CONTENT
Characteristics of tin Applications of electroplated tin alloys Tin alloys used for electroplating Tin alloy electroplating in fluoborate solutions Tin alloy electroplating in methane sulfonic solutions Tin electroplating in sulfate solutions Tin electroplating in stannate solutions
Characteristics of tin
Symbol
Atomic number Atomic weight
: Sn
: 50 : 118.71
: Metal : Tetragonal
Excellent corrosion and tarnish resistance; Excellent cosmetic appearance; Excellent solderability; Very good ductility (malleability); Non-Toxicity; Good anti-friction properties (low friction, high galling resistance).
Electronics and semiconductors industry Tin Electroplating is widely used in manufacturing printed circuit boards (PCBs), printed wiring boards (PWBs), electronic components. Food containers and packages Many food and beverage cans, food storage containers, food handling equipment are tin plated. Engine bearings Tin-copper and lead-tin-copper alloys are used in tri-metal sliding bearings as anti-friction coating of 0.0005-0.001 (0.012-0.025 mm) thick. In addition to this very thin (0.04 inch / 1m) pure tin coating over the bearing surface is used for better cosmetic appearance and corrosion protection.
Most tin base alloys have been developed as non-toxic lead-free alternatives of the traditional tin-lead solder 63Sn-37Pb. Electroplating process of tin base lead-free alloys requires strict control of the electrolyte composition and other process parameters. Small deviations in the deposited alloy composition may result in large changes in the melting point. Another disadvantage of most tin base lead-free alloys is their proneness to form tin whiskers - mono-crystal tin filaments growing on the surface of tin base alloy. Long whiskers formed on a lead extend to other leads and may bridge across them causing catastrophic shorts of the circuit. The following measures reduce the risk of whiskers formation: low brighteners plating solutions, annealing immediately after plating at 300340F (150-170C) for 3-1 hours, reflow after the plating, nickel barrier preventing diffusion of copper from the substrate to the tin coating.
Tin "Whisker" shown above growing between pure tin-plated hook terminals of an electromagnetic relay similar to MIL-R-6106 (LDC 8913)
Tin-copper Eutectic composition Sn-0.7Cu with the melting point 441F (227C) is the most popular non-toxic Sn-Cu alloy. The presence of copper increases the alloy strength but makes it brittle. Other disadvantages of the alloy are its poor wetting and proneness to form whiskers. Tin-silver Sn-3.5Ag, Sn-3Ag are typical tin-silver lead-free alloys possessing good solderability, high maximum service temperature and mechanical strength. The alloy disadvantages are relatively high cost and proneness to form whiskers. Tin-silver-copper Eutectic composition Sn-3.5Ag-0.7Cu has relatively low melting point 423F (217C), moderate wettability, good strength and fatigue strength. Sometimes up to 3% of bismuth is added to the alloy to improve wettability and decrease the melting point.
Bath formulations Tin alloy electroplating in fluoborate solutions Tin Lead Coating oz/gal g/l oz/gal g/l
37
10
7 1.3
75
52 10
1.3
4 9
10
30 68 0.33 2.5
23
17 17
175
128 128
4
4 4
30
30 30
Roughness
Poor solderability
Poor adhesion Brittle deposit
Dark deposit
1. Filter 2. Filter 3. Increase rinsing and filter the bath 1. Ad acid 2. Dummy bath at 1-2 A/ft (0.10.2 A/dm) 1. Carbon treat 2. Dummy bath at 1-2 A/ft (0.10.2 A/dm) Improve cleaning 1. Carbon treat 2. Dummy bath at 1-2 A/ft (0.10.2 A/dm) 1. Carbon treat 2. Ad additive 3. Increase temperature
Electroplating in methane sulfonic acid solutions is more controllable process than deposition in fluoborate solutions. It allows to obtain high quality tin base coatings of consistent chemical composition.
Bath ingredients Stannous methane sulfonate Lead methane sulfonate Copper methane sulfonate Methane sulfonic acid (MSA) Organic brighteners (additives) Deionized (DI) water
Bath formulations
Tin alloy electroplating in Methane sulfonic acid solutions Tin Lead Copper Coating
Pure tin (100Sn) 90Sn-10Cu MSA
oz/gal 6
6.7
g/l 45
50
oz/gal
g/l
g/l 200
200
90Sn-10Pb
60Sn-40Pb
3
2
22
15
0.4
1
3
7.5
26
26
200
200
Improve cleaning
Bath formulations
Tin 6 oz/gal (45 g/l) Sulfuric acid 16 oz/gal (120 g/l)
Roughness
Poor throwing power
Dark deposit
Low conductivity
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