active Active N.A. N.A. N.A. N.A. Manual Powerdown Manual Powerdown w/Rcvr. Disabled Normal Operation Normal Operation w/Rcvr. Disabled
11
FIGURE 4. CONNECTIONS FOR MANUAL POWERDOWN WHEN NO VALID RECEIVER SIGNALS ARE PRESENT
VCC
With any of the above control schemes, the time required to exit powerdown, and resume transmission is only 100s. A mouse, or other application, may need more time to wake up from shutdown. If automatic powerdown is being utilized, the RS-232 device will reenter powerdown if valid receiver levels arent reestablished within 30s of the ICL32XX powering up. Figure 5 illustrates a circuit that keeps the ICL32XX from initiating automatic powerdown for 100ms after powering up. This gives the slow-to-wake peripheral circuit time to reestablish valid RS-232 output levels.
FORCEOFF
FORCEON
ICL3221/23/43
FIGURE 5. CIRCUIT TO PREVENT AUTO POWERDOWN FOR 100ms AFTER FORCED POWERUP
12
2.7V
(standard) receiver outputs placing them in a high impedance state. This is useful to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of a powered down (VCC = GND) peripheral (See Figure 2). The enable input has no effect on transmitter nor monitor (ROUTB) outputs.
Capacitor Selection
The charge pumps require 0.1F capacitors for 3.3V operation. For other supply voltages refer to Table 3 for capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without increasing C1s value, however, do not increase C1 without also increasing C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors). When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitors equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
TABLE 3. REQUIRED CAPACITOR VALUES VCC (V) 3.0 to 3.6 4.5 to 5.5 3.0 to 5.5 C1 (F) 0.1 0.047 0.1 C2, C3, C4 (F) 0.1 0.33 0.47
Automatic powerdown operates when the FORCEON input is low, and the FORCEOFF input is high. Tying FORCEON high disables automatic powerdown, but manual powerdown is always available via the overriding FORCEOFF input. Table 2 summarizes the automatic powerdown functionality. Devices with the automatic powerdown feature include an INVALID output signal, which switches low to indicate that invalid levels have persisted on all of the receiver inputs for more than 30s (See Figure 7). INVALID switches high 1s after detecting a valid RS-232 level on a receiver input. INVALID operates in all modes (forced or automatic powerdown, or forced on), so it is also useful for systems employing manual powerdown circuitry. When automatic powerdown is utilized, INVALID = 0 indicates that the ICL32XX is in powerdown mode.
RECEIVER INPUTS TRANSMITTER OUTPUTS VCC 0 V+ VCC 0 VINVALID } REGION
INVALID OUTPUT
tINVL AUTOPWDN
tINVH PWR UP
13
5V/DIV
FORCEOFF T1
C4 +
Mouse Driveability
The ICL324X have been specifically designed to power a serial mouse while operating from low voltage supplies. Figure 9 shows the transmitter output voltages under increasing load current. The on-chip switching regulator ensures the transmitters will supply at least 5V during worst case conditions (15mA for paralleled V+ transmitters, 7.3mA for single V- transmitter). The Automatic Powerdown feature does not work with a mouse, so FORCEOFF and FORCEON should be connected to VCC.
6 TRANSMITTER OUTPUT VOLTAGE (V) 5 4 3 2 1 0 -1 -2 -3 -4 -5 -6 0 1 2 3 4 5 6 7 8 9 10 5V/DIV. T1IN VCC VCC = 3.0V T1 VOUT+ T2 ICL3241/43 T3 VOUT VOUT VOUT+
5V/DIV T1IN
T1OUT
FIGURE 9. TRANSMITTER OUTPUT VOLTAGE vs LOAD CURRENT (PER TRANSMITTER, i.e., DOUBLE CURRENT AXIS FOR TOTAL VOUT+ CURRENT)
T1OUT
14
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Interconnection with 3V and 5V Logic
The ICL32XX directly interface with 5V CMOS and TTL logic families. Nevertheless, with the ICL32XX at 3.3V, and the logic supply at 5V, AC, HC, and CD4000 outputs can drive ICL32XX inputs, but ICL32XX outputs do not reach the minimum VIH for these logic families. See Table 4 for more information.
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES VCC SYSTEM POWER-SUPPLY SUPPLY VOLTAGE VOLTAGE (V) (V) 3.3 5 5 3.3 5 3.3
COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. Compatible with ACT and HCT CMOS, and with TTL. ICL32XX outputs are incompatible with AC, HC, and CD4000 CMOS inputs.
15 -SLEW +SLEW 10
1000
2000
3000
4000
5000
1000
2000
3000
4000
5000
45 40 SUPPLY CURRENT (mA) 35 30 25 20 15 10 5 0 0 1000 2000 3000 4000 5000 20kbps 120kbps ICL3221 SUPPLY CURRENT (mA)
45 40 250kbps 35 30 25 20 15 10 5 0 0 1000 2000 3000 4000 5000 20kbps 120kbps ICL3222 - ICL3232 250kbps
15
3.5 ICL324X 250kbps SUPPLY CURRENT (mA) 3.0 ICL3221 - ICL3232 2.5 2.0 1.5 1.0 0.5 ICL324X 0 2.5 3.0 3.5 4.0 4.5
ICL324X
5.0
5.5
6.0
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: ICL3221: 286 ICL3222: 338 ICL3223: 357 ICL3232: 296 ICL324X: 464 PROCESS: Si Gate CMOS
16
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 1 2 3 N/2
MILLIMETERS MIN 0.39 2.93 0.356 1.15 0.204 18.66 0.13 7.62 6.10 MAX 5.33 4.95 0.558 1.77 0.355 19.68 8.25 7.11 NOTES 4 4 8, 10 5 5 6 5 6 7 4 9 Rev. 0 12/93
MIN 0.015 0.115 0.014 0.045 0.008 0.735 0.005 0.300 0.240
A
E A2 L A C L
A1 A2
-C-
B B1 C D D1 E
eA eC
C
C A B S
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
E1 e eA eB L N
17
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Dual-In-Line Plastic Packages (PDIP)
N INDEX AREA E1 1 2 3 N/2 -B-AD BASE PLANE SEATING PLANE D1 B1 B 0.010 (0.25) M D1 -CA2 L A1 A C L E
eA eC
C
C A B S
eB
NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3 may have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
2.93
18
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Small Outline Plastic Packages (SOIC)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45 0.25(0.010) M B M
MILLIMETERS MIN 1.35 0.10 0.33 0.19 9.80 3.80 5.80 0.25 0.40 16 8 0 8 MAX 1.75 0.25 0.51 0.25 10.00 4.00 6.20 0.50 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05
MIN 0.0532 0.0040 0.013 0.0075 0.3859 0.1497 0.2284 0.0099 0.016 16 0
MAX 0.0688 0.0098 0.020 0.0098 0.3937 0.1574 0.2440 0.0196 0.050
A1 B C D E e H
C
A1 0.10(0.004)
0.050 BSC
1.27 BSC
e
B 0.25(0.010) M C A M B S
h L N
NOTES: 1. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width B, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
19
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Thin Shrink Small Outline Plastic Packages (TSSOP)
N INDEX AREA E E1 -B1 2 3 0.05(0.002) -AD -CSEATING PLANE A 0.25 0.010 L 0.25(0.010) M GAUGE PLANE B M
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c D E1
A2 c 0.10(0.004) C A M B S
MILLIMETERS MIN 0.05 0.85 0.19 0.09 4.90 4.30 MAX 1.10 0.15 0.95 0.30 0.20 5.10 4.50 NOTES 9 3 4 6 7 8o Rev. 1 2/02
e
b 0.10(0.004) M
A1
e E L N
NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AB, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension E1 does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of b dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
20
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Small Outline Plastic Packages (SSOP)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA 0.25 0.010 L GAUGE PLANE 0.25(0.010) M B M
MILLIMETERS MIN 0.05 1.65 0.22 0.09 5.90 5.00 7.40 0.55 16 8 0 8 Rev. 3 MAX 2.00 1.85 0.38 0.25 6.50 5.60 8.20 0.95 NOTES 9 3 4 6 7 6/05
A1
e
B 0.25(0.010) M
e H L N
0.026 BSC
0.65 BSC
NOTES: 1. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension B does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of B dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
21
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Small Outline Plastic Packages (SOIC)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45 0.25(0.010) M B M
MILLIMETERS MIN 2.35 0.10 0.33 0.23 10.10 7.40 10.00 0.25 0.40 16 8 0 8 MAX 2.65 0.30 0.51 0.32 10.50 7.60 10.65 0.75 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05
MIN 0.0926 0.0040 0.013 0.0091 0.3977 0.2914 0.394 0.010 0.016 16 0
MAX 0.1043 0.0118 0.0200 0.0125 0.4133 0.2992 0.419 0.029 0.050
A1 B C D E e H
C
A1 0.10(0.004)
0.050 BSC
1.27 BSC
e
B 0.25(0.010) M C A M B S
h L N
NOTES: 1. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width B, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
22
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Small Outline Plastic Packages (SOIC)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA h x 45 0.25(0.010) M B M
MILLIMETERS MIN 2.35 0.10 0.33 0.23 11.35 7.40 10.00 0.25 0.40 18 8 0 8 MAX 2.65 0.30 0.51 0.32 11.75 7.60 10.65 0.75 1.27 NOTES 9 3 4 5 6 7 Rev. 1 6/05
MIN 0.0926 0.0040 0.013 0.0091 0.4469 0.2914 0.394 0.010 0.016 18 0
MAX 0.1043 0.0118 0.0200 0.0125 0.4625 0.2992 0.419 0.029 0.050
A1 B C D E e H
C
A1 0.10(0.004)
0.050 BSC
1.27 BSC
e
B 0.25(0.010) M C A M B S
h L N
NOTES: 1. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width B, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
23
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Thin Shrink Small Outline Plastic Packages (TSSOP)
N INDEX AREA E E1 -B1 2 3 L 0.05(0.002) -AD -CSEATING PLANE A 0.25 0.010 GAUGE PLANE 0.25(0.010) M B M
M20.173
20 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c D MIN 0.002 0.031 0.0075 0.0035 0.252 0.169 MAX 0.047 0.006 0.051 0.0118 0.0079 0.260 0.177 MILLIMETERS MIN 0.05 0.80 0.19 0.09 6.40 4.30 MAX 1.20 0.15 1.05 0.30 0.20 6.60 4.50 NOTES 9 3 4 6 7 8o Rev. 1 6/98
A1 0.10(0.004) A2 c
e
b 0.10(0.004) M C A M B S
E1 e E L N
NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AC, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension E1 does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of b dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
24
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA 0.25 0.010 L 0.25(0.010) M GAUGE PLANE B M
MILLIMETERS MIN 1.73 0.05 1.68 0.25 0.09 7.07 5.20 MAX 1.99 0.21 1.78 0.38 0.20 7.33 5.38 3 4 9 NOTES
e
B 0.25(0.010) M
A1
e H L N
0.65 BSC 7.65 0.63 20 0 deg. 8 deg. Rev. 3 11/02 7.90 0.95 6 7
NOTES: 1. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension B does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of B dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
25
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Thin Shrink Small Outline Plastic Packages (TSSOP)
N INDEX AREA E E1 -B1 2 3 0.05(0.002) -AD -CSEATING PLANE A 0.25 0.010 L 0.25(0.010) M GAUGE PLANE B M
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 b c D MIN 0.002 0.031 0.0075 0.0035 0.378 0.169 MAX 0.047 0.006 0.051 0.0118 0.0079 0.386 0.177 MILLIMETERS MIN 0.05 0.80 0.19 0.09 9.60 4.30 MAX 1.20 0.15 1.05 0.30 0.20 9.80 4.50 NOTES 9 3 4 6 7 8o Rev. 0 6/98
e
b 0.10(0.004) M C A M B S
A1 0.10(0.004)
A2 c
E1 e E L N
NOTES: 1. These package dimensions are within allowable dimensions of JEDEC MO-153-AE, Issue E. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension E1 does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of b dimension at maximum material condition. Minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
26
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA H E -B1 2 3 SEATING PLANE -AD -CA 0.25 0.010 L GAUGE PLANE 0.25(0.010) M B M
MILLIMETERS MIN 0.05 1.65 0.22 0.09 9.90 5.00 7.40 0.55 28 8 0 8 MAX 2.00 1.85 0.38 0.25 10.50 5.60 8.20 0.95 NOTES 9 3 4 6 7 Rev. 2 6/05
A1
e
B 0.25(0.010) M
e H L N
0.026 BSC
0.65 BSC
NOTES: 1. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension B does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of B dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
27
ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243 Small Outline Plastic Packages (SOIC)
N INDEX AREA E -B1 2 3 SEATING PLANE -AD -CA h x 45o H 0.25(0.010) M B M
MILLIMETERS MIN 2.35 0.10 0.33 0.23 17.70 7.40 MAX 2.65 0.30 0.51 0.32 18.10 7.60 NOTES 9 3 4 5 6 7 8o Rev. 0 12/93
B C D E
A1 0.10(0.004) C
e H h L N
e
B 0.25(0.010) M C A M B S
NOTES: 1. Symbols are defined in the MO Series Symbol List in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension E does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. L is the length of terminal for soldering to a substrate. 7. N is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width B, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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FN4805.21 March 1, 2006