I. Residual Stresses and Their Measurement flat or cylindrical specimens, and are not readily adaptable
Residual (locked-in) stresses in a structural material to real test objects of arbitrary size and shape.
or component are those stresses that exist in the object X-ray diffraction strain measurement, which does
without (and usually prior to) the application of any not require stress relaxation, offers a nondestructive
service or other external loads. Manufacturing processes alternative to the foregoing methods, but has its own severe
are the most common causes of residual stress. Virtually limitations. Aside from the usual bulk and complexity of
all manufacturing and fabricating processes — casting, the equipment, which can preclude field application, the
welding, machining, molding, heat treatment, etc. — technique is limited to strain measurements in only very
introduce residual stresses into the manufactured object. shallow surface layers. Although other nondestructive
Another common cause of residual stress is in-service techniques (e.g., ultrasonic, electromagnetic) have been
repair or modification. In some instances, stress may also developed for the same purposes, these have yet to achieve
be induced later in the life of the structure by installation wide acceptance as standardized methods of residual
or assembly procedures, by occasional overloads, by stress analysis.
ground settlement effects on underground structures, or
by dead loads which may ultimately become an integral The Hole-Drilling Method
part of the structure. The most widely used modern technique for measuring
The effects of residual stress may be either beneficial residual stress is the hole-drilling strain-gage method of
or detrimental, depending upon the magnitude, sign, stress relaxation, illustrated in Figure 1.
and distribution of the stress with respect to the load- Briefly summarized, the measurement procedure involves
induced stresses. Very commonly, the residual stresses are six basic steps:
detrimental, and there are many documented cases in which
• A special three- (or six-) element strain gage rosette is
these stresses were the predominant factor contributing
installed on the test part at the point where residual
to fatigue and other structural failures when the service
stresses are to be determined.
stresses were superimposed on the already present residual
stresses. The particularly insidious aspect of residual stress • The gage grids are wired and connected to a multi-
is that its presence generally goes unrecognized until after channel static strain indicator, such as the Vishay
malfunction or failure occurs. Micro-Measurements Model P3 (three-element gage),
Measurement of residual stress in opaque objects or System 5000 (six-element gage).
cannot be accomplished by conventional procedures for * Drilling implies all methods of introducing the hole (i.e., drilling,
milling, air abrasion, etc).
experimental stress analysis, since the strain sensor (strain
gage, photoelastic coating, etc.) is totally insensitive to
the history of the part, and measures only changes in Strain Gage
strain after installation of the sensor. In order to measure Rosette
residual stress with these standard sensors, the locked-in
stress must be relieved in some fashion (with the sensor
present) so that the sensor can register the change in
Drilled Hole
strain caused by removal of the stress. This was usually
done destructively in the past — by cutting and sectioning
the part, by removal of successive surface layers, or by
TECH NOTE
(a) S x 1 N ¨ 1 3 4 ·
Z Er
© 2
4 cos 2A 2 cos 2A ¸ (4a)
Xx 2E ªr r r 1 N ¹
S x 1 N ¨ 1 3 4N ·
R EQ
©
2 4 cos 2A
2 coss 2A ¸ (4b)
2E ª r r r 1 N ¹
P(R, G)
α X ra The preceding equations can be written in a simpler
Y X form, demonstrating that along a circle at any radius
XNa R (R ≥ Ro) the relieved radial and tangential strains vary in
a sinusoidal manner:
Xx
E r S x A B cos 2A (5a)
EQ S x
A C cos 2A (5b)
Figure 2. Stress states at P (R, a), Thus, the relieved strains also vary, in a complex way, with
before and after the introduction of a hole. distance from the hole surface. This variation is illustrated in
Figure 3 on page 22, where the strains are plotted along
where: the principal axes, at α = 0° and α = 90°. As shown by the
figure, the relieved strains generally decrease as distance
R
r
Ro
R r Ro from the hole increases. Because of this, it is desirable to
measure the strains close to the edge of the hole in order
Ro hole radius to maximize the strain gage output signal. On the other
hand, parasitic effects also increase in the immediate
R arbitrary radius from hole center
vicinity of the hole. These considerations, along with
Subtracting the initial stresses from the final (after drilling) practical aspects of strain gage design and application,
stresses gives the change in stress, or stress relaxation at necessitate a compromise in selecting the optimum radius
point P (R, α) due to drilling the hole. That is: (R) for gage location. Analytical and experimental studies
have established a practical range of 0.3 < r < 0.45 where
1X r X raa
X ra (3a) r = Ro /R and R is the radius to the longitudinal center of
the gage.
1X N X Naa
X Na (3b)
It can be noticed from Figure 3 that for α = 0° (along the axis
1Z r N Z raaN
Z raN (3c) of the major principal stress) the relieved radial strain, εr,
is considerably greater than the tangential strain, εθ, in the
Substituting Equations (1) and (2) into Equations (3) yields specified region of measurement. As a result, commercial
TECH NOTE
the full expressions for the relaxed (or relieved) stresses. If strain gage rosettes for residual stress analysis are normally
the material of the plate is homogeneous and isotropic in its designed with radially oriented grids to measure the
mechanical properties, and linear-elastic in its stress/strain relieved radial strain, εr. This being the case, only Equation
behavior, these equations can then be substituted into (5a) is directly relevant for further consideration in this
the biaxial Hooke’s law to solve for the relieved normal summary. It is also evident from the figure that the relieved
strains at the point P (R, α). The resulting expressions are radial strain along the major principal axis is opposite in
as follows: sign to the initial residual stress. This occurs because the
Ro R
When both residual stresses are present simultaneously,
the superposition principle permits algebraic addition of 2a
Equations (7) and (8), so that the general expression for the Xx
relieved radial strain due to a plane biaxial residual stress Figure 4. Strain gage rosette arrangement
state is: for determining residual stress.
E r S x A B cos 2A S y A
B cos 2A (9a)
www.vishaymg.com For technical support, contact Document Number: 11053
22 micro-measurements@vishay.com Revision 15-Aug-07
Tech Note TN-503-6
Vishay Micro-Measurements
(11b), the former must represent the maximum principal Equations (6)], for both the through-hole and blind-hole
stress. geometries. Because of the foregoing, and the fact that the
Equation (11c) is identical to that for a conventional transverse sensitivities of Vishay Micro-Measurements
three-element rectangular rosette, but must be interpreted residual stress rosettes are characteristically very low
differently to determine which principal stress is referred (approximately 1%), it is not considered necessary to correct
to gage no. 1. The following rules can be used for this for transverse sensitivity. Kabiri4, for example, has shown
purpose: that the error due to ignoring transverse sensitivity (in the
e
(R
far from typical of practical test objects, however, since 60
ss
6)
ne
ordinary machine parts and structural members requiring
ef.
Vig
(R
residual stress analysis may be of any size or shape, and are
r&
ey
rarely thin or flat. Because of this, a shallow “blind” hole is 40
dle
e ls
D Gage
en
0K
used in most applications of the hole-drilling method. Do
9R
0 .4
The introduction of a blind hole into a field of plane stress
0.2
Z
produces a very complex local stress state, for which no exact 20
solution is yet available from the theory of elasticity. Fortu-
nately, however, it has been demonstrated by Rendler and Do /D
Vigness5 that this case closely parallels the through-hole 0
0 0.1 0.2 0.3 0.4
condition in the general nature of the stress distribution.
Thus, the relieved strains due to drilling the blind hole Z/D
still vary sinusoidally along a circle concentric with the Figure 5. Relieved strain versus ratio of hole depth to gage circle
hole, in the manner described by Equations (9). It follows, diameter (strains normalized to 100% at Z/D = 0.4).
then, that these equations, as well as the data-reduction
relationships in Equations (11), are equally applicable The general variation of relieved strain with depth is
to the blind-hole implementation of the method when illustrated in Figure 5, where the strains have been
appropriate blind-hole coefficients A and B are employed. normalized, in this case, to 100% at Z/D = 0.4. The
Since these coefficients cannot be calculated directly data include experimental results from two different
from theoretical considerations, they must be obtained by investigators demonstrating the manner in which the
empirical means; that is, by experimental calibration or by relieved-strain function is affected by the ratio of hole
numerical procedures such as finite-element analysis. diameter to gage circle diameter (Do/D). Both cases involve
uniform uniaxial (plane) stress, in specimens that are
Several different investigators [e.g., (20)–(23)] have thick compared to the maximum hole depth. The curves
published finite-element studies of blind-hole residual plotted in the figure are considered representative of the
stress analysis. The most recently developed coefficients by response to be expected when the residual stress is uniform
Schajer are incorporated in ASTM standard E 837, and are throughout the hole depth.
shown graphically for the case of uniform stress in Figure
8 of this Tech Note. The computer program H-DRILL uses An important contribution of the Rendler and Vigness
these coefficients. work is the demonstration that, for any given set of
material properties, E and ν, coefficients A and B are
Compared to the through-hole procedure, blind-hole simply geometric functions, and thus constants for all
analysis involves one additional independent variable; geometrically similar cases. This means that once the
namely, the dimensionless hole depth, Z/D (see Figure 5). coefficients have been determined for a particular rosette
Thus, in a generalized functional form, the coefficients can configuration, the rosette size can be scaled upward or
be expressed as: downward and the same coefficients will still apply when
A = fA (E, O, r, Z/D) (12a) the hole diameter and depth are similarly scaled (assuming,
B = fB (E, O, r, Z/D) (12b) of course, the same material). Several different approaches
For any given initial state of residual stress, and a fixed have been taken in attempting to remove the material
hole diameter, the relieved strains generally increase (at dependency from A and B, leaving only the geometric
TECH NOTE
a decreasing rate) as the hole depth is increased. Therefore, dependence. One of these, proposed by Schajer,7 is adopted
in order to maximize the strain signals, the hole is normally in this Tech Note. Schajer introduced two new coefficients,
drilled to a depth corresponding to at least Z/D = 0.4 denoted here as a and b, and defined as follows:
(ASTM E 837 specifies Z/D = 0.4 for the maximum hole 2 EA
depth). a
(13a)
1 N
b
2 EB
(13b)
specimen thickness of five or more times the hole diameter is substituting α = 0° (for grid no. 1) and α = 90° (for grid no.
recommended. For through-hole calibration, the thickness 3) into Equation (5a):
of the calibration specimen is preferably the same as that
of the test part. It is also important that the maximum
applied stress during calibration not exceed one-half of the εc1 = σc [A + B cos (0°)] = σc (A + B)
proportional limit stress for the test material. In any case, εc3 = σc [A + B cos (2 x 90°)] = σc (A – B)
the applied stress plus the initial residual stress must be low
10
The UM design is compatible with all methods of introducing
60 the hole.
cc3 = +39Rc
cc1 = –90Rc
40 N2K-XX-030RR-350/DP
1 The K-alloy grids of this open-faced six-
5
3
element rosette are mounted on a thin,
20 high-performance laminated polyimide
TECH NOTE
2
film backing. Solder tabs are duplex
copper plated for ease in making solder
joints for lead attachment. Diametrically
–100 –80 –60 –40 –20 0 20 40
opposed circumferential and radial grids
CALIBRATION MICROSTRAIN (cc ) are to be wired in half-bridge configurations.
Figure 6. Stress versus relieved strain for calibration of Figure 7. Residual stress strain gage
coefficients A and B on 304 Stainless Steel (through-hole). rosettes (shown approximately 2X).
depth. Both the through-hole and full-depth blind-hole configurations are available in a range of temperature
coefficients plotted in Figure 8 were determined by a compensations for use on common structural metals.
combination of finite-element analysis and experimental However, only the RE design is offered in different sizes
verification. These coefficients are also supplied numerically (031RE, 062RE, and 125RE), where the three-digit prefix
in tabular form in ASTM E 837-99, where RE/UL rosettes represents the gage length in mils (0.001 in [0.0254 mm]).
are designated as Type A, UM rosettes as Type B, and RR The RE design is available either open-faced or with
rosettes as Type C. For the blind-hole coefficients in the Option SE (solder dots and encapsulation).
28
(a) RE AND UL ROSETTES (b) UM ROSETTE (c) RR ROSETTE
0.8 0.8 1.3
1 1
1 2 bx
D
1 Do
D 1
www.vishaymg.com
Do 1
0.7 3 0.7 3 1.2
Do D
2
bx
0.4D
bx
Vishay Micro-Measurements
micro-measurements@vishay.com
SUGGESTED LIMITS SUGGESTED LIMITS
0 0 0.5
0.30 0.35 0.40 0.45 0.50 0.30 0.35 0.40 0.45 0.50
Do /D Do /D
0.4
SUGGESTED LIMITS
0.3
0.40 0.45 0.50 0.55 0.60
Do /D
Figure 8. Full-depth data-reduction coefficients a and b versus dimensionless hole diameter (typical) for
Vishay Micro-Measurements residual stress rosettes, in accordance with ASTM E 837.
Measurement of Residual Stresses by the Hole-Drilling Strain Gage Method
Revision 15-Aug-07
Document Number: 11053
Tech Note TN-503-6
Vishay Micro-Measurements
hole dimensions applicable to all Vishay Micro-Measure- effective for penetrating glass, most ceramics, very hard
ments residual stress rosettes. metals, etc.; but diamond cutters have shown promise
on these kinds of test materials. Figure 9c shows the air
Alignment turbine/carbide cutter assembly installed in the same basic
Rendler and Vigness observed that “the accuracy of RS-200 Milling Guide.
the (hole-drilling) method for field applications will Bush and Kromer14 reported, in 1972, that stress-free holes
are achieved using abrasive jet machining (AJM). Modifi-
Windows is a registered trademark of Microsoft, Inc.
satisfied when doing incremental drilling to examine stress Sensitiv ity of the Gage s and Rel ieve d Strai n
variation with depth. Under these same circumstances, it is Coefficients,” Experimental Mechanics 25: (252-256)
important that the hole depth at each drilling increment be (Sept. 1984).
measured as accurately as possible, since a small absolute 5. Rendler, N.J. and I. Vigness, “Hole-drilling Strain-
error in the depth can produce a large relative error in gage Method of Measuring Residual Stresses.” Proc.,
the calculated stress. Because of practical limitations on SESA XXIII, No. 2: 577-586 (1966).
measuring shallow hole depths, the first depth increment
Drilling Method.” Experimental Mechanics 25: 205- 31. Schajer, G.S., “Use of Displacement Data to Calculate
207 (1985). Strain Gauge Response in Non-Uniform Strain Fields.”
Strain. Vol. 29, No. 1, pp. 9-13, 1993.
19. Niku-Lari, A.J. Lu and J.F. Flavenot, “Measurement of
Residual Stress Distribution by the Incremental Hole- 32. Schajer, G.S. and Tootoonian, M., “A New Rosette
Drilling Method.” Experimental Mechanics 25: 175-185 Design for More Reliable Hole-drilling Residual Stress
(1985). Measurements.” Experimental Mechanics. Vol. 37, No.
3, pp. 299-306, 1997.