PC817X Series

PC817X Series

DIP 4pin General Purpose Photocoupler

4-channel package type is also available. (model No. PC847X Series)

Description
PC817X Series contains an IRED optically coupled to a phototransistor. It is packaged in a 4pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 80V(*) and CTR is 50% to 600% at input current of 5mA.

Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC817) 2. Package resin : UL flammability grade (94V-0)

Applications
1. I/O isolation for MCUs (Micro Controller Units) 2. Noise suppression in switching circuits 3. Signal transmission between circuits of different potentials and impedances

Features
1. 4pin DIP package 2. Double transfer mold package (Ideal for Flow Soldering) 3. High collector-emitter voltage (VCEO:80V(*)) 4. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 5. Several CTR ranks available 6. High isolation voltage between input and output (Viso(rms) : 5.0 kV)
(*) Up to Date code "P7" (July 2002) VCEO : 35V. From the production Date code "J5" (May 1997) to "P7" (July 2002), however the products were screened by BVCEO70V.

Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

Sheet No.: D2-A03101EN Date Sep. 30. 2003 SHARP Corporation

PC817X Series Internal Connection Diagram

1 1 4 2 3 2 3 4

Anode Cathode Emitter Collector

Outline Dimensions
1. Through-Hole [ex. PC817X]
Anode mark 1.20.3 0.60.2
Rank mark Factory identification mark Date code

(Unit : mm) 2. SMT Gullwing Lead-Form [ex. PC817XI]

Anode mark 1.20.3 0.60.2
Rank mark Factory identification mark Date code
1
4

PC817
2 3

4.580.5

PC817
6.50.5

2.540.25

6.50.5 7.620.3

2.540.25

4.580.5

4.580.5
0.1

7.620.3 0.5TYP. 3.50.5

4.580.5

0.350.25

3.00.5

0.26

Epoxy resin 0.260.1 : 0 to 13

2.70.5

0.4 1.0+ 0

Epoxy resin
0 10.0+ 0.5

0.4 1.0+ 0

2.540.25

0.5

0.1

3. Wide Through-Hole Lead-Form [ex. PC817XF]

Rank mark Factory identification mark

4. Wide SMT Gullwing Lead-Form [ex. PC817XFP]

Rank mark

Anode mark 1.20.3 0.60.2

Date code
1 4
0.5

Anode mark 1.20.3 0.60.2

Factory identification mark Date code

4.58

PC817

PC817
6.50.5

1.00.1

2.54

6.50.5 7.620.3

2.540.25

1.00.1

0.25

4.580.5

4.580.5

7.620.3 0.250.25
0.1

4.580.5 3.50.5 0.50.1 0.75

0.25

3.50.5

Epoxy resin 0.75

0.25

MIN.

2.7

Epoxy resin

10.16

0.5

12.0MAX 0.260.1 10.160.5 0.50.1

Product mass : approx. 0.21g

Sheet No.: D2-A03101EN

0.26

3.50.5

PC817X Series Date code (2 digit)

1st digit Year of production A.D Mark 2002 A 2003 B 2004 C 2005 D 2006 E 2007 F 2008 H 2009 J 2010 K 2011 L 2012 M N 2nd digit Month of production Month Mark January 1 February 2 March 3 April 4 May 5 June 6 July 7 August 8 September 9 October O November N December D

A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001

Mark P R S T U V W X A B C

repeats in a 20 year cycle

Factory identification mark

Factory identification Mark no mark Japan Indonesia Philippines China
* This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production.

Country of origin

Rank mark
Refer to the Model Line-up table

Sheet No.: D2-A03101EN

PC817X Series
Absolute Maximum Ratings
Parameter Symbol Forward current IF *1 Peak forward current IFM Reverse voltage VR Power dissipation P Collector-emitter voltage VCEO Emitter-collector voltage VECO IC Collector current Collector power dissipation PC Total power dissipation Ptot *2 Isolation voltage Viso (rms) Operating temperature Topr Storage temperature Tstg *3 Soldering temperature Tsol
Pulse width100s, Duty ratio : 0.001 40 to 60%RH, AC for 1minute, f=60Hz For 10s Up to Date code "P7" (July 2002) VCEO : 35V.

Rating 50 1 6 70 *4 80 6 50 150 200 5.0 30 to +100 55 to +125 260

(Ta=25C) Unit mA A V mW V V mA mW mW kV C C C

*1 *2 *3 *4

Electro-optical Characteristics
Parameter Forward voltage Peak forward voltage Reverse current Terminal capacitance Collector dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current Collector-emitter saturation voltage Isolation resistance Floating capacitance Cut-off frequency Rise time Response time Fall time Symbol VF VFM IR Ct ICEO BVCEO BVECO IC VCE (sat) RISO Cf fc tr tf
Conditions IF=20mA IFM=0.5A VR=4V V=0, f=1kHz VCE=50V, IF=0 IC=0.1mA, IF=0 IE=10A, IF=0 IF=5mA, VCE=5V IF=20mA, IC=1mA DC500V, 40 to 60%RH V=0, f=1MHz VCE=5V, IC=2mA, RL=100, 3dB

Output

Input

VCE=2V, IC=2mA, RL=100

MIN. *5 80 6 2.5 51010

TYP. 1.2 30 0.1 11011 0.6 80 4 3

MAX. 1.4 3.0 10 250 100 30.0 0.2 1.0 18 18

(Ta=25C) Unit V V A pF nA V V mA V pF kHz s s

*5 From the production Date code "J5" (May 1997) to "P7" (July 2002), however the products were screened by BVCEO70V.

Transfer characteristics

Output

Input

Sheet No.: D2-A03101EN

PC817X Series
Model Line-up
Lead Form Package Through-Hole Wide Through-Hole Sleeve 100pcs/sleeve PC817X PC817X1 PC817X2 PC817X3 PC817X4 PC817X5 PC817X6 PC817X7 PC817X8 PC817X9 PC817X0 PC817XF PC817XF1 PC817XF2 PC817XF3 PC817XF4 PC817XF5 PC817XF6 PC817XF7 PC817XF8 PC817XF9 PC817XF0 SMT Gullwing Wide SMT Gullwing Taping 2 000pcs/reel PC817XFP Rank mark with or without A B C D A or B B or C C or D A, B or C B, C or D A, B, C or D IC [mA] (IF=5mA, VCE=5V, Ta=25C) 2.5 to 30.0 4.0 to 8.0 6.5 to 13.0 10.0 to 20.0 15.0 to 30.0 4.0 to 13.0 6.5 to 20.0 10.0 to 30.0 4.0 to 20.0 6.5 to 30.0 4.0 to 30.0

Model No.

PC817XI PC817XI1 PC817XI2 PC817XI3 PC817XI4 PC817XI5 PC817XI6 PC817XI7 PC817XI8 PC817XI9 PC817XI0

PC817XP PC817XP1 PC817XP2 PC817XP3 PC817XP4 PC817XP5 PC817XP6 PC817XP7 PC817XP8 PC817XP9 PC817XP0

Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.

Sheet No.: D2-A03101EN

PC817X Series Fig.1 Forward Current vs. Ambient Temperature

50
Diode power dissipation P (mW)

Fig.2 Diode Power Dissipation vs. Ambient Temperature

100

Forward current IF (mA)

40

80 70 60

30

20

40

10 0 30

20 0 30

25

50 55

75

100

125

25

50 55

75

100

125

Ambient temperature Ta (C)

Ambient temperature Ta (C)

Fig.3 Collector Power Dissipation vs. Ambient Temperature

250 Collector power dissipation PC (mW)

Fig.4 Total Power Dissipation vs. Ambient Temperature

250

Total Power dissipation Ptot (mW)

200

200

150

150

100

100

50

50

0 30

25

50

75

100

125

0 30

25

50

75

100

125

Ambient temperature Ta (C)

Ambient temperature Ta (C)

Fig.5 Peak Forward Current vs. Duty Ratio

10 000 5 000 Peak forward current IFM (mA) 2 000 1 000 500 200 100 50 20 10 5 5 103 2 5 102 2 5 101 2 5 1 Pulse width100s Ta=25C

Fig.6 Current Transfer Ratio vs. Forward Current

800 700 Current transfer ratio CTR (%) 600 500 400 300 200 100 0 0.1 1 Forward current IF (mA)
Sheet No.: D2-A03101EN

VCE=5V Ta=25C

10

Duty ratio

PC817X Series Fig.7 Forward Current vs. Forward Voltage

500 200 Forward current IF (mA) 100 50 20 10 5 2 1 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 1 2 3 4 5 6 7 8 9 Forward voltage VF (V) Collector-emitter voltage VCE (V) Ta=75C 50C 25C 0C 25C 25 Collector current IC (mA)

Fig.8 Collector Current vs. Collector-emitter Voltage

30 IF=30mA 20mA Ta=25C PC (MAX.)

20

15 10mA 10 5mA 5

Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature

150% IF=1mA,VCE=5V Relative current transfer ratio (%) IF=5mA,VCE=5V

Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature

0.14 Collector-emitter saturation voltage VCE (sat) (V) 0.12 0.10 0.08 0.06 0.04 0.02 0 40 20 0 20 40 60 80 100 IF=20mA IC=1mA

100%

50%

0% 40

20

20

40

60

80

100

Ambient temperature Ta (C)

Ambient temperature Ta (C)

Fig.11 Collector Dark Current vs. Ambient Temperature

105 5 Collector dark current ICEO (A) 106 5 107 5 108 5 109 5 1010 5 1011 30 0 20 40 60 80 Ambient temperature Ta (C) 100 VCE=50V

Fig.12 Collector-emitter Saturation Voltage vs. Forward Current

6 Collector-emitter saturation voltage VCE (sat) (V) Ta=25C 5 IC=0.5mA 1mA 4 3mA 5mA 7mA

1 0 0 5 10 15 Forward current IF (mA)

Sheet No.: D2-A03101EN

PC817X Series Fig.13 Response Time vs. Load Resistance

500 VCE=2V 200 IC=2mA Ta=25C 100 50 Response time (s) 20 10 5 2 1 0.5 0.2 0.1 0.01 td ts tr

Fig.14 Test Circuit for Response Time

VCC Input
tf

Input Output 10% 90% td tr ts tf

RD

RL

Output VCE

Please refer to the conditions in Fig.13.

0.1 1 10 Load resistance RL (k)

50

Fig.15 Frequency Response

VCE=5V IC=2mA Ta=25C

Fig.16 Test Circuit for Frequency Response

VCC RD RL Output VCE 100

0 Voltage gain Av (dB)

10

1k RL=10k

Please refer to the conditions in Fig.15.

20 0.5 1 2 5 10 20 50 100 200 500

Frequency f (kHz)

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

Sheet No.: D2-A03101EN

PC817X Series Design Considerations Design guide

While operating at IF<1.0mA, CTR variation may increase. Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED.

Degradation
In general, the emission of the IRED used in photocouplers will degrade over time. In the case of long term operation, please take the general IRED degradation (50% degradation over 5years) into the design consideration.

Recommended Foot Print (reference) SMT Gullwing Lead-form

8.2

Wide SMT Gullwing Lead-form

10.2

2.54

2.54

1.7

2.2

2.2

1.7

(Unit : mm)

For additional design assistance, please review our corresponding Optoelectronic Application Notes.
Sheet No.: D2-A03101EN

PC817X Series
Manufacturing Guidelines Soldering Method Reflow Soldering:
Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice.
(C) 300

Terminal : 260C peak ( package surface : 250C peak)

200

Reflow 220C or more, 60s or less 100 Preheat 150 to 180C, 120s or less

(min)

Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below 270C and within 10s. Preheating is within the bounds of 100 to 150C and 30 to 80s. Please don't solder more than twice.

Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C. Please don't solder more than twice.

Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.

Sheet No.: D2-A03101EN

10

PC817X Series Cleaning instructions Solvent cleaning:

Solvent temperature should be 45C or below Immersion time should be 3minutes or less

Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.

Recommended solvent materials:

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin.

Presence of ODC
This product shall not contain the following materials. And they are not used in the production process for this device. Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

Sheet No.: D2-A03101EN

11

PC817X Series Package specification Sleeve package 1. Through-Hole or SMT Gullwing Lead-Form Package materials
Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer

Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.

Sleeve outline dimensions

12.0

520

6.7

5.8

10.8

(Unit : mm)

2. Wide Through-Hole Lead-Form or Wide SMT Gullwing Lead-Form Package materials

Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer

Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. 20 sleeves in one case.

Sleeve outline dimensions

15.0

6.35

5.9

10.8

520

(Unit : mm)
Sheet No.: D2-A03101EN

12

PC817X Series Tape and Reel package 1. SMT Gullwing Package materials
Carrier tape : PS Cover tape : PET (three layer system) Reel : PS

Carrier tape structure and Dimensions

F E D G C I J

B H A H

Dimensions List A B 16.00.3 7.50.1 H I 0.1 10.4 0.40.05

C 1.750.1 J 4.20.1

D 8.00.1 K 5.10.1

E 2.00.1

(Unit : mm) F G +0.1 4.00.1 1.5 0

Reel structure and Dimensions

e g c d

Dimensions List a b
f a b

X. MA

330 e 231.0

17.51.5 f 2.00.5

(Unit : mm) c d 1.0 100 130.5 g 2.00.5

Direction of product insertion

Pull-out direction

[Packing : 2 000pcs/reel]

Sheet No.: D2-A03101EN

13

PC817X Series 2. Wide SMT Gullwing Package materials

Carrier tape : PS Cover tape : PET (three layer system) Reel : PS

Carrier tape structure and Dimensions

F E D G C I J

B H A K

Dimensions List A B 24.00.3 11.50.1 H I 0.1 12.4 0.40.05

C 1.750.1 J 4.10.1

D 8.00.1 K 5.10.1

E 2.00.1

(Unit : mm) F G +0.1 4.00.1 1.5 0

Reel structure and Dimensions

e g c d

Dimensions List a b 330 e 231.0 25.51.5 f 2.00.5

MA

X.

f b

(Unit : mm) c d 1.0 100 130.5 g 2.00.5

Direction of product insertion

Pull-out direction

[Packing : 2 000pcs/reel]

Sheet No.: D2-A03101EN

14

PC817X Series Important Notices

The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication.

Sheet No.: D2-A03101EN

15