MODEL : 32LH20R
CAUTION
32LH20R-LA/TA
BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CONTENTS
CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION .................................................................9 TROUBLE SHOOTING ............................................................................14 BLOCK DIAGRAM...................................................................................17 EXPLODED VIEW .................................................................................. 18 SVC. SHEET ...............................................................................................
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer.
1.5 Kohm/10W
When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 *Base on Adjustment standard
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-3-
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500F to 600F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wirebristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500F to 600F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suctiontype solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500F to 600F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
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IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1. Application range
This spec sheet is applied to LCD TV used LP91A chassis.
3. Test method
1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC : CE, IEC
2. Specification
Each part is tested as below without special appointment. 1) Temperature : 255C (779F), CST : 405C 2) Relative Humidity : 6510% 3) Power Voltage : Standard input voltage(100~240V@50/60Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment.
4. Electrical specification
4.1. General Specification
No 1 2 3 4 5 6 7 Item Screen Size Aspect Ratio LCD Module Operating Environment Storage Environment Input Voltage LDC Module (Maker : LGD) Coating 16:9 32 TFT WXGA LCD Temp.: 0 ~ 40 deg Humidity : 0 ~ 85 % Temp.: -20 ~ 60 deg Humidity : 0~ 85 % AC100-240V~, 50/60Hz 150 W HD 32 HD 760 x 450 x 48 0.17025 x 0.51075 12 EEFL 3H Unit : mm Specification 32 wide Color Display Module Measurement Remark Resolution : 1366*768
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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7. RGB
7.1. Analog PC, RGB- DTV NOT SUPPORT No Resolution 1 2 3 4 5 6 7 8 9 640* 350 720* 400 640* 480 800* 600 1024* 768 1280* 768 1360* 768 1280* 1024 1920* 1080 Specification H-freq(kHz) 31.468 31.469 31.469 37.879 48.363 47.776 47.72 63.668 66.587 V-freq(Hz) 70.09 70.09 59.94 60.317 60.004 59.87 59.799 59.895 59.934 Pixel Clock(MHz) 25.17 28.32 25.17 40 65 79.5 84.75 109.00 138.50 EGA DOS VESA( VGA) VESA( SVGA) VESA( XGA) VESA( WXGA) VESA( WXGA) XGA WUXGA(Reduced Blanking) Only FHD Model Only FHD Model Proposed Remark
8. HDMI Input
8.1. PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No 1 2 3 4 5 6 7 8 Resolution 640 x 480 800 x 600 1024 x 768 1280 x 768 1360 x 768 1366 x 768 1280 x 1024 1920 x 1080 H-freq(kHz) 31.469 37.879 48.363 47.776 47.72 47.7 63.595 66.647 V-freq.(Hz) 59.94 60.317 60.004 59.87 59.799 60.00 60.00 59.988 Pixel clock(MHz) 25.17 40.00 65.00 79.5 84.62 84.62 108.875 138.625 Proposed VESA( VGA) VESA( SVGA) VESA( XGA) VESA( WXGA) VESA( WXGA) WXGA SXGA WUXGA Remark
8.2. DTV Mode No Resolution 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 720 x 480 720 x 480 720 x 576 720 x 480 720 x 480 720 x 576 1280 x 720 1280 x 720 1280 x 720 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 1920 x 1080 Specification H-freq(kHz) 15.73 15.75 15.625 31.47 31.5 31.25 44.96 45 37.5 28.125 33.72 33.75 56.25 67.432 67.5 27 33.75 V-freq(Hz) 59.94 60.00 50.00 59.94 60.00 50.00 59.94 60.00 50.00 50.00 59.94 60.00 50.00 59.94 60.00 24.00 30.00 Pixel Clock(MHz) 13.500 13.514 13.500 27 27.027 27 74.176 74.25 74.25 74.25 74.176 74.25 148.5 148.350 148.5 74.25 74.25 SDTV, DVD 480I(525I) SDTV, DVD 480I(525I) SDTV, DVD 576I(625I) 50Hz SDTV 480P SDTV 480P SDTV 576P HDTV 720P HDTV 720P HDTV 720P HDTV 1080I HDTV 1080I HDTV 1080I HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P HDTV 1080P
LGE Internal Use Only
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
-8-
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91A/B/C/D chassis. (2) Download steps 1) Execute ISP Tool program, the main window(Mstar ISP utility Vx.x.x) will be opened 2) Click the Connect button and confirm Dialog Box
2. Specification
1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. 2) Adjustment must be done in the correct order. 3) The adjustment must be performed in the circumstance of 25 5 C of temperature and 6510% of relative humidity if there is no specific designation. 4) The input voltage of the receiver must keep 100~220V, 50/60Hz. 5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software (IC800, Mstar ISP Utility) 1) Using D/L Jig 2) Using USB Memory Stick. (2) Input Tool-Option/Area option. (3) Download the EDID - EDID datas are automatically download when adjusting the Tool Option2 (4) ADC Calibration RGB / Component (4) Check SW Version.
3) Click the Config. button and Change speed I2C Speed setting : 350Khz~400Khz
4) Read and write bin file. Click (1)Read tab, and then load download file(XXXX.bin) by clicking Read.
Filexxx.bin
Fil
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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1
Filexxx.bin
5) Click (2)Auto tab and set as below 6) Click (3)Run. 7) After downloading, you can see the (4)Pass message.
(3). Adjustment method - The input methods are same as other chassis.(Use INSTART Key on the Adjust Remocon.) (If not changed the option, the input menu can differ the model spec.) Refer to Job Expression of each main chassis assy (EBTxxxxxxxx) for Option value Caution : Dont Press IN-STOP key after completing the function inspection.
4.1.2. Using the Memory Stick * USB download : Service Mode 1) Insert the USB memory stick to the ISB port. 2) Automatically detect the SW Version. -> S/W download process is executed automatically. 3) Show the message Copy the file from the Memory
4) After Finished the Download, Automatically DC Off -> On 4.3.2. 2nd Method * Caution : Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not be downloaded well. 1) Press the ADJ key 2) Move to the EDID D/L and Press the right direction key(G) 3) Press the right direction key(G) at Start. 4) After about a few seconds, appear OK, then compele.
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is 0 0 0 0. 5) Select 0. ADC calibration : Component by using D/E (CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear (3) HDMI 2 : 256Bytes
OK
4.4.2. ADC Calibration - RGB (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to RGB mode.. 2) Input the PC 1024x768@60Hz Horizontal Color Bar signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is 0 0 0 0. 5) Select 0. ADC calibration : RGB by using D/E(CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear
OK
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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* LP91A~D Support RS-232C & I2C DDC CommunicationWhite Balance Mode. (1) Enter the adjustment mode of DDC - Set command delay time : 50ms - Enter the DDC adjustment mode at the same time heatrun mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heatrun pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment. - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode) (3) Enter the adjust mode of white balance) - Enter the white balance adjustment mode with aging command (F3, 00, FF) * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD)
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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* CASE First adjust the coordinate far away from the target value(x, y). 1. x, y > target i) Decrease the R, G. 2. x, y < target i) First decrease the B gain, ii) Decrease the one of the others. 3. x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R 4. x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment Coordinate Mode Cool Medium Warm x y Temp 11,000K 9,300K 6,500K uv 0.000 0.000 0.003 0.2760.002 0.2830.002 0.2850.002 0.2930.002 0.3130.002 0.3290.002
To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.)
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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TROUBLESHOOTING
No power (LED indicator off) :
[A] PROCESS
Fail
Fail
Fail
Pass Change IC1002,, Q1003 Fail Check LEDAssy Change LED Assy
Pass
No Raster
[B]: Process
Pass
Fail
Repeat A PROCESS
Fail
Fail
Fail
Change IC802
Fail
Change Module
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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No Raster on PC Signal
Pass Check Input source Cable and Jack Pass Check the Input/Output Of J104 Pass Check the Input/Output Of IC100 Pass Check the Input/Output Of IC800 Pass Repeat [A], & [B] Process Re-soldering or Change the defect part Re-soldering or Change the defect part, Check RGB EDID Data Re-soldering or Change the defect part
Fail
Fail
Fail
No Raster on HDMI Signal Pass Check Input source Cable And Jack Pass Check the Input/Output Of JK301, JK302, JK303 Re-soldering or Change the defect part Re-soldering or Change the defect part
Pass
Fail
Fail
Pass Check the Input/Output Of IC300, IC301, JK302 Re-soldering or Change the defect part Check HDMI EDID Data Re-download HDCP
Pass Check the Input/Output Of IC800 Re-soldering or Change the defect part
Fail
Pass Check the Input/Output Of IC800 Pass Repeat [A], & [B] Process Re-soldering or Change the defect part
Fail
Fail
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
- 15 -
No Raster On AV (Video, S-Video)Signal Pass Check Input source Cable And Jack Pass
Fail
Fail
Pass Pass Check the Input/Output Of IC800 Re-soldering or Change the defect part Check the Input/Output Of IC800 Re-soldering or Change the defect part
Fail
Fail
No Sound
Fail
Pass
Fail
Fail
Change Speaker.
Pass
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
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HDMI1 HDMI2 TX HDMI1_SCL/ _ SDA PC_Aud io _L/ R PC_SCL/ SDA PC_R/ G/ B/ HS/ VS COMP1_Y/ Pb / Pr : 1/ 0. 7Vp p COMP2_Y/ Pb / Pr : 1/0. 7Vp p MNT_OUT RIN COMP1_LIN/ COMP2_LIN/ RIN DDR2( 512MB) EEPROM( 256K) Serial Flas h ( 8MByt e)
TMDS TMDS
RGB_PC
PC_R/ G/ B/ HS/ VS
Pr : 1/ 0. 7Vp p COMP1_Y/ Pb / P
USB Fo r D/ L
OUT_O_TX_A OUT_O_TX_A OUT_O_TX_B OUT_O_TX_B OUT_O_TX_C OUT_O_TX_C OUT_O_TX_CLK OUT_O_TX_C OUT_O_TX_D OUT_O_TX_D OUT_O_TX_E OUT_O_TX_E
USB_DN/ PN
HDMI3
TMDS
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
AV1_VIN MNT_VOUT AV1_LIN/ RIN
COMP1 COMP2
AV1_VIN: 1Vp p
MNT_OUT
MNT_OUT: 1Vp p
AV1
BLOCK DIAGRAM
- 17 MAIN SCALER
MNT_L/ R OUT TU_MAIN SIF TXD / RXD :5V Dig it al AUDIO AMP SUB_SCL / SDA TU_MAIN SIF 232C Driver ST3232C
TV ( RF)
TUNER
OUT_E_TX_A OUT_E_TX_A OUT_E_TX_B OUT_E_TX_B OUT_E_TX_C OUT_E_TX_C OUT_E_TX_CLK OUT_E_TX_CLK OUT_E_TX_D OUT_E_TX_ OUT_E_TX_E OUT_E_TX_
Tx/ Rx : 15Vp p
RS232
R_SPK_OUT L_SPK_OUT
SIDE_V : 1Vp p
EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
400 520
805
540
530
801
804
803
LV1
550
806
200T
802
200
200N
120
300
510
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
320
310
500
900
A2
A10
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9D [WH]1P_CAN 8D [WH]C-LUG_A_1
R114 10K
COMPONENT1
COMP2_L
R118 12K
MNT_OUT
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
D101 30V R104 220K
COMP2_R
R117 12K
9F [YL]2P_CAN
[YL]O-SPRING_B 5J
ADUC30S03010L_AMODIODE
MNT_VOUT
[YL]CONTACT_B 6J
R102 75
CVBS_VIN
SPK_R-_HOTEL
R103 0 HOTEL_OPT
AV1
MNT_LOUT 9H [RD]2P_CAN
5L
D104 30V R111 220K R119 12K
[WH]C-LUG_B
7K
8G [WH]C-LUG_A_2
R115 10K
16V 10uF
C100
CVBS_LIN
MUTE_LINE
[RD]O-SPRING_B
Q100 RT1C3904-T112
POP NOISE
C B E
4H [RD]O-SPRING_A_2
R116 10K D105 30V R112 220K R120 12K
SPK_R+_HOTEL
[RD]CONTACT_B 6L
CVBS_RIN
MNT_ROUT
3H [RD]CONTACT_A_2
AUDIO_R
MUTE_LINE
POP NOISE
Q101 RT1C3904-T112 E
S-VIDEO(China Model)
D107 30V
R122 75
SIDE_C
C-LUG1
S-VIDEO
+3.3V_MULTI_MST
C-LUG2
R123 10K
GND
0-SPRING
S_VIDEO_DET
C-LUG3
C-LUG4
D106 30V
SHIELD
ZD106 SD05
SIDE_Y
R121 75
ZD107 SD05
S-VIDEO
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PC
JK200
KCN-DS-1-0088
C204 0.1uF C206 0.1uF C207 0.1uF
JK202 KCN-DS-1-0089
6630TGA004K
C C A A C AC
+3.3V_MST 1
AC AC
ENKMC2837-T112 D210
ENKMC2837-T112 D211
C203 0.1uF
1 11
RED GREEN_GND R211 75
C1+
ENKMC2837-T112 D212
IC200 ST3232CDR
GND_2
6 2
PC_R DSUB_SDA PC_G
30V
R207 68
6
RED_GND
16 VCC
R202
100
V+
C200 0.1uF
15 GND
7 2 12
GREEN D204 ADUC30S03010L_AMODIODE DDC_DATA
7 3 8
IR_OUT
C1- 3
14 T1OUT
C2+
BLUE_GND
13 R1IN
R203
100
8 3 13
BLUE H_SYNC
R212 75
C201 0.1uF
C2-
12
R1OUT
V- 6
11 T1IN
IR_OUT
4
PC_B
R208 68
ZD200 SD05
R214 4.7K
C213 68pF
PC_HS
9
NC
R213 75
C202 0.1uF
T2OUT
10 T2IN
+3.3V_MST 4 14
GND_1 ZD201 SD05 R215 4.7K V_SYNC
9 5 10
10
SYNC_GND
R2IN 8
9 R2OUT
C211 68pF
PC_VS
R204 4.7K
R205 4.7K
UB01123-4HHS-4F
KJA-UB-4-0004
USB_DP
3
5 4
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5
DDC_GND
15
RXD TXD
16
SHILED
DSUB_SCL
SIDE AV
JK201
PPJ218-01
PC SOUND JK203
SIDE_V
R227 75
4A[YL]O_SPRING
3 6A 7A
R224 D206 30V R226
12K
READY
5A[YL]CONTACT
5.6B ZD202
PC_AUD_R
R233 10K D202 30V CDS3C30GTH R231 220K R235 12K
5.6B ZD203
2A[YL]U_CAN
10K R223 220K
3B[WH]C_LUG
SIDE_LIN
2B[WH]U_CAN
R225 D205 30V
READY
PC_AUD_L
R234 10K R236 12K D203 30V CDS3C30GTH R232 220K
4C[RD]O_SPRING
10K R228 12K R222 220K
SIDE_RIN
5C[RD]CONTACT
2C[RD]U_CAN
Close to SIDE_USB
USB
+5V_USB
OCP_READY C AC A Pin to Pin with EAN43439401 KDS226 D213 REAR_USB JK205
L201 500
0 R237 Non_OCP
C214
100uF 16V
PC EDID
IC201 CAT24C02WI-GT3
A0 VCC 1 A1 8
+5VST_MST
C212
220uF 16V
C210 10uF 6.3V R238 510 OCP_READY L200 120OHM OCP_READY C208 0.1uF OCP_READY
R219 4.7K
READY 2 A2 7 WP
R221 4.7K
C205 0.01uF
**
1A Design
REAR_USB R229
R217 100
R230
R201
USB_DL_P
SDA
R218 100
REAR_USB
SIDE_USB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_MULTI
+5V_HDMI_2 +5V_HDMI_3
A2 A1 A2 A1
+5V_MULTI
+5V_HDMI_3
Q301
C
HPD_MST_2
IC301 CAT24C02WI-GT3
RT1C3904-T112
R301 10K
HPD_MST_3
R327 100 R309 R311 10K 10K
C301 0.01uF
E A0 1 8 WP A1 2 7 SCL VCC
A1 2 7 SCL
DDC_WP
JACK_GND 3 6 SDA 20 VSS 19 HPD 18 +5V_POWER 17DDC/CEC_GND 16 SDA 15 SCL 14 NC 13 CEC 12 CLK11 CLK_SHIELD 10 CLK+ 9 DATA08 DATA0_SHIELD 7 DATA0+ 6 DATA15 DATA1_SHIELD 4 DATA1+ 3 DATA22 DATA2_SHIELD 1 DATA2+ JP305 JP304 4 5 A2
R329 100
DDC_WP
A2 3 6 SDA
R317 100
22 VSS 4 5
19
18
17
JP301
16
15
JP300
DDC_SDA3 DDC_SCL3
14
13
12
11 10 CLK+
9 DATA0-
8 DATA0_SHIELD
7 DATA0+
6 DATA1-
5 DATA1_SHIELD
A2
R302 1K
IC300 CAT24C02WI-GT3
A0 1 8 WP VCC C
HPD_MST_1
R315 68K CEC_READY
A1 2 7 SCL
R300 10K
Q300C
RT1C3904-T112
A1
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
TMDS2_RXC+ TMDS2_RX0TMDS2_RX0+ TMDS2_RX1TMDS2_RX1+ TMDS2_RX2TMDS2_RX2+
KJA-ET-0-0032 JK303
4 DATA1+
3 DATA2-
2 DATA2_SHIELD
1 DATA2+
20 JACK_GND
21
JK302 QJ41193-CFEE1-7F
+5V_MULTI
+5V_HDMI_1 +3.3V_MST
DDC_WP
A2 3 6 SDA
CEC_C CEC
D304 CDS3C30GTH 30V CEC_READY
22 VSS 4 5
19
18 JP302
17
16 JP303
15
DDC_SDA1 DDC_SCL1
14
13
12
11 10 CLK+
9 DATA0-
8 DATA0_SHIELD
7 DATA0+
6 DATA1-
5 DATA1_SHIELD
4 DATA1+
3 DATA2-
2 DATA2_SHIELD
1 DATA2+
20 JACK_GND
21
JK301 QJ41193-CFEE1-7F
2008/12/16 3 9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
PANEL WAFER
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4P401 TF05-51S FF10001-30
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
+5V_+12V_LCD
P402 1 1 2 2 3 3 4 4 5 5 6 7 TXCE3+ TXCE36 7 8 TXCLKETXCLKE+ TXCE3TXCE3+ TXCE2TXCE2+ TXCLKE14 14 15 TXCE2+ 16 17 18 TXCLKE+ 19 20 21 TXCLKETXCE3+ TXCE3TXCE4+ 23 24 25 25 26 27 28 28 29 30 31 26 27 TXCE422 TXCE0+ TXCE0TXCE1TXCE1+ TXCE2+ TXCE2TXCE1+ TXCE2TXCE1TXCLKE+ 15 16 17 18 19 20 21 TXCE0TXCE0+ 22 23 24 9 10 11 12 13
+5V_+12V_LCD
+5V_+12V_LCD
P403
SMW200-28C
1 2 3 4 5 6 7
SUB_SCL
+3.3V_MST
8 9
SUB_SDA
NON_19_22_26"
L403 120ohm
R420 4.7K
KEY1
11 12
NON_19_22_26"
L406 120ohm
NON_19_22_26" 13 14 15 16 17 18 19 20 21 22
C412 470pF
NON_19_22_26"
KEY2
NON 22/27" FHD R419 0 R422 0 NON 22/27" FHD TXCE0+ TXCE0TXCE1+
NON_19_22_26"
C408 0.1uF
NON_19_22_26"
P400
12507WS-12L
+5VST_MST
SCL
ZD401
SDA
3 23 24 25 26 27 28
GND
ZD402
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
IR
+5VST_MST +5VST_MST
29 30
KEY1
KEY2
FHD
NON 22/27" FHD R425 0 R431 0 NON 22/27" FHD TXCO0+ TXCO0TXCO1+ TXCO1-
5V_ST
+3.3V_MULTI_MST
GND
WARM_ST(LED_R_BIG)
IR
ZD400 R428 10K IR-OUT B TXCLKO+ C E Q405 2SC3052 IR-OUT TXCO3+ C Q404 2SC3052 E IR-OUT
IR_OUT
TXCO2+ TXCO2-
X X X X
R402 X 0 0 0 X
+3.3V_MULTI_MST B
*8BIT(FHD):22/27"
10
GND
11
ST_3.3V(LED_B)
L407 120-ohm
R400
OPC_OUTPUT
12
POWER_ON(LED_R_SMALL)
C414
READY
OPC_OUT
R412 0 OPC_ENABLE
HD(19/22")
E-DIM
External VBR
13
0 NON_19_22_26"
+3.3V_MULTI_MST NON 22/27" FHD R423 0 R409 100 R407 4.7K JEIDA R424 0 VESA
19_22_26" P405
IR(19/22/26")
KEY1
READY R413 0
KEY2
GND
5V_ST
GND
+3.3V_MULTI_MST
IR
LED_B
SUB_SCL
8 19_22_26" P404 SMAW200-03 19_22_26" L400 BG1608B121F KEY1 1 KEY1 LED_R KEY2 19_22_26" 19_22_26" 3 C400 100pF 50V C401 GND 100pF 19_22_26" 50V 2 L401 BG1608B121F KEY2
LED_R
R404 10K 19_22_26" R416 0 READY C R410 10K 19_22_26" B Q401 E 19_22_26" 2SC3052
+3.3V_MST
+3.3V_MST
19_22_26"
R418 0 READY
2008/12/16 4 9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TU500-*1 TAFT-H203F
TU500 TAFT-Z203D
1 2
+5V_TUNER
NC_1 GND_1 +B[5V] NC_2 RF_AGC TP[3.3V_OPT] NC_3 GND_2 SDA SCL MOPLL_AS NC_4 V-OUT NC_5 A-OUT SIF-OUT NC_6
1 NC_1 2 GND_1
3 4 5 6 NTSC_TUNER 7 8
+5V_TUNER
3 +B[5V] 4 NC_2
C505 100uF 16V C506 100uF 16V C509 100uF 16V
C501 0.01uF
L500
5 RF_AGC
120-ohm
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
9 10
L501
L501-*1 120-ohm 0 0 Ohm
READY
R504 47
C502 27pF
11
TV_MAIN
13 14 15 16
12
14 NC_5 MAIN_SIF
17 18 19 20 21 SHIELD
R502 4.7K
19 NC_8
20 NC_9
21
SHIELD
MSTAR TUNER
2008/12/16 5 9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
AMP :GAIN X 4
+12V_AUDIO
IC601
HOTEL_OPT
+1.8V
L606 +16V_NTP
Q600 RT1C3904-T112 R607 1K NON_HOTEL_OPT E C627 6800pF R605 4.7K B C
120-ohm
+1.8V_AVDD
C642 10uF 35V
0LCML00003B C615 0.1uF C613 0.01uF R608 12 R611 12 L603 2S DA-8580 2F R626 3.3 R625 3.3 C671 0.01uF
SPK_L-
L605
C617 0.1uF
120-ohm
MNT_LOUT
SPK_L+
C637 0.1uF C632 0.47uF +12V_AUDIO C635 0.01uF C669 0.1uF R623 4.7K R663 4.7K
MLB-201209-0120P-N2 0LCML00003B
MNT_L_AMP
R614 5.6K
SPK_L-
C611
22000pF
MNT_R_AMP
R615 5.6K
C BST1B 44 43 VDR1B
PGND1A_2
PGND1A_1 OUT1A_2
OUT1A_1
PVDD1A_2
PVDD1A_1 PVDD1B_2
PVDD1B_1 OUT1B_2
OUT1B_1
PGND1B_2 46 45
E 55 54 53 52 51 50 49 48 47 C622 0.1uF
Q601 RT1C3904-T112
Q603 RT1C3904-T112
56
PGND1B_1
R629
B 10K
R616-* 12K
READY
SW_RESET
42 41 40 39 38 37 36 35 34 33 PVDD2B_2 PVDD2B_1 OUT2B_2 OUT2B_1 PGND2B_2 R621 12 C643 0.1uF C647 0.01uF R667 4.7K C626 0.1uF C629 0.1uF R635 3.3 C634 390pF C673 0.47uF 1S 1F EAP38319001 R654 12 PVDD2A_1 R671 3.3 PVDD2A_2 +16V_NTP C644 0.1uF R628 4.7K C648 0.01uF OUT2A_1 R658 R653 12 12 C630 L607 390pF 2S DA-8580 2F OUT2A_2 PGND2A_1 C625 22000pF PGND2A_2 BST2A C624 1uF
R606 4.7K C628 6800pF
R624 NC VDR2A
7 OUT2
OUT3 8
BST1A
15
16
17
18
19
20
21
22
23
24
25
26
27
C604 10uF 16V DVDD WCK BCK SDA SCL FAULT SDATA VDR2B BST2B MONITOR_0 MONITOR_1 MONITOR_2 PGND2B_1 28
+1.8V_DVDD
DVSS_2
100
100
100
R676
R677
R678
R656 0 HOTEL_OPT
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
MNT_ROUT
SPK_R+
READY
VDR1A
MULTI_PW_SW
RESET
AD
DVSS_1
VSS_IO
I2S_MCLK
CLK_I
+3.3V_MULTI_MST
VDD_IO
IC600 NTP-3100L
+1.8V_AVDD
DGND_PLL
AGND_PLL
10
LFM 31 30 29
11
Main AMP
32
+1.8V_AVDD
AVDD_PLL
12
C602 0.1uF
DVDD_PLL
13
SPK_R-
TEST0
14
+1.8V_DVDD
C610 0.1uF
C614 1uF
C623 22000pF
MULTI_PW_SW
P600
SMAW250-04
AUDIO_R
+3.3V_MULTI_MST
HOTEL_OPT
3 4 R619 0 5 6
SPK_R+
SPK_L-
SPK_L+
AMP_MUTE_HOTEL
SPK_R+_HOTEL SPK_R-_HOTEL
8 9 10
2008/12/16 6 9
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
*H/W OPTION
Close to IC as close as possible
+1.2V_VDDC_MST +1.8V_DDR
DDR2_CASZ DDR2_RASZ DDR2_ODT
4.7K R8010 4.7K R8011 +3.3V_MULTI_MST R896 4.7K R898 4.7K +3.3V_MULTI_MST Small_HD Non_Small_FHD Small_HD Small_FHD R898-*2 R8010-*3 R896-*2 R8011-*3 4.7K 4.7K 4.7K 4.7K 100Hz Non_Small_HD Apollo DDR2_A[0-12] 100Hz R8010-*2 R8011-*2 R898-*1 R896-*1 4.7K 4.7K 4.7K 4.7K Small_FHD Non_Small_FHD Apollo Apollo R8010-*1 R8011-*1 4.7K 4.7K Small_FHD +5VST_MST Non_Small_HD DDR2_CKE DDR2_BA0
IC802 MX25L6405DMI-12G R8003 10K C857 0.01uF C878 0.01uF +3.3V_MULTI_MST +1.8V_DDR
56 0.1uF 0.1uF AR812 56 AR813 56 AR814 56 AR815 56 AR800 56 1K
+3.3V_MULTI_MST I2S_OUT
TXD LED_R KEY2 KEY1 SYS_RESET CEC_C PC_VS PC_HS IR DSUB_SDA RXD TXD RXD EEP_SCL EEP_SDA RL_ON I2S_SDO I2S_SCK
DDR2_BA1 DDR2_WEZ
Small HD Small FHD (27) Non Small HD Non Small FHD Apollo 100HZ
+3.3V_MST C859 0.01uF C877 0.01uF C879 0.01uF
R8020 10K
R8010 R8011 X 4.7K 4.7K 4.7K X 4.7K 4.7K X 4.7K 4.7K X 4.7K
1 HOLD
I2S_WS I2S_MCLK PANEL_STATUS
SCLK 16
C807 0.01uF
R852 C844 C863 R868 C817 20pF C816 20pF
L802 120-ohm
SPI_CLK
C864 0.01uF +1.2V_VDDC_MST
100
SI.SIO0 15
SPI_DI
+1.8V_DDR
X801 12MHz
3 NC_1 +3.3V_MULTI_MST
0 0 100 100 100 100 100 100 R8022 R8021 R839 1M 100 100 0.1uF
NC_8 14
C862 0.01uF
C865 0.01uF
4 NC_2
0 0 READY READY R8016 R8017
NC_7 13
+3.3V_MULTI_MST
R8035 R8034 R895 R849 R850 R8012 R824 R825 C883
C867 0.1uF C866 10uF
+3.3V_MULTI_MST
R829
5 NC_3
NC_6 12
R877 4.7K
L800 120-ohm
6 NC_4
NC_5 11
R878 4.7K
SPI_DO
R851 R854 R856 R858 AR805 56 C853 AR806 56 0.1uF R859 R862 10 10 DDR2_MCLKZ DDR2_MCLK DDR2_D[5] DDR2_D[2] DDR2_D[0] DDR2_D[7]
8 SO/SIO1 WP/ACC 9
10 10 10 10 R843 R844 33 33
HDMI_2
EEPROM
C833 0.1uF TMDS2_RX2TMDS2_RX2+ TMDS1_RXCTMDS1_RXC+ TMDS1_RX0TMDS1_RX0+ R869 R871 R872 R873 R874 R879 10 10 10 10 10 10
IC801 24LC256-I/SM
+3.3V_MULTI_MST
HWRESET CEC VSYNC1 HSYNC1 VSYNC0 HSYNC0 IRIN GPIO140 GPIO139 GPIO138 GPIO135 GPIO134 XIN XOUT AVDD_MPLL SAR3 SAR2 SAR1 SAR0 USB0_DP USB0_DM GND_18 GND_17 UART1_TX/GPIO87 UART1_RX/GPIO86 UART2_TX/I2CM_SCK UART2_RX/I2CM_SDA SPDIFO I2S_OUT_SD I2S_OUT_BCK VDDC_7 GND_16 VDDP_5 I2S_OUT_WS I2S_OUT_MCK I2S_IN_SD I2S_IN_BCK/GPIO68 I2S_IN_WS/GPIO67 VDDC_6 A_MCLKE A_MADR[3] A_MADR[7] A_MADR[12] A_MADR[9] A_MADR[5] AVDD_DDR_6 A_MADR[10] A_MADR[1] A_BADR[0] A_BADR[1] A_WEZ A_MADR[11] A_MADR[8] A_MADR[6] GND_15 A_MADR[4] A_MADR[2] A_MADR[0] A_CASZ A_RASZ A_ODT MVREF AVDD_MEMPLL GND_14
READY
SPI_CZ
7 CS
GND 10
DDC_WP
DDR2_D[0-15]
A0
VCC
A1
WP
C803 0.01uF
A2
SCL
HDMI_1
R8027 4.7K
C815 TMDS1_RX1TMDS1_RX1+ C849 0.1uF 0.1uF R880 R890 10 10
R8028 4.7K
DDR2_DQS1M DDR2_DQS1P
R812
TMDS1_RX2TMDS1_RX2+ HPD_MST_1 IC800 C819 0.1uF MST99A88ML(MATRIX BASIC) R891 R892 10 10
22
EEP_SCL
22K
P_24V_SMALL_15V P_12V_SMALL_15V
NON 19_22"
AUL0 AUR0 AUL1 AUR1 AUL2 AUR2 AUL3 AUR3 AUCOM AUL4 AUR4 GND_4 AUVRP AUVAG AVDD_AU GND_5 VDDC_2 DDCA_CK DDCA_DA DDCDA_CK DDCDA_DA DDCDB_CK DDCDB_DA GPIO20 VDDP_1 VDDC_3 UART2_RX UART2_TX DDCDC_CK RXCCKN RXCCKP DDCDC_DA RXC0N RXC0P GND_6 RXC1N RXC1P AVDD_DM RXC2N RXC2P HOTPLUGC USB1_DM USB1_DP SCK SDI SDO SCZ PWM0 PWM1 PWM2 PWM3 LVA4P LVA4M LVA3P LVA3M LVACKP LVACKM LVA2P LVA2M LVA1P LVA1M LVA0P LVA0M VDDP_2
D801 KDS181
R885
150
R860
1K
D802 KDS181
+5VST_MST
POWER_DET
+1.2V_VDDC_MST
GND
1K
Q803 RT1C3904-T112
Q800 ISA1530AC1
3 1
+5VST_MST
R861
1K
B E C
SW800 JTP-1127WEM
C8000 READY
2.2uF 16V
SYS_RESET
C823 2.2uF 65 CVBS_LIN 66 C824 2.2uF CVBS_RIN 67 68 69 C802 2.2uF COMP2_L 70 C873 2.2uF COMP2_R 71 C874 2.2uF 72 C875 2.2uF 73 C808 0.1uF 74 C821 2.2uF PC_AUD_L 75 C822 2.2uF PC_AUD_R 76 77 78 79 C840 0.01uF L801 80 120-ohm 81 82 R894 0 DSUB_SCL 83 R899 0 DSUB_SDA 84 R8023 100 DDC_SCL1 85 R8024 100 DDC_SDA1 86 R8025 100 DDC_SCL2 87 R8026 100 DDC_SDA2 88 R8033 0 READY POWER_DET 89 C882 0.1uF 90 R806 0 91 R870 0 92 R8039 100 HDMI3_SIDE 93 DDC_SCL3 R801 10 HDMI3_SIDE 94 TMDS3_RXCR805 10 HDMI3_SIDE 95 TMDS3_RXC+ R8040 100 HDMI3_SIDE 96 DDC_SDA3 R820 10 HDMI3_SIDE 97 TMDS3_RX0R821 10 HDMI3_SIDE 98 TMDS3_RX0+ 99 R822 10 HDMI3_SIDE 100 TMDS3_RX1R823 10 HDMI3_SIDE 101 TMDS3_RX1+ C876 0.01uF 102 R841 10 HDMI3_SIDE 103 TMDS3_RX2R848 10 HDMI3_SIDE 104 TMDS3_RX2+ 105 HPD_MST_3 106 R826 0 USB_DN 107 USB PART USB_DP R827 0 108 SPI_CLK 109 AR818 SPI_DI 33 110 SPI_DO 111 SPI_CZ 112 113 114 I-DIM 115 E-DIM 116 117 118 119 120 121 122 123 124 125 126 127 128
R8000 10K
HWRESET
CEC
VSYNC1
HSYNC1
VSYNC0
HSYNC0
IRIN
GPIO140
GPIO139
GPIO138
GPIO135
GPIO134
XIN
XOUT
AVDD_MPLL
SAR3
SAR2
SAR1
SAR0
USB0_DP
USB0_DM
GND_18
GND_17
UART1_TX/GPIO87
UART1_RX/GPIO86
UART2_TX/I2CM_SCK
UART2_RX/I2CM_SDA
SPDIFO
I2S_OUT_SD
I2S_OUT_BCK
VDDC_7
GND_16
VDDP_5
I2S_OUT_WS
I2S_OUT_MCK
I2S_IN_SD
I2S_IN_BCK/GPIO68
I2S_IN_WS/GPIO67
VDDC_6
A_MCLKE
A_MADR[3]
A_MADR[7]
A_MADR[12]
A_MADR[9]
A_MADR[5]
AVDD_DDR_6
A_MADR[10]
A_MADR[1]
A_BADR[0]
A_BADR[1]
A_WEZ
A_MADR[11]
A_MADR[8]
A_MADR[6]
GND_15
A_MADR[4]
A_MADR[2]
A_MADR[0]
A_CASZ
A_RASZ
A_ODT
MVREF
AVDD_MEMPLL
256
255
254
253
252
251
250
249
248
247
246
245
244
243
242
241
240
239
238
237
236
235
234
233
232
231
230
229
228
227
226
225
224
223
222
221
220
219
218
217
216
215
214
213
212
211
210
209
208
207
206
205
204
203
202
201
200
199
198
197
196
195
194
193
GND_14
100
R887 33K
M_SDA M_SCL
116
117
118
119
120
121
122
123
124
125
126
127
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
SDI
SCK
AUL0
AUL1
AUL2
AUL3
AUR0
AUR1
AUR2
AUR3
AUL4
AUR4
SDO
SCZ
PWM0
PWM1
PWM2
PWM3
115
LVA4P
LVA3P
LVA2P
LVA1P
RXC0P
RXC1P
GND_4
GND_5
RXC0N
GND_6
RXC1N
AUVRP
GPIO20
RXC2N
RXC2P
LVA4M
LVA3M
LVA2M
LVA1M
LVA0P
AUVAG
LVA0M
A U C O M
VDDC_2
VDDP_1
VDDC_3
RXCCKN
RXCCKP
USB1_DP
LVACKP
DDCA_CK
AVDD_AU
DDCA_DA
UART2_RX
UART2_TX
AVDD_DM
DDCDB_CK
DDCDA_CK
DDCDB_DA
DDCDC_CK
DDCDA_DA
DDCDC_DA
HOTPLUGC
USB1_DM
LVACKM
VDDP_2
128
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
DDR2_DQS0M DDR2_DQS0P DDR2_DQM0 DDR2_DQM1 AR809 56
VSS
SDA
R813
22
EEP_SDA
C804/C805/C806:Close to IC as close as possible
PC_B PC_G PC_R R814 R803 R816 R818 R838 R833 47 C827 0.047uF
HDCP EEPROM
+3.3V_MULTI_MST
R840 C804 C805 C806 47 C843 470 C846 47 C845 47 C847 47 C825
R8004 4.7K
R836 47 C829 0.047uF
IC803 CAT24WC08W-T
R817 4.7K
AR810 56
A0
VCC
A1
WP
C848
R8038 R8042
0.1uF
1K 100
R8018
0.1uF
1K
A2
SCL
R8005
22
EEP_SCL
+3.3V_MULTI_MST
VSS
SDA
R8006
22
EEP_SDA
47 47 470 47 47 47 47 47
MUTE_LINE R865 4.7K SUB_SCL R866 4.7K SUB_SDA S_VIDEO_DET PANEL_ON R819 3.3K DISP_EN/VAVS_ON SW_RESET DDC_WP R893 4.7K OPC_EN
GAIN X 4
C810 MNT_VOUT_T MAIN_SIF R875 R876 C856 C861 2.2uF 2.2uF 47 47 C868 C869 0.1uF 0.1uF 0.01uF
+12V_AUDIO
TV_MAIN
47 47 47
C850
0.01uF
E B C Q801 ISA1530AC1
SIDE_LIN SIDE_RIN MNT_L_AMP MNT_R_AMP R842 C839 22K 0.01uF
R809 470
MNT_VOUT
R882 R881 R846 R847 100 100 100 100
R808
220
MNT_VOUT_T
R810 68
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 B_MCLKZ B_MCLK B_MDATA[5] B_MDATA[2] B_MDATA[0] B_MDATA[7] AVDD_DDR_5 B_MDATA[13] B_MDATA[10] GND_13 B_MDATA[8] B_MDATA[15] AVDD_DDR_4 B_DDR2_DQSB[1] B_DDR2_DQS[1] GND_12 VDDP_4 AVDD_DDR_3 B_DDR2_DQSB[0] B_DDR2_DQS[0] GND_11 B_DDR2_DQM[0] B_DDR2_DQM[1] AVDD_DDR_2 B_MDATA[14] B_MDATA[9] GND_10 B_MDATA[12] B_MDATA[11] AVDD_DDR_1 B_MDATA[6] B_MDATA[1] GND_9 B_MDATA[3] B_MDATA[4] VDDC_5 VDDP_3 GPIO58 GPIO57 GPIO56 GPIO55 GPIO54 GPIO53 GPIO52 GPIO51 GND_8 GPIO152/I2C_OUT_SD3 GPIO151/I2C_OUT_SD2 GPIO150/I2C_OUT_MUTE VDDC_4 GND_7 AVDD_LPLL LVB0M LVB0P LVB1M LVB1P LVB2M LVB2P LVBCKM LVBCKP LVB3M LVB3P LVB4M LVB4P 192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129
RXBCKN RXBCKP RXB0N RXB0P HOTPLUGB RXB1N RXB1P AVDD_33_1 RXB2N RXB2P RXACKN RXACKP RXA0N RXA0P AVDD_33_2 RXA1N RXA1P GND_1 RXA2N RXA2P HOTPLUGA REXT VCLAMP REFP REFM BIN1P SOGIN1 GIN1P RIN1P BINM BIN0P GINM GIN0P SOGIN0 RINM RIN0P AVDD_33_3 GND_2 BIN2P GIN2P SOGIN2 RIN2P CVBS6 S-VIDEO CVBS5 CVBS4 CVBS3 CVBS2 CVBS1 VCOM1 CVBS0 VCOM0 AVDD_33_4 CVBSOUT GND_3 SIF0P SIF0M VDDC_1 AUL5 AUR5 AUVRM AUOUTL2 AUOUTR2 AUOUTL1 AUOUTR1
R8001
C842
0.1uF
R800 READY 0
RL_ON
R855 10K
+5VST_MST
R853
MULTI_PW_SW
HDMI_3
+3.3V_MULTI_MST
4.7K 4.7K
R863 R864
+3.3V_MULTI_MST
+3.3V_MULTI_MST
2K
R811 1K READY
R883 1K
RXBCKN RXBCKP RXB0N RXB0P HOTPLUGB RXB1N RXB1P AVDD_33_1 RXB2N RXB2P RXACKN RXACKP RXA0N RXA0P AVDD_33_2 RXA1N RXA1P GND_1 RXA2N RXA2P HOTPLUGA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
192 191 190 189 188 187 186 185 184 183 182 181 180 179 178 177 176 175 174 173 172
B_MCLKZ B_MCLK B_MDATA[5] B_MDATA[2] B_MDATA[0] B_MDATA[7] AVDD_DDR_5 B_MDATA[13] B_MDATA[10] GND_13 B_MDATA[8] B_MDATA[15] AVDD_DDR_4 B_DDR2_DQSB[1] B_DDR2_DQS[1] GND_12 VDDP_4 AVDD_DDR_3 B_DDR2_DQSB[0] B_DDR2_DQS[0] GND_11
R889 1K
R884 1K READY
REXT
22
171
B_DDR2_DQM[0]
VCLAMP
23
170
B_DDR2_DQM[1]
REFP
24
169
AVDD_DDR_2
RESET
[MODE SELECTION]
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
2008/12/16 7 9
DDR2_D[0-15]
DDR2_D[0-15]
1K R907
DDR2
1K R908 C904 0.01uF C905 1000pF C918 0.1uF 50V
+1.8V_DDR
V_REF
IC900 HYB18TC512160B2F-2.5
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
Close to DDR2 IC +1.8V_DDR
DDR2_BA0
L2 L3 A1 E1 CK J8 J9 M9 R1 VDD1 VDD2 K8 K2 VDD3 CK READY CKE C901 0.01uF C902 0.01uF C903 0.01uF C906 0.01uF VDD4 VDD5 C907 0.01uF C908 0.01uF C909 0.01uF C910 0.01uF C911 0.01uF C912 0.01uF C913 0.01uF C914 0.01uF C915 0.01uF C916 0.01uF C917 0.01uF BA0 BA1 R906 150
DDR2_A[0-12]
+1.8V_DDR
DDR2_DQM0 DDR2_DQM1
R904 56 R905 56
DDR2_DQS0M DDR2_DQS1M
+1.8V_DDR
VSSDL J7
DDR2 MEMORY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MSTAR DDR2
2008/12/16 8 9
**5V_MULTI->3.3V->1.2V
IC1001 BD9130EFJ-E2
ADJ 1 PVCC L1002 2.2uH R1009 2K 1/10W 1% R2 10K R1006 8 EN
P1001 FM20020-24
NC
Power ON
GND
GND
GND
GND
5.2V
5.2V
5.2V
10
5.2V
GND
11
12
GND
12V VCC 2 7 SW
13
14
12V
GND
15
16
GND
*ST 5V->3.3V
+5V_MULTI
ITH IC1007 AP2121N-3.3TRE1 C1017 10uF 16V R1008 12K GND 4 5 C1018 10uF 16VR1010 3.3K 1% 1/10W R1 PGND C1012 560pF 50V C1004 10uF 16V 3 6
24V
17
18
24V
NC
19
20
Inverter ON
A.Dim
21
22
Error Out
NC
23
24
PWM Dim
25
+5VST_MST
GND
VOUT
26"
C1053 0.01uF
MAX 2A V0 = 0.8*(1+(R2/R1))
IC1003 AZ1085S-3.3TR/E1
R1078 3.3 READY C1055 2200pF 50V READY C1014 0 . 1 u F C1013 10uF 16V 16V
P1000 FW20020-24S
P_5V
NON 19_22"
NC
P1002
1
AP1117EG-13 IN 3 MAX 1A 2 1 C1016 10uF 10V ADJ/GND C1015 0.1uF 50V R1 OUT
2
SMAW200-11
R1077 0 READY
Power ON
ADJ/GND
R1000 2.2K C1054 0.1uF 1 C1028 100uF 16V OUT:1.85V R1004 120 5%
R2 IC1002
19_22"
R1073
MAX 3A
INPUT 3
2 OUTPUT OUT:3.3V
R1013 0
+3.3V_MULTI_MST
L1013 MLB-201209-0120P-N2
GND
GND
+1.8V_DDR
120-ohm C1022 10uF 6.3V C1023 0.1uF 50V
DDR2, Vref
GND
15V 1
5
P_5V
15V 2
NON 19_22"
GND
P_5V
5.2V
5.2V
RL_ON
+1.8V
NTP,AUDIO DSP
5.2V
10
5.2V
GND
R1074 0 1/4W 5% 19_22"
11
P_12V_SMALL_15V
GND 3
12
GND
P_12V_SMALL_15V
12V
13
14
12V
V0 = 1.25*(1+(R2/R1))
4
GND
P_24V_SMALL_15V
GND
15
16
GND
Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes
5V 5 5V 6
P_24V_SMALL_15V
24V
17
18
24V
NC
19
20
Inverter ON
A.Dim
21
22
Error Out
NC
23
24
PWM Dim
NON_19_22_26"
7 NC 8
NC
Inverter_ON 9
Q1003 SI4925BDY EBK32753101 8 D1_2 7 D1_1 6 D2_2 5 D2_1 C1019 C1021 10uF 16V 0.01uF +5V_MULTI C1005 0.1uF L1007 MLB-201209-0120P-N2 0LCML00003B R1050 2.2K R1051 2.2K R1052 2.2K C1009 100uF16V C1010 0.01uF +5V_+12V_LCD
PWM_Dim 10
PANEL_ON
R1020 10K
R1048
A.Dim 11
R1065 33K NON 19_22" R1065-*1 19_22" 10K C 10K B Q1001 RT1C3904-T112 E P_5V
C1048 1uF
PANEL_STATUS POWER_SW
R1054 4.7K NON SHARP 32&52",AUO 25V R1053 C1043 0 0.47uF SHARP 52",AUO NON SHARP 52",AUO R1014 0 CMO 32,42,47,57 +5V_MULTI R1040 0 CMO 57" 3 R1047 10K 1 2 Q1002 2SC3875S R1046 3K
Q1004 RT1C3904-T112
R1064
V0 = 0.8*(1+(R1/R2))
C1026 100uF 16V READY
+5V_TUNER
DISP_EN/VAVS_ON
R1023 0 NON (CMO 32,42,47,57, SHARP 32")
+5V_USB
E-DIM OPC_OUT
R1022 1K OPC_ENABLE R1079 10K
LED Block
C1045 2.2uF 16V R1044-*1 100 DC_DIM PWM_DIM
OPC_ENABLE R1021 1K OPC_DISABLE
R1075 1K
IC1006 MP2212DN FB 1
C1032 560pF 50V MAX 3A
+5VST_MST
+5V_MULTI
L1009 3.6uH +5V_MULTI 6 SW_1 C1030 10uF 25V C1031 10uF 25V BS 4 5 VCC C1035 1uF 25V
R1011 0 C1029 0.1uF 50V
19_22"
Small(19_22")
R1015 10
19_22"
R1002 10K
R1005 1.2K
RL_ON
D1002 SAM2333
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MSTAR
2008/12/16
POWER
P/NO : MFL60021510