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Engineering of Polymeric Materials The 5 P!

s
Tim A. Osswald

Polymer Engineering Center University of Wisconsin-Madison

King Saud University 15-17 November 2008

Topics
The 5 P!s Introduction to Polymers Polymer Recognition and Diagnostics Introduction to Mixing and Blending Anisotropy Development Solidication Shrinkage and Warpage Mechanical Behavior of Polymers Failure of Polymers Simulating Polymer Processes Processing Innovations Materials Innovation Polymers from Renewable Resources Modeling Innovations

The 5 P!s
Polymer Processing Product Performance Post-consumer Life

Polymer Process Product

Molecule Material Filler Fiber Additive

Compatibility Properties Adhesion Regulation/Legislation Cost Heating Morphology Mixing Orientation Pumping Degradation Forming

Extrusion Injection Compression

Performance

Post-consumer life

Pellet Film/Fiber Component/Assembly Thermal Mechanical Environmental Optical Electrical Recycling Environment Sustainability Legislation

Assembly Injection Molding Product Polymer(s)


Rheological properties Thermal properties Mechanical Properties

Process
Flow Heat Transfer Fiber orientation Fiber damage Degradation Shrinkage/Warpage

Assembly Desired interactions

Assembly/Disassembly Choice of materials

Post-Consumer Life

Performance

Anisotropy Mechanical Properties Stresses Friction Properties

Osswald - Frth, Germany, Montagespritzgieen (2007)

Misconceptions and Misunderstandings

Data useful for comparison between materials


Deflection temperature C under flexural load (1.82 MPa) ASTM D 648 Thermal expansion coefficient, 10-5 m/m C ASTM D 696 Tensile strength, MPa at 23C ASTM D 638 Flexural modulus, MPa at 23C ASTM D 790

Elongation at break, % at 23C ASTM D 638 1000

IZOD impact strength J/m of notch at 23C ASTM D 256 LDPE

Specific gravity ASTM D 792 no break PTFE

Market price $/lb (February 2003) 20.0 15.0 10.0 PI

LDPE 300 15

200 10,000

PI Epoxy Phenolic UP

HDPE PTFE PP LDPE PET PA66 PC 100 1000 PA66 Epoxy PC 2.0

UP Phenolic Epoxy PET

5.0

PTFE

PI PET Phenolic UP 200 10 Epoxy PTFE PC POM 5 100 PA66 PMMA HIPS ABS SAN PS PVC PP HDPE LDPE 0

HIPS HDPE

150 PET Epoxy PI SAN PMMA POM PC 50 1000

PVC HDPE Phenolic UP ABS PVC POM HIPS ABS HIPS 1.5 PTFE 100 PET PP

POM PTFE ABS PP PET SAN PA66 100 PVC PC PMMA PS PI

PMMA PS SAN PC PVC PETABS HIPS POM PP HDPE PA66 PTFE

1.5

PC PA66

PVC PI

POM

POM Epoxy

10 PI PMMA SAN Epoxy PS 10 1.0 UP Phenolic

UP Epoxy Phenolic

PS LDPE PVC PA66 PP PTFE ABS HIPS UP 100 HDPE Phenolic LDPE

1.0 PC PMMA PA66 SAN HIPS PS ABS 1.0 HDPE LDPE PP PMMA PS SAN POM PI

PMMA Phenolic SAN ABS PET

LDPE UP 0.5 HIPSHDPE PS PVC PP 0.5

Standard Testing Methods (ASTM)

ASTM Designation: D638 - 01


Standard Test Methods for Tensile Properties of Plastics

Polyethylene Straw Experiment

Straw Test
Impact Test

Faster Test

Slower test

10%

20%

100%

200%

300%

STRAIN

PMMA
100 90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 Strain, ! (%) 6 7 8 1 0.5 0.2 Strain rate = 0.05%/h 10 10000 5000 2000 1000 500

200 100 50 20

Plastics Material Properties Data Survey


! ! !

Conducted at the SPE ANTEC 2002 People attending product design and failure sessions 300 surveyed, 100 responded (on site)

Product Development Respondents


Which of the following properties do you often use during product and process development?
0.00% 10.00% 20.00% 30.00% 40.00% 50.00% 60.00% 70.00% 80.00% 90.00% 100.00%

Tensile strength Material cost Density Impact Strength Melt flow index Flexural Modulus Chemical resistance Elastic Modulus Yield Stress Viscosity curves Heat deflection temperature Fracture Strain Thermal Expansion coefficient Optical properties Creep Data Friction characteristics Dielectric properties Tensile-creep modulus Secant Modulus Shear Modulus Poisson's ratio P-V-T diagram Dynamic Modulus Heat Conduction Isochronous q-e curves Isometric q-relaxation curves

Product Development respondents

Polymer Material Data Survey (Germany)*


Which of the following properties do you often use during product and process development? points
0 50 100 150 200 250 300 350

Young's modulus Tensile Strength Temperature behavior Tensile stress at yield Tensile strain at break Price of raw material Chemical resistance Flexural modulus Viscosity Tensile-creep modulus Charpy values Isochrones Critical strain P-V-T diagrams Poisson's ratio Reduction factors Deformation energy density

3 Pts Often 1 Pts Rarely 0 Pts Never -1 Pts Do not Understand Property
Data from Germany

* Berlich, Gabriel, Schmachtenberg, Kunststoffe, 2001

Data useful for comparison between materials


Deflection temperature C under flexural load (1.82 MPa) ASTM D 648 Thermal expansion coefficient, 10-5 m/m C ASTM D 696 Tensile strength, MPa at 23C ASTM D 638 Flexural modulus, MPa at 23C ASTM D 790

Elongation at break, % at 23C ASTM D 638 1000

IZOD impact strength J/m of notch at 23C ASTM D 256 LDPE

Specific gravity ASTM D 792 no break PTFE

Market price $/lb (February 2003) 20.0 15.0 10.0 PI

LDPE 300 15

200 10,000

PI Epoxy Phenolic UP

HDPE PTFE PP LDPE PET PA66 PC 100 1000 PA66 Epoxy PC 2.0

UP Phenolic Epoxy PET

5.0

PTFE

PI PET Phenolic UP 200 10 Epoxy PTFE PC POM 5 100 PA66 PMMA HIPS ABS SAN PS PVC PP HDPE LDPE 0

HIPS HDPE

150 PET Epoxy PI SAN PMMA POM PC 50 1000

PVC HDPE Phenolic UP ABS PVC POM HIPS ABS HIPS 1.5 PTFE 100 PET PP

POM PTFE ABS PP PET SAN PA66 100 PVC PC PMMA PS PI

PMMA PS SAN PC PVC PETABS HIPS POM PP HDPE PA66 PTFE

1.5

PC PA66

PVC PI

POM

POM Epoxy

10 PI PMMA SAN Epoxy PS 10 1.0 UP Phenolic

UP Epoxy Phenolic

PS LDPE PVC PA66 PP PTFE ABS HIPS UP 100 HDPE Phenolic LDPE

1.0 PC PMMA PA66 SAN HIPS PS ABS 1.0 HDPE LDPE PP PMMA PS SAN POM PI

PMMA Phenolic SAN ABS PET

LDPE UP 0.5 HIPSHDPE PS PVC PP 0.5

BUT NOT USEFUL FOR DESIGN!!!

What kind of data should be used for design?

Creep data
(Time dependent)

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