WBM Release 2 1

REFERENCE-2.
1
DOI-G06349
NEC Corporation
7-1, Shiba 5-Chome, Minato-Ku, Tokyo 108-8001, Japan
TEL: +81-3-3454-1111
FAX: +81-3-3798-1510
TELEX: NECTOK J22686
EMAIL: mcj@onw.nec.co.jp
SpectralWave
UNIVERSAL NODE
WIDE BAND MANAGER
RELEASE 2.1
RELEASE NOTES
REFERENCE-2.1
DOI-G06349
The information in this document was approved by the engineer(s) listed below
and was intended to be complete and accurate at the time of printing. However,
information is subject to change.
This document contains proprietary information of NEC Corporation,
and is not to be disclosed or used except in accordance with applicable
agreements. Please contact NEC Corporation or the project contractor.
Copyright 2003 by NEC Corporation
All rights reserved.
Printed in Japan
1st Edition June 2003, approved by S. Arai of NEC-BBN-CNW
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U-NODE WBM RELEASE 2.1: RELEASE NOTES
SpectralWave U-Node WBM
Contents
Contents
- i -
1. SUMMARY 1-1
2. VERSION INFORMATION 2-1
2.1 Firmware Versions ................................................................................2-2
2.2 CID Application Software .....................................................................2-3
2.2.1 Version ....................................................................................................... 2-3
2.2.2 Applicable Operating System .................................................................. 2-3
2.2.3 Available Functions .................................................................................. 2-3
2.3 Hardware Compatibility ........................................................................2-4
2.3.1 Packages ................................................................................................... 2-4
2.3.2 Shelves ...................................................................................................... 2-5
3. FEATURES 3-1
3.1 Shelf Types ............................................................................................3-2
3.1.1 Available Slots for Packages ................................................................... 3-2
3.2 Interfaces ...............................................................................................3-3
3.2.1 SINF64(B) Package ................................................................................... 3-3
3.2.2 SINF16/SINF16(B) Package ...................................................................... 3-3
3.2.3 SINFM Package ......................................................................................... 3-3
3.2.3.1 SINFM with OP1 ............................................................................ 3-3
3.2.3.2 SINFM with OP4 ............................................................................ 3-3
3.2.4 GBEM Package .......................................................................................... 3-4
3.2.5 FEH Package ............................................................................................. 3-4
3.2.6 STM1E Package ......................................................................................... 3-4
3.2.7 E12 Package .............................................................................................. 3-5
3.2.8 E31 Package .............................................................................................. 3-5
3.2.9 E32 Package .............................................................................................. 3-5
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3.3 Configuration ........................................................................................3-6
3.3.1 Line Protections ........................................................................................ 3-6
3.3.1.1 10G (STM-64) ................................................................................ 3-6
3.3.1.2 2.5G (STM-16) ............................................................................... 3-6
3.3.1.3 600M (STM-4) ............................................................................... 3-6
3.3.1.4 150M (STM-1) ............................................................................... 3-7
3.3.2 Package Protections ................................................................................. 3-8
3.3.2.1 STM1E Package ............................................................................ 3-8
3.3.2.2 E12 Package ................................................................................. 3-8
3.3.2.3 E31/E32 Package .......................................................................... 3-8
3.3.2.4 PSW40B Package ......................................................................... 3-8
3.3.3 Path Protection .......................................................................................... 3-9
3.3.3.1 Higher Order Path ......................................................................... 3-9
3.3.3.2 Lower Order Path .......................................................................... 3-9
3.3.4 UPSR .......................................................................................................... 3-9
3.3.5 ILR .............................................................................................................. 3-9
3.4 Operations ...........................................................................................3-10
3.4.1 Upper OS (NMS) Access ......................................................................... 3-10
3.4.2 CID Access .............................................................................................. 3-10
3.4.2.1 Available Connection Methods .................................................... 3-10
3.4.2.2 Restrictions .................................................................................. 3-10
3.4.3 Firmware Download ................................................................................ 3-10
3.4.4 Performance Monitoring (PM) ................................................................ 3-11
3.4.5 Crossconnection ..................................................................................... 3-11
3.4.5.1 Crossconnect Type ...................................................................... 3-11
3.4.5.2 Higher Order Path ....................................................................... 3-11
3.4.5.3 Lower Order Path ........................................................................ 3-11
3.4.6 Laser Shutdown ...................................................................................... 3-12
3.4.7 Timing Source Selection ........................................................................ 3-12
3.4.8 Overhead Access .................................................................................... 3-12
3.4.9 Loopback ................................................................................................. 3-13
3.4.10 TU Squelch Process ............................................................................... 3-13
3.4.11 In-Service Upgrade ................................................................................. 3-13
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4. PRECAUTIONS 4-1
4.1 Equipment/Shelves ...............................................................................4-2
4.1.1 Equipment Version ................................................................................... 4-2
4.2 Packages ...............................................................................................4-3
4.2.1 Memory Card ............................................................................................. 4-3
4.2.2 PSW40B ..................................................................................................... 4-3
4.2.3 OHC ............................................................................................................ 4-3
4.2.4 E32 .............................................................................................................. 4-4
4.2.5 E12 .............................................................................................................. 4-4
4.2.6 GBEM/FEH ................................................................................................. 4-4
4.2.7 Fan .............................................................................................................. 4-5
4.2.8 About U-Node BBM Compatible Packages ............................................. 4-5
4.3 CID, CID Operations ..............................................................................4-6
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SUMMARY
1-1
1. SUMMARY
This document provides information regarding the SpectralWave Universal Node Wide
Band Manager (U-Node WBM) Release 2.1.
The information includes some restrictions that should be considered, in order to avoid
causing failures while U-Node WBM is in service.
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SUMMARY
1-2
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VERSION INFORMATION
2-1
2. VERSION INFORMATION
This section provides version information for firmware and CID application software used in
U-Node WBM Release 2.1.
Each version should be confirmed prior to equipment installation.
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VERSION INFORMATION Firmware Versions
2-2
2.1 FIRMWARE VERSIONS
PACKAGE
APPLICATION
VERSION
NAME ID (NEC Code)
MSCB SC [SCBCPU] UB708-**** 2.03
AGENTOSI [AGCPU] UB708-*C**/*D** 2.16
AGENTTCP/IP [AGCPU] UB708-*E**/*F** 3.12
SSCB [SWBCPU] UC231-**** 2.01
OHC [OHCPU] UB275-A*** 8.06
PSW40B [PW40BCPU] UC232-**** 2.02
SINF64(B) [IF64CPU] UC234-**** 8.16
SINF16 [IFCPU] UB282-**** 8.10
SINF16(B) [IFCPU] UC235-**** 8.10
SINFM [IFCPU] UB283-**** 8.10
STM1E [IFCPU] UB287-**** 8.10
E12 [E12CPU] UB563-**** 8.09
E31 [E31CPU] UB564-**** 8.02
E32 [E32CPU] UB565-**** 8.02
GBEM [GEMUSPU] UB986-**** 8.07
FEH [FEHCPU] UB290-**** 8.08
: Firmware version conforms to that of U-Node BBM Release 8.2.
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VERSION INFORMATION CID Application Software
2-3
2.2 CID APPLICATION SOFTWARE
2.2.1 Version
The applicable CID version for U-Node WBM Release 2.1 is:
CID Application Software (FB357-EB00), Version 2.1.13
or later version for equipment Release 2.1.
2.2.2 Applicable Operating System
CID application software runs on the following operating systems of English version:
! Microsoft Windows 98/98 Second Edition
! Microsoft Windows NT
! Microsoft Windows 2000 Professional
! Microsoft Windows XP Professional
2.2.3 Available Functions
The full range of functions on the CID application software are available.
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VERSION INFORMATION Hardware Compatibility
2-4
2.3 HARDWARE COMPATIBILITY
Some packages can be commonly used for U-Node BBM system; the firmware versions used
for U-Node BBM Release 8.2 conform to this release of U-Node WBM.
2.3.1 Packages
NAME ID (NEC Code)
H/W COMPATIBILITY
WITH U-NODE BBM
MSCB SC UB708-**** NO
AGENT UB708-*C**/*D** NO
UB708-*E**/*F** NO
SSCB UC231-**** NO
OHC UB275-A*** YES
PSW40B UC232-**** NO
SINF64(B) UC234-**** NO
AMP64 UC320-**** NO
DCF1 UC221-0A**/1A** YES
DCF2 UC221-S*** YES
SINF16 UB282-**** YES
SINF16(B) UC235-**** NO
SINFM UB283-**** YES
OP1 (optical stick) UB285-**** YES
OP4 (optical stick) UB286-**** YES
GBEM UB986-**** YES
SFP UC092-L*** YES
FEH UB290-**** YES
STM1E UB287-**** YES
STM1TRM UB291-0A00 YES
E12 UB563-**** YES
E1 THR UB569-**** YES
E1 TRM UB566-**** YES
E31 UB564-**** YES
E32 UB565-**** YES
E3 THR UB570-0A00 YES
E3 TRM UB567-0A00 YES
MEMB UC230-**** NO
: Package newly designed for WBM can be installed into BBM shelf. Screws on the
old type package do not work on WBM shelf.
: Package newly designed for WBM can be installed into BBM shelf. Screws on the old
type package cannot fasten the optical stick guard to WBM shelf.
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VERSION INFORMATION Hardware Compatibility
2-5
2.3.2 Shelves
NAME ID (NEC Code)
H/W COMPATIBILITY
WITH U-NODE BBM
PDP Slim-type Shelf NA191-**** YES
WBM Shelf NA472-****
STM1TRM Shelf M9995-**** YES
AMP Shelf NA495-****
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VERSION INFORMATION
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FEATURES
3-1
3. FEATURES
This section provides information regarding operational setups/configurations, modes, and
functions supported by U-Node WBM Release 2.1. Some operations may require certain
conditions.
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FEATURES Shelf Types
3-2
3.1 SHELF TYPES
U-Node WBM can provide various level of interfaces using only type of shelf, WBM shelf.
3.1.1 Available Slots for Packages
This release of U-Node WBM allows the use of slots for interface packages as follows:
NOTE: The use of ! !! ! Slots (for SINF64(B), GBEM and FEH) are available from this release of
U-Node WBM.
M
S
C
B
S
S
C
B
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
P
S
W
40
B
P
S
W
40
B
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
I
N
F
O
H
C
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
! !! ! ! !! !
! !! ! ! !! ! ! !! ! ! !! ! ! !! ! ! !! !
! !! ! ! !! ! ! !! ! ! !! ! ! !! ! ! !! !
(P)
PKG SLOT #
available slot
SINF16
SINF16(B)
SINFM
STM1E
E32
E31
E12
(P) Protection package slot for E12 1:N Package Protection
" " " " slot number to be used for double-slot size package (number to the right is used)
vacant slot to be kept when SINF16(B) is installed in the right; or if this slot has an
interface package, the slot to the right cannot have SINF16(B).
SINF64(B)
GBEM
FEH
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FEATURES Interfaces
3-3
3.2 INTERFACES
This release of U-Node WBM provides the packages supporting the following interfaces.
However, the use of these interfaces may be restricted by the configuration. See 3.3
Configuration for the interfaces available for the configuration.
3.2.1 SINF64(B) Package
SINF64(B) package is a double-slot size package. This package requires AMP shelf and
AMP64 package when supporting 10G interface of L.64.2a and V.64.2a standards.
! STM-64 optical interface
NOTE: STM-64 L.64.2a and V.64.2a are newly added interface from this release of U-Node
WBM.
3.2.2 SINF16/SINF16(B) Package
SINF16 package is a double-slot size package. SINF16(B) package is a single-slot size
package.
3.2.3 SINFM Package
SINFM package is a double-slot size package. This package is a base package to support
OP1 and OP4 optical sticks. SINFM package can simultaneously accommodate these optical
sticks.
3.2.3.1 SINFM with OP1
3.2.3.2 SINFM with OP4
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FEATURES Interfaces
3-4
3.2.4 GBEM Package
GBEM package is a double-slot size package. This package requires SFP module for its
operation. This package is newly added interface from this release of U-Node WBM.
! Giga-Bit Ethernet: 1000BASE-SX/1000BASE-LX
NOTES
1: Port-Multiplex operation is available.
2: For GBEM virtual concatenation, distance gap between each path within a network
must not exceed 1200 km.
3.2.5 FEH Package
FEH package is a double-slot size package. This package is newly added interface for this
release of U-Node WBM.
! Fast Ethernet: 100BASE-TX
! Ethernet: 10BASE-T
NOTES
1: Port-Multiplex operation is available.
2: For FEH virtual concatenation, distance gap between each path within a network must
not exceed 1200 km.
3.2.6 STM1E Package
STM1E package is a double-slot size package. This package requires STM1TRM shelf and
STM1TRM package for its operation.
! STM-1e electrical interface
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FEATURES Interfaces
3-5
3.2.7 E12 Package
E12 package is a single-slot size package. This package requires E1 THR or E1 TRM
package for its operation.
! E12 (2M) electrical interface
3.2.8 E31 Package
package for its operation.
3.2.9 E32 Package
package for its operation. See also 4. PRECAUTIONS: 4.2.4 E32 for the combinations of
these packages.
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FEATURES Configuration
3-6
3.3 CONFIGURATION
For this release of U-Node WBM, the following configurations are available:
3.3.1 Line Protections
3.3.1.1 10G (STM-64)
! Non-Protection
! 2F MS-SPRing (SLA supported)
NOTE: STM-64 interface is newly added for this release of U-Node WBM.
3.3.1.2 2.5G (STM-16)
! Non-Protection
! Linear Protection: 1+1 Unidirectional, Non-revertive
! Linear Protection: 1+1 Bidirectional, Non-revertive
! Linear Protection: 1:1 Bidirectional, Revertive (SLA supported)
! 2F MS-SPRing (SLA, Multi-Ring
NOTE
supported)
NOTE: Multi-Ring is available by using SINF16(B) package.
! 4F MS-SPRing (SLA supported)
3.3.1.3 600M (STM-4)
! Non-Protection
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3.3.1.4 150M (STM-1)
! Non-Protection
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3.3.2 Package Protections
3.3.2.1 STM1E Package
! Non-Protection
! 1+1 Package Protection
NOTE: Protection configuration cannot be assigned if the line facilities are
registered to a pair of STM1E packages individually.
3.3.2.2 E12 Package
! Non-Protection (E1 THR or E1 TRM package is required)
! 1:N Package Protection (E1 TRM package is required)
NOTES
1: N = up to 8; number of work packages assigned for a protection group.
2: E12 package must be installed and registered for Slot #7 when
configuring protection switch group. Slot #7 is a slot reserved for the
E12 protection package.
3.3.2.3 E31/E32 Package
! Non-Protection (E3 THR package is required)
! 1+1 Package Protection (E3 TRM package is required)
NOTES
1: Protection configuration cannot be assigned if the line facilities are
registered to a pair of E31 or E32 packages individually.
2: See also 4. PRECAUTIONS: 4.2.4 E32.
3.3.2.4 PSW40B Package
! Non Protection
! 1+1 Package Protection
NOTE: Protection configuration is assigned when PSW40B packages are
registered for both slots.
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3.3.3 Path Protection
This release of U-Node WBM supports the path protection function (PPS) for the following
levels ($ indicates for available):
3.3.3.1 Higher Order Path
3.3.3.2 Lower Order Path
3.3.4 UPSR
This release of U-Node WBM supports UPSR (Uni-directional Path Switched Ring).
NOTE: UPSR is the configuration using SNC/P.
3.3.5 ILR
This release of U-Node WBM does not support ILR (Interlocked Ring) configuration.
CROSSCONNECT
LEVELS
10G:
STM-64
2.5G:
STM-16
600M:
STM-4
150M:
STM-1
GBEM:
1000BASE-SX
1000BASE-LX
FEH:
10BASE-T
100BASE-TX
VC-4-16c $ $ $ $
VC-4-4c $ $ $ $ $
VC-4 $ $ $ $ $ $
CROSSCONNECT
LEVELS
2.5G: STM-16
600M: STM-4
150M: STM-1
45M: E32 34M: E31 2M: E12
VC-12 $ $
VC-3 $ $ $
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FEATURES Operations
3-10
3.4 OPERATIONS
This release of U-Node WBM supports the following functions and setups:
3.4.1 Upper OS (NMS) Access
! OSI Protocol
! TCP/IP Protocol
3.4.2 CID Access
3.4.2.1 Available Connection Methods
! Direct Line: using CID port (RS-232C serial interface) on MSCB package
! TCP/IP: using CID port (LAN interface) on top of the shelf
3.4.2.2 Restrictions
! Maximum number of users who can remotely log in to the same NE is four.
3.4.3 Firmware Download
! By CID operation
Local access
Remote access
! By NMS operation
Remote access
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FEATURES Operations
3-11
3.4.4 Performance Monitoring (PM)
This release of U-Node WBM supports the Intermediate Path Performance Monitoring
(IPPM) function for both higher and lower order paths.
3.4.5 Crossconnection
This release of U-Node WBM supports the following crossconnect types and the levels:
3.4.5.1 Crossconnect Type
! 1-Way
! 2-Way
! 1-Way PPS
! 2-Way PPS
Specified crossconnection type can be modified by adding/deleting PPS setup without re-
registering the crossconnection.
3.4.5.2 Higher Order Path
! AU-4 (VC-4)
! AU-4-4C (VC-4-4C)
! AU-4-16C (VC-4-16C)
NOTES
1: AU-4-64C (VC-4-64C) level is not supported.
2: From this release of U-Node WBM, Virtual Concatenation of VC-4-1v thru VC-4-6v is
available.
3.4.5.3 Lower Order Path
! TU-12 (VC-12)
! TU-3 (VC-3)
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FEATURES Operations
3-12
3.4.6 Laser Shutdown
This release of U-Node WBM supports automatic/forced laser shutdown for terminating
optical outputs if the signal is lost. Optical output can be restarted by specifying either
automatic or manual.
3.4.7 Timing Source Selection
This release of U-Node WBM supports the following timing source selections:
! Line Selection
! External Selection
2M PDH line timing output is available as well.
NOTE: E12 package that belongs to group 0A00/0B00 of version V01AX does
not support this function.
In addition to the automatic switching of selected timing sources, the following operations
are available:
! FSW: forced switching operation for the use of timing source
! MSW: manual switching operation for the use of timing source
! Lockout: inhibits switching to particular timing sources among selections
3.4.8 Overhead Access
This release of U-Node WBM supports the following types of OH access:
! DCC connection
! Orderwire access (head set and hand set)
! User channels
NOTE: From this release of U-Node WBM, the overhead access to STM1E lines is available.
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FEATURES Operations
3-13
3.4.9 Loopback
This release of U-Node WBM can perform the following types of loopbacks:
! Terminal loopback
! Facility loopback
! Remote terminal loopback
NOTE
NOTE: Available for E12, E31, and E32 facilities only.
3.4.10 TU Squelch Process
U-Node WBM does not support TU levels squelch function for node failure.
3.4.11 In-Service Upgrade
This release of U-Node WBM supports MS-SPRing In-Service Upgrade from 2-Fiber to 4-
Fiber. This In-Service Upgrade requires CID operation to keep traffic operative. The
implementation must follow the in-service upgrade procedure in the Operation and
Maintenance manual.
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FEATURES
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PRECAUTIONS
4-1
4. PRECAUTIONS
This section provides information, guidelines, and restrictions regarding U-Node WBM
operation. Improper equipment operation may cause damage to the traffic, equipment and/or
packages.
In order to run U-Node WBM at its top performance, all information provided here must be
read through and fully understood.
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PRECAUTIONS Equipment/Shelves
4-2
4.1 EQUIPMENT/SHELVES
4.1.1 Equipment Version
! Do not downgrade equipment to the prior release.
! When upgrading, cutovers to all upgrading firmware within the equipment should be
scheduled to take place at the same time.
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PRECAUTIONS Packages
4-3
4.2 PACKAGES
! Whether by accident or not, if an installed package is disengaged and re-engaged rapidly,
the MSCB package within the equipment may not be able to detect the changes. This
results in the provisioning process not being applied to the re-installed package.
When replacing a package, remove the installed package, and wait for at least a few
seconds (confirm that IMPROPRMVL alarm is issued) before installing the replacement.
If LEDs on the newly installed package do not stop blinking, it means that the changes
have not been detected by the MSCB package, and the provisioning process has not taken
place. The package should be re-installed so that the MSCB package detects it.
! Do not install a newly supported package before other existing-installed packages have
their firmware upgraded to meet the same version.
! Do not execute CPU reset to more than one CPU at a time. CPU reset must be executed to
one CPU at a time.
4.2.1 Memory Card
! Memory card replacement must take place by following the instructions provided in the
Operation and Maintenance manual. Improper replacement may damage the memory
card. Replacing memory cards and MSCB packages require special precautions.
4.2.2 PSW40B
! Even a slight movement of ejectors on PSW40B package can cause their protection
switching to be carried out. If this movement is attempted between both Working and
Protection packages by turns consecutively, CID may not reflect the changes, and may
remain an online indication onto the offline package. (Actual Online LED indications
light on the proper package.)
4.2.3 OHC
! LEDs on OHC faceplate do not blink if its OHCPU is being reset.
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4.2.4 E32
! E32 package group 0A00 must use E32 TRM package (UB568) when configuring
protection configuration, or E32 THR package (UB571) for non-protection configuration.
! E32 package group BA00 must use E3 TRM package (UB567) when configuring
protection configuration, or E3 THR package (UB570) for non-protection.
4.2.5 E12
! Version V01AX of E12 package Group 0A00/0B00 does not support the 2M tributary
clock.
4.2.6 GBEM/FEH
! If the link is not established, following alarms will be indicated depending on the Auto
Negotiation setups:
Auto Negotiation ON: AUTONEGOERR
Auto Negotiation OFF: LINKDOWN
! If replacing (disengage and re-engage) GBEM or FEH package rapidly, CPU_FAIL may
be reported at the startup. Once disengaging GBEM or FEH package from the backplane
connector, wait at least for three to five seconds before engaging the package back in
place. If replacing these packages with the Service State IS (In-Service), wait for
IMPROPRMVL alarm before re-engaging the package.
! Ethernet interface should be used in the network where the equipment clocks are
synchronized, or a packet error may occur.
! SNC/P should be operated in a network where the distance gap between a Work path and
the Protection path is 1200 km or less.
! When crossconnecting GBEM/FEH virtual concatenation path, ensure to specify Higher
Order paths (AU paths) in the same sequence at both Add and Drop sides.
! CSF (Client Signal Failure) is issued by the link failure, such as LOS (for GBEM only),
AUTONEGOERR, and LINKDOWN. For GBEM, if ALS (Automatic Laser Shutdown)
has terminated optical outputs, CSF is not forwarded to the opposing node.
! For an Extra Concatenation path of GBEM/FEH, B3 ERROR, that does not actually
occur, may be reported from SLA path on Through Node when 4F MS-SPRing span
switching is carried out.
! While the Extra Concatenation is functioning, CSF (Client Signal Failure) may not be
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properly forwarded.
! RDI-P forwarded by PLMF alarm does not enable the Link Path Through.
! Under condition where an LOA alarm is causing traffic failure, LOM alarm is not cleared
by establishing the multiframe synchronization.
! GBEM/FEH path cannot be terminated in PDH facility.
! For FEH, some combinations of MDI setups are not supported. Check MDI setup of the
opposing node.
4.2.7 Fan
! Do not install fans provided for U-Node BBM; U-Node WBM requires FAN(B), high-
speed rotating fans.
4.2.8 About U-Node BBM Compatible Packages
! As hardware, those compatible packages can be installed into either U-Node WBM or U-
Node BBM. However, the firmware for different release are incompatible. To install
package into either system, appropriate firmware for the system must be confirmed. The
common firmware for this release of U-Node WBM is that for U-Node BBM Release 8.2.
REFERENCE-2.1
DOI-G06349
PRECAUTIONS CID, CID Operations
4-6
E
4.3 CID, CID OPERATIONS
! CID application software provided for U-Node WBM must be installed. This CID cannot
access or operate U-Node BBM or U-Node REG. CID for U-Node BBM or U-Node REG
cannot access or operate U-Node WBM either.
! Do not remove the CID connection cable while CID is in operation, or CID may be
terminated forcibly and another session may be rejected at login when connection is
established again. If this problem happens, clear it by starting up CID again, or by
restarting your PC.
! The Update button should be used occasionally to retrieve the latest information from
NE where a remote user can also make an access. Also, depending on the PC or installed
operating system, the CID display may not reflect changes made by usual CID operation.
Click the Update button in dialog boxes or restart CID application software to retrieve
the latest information.
! When CPU reset is executed via CID, a LINK_FAIL alarm may be issued. If issued, this
pseudo-alarm will automatically be cleared.
! If a BACKUPMEMP or BACKUP_MIS alarm is issued, clear the memory card failure
before starting CID operation; operating CID where the memory card has an error may
forcibly terminate the session.
! Terminal Emulator should be opened only for viewing command sequence issued on the
background. Do not enter TL1 commands directly. Entering TL1 commands via Terminal
Emulator may cause failure to communication between NE and CID.
! Depending on the combination of PC type and unrecommended operating system,
unreadable characters may be displayed when starting up CID, or the display may not
reflect the condition properly.
! For CID connected with NE by modem, available operation is retrieving information
only. Do not attempt managing NE.

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