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TABLE OF CONTENTS
1. ANTENNA DESCRIPTION ______________________________________________________ 3 2. QUICK REFERENCE GUIDE _____________________________________________________ 3 3. ELECTRICAL PERFORMANCE ___________________________________________________ 4 3.1. TVNow EVALUATION BOARD ________________________________________________ 4 3.2. RADIATION PATTERN AND GAIN _____________________________________________ 5 3.3. CAPABILITIES AND MEASUREMENT SYSTEMS ___________________________________ 6 4. MECHANICAL CHARACTERISTICS _______________________________________________ 7 4.1. DIMENSIONS AND TOLERANCES _____________________________________________ 7 4.2. SPECIFICATIONS FOR INK __________________________________________________ 7 5. ASSEMBLY PROCESS _________________________________________________________ 8 6. ANTENNA FOOTPRINT (as used in the evaluation board) ____________________________ 10
Any update on new patents linked to this product will appear in http://www.fractus.com/index.php/fractus/patents All information contained within this document is property of Fractus and is subject to change without prior notice. Information is provided as is and without warranties. It is prohibited to copy or reproduce this information without prior approval. Fractus is an ISO 9001:2008 certified company. All our antennas are lead-free and RoHS compliant.
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1. ANTENNA DESCRIPTION
The TVNowTM is an off-the-shelf internal antenna solution specifically designed for DVB-H applications, covering UHF and L-band requirements. TVNow minimises your product development cost and time. It combines small size and high performance making TVNow an optimal choice for your portable DVB-H applications.
5.0 mm 40.0 mm
4.8 mm
TOP
BOTTOM
APPLICATIONS Mobile phones Personal Media Player (PMP) Ultra Mobile PC (UMPC) Secure Digital (SD) cards
BENEFITS Reduced Form Factor Modularity - SMD Superior Performance High Isolation (DVB-H and GSM)
470 698 MHz 1670-1675 MHz >2 dB margin with DVB-H recommendations Omnidirectional 2 dB 1.9 g -40 to 85 C 50 40.0 mm x 5.0 mm x 4.8 mm
Please contact info@fractus.com if you require additional information on antenna integration or optimisation on your PCB.
Table 1 -Technical Features. Measures from the evaluation board (107.0 mm x 42.7 mm x 1.0 mm PCB)
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3. ELECTRICAL PERFORMANCE
3.1. TVNow EVALUATION BOARD
The configuration used in testing the TVNowTM dual band (UHF+Lband) DVB-H antenna is displayed in Figure 1.
Measure
Antenna clearance (white colour)
mm 95.0 42.7
A B
Note: Optimal matching network values may vary depending on the antenna environment. Please, contact info@fractus.com for additional support to integrate the antenna in a specific application.
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TVnow
1 0 -1
Gain (dBi)
TM
performance in L US bands
GAIN
Gain (dBi)
-2 -3 -4 -5 -6 1660
495
520
545
570
595
620
645
670
695
1665
1670
1675
ETSI Specs
1680
1685
Radiation Pattern
3D
330 310
Radiation Pattern
270
0 30 60
310 330
90
270
0 30 60
90
120
120
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0 330
5 0 -5 -10 30
300
60
270
90
120
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4. MECHANICAL CHARACTERISTICS
4.1. DIMENSIONS AND TOLERANCES
C D Note: all antenna pads (feed point and mounting pads) have the same dimensions.
A B
Measure A B
Measure C D
The black hole located on the front of the antenna, provides a visual cue to mounting the antenna. It is located above the feed point of the antenna and is included to decrease possible manufacturing error.
The TVNowTM Dual Band (UHF+Lband) DVB-H antenna is compliant with the directive 2002/95/EC on the restriction of the use of hazardous substances ( RoHS). Please contact your account representative if you require a green certificate (RoHS report.)
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5. ASSEMBLY PROCESS
Figure 3 shows the back and front view of the TVNowTM Dual Band (UHF+Lband) DVB-H antenna , and indicates the location of the feeding point and the mounting pads:
Mounting Pads (2, 3, 4, 5): solder the antenna mounting pads to the soldering pads on the PCB. These pads must NOT be grounded.
1 2 3 4 5
Feed Pad (1): align the feed point with the feeding line on the PCB.
Figure 3 Views of the TVNowTM dual band (UHF+Lband) DVB-H antenna As a surface mount device (SMD), this antenna is compatible with industry standard soldering processes. The basic assembly procedure for this antenna is as follows: 1. Apply a solder paste to the pads of the PCB. Place the antenna on the board. 2. Perform a reflow process according to the temperature profile detailed in Table 3, Figure 5 on page 9. 3. After soldering the antenna to the circuit board, perform a cleaning process to remove any residual flux. Fractus recommends conducting a visual inspection after the cleaning process to verify that all reflux has been removed. The drawing below shows the soldering details obtained after a correct assembly process: Antenna Antenna Solder Paste
Figure 4 - Soldering Details NOTE: Solder paste thickness after the assembly process will depend on the thickness of the soldering stencil mask. A stencil thickness equal to or larger than 127 microns (5 mils) is required.
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The TVNowTM dual band (UHF+Lband) DVB-H antenna should be assembled following either Sn-Pb or Pb-free assembly processes. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follows:
Profile features Avg. Ramp-up Rate (Tsmax to Tp) - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (tsmin to tsmax) - Temperature (TL) - Total Time above TL (t L) - Temperature (Tp) - Time (tp) Rate
Pb-Free Assembly (SnAgCu) 3 C / second (max.) 150 C 200 C 60-180 seconds 217 C 60-150 seconds 260 C 20-40 seconds 6 C/second max. 8 minutes max.
REFLOW
PEAK
RAMP-DOWN
Table 3 Recommended soldering temperatures Next graphic shows temperature profile (grey zone) for the antenna assembly process in reflow ovens.
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Other PCB form factors and configurations may require a different feeding configuration, feeding line dimensions and clearance areas. If you require support for the integration of the antenna in your design, please contact info@fractus.com
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