Microelectronics Journal 35 (2004) 131143 www.elsevier.

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Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: a review
Chantal Khan Maleka,*, Volker Saileb
a

trologie des Oscillateurs (LPMO)-CNRS 32 Av. de lObservatoire, Besanc Laboratoire de Physique et Me on 25044, France b r Mikrostrukturtechnik (IMT), Universita t Karlsruhe and Forschungszentrum Karlsruhe GmbH, and ANKA, Institut fu mquelle Karlsruhe GmbH, P.O. Box 3640, D-76021 Karlsruhe, Germany Angstro Received 9 December 2002; revised 22 September 2003; accepted 3 October 2003

Abstract The by far leading technology for manufacturing MEMS devices is Si-micromachining with its various derivatives. However, many applications of microsystems have requirements on materials basis, geometry, aspect ratio, dimensions, shape, accuracy of microstructures, and number of parts that cannot be fullled easily by mainstream silicon-based micromachining technologies. LIGA, an alternative microfabrication process combining deep X-ray lithography, plating-through-mask and molding, enables the highly precise manufacture of high-aspect-ratio microstructures with large structural height ranging from hundreds to thousands of micrometers thick. These tall microstructures can be produced in a variety of materials with well-dened geometry and dimensions, very straight and smooth sidewalls, and tight tolerances. LIGA technology is also well suited for mass fabrication of parts, particularly in polymer. Many microsystems benet from unique characteristics and advantages of the LIGA process in terms of product performance. The LIGA technology is briey reviewed. The strengths of the manufacturing method and its main elds of application are emphasized with examples taken from various groups worldwide, especially in micromechanics and microoptics. q 2003 Elsevier Ltd. All rights reserved.
Keywords: LIGA; 3D-micromachining; High-aspect-ratio; Micromechanics; Microoptics; Microuidics

1. Introduction Several microfabrication technologies are available today and are used to fabricate microcomponents and systems. The most successful micromachining technologies have been developed as extensions of standard IC and microelectronics planar silicon-based processing. Others are based on advanced precision engineering and laser structuring. However, individual technologies including Si-micromachining or laser structuring are far from being sufcient to fulll the needs of the variety of problems posed by: The great variety of functions of most devices to be made, The specicity of surroundings in which they will operate,
* Corresponding author. E-mail addresses: chantal.khan-malek@lpmo.edu (C. Khan Malek), volker.saile@imt.fzk.de (V. Saile). 0026-2692/$ - see front matter q 2003 Elsevier Ltd. All rights reserved. doi:10.1016/j.mejo.2003.10.003

The optimum cost/performance ratio for the targeted application. Interest in a number of non-Si based machining methods stems from major deciencies of IC-based machining techniques: The need for using application-specic materials to optimize the functions and performance of various devices, The need to reduce cost by choosing low-cost materials, The difculty to construct truly 3D objects with planarbased processing continues to be a challenge. Precision and ultra-precision mechanical, electro-discharge, LIGA-based, and laser-based, micromachining techniques, to mention the most current ones, are such alternative techniques, each with their specic application domains and relative merits. LIGA-based processing, a sequence of microfabrication steps combining a step of deep X-ray lithography [1] [(DXRL), also called by some authors

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deep etch X-ray lithography], and subsequent additive processing of plating-through-mask and molding [2], has moved from emerging microfabrication technology to wellestablished non-silicon alternative microfabrication technology for MEMS. The LIGA technology provides unique advantages over other manufacturing methods in the fabrication of microstructures. LIGA-based technologies are used and further developed in a number of R&D institutes around the world. Spin-off companies and commercial companies have also evolved around largescale synchrotron facilities. Commercial application of the LIGA process is occurring. This short review will not go back to the physical and technological fundamentals of the technique [3 5]; it is rather intended to recall the essential steps of the process sequence and focus on a number of selected examples from recent work performed in various LIGA groups around the world and show the usefulness and advantages of this technology. The LIGA technology has been developed over a rather long time span of two decades. During that time other highaspect-ratio technologies such as UV photolithography in thick resist like SU8, often referred to as UV LIGA and Deep Reactive Ion Etching (DRIE) of silicon have evolved as well and challenge LIGA successfully in some specic application areas. For planning LIGA role in future manufacturing, a review of potential applications may serve as a basis. The fabrication of LIGA-parts concerning in particular the lithographic aspect, materials base expansion through replication technologies such as electroplating and moulding and some associated challenges, as well as some materials issues was reviewed in a former article by one of the authors [6].1 The basic LIGA process and some aspects of the process are recalled here to illustrate its strengths and discuss challenges, not in terms of materials properties [7] but in terms of applications. The purpose of this article is thus providing input on the discussion of the LIGA potential by summarizing proposals and ideas for LIGA applications found in literature.

Fig. 1. (a) Illustration of the basic LIGA process steps. The six panels stand for lithography, polymer components after development, electroplating and overplating the polymer template, a metal mold, and replication. (b) Basic LIGA process sequence.

irradiated parts of the resist layer in a chemical developer results in a polymeric relief replica of the mask pattern. Then, depending on the material and number of parts selected for the nal product, different fabrication routes can be chosen, which may include further steps of microreplication through electroforming and/or a variety of molding techniques (injection molding, embossing, casting, compression molding, etc.). The polymeric microstructure can be used: Simply as-is; As a lost mold for the formation of ceramic microparts; As an electroplating template to generate metallic microparts. The microstructures are often further dened by precision lapping to control thickness. As an electroplating template to produce a metallic master mold, which can then be used multiple times to mold cost-effective replicates in other materials, primarily polymers. When producing large numbers of electroplated components, the molded polymer parts are used as lost molds for a second plating process. The unique processing feature that enables the manufacture of thick microstructures characterized by very steep walls and very tight tolerances is the creation of highly

2. LIGA process and strengths 2.1. Basic process The basic LIGA process is described in Fig. 1. In the rst step of the LIGA process, an X-ray sensitive polymer (resist) layer up to several millimeters thick, typically polymethylmethacrylate (PMMA) is coated onto a conductive substrate. A pattern from a mask is therefore transferred into the thick resist layer via a 1:1 shadow proximity printing scheme using hard X-rays from a synchrotron radiation source. After exposure, selective dissolution of the chemically modied
1

Many references are not repeated in this review.

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precise resist template by deep X-ray lithography using X-ray photons from a synchrotron radiation source. Features characterizing this process are listed below: As a result of their high energy, these X-rays are capable of deeply penetrating thick (e.g. hundreds of micrometers or even millimeters) layers of polymeric resist, allowing uniform deposition of energy in the depth of the resist and the formation of tall microstructures in one exposure step. The short wavelengths of X-ray photons provide high resolution for patterning due to low diffraction effects. The very small vertical angular divergence of the X-ray beam achieves high accuracy in pattern transfer from the mask. Due to their excellent collimation the X-rays penetrate thick resists with extremely low horizontal run-out (less than 0.1 mm/100 mm thickness), thereby producing the substantially vertical walls for which LIGA structures are well known. The almost parallel (well collimated) light of X-ray beams produced by synchrotron radiation sources also allows printing with large depth-of-eld. A large working gap between mask and substrate can then be used in non-traditional pattern transfer as for the manufacture of slanted structures or for pattern formation on substrates presenting a large topography. The vertical sidewalls are optically smooth with typical local roughness of the order of 10 nm and longer-range waviness such as slope errors or steps determined solely by the accuracy of mask writing. Some aspects in utilizing synchrotron radiation for LIGA are: A widely perceived drawback in using LIGA-like processes is that synchrotron radiation is the optimum exposure source and thus requires access to large accelerators. However, deep X-ray lithography is one of the demanded services, which has led to improved storage ring access to the point where it may be acquired as a foundry service and can be provided as part of a distributed manufacturing process, as for example ion implantation. It is worth noting in this context that the cost of lithography at synchrotron radiation sources is not a limiting factor in the overall cost of a mold. Entirely different is the case of direct LIGA [8] when each batch of parts is produced with X-rays. Then access to a synchrotron facility, intensity of the source, cost per hour of X-rays, exposure eld size, and others become crucial factors for the economics of LIGA fabrication. Specialized equipment for the LIGA process is currently commercially available (from companies such as, e.g. Jena-Optics and Technotrans), besides the custom equipment that various groups have developed. Companies and institutes worldwide provide services for mask making (e.g. ANKA GmbH), X-ray exposure (e.g. ANKA GmbH

and CAMD), development, electroplating (e.g. TVJ Dover Industrial Chrome, Inc., Dynamics Research Corporation (DRC), etc.), post-processing, molding (e.g. microParts GmbH, Mezzo Systems Inc.,), etc. Exposure cost is being dramatically reduced by the use of a new very sensitive X-ray resists such as SU8 (which has been developed as a UV resist for photolithography but proved very sensitive to X-rays as well [9]). Little effort has been devoted up to now to optimize the cost of exposure and access for LIGA applications on synchrotron facilities that have originally been developed for totally other applications. Therefore, the margin for improvement in that eld is very large [10]. Once the master mold is prepared, the replication steps of microelectroplating and micromolding can be carried out away from the synchrotron source. The development and utilization of new application-specic materials has become one of the key challenges for the commercial production of microcomponents and systems. This applies, in particular, to the LIGA process and is offered through various replication techniques. Electroforming and various types of molding techniques extend the materials basis. They also allow for low-cost mass production. The best strengths of the LIGA technology lie in several key functional areas: Large to very large structural heights, typically from hundreds to thousands of micrometers thick that can be formed in one single step, Smallest lateral dimension of a few micrometers with structural details in the sub-micrometer range, Access to a large base of functional materials: electroplated metals and alloys, molded polymers [11], ceramics, composites, multilayered materials, gradedmaterials, nanomaterials, etc. The development and utilization of application-specic materials have become one of the key challenges for the commercial production of microcomponents and microsystems. This applies, in particular, to the LIGA process and is offered through the various replication techniques that extend the materials basis. Formation of complex shapes, * Free lateral shape, * Mastering of the third dimension, not only by achieving deep structures with high aspect ratios, but also more complex structures involving multilevel and oblique shape structures (see paragraph 3), Structural accuracy of features, * Good dimensional control over the entire structure height, * Very precise shape denition of parts, both laterally in terms of dimensional control and in term of straightness and planarity of sidewalls,

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Low surface roughness of side-walls (rms roughness of 20 nm or better), which is an essential factor for microoptical components [12], Typical feature sizes of several micrometers with structural height of several 100 mm to several 1000 mm and sub-micrometer details are routinely available [13]. Extreme parallelism/verticality of sidewalls with slopes of the order of 1 mrad.

Mixing of scales (small features on large parts), which is important for several applications that call for a macroor meso-scale main part with microscale features, e.g. patterning of optical waveguides. Optical transparency of plastics, mainly PMMA-based, within a wide range of wavelengths (typically between 200 and 900 nm) and low autouorescence, which makes these materials well suited for optical applications. Large process latitude. In particular, X-ray lithography functions with large depth of eld, allowing for pattern formation on non-planar surfaces [14]. Combination with CMOS type processes possible as well as with other microfabrication techniques, e.g. high precision mechanical engineering, silicon surface and bulk micromachining, sacricial layers, membrane technique, etc. Collective manufacturing by parallel processing of parts (batch fabrication) to reduce cost of fabrication. Possibility of high-volume low-cost production. The original formulation of the LIGA process included molding, by injection molding or hot embossing, as the technology for mass fabrication. Finally, fab-lines for LIGA components have been established complying with rigorous quality management systems [15].

One based on the sequential planar formation of individual levels to form 3D structures [16]. Fabricating such 3D structures by multiple level, aligned X-ray exposures requires additional processes such as * An accurate replanarization process such as precision lapping after each electroplating step enabling subsequent resist application, * A mask-alignment procedure between each conventional DXRL cycle with special alignment gear and alignment marks on the mask and the substrate. The other with spatial variation of the absorbed dose. Off-axis X-ray exposures and exposures where mask and/or substrate are moved in non-standard schemes during irradiation are capable of forming complex threedimensional structures. They require: * Tilting and/or rotation of the mask and/or substrate system during exposure [17 20] or oscillation of the mask [21]; the use of specialized exposure xtures or sophisticated stages permit angular positioning and rotation of the substrate and/or mask during X-ray exposure. The capability of nearly arbitrary angled resist patterning allows for the formation of multiple angled cylindrical surfaces and a wide range of geometries. * Software packages modeling the dose deposited inside the resist with complex exposure scheme. The technique can also be extended to the manufacture of 3D, more complex systems by: Stacking and assembling various levels of microfabricated structures or by bonding several superimposed structure levels * Multiple materials (e.g. non-silicon materials, e.g. for magnetic actuation) and multiple levels; free-moving parts, * The release of parts through the use of sacricial layers, * Requires small part handling. Forming stepped structures, thus shaping the third dimension, for example by combining DXRL with other process steps or other techniques, e.g. by machining the substrate into a 3D geometry before applying the resist layer. The fabrication of micromechanical sensors and actuators often requires movable parts, which can be achieved by combining the LIGA process with a sacricial layer technique. Many microsystems make use of a combination of various microfabrication techniques. Micromechanical and microoptical structures can be combined with microelectronic devices to form intelligent microsystems. Several methods have been used to combine various functions and materials.

2.2. Towards building 3D systems with LIGA Lithography is often considered as a planar process step. Deep X-ray lithography extends to a third out-of-plane dimension through forming microstructures with high vertical or oblique sidewalls. Typically LIGA structures allow for the free choice of the lateral 2D pattern that is projected into the third dimension to form prismatic or cylindrical geometries. This technique has generally been used to produce structures with straight walls. However, for all major LIGA process steps, variations have been developed that increase the fabrication exibility. Geometrical variations in that third vertical dimension are possible and can be obtained in different ways by modifying or combining process steps, in particular for producing shapes with increased dimensionality. The 3D structural construction with LIGA technique can be primarily classied in two categories:

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Many devices successfully demonstrated interfacing of bulk or surface silicon micromachining and LIGA through assembled and co-processed integration in advanced, integrated systems. However, in most cases a monolithic approach where the LIGA components such as sensors and actuators are co-processed on the same chip with the silicon-based processing circuitry is difcult due to low compatibility of processes, though some examples exist such as the fabrication of LIGA microstructures on CMOS wafers using deep X-ray lithography [22] or molding techniques [23,24]. Alternative hybrid concepts for integrating components and circuitry made from the most appropriate materials made on separate substrates offer the possibility to build up miniaturized systems with optimum performances and reduced cost. For example an accelerator sensor has been integrated with ASICs [25]. To date, the majority LIGA MEMS has been accomplished by hybrid integration of individual LIGA components with electronics. In practice, only components with the highest precision requirements are fabricated by LIGA, whereas the other parts are produced by other methods. Approaches to microassembly of high aspect-ratio metal mechanisms benet from conventional and silicon micromachining technology. Bonding approaches such as diffusion bonding or press-t assembly proved powerful approaches to achieving multilevel mechanisms. Complex three-dimensional millimeter-sized structures can also be constructed using a peg-board approach, which offers increased exibility for batch assembly of LIGA fabricated devices [26]. A ip-chip assembly technique by means of electroplating at a low processing temperature has also been applied to the integration of high-aspect-ratio microstructures with substrates that have pre-fabricated microelectronics massively and in parallel. As such, it provides a powerful way to achieve the integration of meso- and microscopic electromechanical systems [27]. In many cases, hybrid integration and in particular hybrid assembly imposes good tolerances and alignment accuracy. The evolution of microfabrication technologies from laboratory-scale prototyping to a viable manufacturing process requires the ability to set dimensional tolerances and clearance ts at the design stage. To do this requires evaluation, characterization and understanding of the magnitude and origin of dimensional variation in microfabricated components [28] as well as development of a consistent set of specications for clearance and tolerance in microfabricated and micro assembled parts [29,30]. Specic tools and methods for automated and parallel assembly of LIGA-fabricated systems are being developed [31 43].

worldwide [44 50]. The presence of thick, deep and highly precise microstructures with high aspect ratios is a requirement for a number of micromechanical, optical or packaging applications, as well as in other elds.

3.1. MEMS, high-precision parts and tooling One primary application area for the LIGA technique is the batch fabrication of precision actuators and mechanisms [51,52]. The goal is producing mechanically sturdy and stable, yet highly precise structures for microactuators for a variety of applications. Large structural heights are also advantageous to achieve microdevices, which are capable of generating sufcient force and/or torque to be functional. Most difculties for producing powerful microactuators arise from the use of essentially planar technologies and severe materials restrictions associated with them. The material basis is enlarged in particular towards metallic and magnetic materials. The possibility of accurately shaping magnetic materials with a large volume through electroplating or casting and sintering allows large magnetic forces. Typical examples are magnet rings, motor parts [53]. High accuracy and tight tolerance for a variety of moving elements such as shafts, contacting parts, bearings [54] and gears. Miniaturized gear systems [55] are a typical example of micromechanical systems where LIGA technology demonstrates its superiority by producing the various gears with sufcient height and excellent tolerances. The precision of LIGA allows for the fabrication of gears with minimized backlash and friction. The free design in two dimensions allows for the creation of structures with specic optimized geometries [56,57]. The steep and precise prole in conjunction with the smoothness of side-walls are very well suited to good tting and assembly of various components such as rotor and shaft. Many components with those improved performances have a high potential in application elds such as microsurgery, robotics and assembly, automotive and aerospace industry, military sang and arming devices for munitions [58,59] (force, precision and reliability): * Micromotors [60 67]-rotors and -drivers with appreciable torques [68], microturbines [69] generating power for a variety of applications, various actuators [53,70 73] and sensors based on electrostatic or electromagnetic-based principle [74,75], e. g. mechanical microconnectors using magnetic force [76], high precision micromechanical actuators for electrical switches and relays, optical switches, uid control valves and pumps, etc.

3. Applications of LIGA Applications for deep microstructures exist in many sectors of R&D activity and as industrial products,

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Various sensors and actuators where surface area dependent structures benet from the height/mass/volume for better performances such as improved sensitivity/resolution, for actuators systems, lower driving voltage, etc. Examples are found in microgyroscopes [77,78], and capacitive acceleration sensors [79] for automotive and aerospace industry, trajectory sensing devices, mass spectrometers [80], switches and relays [81], magnetic sensor [82], magnetoelectric devices [83], electrostatic actuators, e.g. for magnetic head tracking system of hard disk drives [84], new type of transistors [85], various types of transducers [86 88], and detectors [89 96]. More robust microprobes [97,98], grippers [99 102], and manipulators for interfacing the micro/nanoworld with the macro-world or for precision handling and manipulating mechanical or biological micro/nano-objects; Flexural stiffness of microstructures constraining the motion to a plane, e.g. springs and coils; the height provides greater structural strength and rigidity.

precise to form edge reference structures in a number of applications. 3.2. MOEMS, optics and communication Another application, for which LIGA components provide superior performance, is in the eld of microoptical components and systems [110,111]. The technical viability of the LIGA-approach for fabricating microoptics has been demonstrated for a variety of cases such as: Miniature optically-based sensors such as microspectrometers for different wavelength ranges [112 114], interferometers for various applications [115],distance sensor [116], polarization sensor [117], microchopper [118], wavefront sensor [119], etc. * The use of microoptical systems in optical telecom and datacom [120]. Applications in this eld require a variety of optical microcomponents, both active and passive, many of which can be economically produced through LIGA. In particular, through LIGA, polymers offer a broad range of materials that can also be tailored to specic requirements, providing exibility and cost advantage over other materials. Additionnally, the LIGA-based replication processes enable high-volume production of parts and systems of low-cost and high performance. They include: Batch fabrication of optical components [121] such as microlenses [122,123], gratings [124], mirrors [125], and lters. The sidewalls of LIGA components are inherently optical ats with surface roughness (of 30 nm or under) low enough to make those structures suitable for optical applications as well as compatible with industry specications on elimination of scattering. Some possible applications of multiple oblique X-ray exposure techniques are the fabrication of optical devices such as microprisms [126], cat-eye reectors, two and 3D photonic band gap microstructures [127 129]2 The high aspect ratio capabilities of LIGA combined with its excellent spatial resolution and patterning accuracy over large eld sizes are utilized for manufacturing a variety of passive optical components based on light-guiding elements, optical benches, base plates and high precision mechanical holders and xtures, as well active components. They include: Complex planar optical waveguiding structures [130,131] are achieved through stacking a combination of transparent optical polymer layers of adequate refractive index on top of each other. This layer stack can be structured
A special paragraph further down in the text deals on X-ray components, including crossed lenses for X-ray focusing produced by multiple oblique X-ray exposures (Ref. [162]).
2

Nozzles for a variety of applications. The attractive feature is here the high precision combined with the smooth surface state as well as application-specic tailored geometries and materials. Examples are: * Spinnerets for textile ber [103] of better quality and lifetime, * Nozzles for ink-jet printing type applications, * Nozzles for uid injection systems in various applications: automotive, aerospace, etc. Passive high-added-value highly precise parts for integrated tooling and mold manufacturing. The precision of fabrication, the accuracy of assembly process, and the resistance to wear are here attractive features. The examples include microtools for various techniques [104]: * Mold inserts/dies for a number of replication technologies [105,106,50]. The capability to have straight and smooth sidewalls facilitates the demolding process of the molded microparts. In many cases, complex molds are built up in a modular way by combining levels made by LIGA with those made by precision engineering techniques, * Electrode arrays for microEDM [107], * IC leadframe punches [108]; * 3D carriers for microdevices have also been produced by LIGA [109]. LIGA is also a powerful tool for manufacturing positioning structures with the highest of precision. Structural heights are sufciently thick to form passive, robust xturing guides for other components such as bers, lenses, etc. (see next paragraph) and sufciently

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to perform optical functions both horizontally and vertically, for example with mirrors, lenses, 3D gratings, Hollow waveguides and waveguide cavities have also been made for visible light, longer wavelength in the IR, and for the terahertz range [132]. Various high precision mechanical positioning structures such as mounts, supports and connectors for accurate and robust aligning, mounting, coupling and interconnecting [133 141], assembling, and packaging of components [142,143], devices, and systems. Splices, directional couplers, holders for optical bers or optical stops can be produced by deep X-ray lithography, where features such as grooves or pins allow for reproducible positioning of ball lenses, detectors, light sources, bers, etc. without time consuming manual alignment. Waveguides and ber positioning grooves (including V-grooves with arbitrary slope, which is an advantage compared to what can be produced with silicon-based grooves) can also be achieved using aligned and stepped exposures and/or embossing elements. The extremely high precision achieved garantees the exact position of the optical components, minimizing optical losses. For hybrid optical systems and free space microoptical set-ups, an optical bench shows advantages upon actively aligned counterparts [144,145]. The reduction of the number of degrees of freedom in alignment leads to distinct savings in cost and time. In addition the use of LIGA allows extending the materials base for microoptical benches from polymers to ceramics for better thermal management and lower thermal expansion. Micrometer to sub-micrometer positioning accuracy of the microoptical elements is guaranteed by the LIGA technique. LIGA is also a scalable approach well suited for monolithic integration in one substrate of optical and mechanical functionalities, allowing the reduction of the degrees of freedom for critical alignment. For example, passive berto-chip coupling with ber alignment to optical chips based on mechanical alignment can be realized by structures for guiding pins. The accuracy of patterning such systems, even in multiple levels with accuracies in the range of several micrometers, is ideally suited for assembly and packaging of hybrid optical systems at micron or sub-micron precision without the need for active alignment.

Optical processing elements to perform functions such as ltering, beam splitting, attenuating, and redirecting optical signals: 3D diffraction gratings; a variety of switches [146 149,47,150], which are key components for optical networks: by-pass switch, cross-connect matrix switch for reconguration of systems in high-speed optical datacom networks; Coupling and interconnecting components for optical backplane for computer applications such as 1 N splitters and N N star couplers [151]. 3D high-power microwave, millimeter-wave photonics and RF components [152] and devices [153], transmission lines, antennas, couplers, lters and resonators [154], etc. Since the sidewalls of these structures can be made accurate, smooth, and highly vertical, closely spaced, tall microstructures in thick metal able to conduct heat in highly coupled circuit topologies can be fabricated. X-ray optical components [155 162] Various components for accelerators: mm-wave linac [163], W-band klystron, and accelerator structures [164]. 3.3. Microuidics and bio-MEMS The development of miniaturized devices for microuidics holds great promise for high throughput screening and drug discovery as well as therapeutic drug delivery: in particular multifunctional analytical systems in the rapidly growing eld of lab-on-a-chip devices or microTotalAnalysis Systems (m-TAS). Besides the medical/biological elds, microuidics systems also nd applications in many other els, such as chemical and biotech systems [165], optical systems, ink jet printers, heat exchange, etc. They consist of a number of components and systems that can be fabricated in part or in total by LIGA and exploit a number of characteristics linked to the high aspect ratio nature of the microfabricated structures. For many applications such as reactions of uids in crossing channels well-dened interaction volumes provided by LIGA are of crucial importance. Furthermore, plastic microstructures are desirable as low-cost material for microuidic components for a number of portable analytical and single-use disposal medical or biological applications. LIGA was used in diverse microrouidic building blocks [166,167] such as microchannels, reaction chambers, integrated heat exchangers [168], mixing or separation [1] capabilities, micropumps [169 172], microvalves [173 175], microsieves, lters and membranes [176 178], microinjectors [179] and-extractors, catalyst carriers, microplates [180], various sensors and actuators [181 184], as well as various integrated systems such as inhalers [185], electrophoretic devices [186,187], gas chromatographs [188], microthrust and heat generator [189], as well as complete systems such as miniature modular microuidic

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chips with processing units, monitoring and diagnosing systems [190]. Cells combining electrochemistry and spectroscopic applications have also been produced, for the control of electrochemical microreactions [191].

industries and will push fabrication of such molds forward. Much effort still has to be devoted to the commercialization of LIGA-based products, in particular, time-to-market, process stability, quality, and cost are key issues for a broad industrial implementation of LIGA.

4. LIGA products 5. Conclusion Though there is active R&D in LIGA in several groups around the world and prototyping with commercial companies is active, commercialization of LIGA products has been rather slow but is developing. Products manufactured by using LIGA and associated processes have emerged worldwide in companies [192 196]. In addition, LIGA foundry capabilities have been established, providing easy access to synchrotron radiation [197,13]. Several groups are also offering process know-how that can be licensed by commercial entities interested in LIGA production. Applications in the defense sector are also expanding, especially in the US [198]. Exactly what market share will be for LIGA still remains to be determined. A few products with LIGA-parts are presently commercially available, such as: MicroSpectrometer (see Fig. 2) for visible and IR ranges [192], Mechanical gear systems [193,194], Optical ber connectors [141], Microalignment exures for photonics platform [196]. This success was made possible in part by a consistent and consequent focus on making the technology reliable for manufacturing purposes [199]. Nevertheless, LIGA has been limited to niche markets, predominantly due to the complex production infrastructure required. Unlike for Si microfabrication, where a vast array of processes, originally developed with billions of US$ for the electronics industry, is available, LIGA processes have been developed at institutes with comparatively modest resources. However, the superior qualities, in particular of LIGA molds, for mass production of polymer parts are increasingly recognized by LIGA is a exible technology that offers several advantages over other microfabrication techniques. The fabrication of components, systems or molds using Deep-X-Ray-Lithography remains the most precise batch technique available for the manufacture of microobjects with large structural height and high aspect ratio. Most of the interest in LIGA is associated with the ability to provide these microstructures in a large selection of materials, in particular in metal or polymer, through replication techniques. The usefulness and exibility of the technique is further extended through advanced processing, sacricial layers, multilevel and oblique exposures, and combination with other microstructuring processes through multiprocessing or assembly. LIGA technology is particularly well suited for fabricating polymer components where high aspect ratios, smooth surfaces and submicron accuracies are required. The main elds of current applications are in mechanical devices and microoptics, in particular, for sensing, optical telecom and datacom networks. Future high-impact elds may include large-area high-precision patterning and, in general, the fabrication of moulding tools for various applications including polymer uidics. In the latter example the extremely smooth surfaces are the most attractive feature of LIGA when compared to more traditional fabrication techniques such as milling or microelectro-discharge machining. A second route, producing components directly with Deep-X-Ray-Lithography is currently being explored. Here cost has been prohibitively high due to the long exposure times of the PMMA resist. However, recent progress with new resists, in particular EPON SU-8 with dramatically increased sensitivity as compared to PMMA

Fig. 2. LIGA-Spectrometers (Steag Microparts GmbH) in various products for color determination in dentistry, quality control, and health care.

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has been encouraging. After establishing a robust process with such a resist Direct-LIGA could become feasible, at least for small and medium size volume production of specic components.

References
[1] E.W. Becker, et al., Production of separation nozzle systems for uranium enrichment by a combination of X-ray lithography and galvanoplastics, Naturwissenschaften 69 (1982) 520523. [2] W. Becker, et al., Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process), J. Microelectron. Engng. 4 (1986) 3556. [3] M. Madou, Fundamentals of Microfabrication, CRC Press, Washington, DC, 1997. [4] C.R. Friedrich, High aspect ratio processing, in: P. Rai-Choudhury (Ed.), Handbook of Microlithography, Micromachining and Microfabrication, vol. 2: Micromachining and Microfabrication, SPIE Press Monograph, PM 39, 1997, pp. 299 377, Chapter 6 [5] W. Menz, J. Mohr, O. Paul, Microsystem Technology, Wiley VCH, Weinheim, 2001. [6] C. Khan Malek, Fabrication of high-aspect-ratio precision MEMS with LIGA using synchrotron radiation, SPIE Proc. 4592 (2001) 119130. [7] J. Hormes, et al., Materials for LiGA and LiGA-based microsystems, Nucl. Instrum. Meth., B 1999 (2003) 332341. [8] H. Guckel, et al., Direct high throughput LIGA for commercial applications: a progress report, J. Microsyst. Technol. 6 (2000) 103105. [9] R. Lawes, et al., LIGA: a fabrication technology for industry ?, Proc. SPIE 4593 (2001) 145 155. [10] V. Saile, Strategies for LIGA Implementation, in: H. Reichl, E. Obermeier (Eds.), Microsystem Technologies 98, Sixth International Conference on Micro Electro, Opto, Mechanical Systems and Components; Potsdam, VDE-Verlag, 1998, pp. 2530. [11] P. Bley, Polymersan excellent and increasingly used material for microsystems, SPIE Proc. 3876 (1999) 172 184. [12] D. Munchmeyer, W. Ehrfeld, Accuracy limits and potential applications of the LIGA technique in integrated optics, SPIE Proc. 803 (1987) 7279. [13] ANKA GmbH: http://www.anka-online.de [14] F.T. Hartley, C. Khan Malek, Nanometer X-ray lithography, SPIE Proc. 3892 (1999) 6979. [15] D. Maas, B. Karl, V. Saile, J. Schulz, Manufacturing of microcomponents in a research institute under DIN EN ISO 9001, Proc. SPIE 4174 (2000) 416 426. [16] S. Massoud-Ansari, P.S. Mangat, J. Klein, H. Guckel, A multi-level, LIGA-like process for three dimensional actuators, IEEE Proc. MEMS96 (1996) 285289. [17] O. Tabata, et al., 3D fabrication by moving mask Deep X-ray Lithography (M2 -DXL), with multiple stages, IEEE Proc. MEMS2002 (2002) 180183. [18] G. Feiertag, W. Ehrfeld, H. Lehr, M. Schmidt, Sloped irradiation techniques in deep X-ray lithography for 3D shaping of microstructures, SPIE Proc. 3048 (1997) 136143. [19] D.Y. Oh, et al., A tetrahedral three-facet micro mirror with the inclined deep X-ray process, Sens. Actuators A93 (2001) 157161. [20] S. Sugimaya, H. Ueno, Novel shaped microstructures processed by deep x-ray lithography, Transducers 01-Eurosensors XV, 11th Int Cont on Solid-Stake Sensors and Actuators, Munich, Germany, June (2001) 1014. [21] K.-C. Lee, S.S. Lee, 3D fabrication using deep X-ray mask with integrated micro-actuators, IEEE Proc. MEMS03 (2003) 558561.

[22] S. Stadler, P.K. Ajmera, Integration of LIGA structures with CMOS circuitry, SPIE Proc. 3046 (1997) 230 241. [23] A. Both, et al., Fabrication of LIGA acceleration sensors by aligned molding, Microsyst. Technol. 2 (3) (1996) 104108. ller, et al., Flexible integration of nonsilicon microstruc[24] K.-D. Mu tures on microelectronic circuits, IEEE Proc. MEMS98 (1998) 263 267. [25] M. Strohrmann, et al. Smart acceleration sensor systems based on LIGA micromechanics, in: H. Reichl (Ed.), Microsystem Technologies 94, 1994, pp. 753 762. [26] T.R. Christenson, Advances in LIGA-post-mold fabrication, SPIE Proc. 3511 (1998) 192203. T.R. Christenson, D.T. Schmale, A batch wafer scale LIGA assembly and packaging technique via diffusion bonding, IEEE Proc. MEMS99 (1999) 476 481. [27] L.-W. Pan, L. Lin, J. Ni, A ip-chip LIGA assembly technique via electroplating, J. Microsyst. Technol. 7 (1) (2001) 40 43. [28] C.G. Khan Malek, R. Wood, B. Dudley, P. Genova, Metrology study of structural transfer accuracy for high-aspect-ratio microelectromechanical systems (MEMS): from optical mask to polished electroplated parts, J. Vac. Sci. Technol. B 16 (6) (1998) 3552 3557. [29] B.L. Dearth, R.G. Steinhoff, LiGA measurement and acceptance evaluation, Microsyst. Technol. 9 (3) (2003) 197203. [30] H. Last, et al., MEMS reliability, process monitoring, and quality assurance, SPIE Proc. 3880 (1999) 140147. [31] W.K. Schomburg, et al., Assembly for micromechanics and LIGA, J. Micromech. Microengng. 5 (1995) 5763. [32] U. Gegenbach, Automatic assembly of micro-optical components, Proc. SPIE 2906 (1996) 141150. [33] C.M. Egert, K.W. Hylton, Automated assembly: a high throughput, low cost assembly process for LIGa-fabricated micro-components, Microsyst. Technol. 4 (1) (1997) 2527. [34] T.R. Christenson, Advances in LIGA-based post-mold fabrication, SPIE Proc. 3511 (1998) 192203. [35] J. Feddema, et al., Experiments in micromanipulation and CADdriven microassembly, Proc. SPIE 3202 (1998) 98107. [36] J. Feddema, T. Christenson, Parallel assembly of high-aspect-ratio microstructures, Proc. SPIE 3834 (1999) 153164. [37] T.R. Christenson, D.T. Schmale, A batch wafer scale LIGA assembly and packaging technique via diffusion bonding, IEEE Proc. MEMS99 (1999) 476 481. [38] Y. Ansel, et al., Development of tools for handling and assembling microcomponents, J. Micromech. Microengng. 12 (2002) 430437. [39] M. Niehaus, et al., Tools and methods for automated assembly of miniaturized gear systems, Proc. SPIE 4194 (2000) 3343. [40] W. Ehrfeld, et al., Highly parallel mass fabrication and assembly of microdevices, Microsyst. Technol. 7 (4) (2001) 145 150. [41] A. Gerlach, et al., Assembly of hybrid integrated micro-optical modules using passive alignment with LIGA mounting elements and adhesive bonding techniques, Microsyst. Technol. 7 (1) (2001) 2731. [42] U. Wallrabe, et al., Characterization of a micro optical distance sensor, Proceedings of IEEE/LEOS, International Conference on Optical MEMs, Lugano, August, 2002, pp. 2023. [43] P. Li-Wei, L. Lin, Batch transfer of LIGA microstructures by selective electroplating and bonding, IEEE Proc. MEMS2000 (2000) 259 264. [44] A. Rogner, et al., The LIGA techniquewhat are the new opportunities?, J. Micromech. Microengng. 2 (3) (1992) 133140. [45] W. Ehrfeld, A. Schmidt, Recent developments in deep X-ray lithography, J. Vac. Sci. Technol. B16 (6) (1998) 35263534. M. Abraham, et al., Microsystem: between research and industrial application, Engineering 4142 (1998) 47 52. [46] W. Menz, LIGA and related technologies for industrial applications, Sens. Actuators A 54 (13) (1996) 785 789.

140

C. Khan Malek, V. Saile / Microelectronics Journal 35 (2004) 131143 Technology, (HARMST01), Baden-Baden, Germany, June 2001, pp.207208. H. Guckel, et al., Electromagnetic linear actuators with inductive position sensing for micro relay, micro valve and precision positioning applications, Sens. Actuators A 53 (13) (1996) 386391. E.J. Garcia, et al., Design and fabrication of a LIGA milliengine, Proceedings of IEEE Transducers97, Chicago, June 1997, pp. 765768. H. Guckel, et al., Electromagnetic, spring constrained linear actuator with large throw, Actuator94, Bremen, Germany, June 15 17, 1994. H. Guckel, et al. Closed loop controlled, large throw, magnetic linear microactuator with 1000 micron structural height Proc. MEMS98, 1998, pp. 414 418. J. Mohr, et al., Fabrication of microsensor and microactuator elements by the LIGA process, Proceedings of Transducers91, San Francisco, CA, June 24 27, 1991, pp. 607609. H. Lehr, et al., Application of the LIGA technique for the development of microactuators based on electromagnetic principles, J. Micromech. Microengng. 2 (1992) 229233. T. Haga, et al., Development of microconnector with an automatic connecting/disconnecting mechanism, Microsyst. Technol. 6 (4) (2000) 157 160. K. Schumacher, et al., Micromechanical LIGA gyroscope, Transducer99, Sendai, Proceedings, vol. 1, June 1999, pp. 1574-1577. Y.M. Desta, et al., Fabrication of Micromachined Resonating Cylinder Gyroscopes, Book of Abstract HARMST01, BadenBaden, Germany, June 2001, pp. 259-260. M. Strohrmann, et al., Acceleration sensor with integrated compensation temperature effects fabricated by the LIGA process, Sens. Actuators, A 4142 (1994) 426429. A. Both, et al., Fabrication of LIGA acceleration sensors by aligned molding, Microsyst. Technol. 2 (3) (1996) 104108. A. Chutjian, et al., Miniature micromachined quadrupole mass spectrometer array and method of making the same, US patent 6,188, 067, 2001. E. Tabat, H. Guckel Single coil bistable, bidirectional micromechanical actuator, US patent 5,803,385, 1998. H. Zhang, et al., Microfabrication of a Magnetic Field Sensor Based on Electrodeposited Giant Magnetoresistant Material, Proceedings of IEEE International Symposium on Test and Measurement (ISTM/ 97), Beijing, China, June 1997, pp. 661665. T. Wang, High-aspect-ratio microstructures for magnetoelectronic applications, SPIE Proc. 4979 (2003) 464471. S. Nakamura, et al., An electrostatic microactuator using LIGA process for a magnetic head tracking system of hard disk drives, J. Microsyst. Technol. 5 (2) (1998) 6971. P.K. Ajmera, I.-H. Song, Laterally movable gate (LMGFET) for onchip integration of MEMS with electronics, SPIE Proc. 4334 (2001) 30 37. B. Choi, et al., Development of pressure transducers utilizing deep X-ray lithography, International Conference on Solid-State Sensors and Actuators (1991) 393396. Y. Hirata, et al., Piezoelectric composites for micro-ultrasonic transducers realized with deep-etch X-ray lithography, Proc. MEMS98 (1995) 191 196. S. Takimoto, et al., Transformersa, inductors, power and magnetic device controlfabrication of thick lm magnetic cores for high frequency using LIGA process, IEEE Trans. Magnetics 37 (4-1) (2001) 28882890. M. Lemonnier, et al., First experimental results on new microstrip with three dimensional geometry, Nucl. Instrum. Meth., A 349 (1994) 274 276. J. Kawarabayashi, et al., Development of a micro-array type electron multiplier, Proc. IEEE MEMS98 (1998) 791 794. H. Zhang, Microfabrication of a magnetic eld sensor based on electrodeposited giant magnetoresistant material, Proceedings of

[47] J. Mohr, LIGAa technology for fabricating microstructures and microsystems, Sens. Mater. 10 (6) (1998) 363 373. [48] J. Skardon, M. Vandenberg, Developing new markets for high aspect ratio micro-machined devices, Microsyst. Technol. 5 (1998) 65 68. [49] S.-J. Chung, et al., LIGA technology today and its industrial applications, SPIE Proc. 4194 (2000) 44 55. [50] J. Hruby, The state of LIGA development, Semicon 2000, San Francisco, CA, July 2000. J. Hruby, LIGA technologies and applications, MRS Bull. April 2001 337340. [51] T.R. Christenson, et al., Micromechanics for actuators, SPIE Proc. 2220 (1994) 3947. H. Guckel, Progress in magnetic microactuators, Microsyst. Technol. 5 (2) (1998) 5961. [52] J. Schulz, A comparison of micro-actuators concepts in view of fabrication technologies and applications, Electrochem. Soc. Proc. 95-18 (1995) 436 450. [53] H. Guckel, et al., Laterally driven electromagnetic actuators, Tech. Digest 1994 Solid State Sensor and Actuator Workshop, Hilton Head Island, SC, pp. 49-52,1994. [54] L.S. Stephens, K.W. Kelly, K.W., Bearings and mechanical seals enhanced with microstructures, US patent 6617556, 2000. [55] C. Thueringen, et al., Construction and manufacturing of a microgearhead with 1.9 mm outer diameter for universal applications, SPIE Proc. 360 (1999) 526533. [56] S.J. Chung, et al., A micro-cycloid gear system fabricated by multiexposure LIGA, J. Microsyst. Technol. 6 (4) (2000) 149 153. [57] R. Degen, et al., Hollow shaft micro-servo actuators realized with the Micro Harmonic Drivew, Proc. Actuators 2002, Bremen June (2002). [58] L. Fan, et al., SLIGA based underwater weapon safety and arming system, J. Microsyst. Technol. 4 (4) (1998) 168171. [59] C.H. Robinson, Miniature, planar, inertially-actuated delay slider actuator, US patent 5,705,767, 1998. C.H. Robinson, Microelectromechanical systems (MEMS)-type high-capacity inertial-switching device, US patent 6,314,887, 2001. C.H. Robinson, Microelectromechanical systems (MEMS)-type devices having latch release and output mechanisms, US patent 6, 321,654, 2001. [60] H. Guckel, et al., Fabrication and testing of the planar magnetic micromotor, J. Micromech. Microengng. 4 (1991) 40 45. [61] H. Lehr, et al., Microactuators as driving units for microrobotic systems, SPIE Proc. 2906 (1996) 202210. [62] T.R. Ohnstein, et al., Micromechanical stepper motor, US patent 5, 929,542, 1999. [63] M. Nienhaus, et al., Design and realization of a penny-shaped micromotor, SPIE Proc. 3680 (1999) 592 600. [64] V.D. Samper, et al., Multistator LIGA-fabricated electrostatic wobble motors with integrated synchronous control, IEEE J. Microelectromech. Syst. 7 (2) (1998) 214223. [65] R. Ledworuski, et al., A new ultrasonic catheter system with micromotor and LIGA gear-boxes, Microsyst. Technol. 9 (12) (2002) 133136. [66] F. Yi, et al., A new process to fabricate the electromagnetic stepping micromotor using LIGA process and surface sacricial layer technology, J. Microsyst. Technol. 7 (3) (2001) 103106. [67] E.J. OSullivan, et al., Future directions in electroplated materials for thin-lm recording heads, IBM J. Res. Dev. 42 (5) (1998) 1 12. [68] A. Cox, E. Garcia, Development of a LIGA-based elastodynamic ying mechanism, SPIE Proc. 3329 (1998) 28. [69] U. Wallrabe, et al., Power characteristics of 3D operated microturbines for minimally invasive therapy, Proc. IEEE Transducers (1996) 462466. [70] R. Kondo, et al., High aspect ratio electrostatic micro-actuators using LIGA process, J. Microsyst. Technol. 6 (6) (2000) 210 213. R. Kondo, et al., Fabrication of thick lm magnetic core with high aspect ratio and long structure using LIGA Book of Abstract of Fourth International Workshop on High Aspect Ratio Microstructure

[71]

[72]

[73]

[74]

[75]

[76]

[77] [78]

[79]

[80]

[81] [82]

[83] [84]

[85]

[86]

[87]

[88]

[89]

[90] [91]

C. Khan Malek, V. Saile / Microelectronics Journal 35 (2004) 131143 IEEE International Symposium on Test and Measurements (ISTM97), Beijing, China, June 1997, pp. 661665. R.H. Liu, et al., Investigation of the LIGA process to fabricate microchannel plates, Proc. IEEE Transducers97 (1997) 645 648. K.H. Jackson, et al., Fabrication of miniaturized electrostatic deectors with LIGA, SPIE Proc. 2640 (1995) 204213. V.I. Kondratyev, et al., Preliminary testing of microstructured imaging plates with improved resolution, Nucl. Instrum. Meth., A 448 (12) (2000) 207 210. T.R. Christenson, et al., A variable reluctance stepping microdynanometer, Microsyst. Technol. 2 (3) (1996) 139 143. M. Inoue, et al., Development of new position sensitive electron multiplication device fabricated by LIGA process, Microsyst. Technol. 6 (3) (2000) 90 93. S. Akkaraju, et al., LIGA-based family of tips for scanning probe applications, SPIE Proc. 2880 (1996) 191 198. L. Huang, et al., Microfabrication of high aspect ratio BiTe alloy microposts and applications in micro-sized cooling probes, Microsyst. Technol. 6 (1999) 15. S. Ballandras, et al., Microgrippers fabricated by the LIGA technique, Sens. Actuators A 58 (1997) 265272. F. Yi, et al., A new sacricial layer method of LIGA technology to fabricate movable part of a gripper, J. Microsyst. Technol. 6 (4) (2000) 154156. M. Nienhaus, et al., Tools and methods for automated assembly of miniaturized gear systems, SPIE Proc. 4194 (2000) 3343. M.C. Carrozza, et al., Towards a force controlled microgripper for asssembling biomedical microdevices, J. Micromech. Microengng. 10 (2000) 271 276. Y. Cheng, et al., LIGA spinnerets for microber, Proceedings of Transducer99, Sendai, Japan, June 710, 1999, pp. 14521455. S.C. Tseng, et al. New pattern on fabrication of ber spinnerets by LIGA technologySPIE Proc., 3680, 1999, pp. 518525. H. Yang, et al., Ultra-ne machining tool/molds by LIGA technology, J. Micromech. Microengng. 11 (2001) 9499. J. Fahrenberg, et al., High aspect ratio multi-level mold inserts fabricated by mechanical micromachining and deep etch x-ray lithography, J. Microsyst. Technol. 2 (1996) 174 177. W. Bacher, et al., Fabrication of LIGA mold inserts, J. Microsyst. Technol. 4 (3) (1998) 117 119. S.M. Ford, et al., Rapid fabrication of embossing tools for the production of polymeric microuidic devices for bioanalytical applications, SPIE Proc. 4560 (2001) 207 216. K. Takhata, et al., A novel micro-electro-discharge machining method using electrodes fabricated by the LIGA process, Proc. MEMS99 (1999) 238243. K. Takhata, et al., High-aspect-ratio WC-Co microstructure produced by the combination of LIGA and micro-EDM, J. Microsyst. Technol. 6 (2000) 175178. Y. Cheng, et al., Ultra-deep LIGA process and its applications, Nucl. Instrum. Meth., A 467 468 (2001) 741 744. A. Cox, E. Garcia, Three-dimensional LIGA structures for use in tagging, SPIE Proc. 3673 (1999) 122126. D. Munchmeyer, W. Ehrfeld, et al., Accuracy limits and potential applications of the LIGA technique in integrated optics, SPIE Proc. 803 (1987) 72 78. J. Mohr, Micro-optical and opto-mechanical systems fabricated by the LIGA technique, SPIE Proc. 3008 (1997) 273 278. M. Gerner, et al., Micro-optical components for ber and integrated optics realized by the LIGA technique, Proc. IEEE MEMS95 (1995) 328333. J. Mohr, et al., Fabrication of a planar grating spectrograph by deepetch lithography with synchrotron radiation, Sens. Actuators, A 25 27 (1991) 571 575. P. Krippner, et al., Microspectrometer system for the near infrared wavelength range based on the LIGA technology, SPIE Proc. 3912 (2000) 141149.

141

[92] [93] [94]

[95] [96]

[97] [98]

[99] [100]

[101] [102]

[103]

[104] [105]

[106]

[107]

[108] [109] [110]

[111]

[112]

[113]

[114] D. Brennan, et al., Development of a micro-spectrometer system for process control application, Infrared Phys. Technol. 43 (2) (2002) 6976. [115] A. Ruf, A miniaturized FabryPerot AFM sensor, Proceedings of Transducers95-Eurosensors IX, Stockholm, Sweden, 1995, pp. 660 663. [116] H. Nakajima, et al., Micro-optical distance sensor fabricated by deep x-ray lithography, Opt. Engng. 40 (8) (2001) 16671673. [117] B. Stenkamp, et al., Miniaturised polarisation sensor as a concept for new optical microsystems, Proceedings of Transducers95, Stockholm, Sweden, June, 1995, pp. 160. [118] P. Krippner, et al., Electromagnetically driven microchopper for integration in microspectrometers based on LIGA technology, Proc. SPIE 3878 (1999) 144 154. renne ` s, et al., Characterisation of adaptive optic pyramid [119] F. Pe wavefront sensors fabricated by deep X-ray lithography, Microelectronic Engng. 6768 (2003) 566 573. [120] T. Paatzsch, et al., Polymer waveguides for telecoms, datacom and sensor applications, SPIE Proc. 3276 (1998) 16 27. H.-D. Bauer, et al., Manufacturing microcomponents for optical information technology using the LIGA technique, Proc. SPIE 3739 (1999) 224 229. [121] W.C. Sweatt, et al., A plethora of micro-optical systems, SPIE Proc. 4437 (2001) 125133. T.R. Christenson, W.C. Sweatt, Micro-optomechanical uses of deep x-ray lithography (X-optics)Book of Abstract HARMST01, BadenBaden, Germany, June (2001) pp. 34. [122] A. Picard, et al., Refractive microlens arrays made by contactless embossing, SPIE Proc. 3135 (1997) 96105. [123] M. Ilie, U. Danut, Miniaturized achromatic hybrid objective containing LIGA-made microlenses, SPIE Proc. 3879 (1999) 196205. [124] T.R. Ohnstein, et al., Tunable IR lters with integral electromagnetic actuators, Proceedings of Solid-State Sensor and Actuator Workshop, Hilton Head, South Carolina, June, 1996, pp. 196 199. J.A. Cox, et al. Optical performance of high aspect LIGA gratings II, Opt. Engng., 3711, 1998, pp. 28782884. [125] D.-Y. Oh, et al., A tetrahedral three-facet micro-mirror with the inclined deep X-ray, Sens. Actuators A93 (2) (2001) 157 161. [126] K.-H. Brenner, et al., Micro-optical set-up with microlenses and microprisms based on refractive optics, Proc. SPIE 1806 (1993) 228 233. [127] G. Feiertag, et al., Fabrication of photonic crystals by deep X-ray lithography, Appl. Phys. Lett. 71 (11) (1997) 14411443. M. Katsarakis, et al., Two-dimensional metallic photonic band-gap crystals fabricated by LIGA, Microsyst. Technol. 8 (23) (2002) 7477. [128] C. Cuisin, et al., Fabrication of three-dimensional photonic structures with submicrometer resolution by x-ray lithography, JVST B 18 (6) (2000) 3505 3509. [129] F. Romanato, et al., Fabrication of metallic photonic crystals by Xray lithography, J. Microelectron. Engng. 6768 (2003) 479486. [130] A. Rogner, W. Ehrfeld, Fabrication of light-guiding devices and ber-coupling structures by the LIGA process, Proc. SPIE 1506 (1991) 8091. [131] T. Paatzsch, et al., Polymer waveguides for optical backplane interconnects fabricated by the LIGA technique, Proceedings of Microsystem Technology98, Postdam, VDE-Verlag, Berlin, 1998, ISBN No3-8007-2421-9, pp7782. H.-D. Bauer, et al. Polymer waveguide devices with passive pigtailing: an application of LIGA technologySynth. Metals, 1151 3, 2000, pp. 1320. [132] I. Turcu, et al., X-ray micromachining of deep 3D terahertz waveguide components using a laser plasma source at 1 nm wavelength, SPIE Proc. 3157 (1997) 291299. [133] A. Rogner, et al., LIGA-based exible microstructures for ber-chip coupling, J. Micromech. Microengng. 1 (1991) 167170.

142

C. Khan Malek, V. Saile / Microelectronics Journal 35 (2004) 131143 [154] S.S. Gearhart, et al., Integrated micromachined transmission lines and endre slot antennas, SPIE Proc. 3225 (1997) 109118. T.L. Willke, S.S. Gearhart, LIGA micromachined planar transmission lines and lters, IEEE Trans. Microwave Theory Tech. 45 (10) (2002) 1681 1688. [155] R.A. Brennen, et al., Fabricating sub-collimating grids for an X-ray solar imaging spectrometer using LIGA techniques, SPIE Proc. 2640 (1995) 214 225. [156] K. Fischer, et al., Fabrication of 2D x-ray scatter grids for mammography, Proc. SPIE 4145 (2001) 227234. [157] M. Gerner, et al., Manufacturing pinhole arrays for X-ray source diagnostics using LIGA, Microsyst. Technol. 4 (4) (1998) 184 186. [158] R.K. Kupka, et al., X-ray transmission lenses by deep x-ray lithography and LIGA technique: rst results and fundamental limits, SPIE Proc. 3680 (1999) 508 517. [159] A. Peele, et al., LIGA fabrication of high-aspect-ratio lobster-eye optics, SPIE Proc. 4592 (2001) 406413. A. Peele, et al., Book of Abstract of HARMST01, Baden-Baden, Germany, June (2001) pp. 2324. [160] O.V. Makarova, et al., Microfabrication of freestanding metal structures released from graphite substrates, Proc. IEEE MEMS2002 (2002) 400 402. [161] L. Shabelnikov, et al., X-ray lens with kinoform refractive prole created by x-ray lithography, SPIE Proc. 4783 (2002) 176. [162] V. Nazmov et al., Refractive lenses fabricated by deep SR lithography and LIGA technology for X-ray energy range from 1 keV to 1 MeV, AIP Proceedings of SRI 2003, 25 29.08, San Francisco, USA, 2003. [163] J.J. Song, et al., LIGA fabricated compact mm-wave linear accelerator cavities, Microsyst. Technol. 4 (4) (1998) 193 196. [164] Y. Cheng, et al., Ultra-deep LIGA process and its application, Nucl. Instrum. Meth., A 467468 (2001) 741744. [165] http://www.ehrfeld.com. [166] W.K. Schomburg, et al., Microuidic components in LIGA technique, J. Micromech. Microengng. 4 (1994) 186 191. [167] M. Niggemann, et al., Fabrication of miniaturized biotechnical devices, SPIE Proc. 3511 (1998) 204 213. [168] K.W. Kelly, et al., Industrial applications for LIGA-fabricated micro heat exchangers, SPIE Proc. 4559 (2001) 7384. [169] R. Rapp, et al., LIGA micropump for gases and liquids, Sens. Actuators A 40 (1) (1994) 5761. B. Bustgens, et al., Micropump manufactured by thermoplastic molding, Proc. IEEE-MEMS94 (1994) 18 21. [170] A.S. Dewa, et al., Development of LIGA-fabricated, self-priming, in-line gear pumps, Proceedings of IEEE Transducers97, Chicago, June, 1997, pp. 757 760. [171] J. Doepper, et al., Micro-gear pumps for dosing of viscous uids, J. Micromech. Microengng. 7 (1997) 230232. [172] L. Huang, et al., LIGA fabrication and test of a DC type magnetohydrodynamic(MHD) micropump, Microsyst. Technol. 6 (2000) 235240. [173] W.K. Schomburg, et al., Active valves and pumps for microuidics, J. Micromech. Microengng. 3 (1993) 216218. A. Ruzzu, et al., Multi-functional valve components fabricated by combination of LIGA processes and high precision mechanical engineering, J. Microsyst. Technol. 4 (1998) 128131. A. Ruzzu, et al., Positioning system for catheter tip based on an active microvalve system, J. Micromech. Microengng. 8 (2) (1998) 161164. [174] H.-F. Kober, Microvalve with joined layers of metal parts and process for manufacture of microvalves, US patent 5,926,955, 1999. [175] T.W. Tsuei, et al., Tapered microvalves fabricated by off-axis X-ray exposures, J. Microsyst. Technol. 4 (4) (1998) 201 204. [176] W. Ehrfeld, et al., Microfabrication of membranes with extreme porosity and uniform pore size, J. Membr. Sci. 36 (1988) 67 77. [177] H.E. Snyder, R.D. Reitz, Development of micro-machining techniques for air-assisted liquid atomization, Exp. Therm. Fluid Sci. 20 (1) (1999) 11 18.

[134] J. Haake, et al., In-package active ber optic micro-aligner, Proc. SPIE 3276 (1998) 207 219. E. White, et al., Three-axis microactuator for smart optical interconnect system, Proc. SPIE 3328 (1998) 353 364. [135] K.-H. Dunkel, et al., Injection-moulded bre ribbon connectors for parallel optical links fabricated by the LIGA technique, J. Micromech. Microengng. 8 (1998) 301306. J. Schulze, et al., Parallel optical interconnection using self-adjusting microlenses on injection molded ferules made by LIGA technique, SPIE Proc. 3737 (1999) 562571. [136] W. Du, et al., Tunable chirped ber Bragg grating embedded in a textile laminated beam for ber dispersion compensation, SPIE Proc. 3240 (1998) 226231. [137] H. Yang, M. Vasile, Fabrication of single-mode optical ber ferrule mold insert with twelve channels, SPIE Proc. 3680 (1999) 848852. [138] R.F. Shyu, et al., Realization of multi-ber ferrule mold inserts fabricated by the LIGA process, SPIE Proc. 4230 (2000) 210217. [139] P. Ziegler, et al., Passive alignment and hybrid integration of active and passive optical components on a microoptical LIGAbench, Proceedings of MOEMS99, Mainz, August 30Sept. 1, 1999, pp. 186. [140] A. Gerlach, et al., Assembly of hybrid integrated micro-optical modules using passive alignment with LIGA mounting elements and adhesive bonding techniques, J. Microsyst. Technol. 7 (1) (2001) 2731. [141] U. Wallrabe, et al., Micromolded easy-assembly multiber connector: Ribcon, Microsyst. Technol. 8 (2 3) (2002) 8387. [142] L. Weber, et al., LIGA technique for packaging and interconnection, Proceedings of EUPAC, Essen, Germany, 1994, pp. 104 106. [143] J.T. Rantala, et al., Fabrication and packaging of optical components and microsystems, SPIE Proc. 4075 (2000) 140 149. [144] Y.M. Desta, et al., Integrated optical bench for a CO2 gas sensor, Proc. SPIE 2640 (1995) 172177. chtig, LIGA-technology for the fabrication of [145] H. Schift, J. So positioned planar structures, Microsyst. Technol. 4 (3) (1998) 132 134. H. Schift, et al., Fabrication of replicated high-precision insert elements for micro-optical bench arrangements, Proc. SPIE 3515 (1998) 122 134. [146] J. Mohr, Micro-optical and optomechanical systems fabricated by the LIGA technique, Proc. SPIE 3008 (1997) 273 278. [147] M. Neumeier, et al., Miniaturized ber optical switches with nonmoving polymeric mirrors for tele- and datacommunication networks fabricated using the LIGA technology, SPIE Proc. 3276 (1998) 3747. [148] M. Beamesderfer, et al., Analysis of an optical energy interrupter for MEMS-based safety and arming systems, SPIE Proc. 3880 (1999) 101111. [149] A. Ruzzu, et al., Optical 2 2 switch matrix with electromechanical motors, SPIE Proc. 4178 (2000) 6776. [150] S.A. Kemme, et al., Four-function optical switch with LIGA alignment plates, SPIE Proc. 4284 (2001) 10 16. [151] T. Paatzsch, et al., Polymer star coupler for optical backplane interconnects fabricated by LIGA technique, Proc. Seventh Int. Plastic Opt. Fibres Conf. (POF98) (1998) 324 331. I. Frese, et al., Combination of guided wave and free-space microoptics for a new optical backplane concept, Proc. SPIE 4430 (2001) 715721. [152] S.W. Moon, et al., Terahertz waveguide components fabricated using a 3D x-ray microfabrication technique, Electron. Lett. 32 (1996) 1794 1795. [153] D.C. Mancini, Microfabrication of RF devices using deep x-ray lithography and copper electroforming, SPIE Conference Smart Materials, Nano-, and Micro- Smart Systems, Melbourne, Dec. 1618, Proc. SPIE, vol. 4936, 2002.

C. Khan Malek, V. Saile / Microelectronics Journal 35 (2004) 131143 [178] M. Himmelhaus, et al., Integrated measuring systems for the detection of the revolutions of LIGA microturbines in view of a volumetric ow sensor, J. Micromech. Microengng. 2 (3) (1992) 196 198. [179] B. Taubitz, et al., Fuel injection devices, US patent 5,662,277, 1997. [180] M. Nieggemann, et al., Miniaturized plastic micro-plates for application in HTS, Microsyst. Technol. 6 (1999) 4853. [181] I. Vollmer, et al., Bistable uidic elements in LIGA-technique as microactuators, Proceedings IEEE Transducers93, Yokohama, Japan, 1993, pp. 116119. [182] U. Gebhard, et al., Combination of a uidic micro-oscillator and micro-actuator in LIGA-technique for medical applications, Proceedings of IEEE Transducers97, Chicago, 1997, pp. 761764. [183] M. Kohl, Fluidic actuation by electrorhelogical microdevices, Mechatronics 10 (45) (2000) 583594. [184] K. Feit, et al., Micro-mechanical actuator, US patent 6,055,899, 2000. [185] B. Zierenberg, D. Hochrainer, Powder inhaler with powder carrier consisting of regular microstructures, US patent 5,645,050, 1997. [186] S. Soper, et al., Microelectroelectrophoresis devices with integrated uorescence detectors and reactors for high-throughput DNA sequencing, Proc. SPIE 2985 (1997) 3646. S.M. Ford, et al., Micromachining in plastics using x-ray lithography (LIGA) for the fabrication of microelectrophoresis devices, J. Biomech. Engng. 121 (1999) 1321. [187] Y. Baba, O. Tabata, Novel Microfabricated Capillary Array Electrophoresis Chip Fabricated by Synchrotron Radiation and Direct Observation of Dynamics of DNA Molecules in Microchannels, Proceedings of the mTAS98 Workshop, 1998, pp. 331 334.

143

[188]

[189] [190]

[191] [192] [193] [194] [195] [196] [197] [198] [199]

S. Shinohara, et al., Performance of Micro-CE Polymer Chip fabricated by x-ray lithography, International Symposium on Microchemistry and Microsystems (ISMM 2001), 2001, pp. 100101. E.B. Overton, K.R. Carney, Portable Gas Chromatograph, US Patent 5,611,846, 1997. G.A.Eiceman et al. Gas chromatography, Anal.Chem.-Colombus 74(12) (2002) 2771 2780. E. Garcia, Micro thrust and heat generator, US patent 5,836,150, 1998. H. Lowe, W. Ehrfeld, State-of-the-art in microreaction technology: concepts, manufacturing and applications, Electrochim. Acta 44 (2122) (1999) 36793689. W. Ehrfeld, V. Essel, H. Lowe, Microreactors, New Technology for Modern ChemistryWiley-VCHNew York (2000). P. Rapt, et al., Micro-structured conducting polypyrrole electrodes, Electrochim. Acta 44 (20) (1999) 34833489. STEAG MicroParts, GmbH: http://www.microparts.de/english/ index.html DR. FRITZ FAULHABER GMBH & CO. KG: http://www. faulhaber.de/ Micromotion: http://www.mikrogetriebe.de/ Mezzo Systems: http://www.mezzosystems.com/. AXSUN Technologies: http://www.axsun.com/. MEMS Exchange Program: http://www.mems-exchange.org http://www.sandia.gov/liga J. Schulz, et al., Ensuring Reliability and Repeatability in LIGA Mould Insert Fabrication, to be presented in SPIE, CannesMandelieu, May 2003