EXPERIMENT 2 Aim :- Soldering and desoldering of electronics component on PCB.

Apparatus required:-Solder, Flux, soldering Iron, PCB Theory:Solder :- Solder is a fusible metal alloy used to join together metal workpieces and having a melting point below that of the work pieces. The alloy used for soldering consist of tin(Sn) and lead(Pb). Melting point of this alloy depends on the fraction of Sn, Pb.melting of of some commonly used composition of Sn and Pb is given below

Fig 2.1 Solder

Sn/Pb 63/37 :-melts at 1830C(361.40F) (eutectic:-the point,instead of over a range) only mixture that melts at a

60/40 :-melting point ranges from 183-2900C

FLUX

:- In high-temperature metal joining processes (welding, brazing and

soldering), the primary purpose of flux is to prevent oxidation of the base and filler materials. Tin-lead solder (e.g.) attaches very well to copper, but poorly to the various oxides of copper, which form quickly at soldering temperatures. Flux is a substance which is nearly inert at room temperature, but which becomes strongly reducing at elevated temperatures, preventing the formation of metal oxides. Additionally, flux allows solder to flow easily on the working piece rather than forming beads as it would otherwise. The role of a flux in joining processes is typically dual: dissolving of the oxides on the metal surface, which facilitates wetting by molten metal, and acting as an oxygen barrier by coating the hot surface, preventing its oxidation. In some applications molten flux also serves as a heat transfer medium, facilitating heating of the joint by the soldering tool or molten solder. Fluxes for soft soldering are typically of organic nature, though inorganic fluxes, usually based on halogenides and/or acids, are also used in non-electronics applications. Fluxes for brazing operate at significantly higher temperatures and are therefore mostly inorganic; the organic compounds tend to be of supplementary nature.

Fig 2.2 Soldering flux

Desoldering:-In electronics, desoldering is the removal of solder and components from a circuit board for troubleshooting, repair, replacement, and salvage. Specialized tools, materials, and techniques have been devised to aid in the desoldering process. For desoldering we heat the solder upto melting temperature and then use desoldering pump.

Fig 2.3 Desoldering

A desoldering

pump, colloquially known as a solder sucker, is a manually-

operated device which is used to remove solder from a printed circuit board. There are two types: the plunger style and bulb style. (An electrically-operated pump for this purpose would usually be called a vacuum pump.) The plunger type has a cylinder with a spring-loaded piston which is pushed down and locks into place. When triggered by pressing a button, the piston springs up, creating suction that sucks the solder off the soldered connection. The bulb type creates suction by squeezing and releasing a rubber bulb. The pump is applied to a heated solder connection, then operated to suck the solder away

Preacautions :1 Never touch the element or tip of the soldering iron. It is very hot (about 400C) and will burn

Hold wires to be heated with tweezers, pliers or clamps to avoid receiving

burns from objects that are heated.

3 Turn unit off or unplug the iron when not in use .

always return the soldering iron to its stand when not in use. Never put it down

on your workbench.

Result and conclusion :- write in your own words.