Brief Introduction of NB Thermal Design

Thermal/Acoustics Section
William Kao (Ping-Sheng Kao, Ph.D.) April 2006 -- Quanta Confidential --

Outline
Thermal Design Requirements
Product spec Ergonomic Spec

Thermal Design consideration

Air flow evaluation Heat pipe chosen Fin estimate

Other design limitations

Thermal Design Concept

We want to provide the integrated solution for acoustic and thermal problem. And our design objective is to keep our system Cool, Quiet and Comfortable!

Product Spec
Power Budget Spec. Component Core CPU N Bridge S Bridge VGA Ram Device HDD ODD PCMCIA Others Skin @ 35C Base Palm Rest LCD Bazel Keyboard Ambient temperature 35C 2.5W 2.5W spec.=60 degreeC spec.=60 degreeC TYPE Yonah/Merom Calistoga ICH7 ATi M56 DDR2 667 TDP 31W 9W 2.5W 16-18W 3.0W * 2 Remark spec.=100 degreeC spec.=105 degreeC spec.=105 degreeC spec.=105 degreeC spec.=95 degreeC

spec.=60 degreeC spec.=50 degreeC spec.=50 degreeC spec.=50 degreeC

Ergonomics Request

Remote Heat Exchanger

A good remote heat exchanger can achieve high cooling capability with minimize volume utilization Keys to success:

Minimize thermal impedance junction-ambient Maximize airflow and RHE temperature delta (inlet to outlet)
Air Inlet

Ambient

Attachment Block

Air Exhaust Heat Exchanger (HX)

CPU (junction)

j-block

block-heat pipe

Heat Pipe

heat pipe-HX

HX-Ambient

Total j-a

Fan Performance & System Resistance Curve

1. Measure maximum static pressure at 0 cfm flow condition
Static Pressure (m m -Aq)
20.0
P-Q and Fan Speed Curve Fan Speed

8000

16.0

Single Fan with Module System Resistance

12.0

3. Record static pressure at several points between 0 cfm and maximum cfm 4. Measure fan voltage, current, and RPM at all points

8.0 4000

4.0

0.0 0.0 1.0 2.0 3.0 4.0

2000

Flow rate (CFM)

Fan performance curve

Fan Speed (RPM)

2. Measure maximum air flow under free air condition (no static pressure)

6000

Minimum Air Flow to Remove Heat

Q = h(T ) & C P T = V&C P T = m & = air mass flow rate m

= density = 1 . 18 kg / m 3
V& = air volume flow rate C P = specific heat = 1 . 005 1 cfm = 1 ft 3 / min = 4 . 72 10 4 m 3 / s if T = 15 C Q = (1 . 18 )( 4 . 72 10 4 )( 1 . 005 )( 15 ) 1 cfm 8 . 4W / m 2 if T = 15 C

Passive Cooling
Passive heat dissipation from general Notebook skin
Ambient = 35C and notebook size = 305x260x23 mm

30 25 20 15 10 5 0 35 40 45 50 55 60
Reference: Intel yellow book 18188

Skin Temperature (degree C)

Air Flow Evaluation

31+18+7-18=38W
CPU+VGA+NB

4.5 CFM
System airflow requirement

P
System air impedance

Fan P-Q curve Q Actual operating air flow rate 0.7 x fan air flow

Fan flow requirement = 4.5 / 0.7 = 6.4

Fan Selection

Reference: KME fan catalog

Heat Pipe Chosen

Fin Estimate
Q = h Ae T Ae is effective fin area If fin is copper made, t/d should > 1/30

d Fin, thickness = t

Sink base or heat pipe

Effective Fin Area

Reference: Intel yellow book 18188

Stagger Fin (Quanta Patent)

Original flat fin

Stagger fin

Other Design Limitations

HDD keep 2mm gap from top case inner surface Its batter to design air flow through DDR top

Other hot components must be considered for skin (ex: clock

genn, MOS, audio amp )

~ The End ~ Thank You

With any query, you may contact William.Kao@quantatw.com