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BAR42FILM BAR43FILM

SMALL SIGNAL SCHOTTKY DIODE

Table 1: Main Product Characteristics IF(AV) VRRM Tj VF(max) 0.1 A 30 V 150C 0.33 and 0.40 V
K Nc A K2 K A A K1 A K2 K1

BAR42FILM BAR43FILM
A1 K A2 A1 K A2 A1 K2

BAR43AFILM
A2 K1 A2 A1 K2 K1

FEATURES AND BENEFITS


Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount device

BAR43CFILM

BAR43ASFILM

SOT23-3L DESCRIPTION Genral purpose metal to silicon diodes featuring very low turn-on voltage and fast switching. Table 2: Order Codes Part Number BAR42FILM BAR43FILM BAR43AFILM BAR43CFILM BAR43SFILM Marking D94 D95 DB1 DB2 DA5

Table 3: Absolute Ratings (limiting values) Symbol VRRM IF(AV) IFSM Ptot Tstg Tj TL Parameter Repetitive peak reverse voltage Continuous forward current Surge non repetitive forward current Power dissipation (note 1) Maximum storage temperature range Maximum operating junction temperature * Maximum temperature for soldering during 10s tp = 10ms sinusoidal Tamb = 25C Value 30 0.1 0.75 250 -65 to + 150 150 260 Unit V A A mW C C C

Note 1: for double diodes, Ptot is the total dissipation of both diodes. 1 dPtot - thermal runaway condition for a diode on its own heatsink * : --------------- > ------------------------dTj Rth ( j a )

April 2005

REV. 3

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Table 4: Thermal Resistance Symbol Rth(j-a) Junction to ambient (*) Parameter Value 500 Unit C/W

(*) Mounted on epoxy board with recommended pad layout.

Table 5: Static Electrical Characteristics Symbol VBR IR * Parameter Breakdown voltage Reverse leakage current Tests conditions Tj = 25C Tj = 25C Tj = 100C BAR42 VF ** Forward voltage drop Tj = 25C BAR43 ALL
Pulse test: * tp = 5 ms, < 2% ** tp = 380 s, < 2%

Min. 30

Typ

Max. 500 100

Unit V nA A

IR = 100A VR = VRRM IF = 10mA IF = 50mA IF = 2mA IF = 15mA IF = 100mA

0.35 0.50 0.26

0.40 0.65 0.33 0.45 1 V

Table 6: Dynamic Characteristics (Tj = 25C) Symbol C trr Parameter Junction capacitance Reverse recovery time Detection efficiency Tj = 25C Tests conditions VR = 1V F = 1 MHz Min. Typ. 7 5 80 Max. Unit pF ns %

IF = 10 mA IR = 10 mA Tj = 25C Irr = 1 mA RL = 100 CL = 300 pF F = 45 MHz Tj = 25C Vi = 2 V RL = 50

Figure 1: Forward voltage drop versus forward current (typical values, low level)
IFM(A)
2.00E-2 1.80E-2 1.60E-2 1.40E-2 1.20E-2 1.00E-2 8.00E-3 6.00E-3 4.00E-3 2.00E-3 0.00E+0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50
Tj=50C Tj=25C Tj=100C

Figure 2: Forward voltage drop versus forward current (typical values, high level)
IFM(A)
5E-1

1E-1
Tj=100C

Tj=50C

1E-2

Tj=25C

VFM(V)
1E-3 0.0 0.1 0.2 0.3 0.4

VFM(V)
0.5 0.6 0.7 0.8 0.9 1.0 1.1

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Figure 3: Reverse leakage current versus reverse voltage applied (typical values)
IR(A)
1E+2
Tj=100C

Figure 4: Reverse leakage current versus junction temperature


IR(A)
1E+4 1E+3 1E+2
VR=30V

1E+1

1E+0

Tj=50C

1E+1 1E+0

1E-1

Tj=25C

1E-1

1E-2 0 5 10

VR(V)
15 20 25 30

VR(V)
1E-2 0 25 50 75 100 125 150

Figure 5: Junction capacitance versus reverse voltage applied (typical values)

Figure 6: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, e(Cu)=35m)
Zth(j-a)/Rth(j-a)
1.00

C(pF)
10
F=1MHz Tj=25C

= 0.5

= 0.2 = 0.1

0.10

2
Single pulse

VR(V)
1 1 2 5 10 20 30

tp(s)
0.01 1E-3 1E-2 1E-1 1E+0

=tp/T
1E+1

tp

1E+2

Figure 7: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m)
Rth(j-a)(C/W)
350
P=0.25W

300

250

200

150 0 5 10 15

S(CU)(mm)
20 25 30 35 40 45 50

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Figure 8: SOT23-3L Package Mechanical Data
A E

REF. A A1 B c D e e1 E H L S

e B e1 D

S A1

L H

DIMENSIONS Millimeters Inches Min. Max. Min. Max. 0.89 1.4 0.035 0.055 0 0.1 0 0.004 0.3 0.51 0.012 0.02 0.085 0.18 0.003 0.007 2.75 3.04 0.108 0.12 0.85 1.05 0.033 0.041 1.7 2.1 0.067 0.083 1.2 1.6 0.047 0.063 2.1 2.75 0.083 0.108 0.6 typ. 0.024 typ. 0.35 0.65 0.014 0.026

Figure 9: Foot Print Dimensions (in millimeters)


0.95 0.61

1.26

0.73

3.25

Table 7: Ordering Information Ordering type BAR42FILM BAR43FILM BAR43AFILM BAR43CFILM BAR43SFILM

Marking D94 D95 DB1 DB2 DA5

Package

Weight

Base qty

Delivery mode

SOT23-3L

0.01 g

3000

Tape & reel

Epoxy meets UL94, V0

Table 8: Revision History Date Aug-2001 16-Apr-2005 Revision 2B 3 Last update. Layout update. No content change. Description of Changes

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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com

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