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Tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes. Resistors do not feature a limited lifetime when operated within the permissible limits. Power rating depends on the max. Temperature at the solder point, the component placement density and the substrate material.
Tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes. Resistors do not feature a limited lifetime when operated within the permissible limits. Power rating depends on the max. Temperature at the solder point, the component placement density and the substrate material.
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Attribution Non-Commercial (BY-NC)
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Tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes. Resistors do not feature a limited lifetime when operated within the permissible limits. Power rating depends on the max. Temperature at the solder point, the component placement density and the substrate material.
Hak Cipta:
Attribution Non-Commercial (BY-NC)
Format Tersedia
Unduh sebagai PDF, TXT atau baca online dari Scribd