Instruction Manual
Fisher, FloBoss, and ROCLINK are marks of one of the Emerson Process Management companies. The Emerson logo is a trade mark and service mark of Emerson Electric Co. All other marks are the property of their respective owners. This product may be covered under one or more patents pending. Fisher Controls International, Inc. 1997-2001. All rights reserved.
While this information is presented in good faith and believed to be accurate, we do not guarantee satisfactory results from reliance upon such information. Nothing contained herein is to be construed as a warranty or guarantee, express or implied, regarding the performance, merchantability, fitness or any other matter with respect to the products, nor as a recommendation to use any product or process in conflict with any patent. We reserve the right, without notice, to alter or improve the designs or specifications of the products described herein. Printed in the U.S.A.
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TABLE OF CONTENTS
TABLE OF CONTENTS .....................................................................................................................III SECTION 1 GENERAL INFORMATION.................................................................................... 1-1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 2.1 2.2 2.3 2.4 2.5 2.6 2.7 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 4.1 4.2 4.3 4.4 4.5 4.6 4.7 Scope of Manual........................................................................................................................ 1-1 Section Contents........................................................................................................................ 1-1 Manual Contents........................................................................................................................ 1-2 Product Overview ...................................................................................................................... 1-3 Installation Guidelines............................................................................................................... 1-5 Power Supply Requirements ..................................................................................................... 1-8 Startup and Operation.............................................................................................................. 1-11 Scope ......................................................................................................................................... 2-1 Section Contents........................................................................................................................ 2-1 Product Descriptions ................................................................................................................. 2-2 Installation ............................................................................................................................... 2-14 Connecting the MCU Wiring .................................................................................................. 2-16 Troubleshooting and Repair .................................................................................................... 2-22 ROC306 and ROC312 Specifications ..................................................................................... 2-33 Scope ......................................................................................................................................... 3-1 Section Contents........................................................................................................................ 3-1 Product Descriptions ................................................................................................................. 3-3 Initial Installation and Setup...................................................................................................... 3-7 Connecting the I/O Modules to Wiring ..................................................................................... 3-8 Troubleshooting and Repair .................................................................................................... 3-27 Removal, Addition, and Replacement Procedures .................................................................. 3-35 I/O Module Specifications....................................................................................................... 3-38 Scope ......................................................................................................................................... 4-1 Section Contents........................................................................................................................ 4-1 Product Descriptions ................................................................................................................. 4-2 Initial Installation and Setup.................................................................................................... 4-11 Connecting Communications Cards to Wiring........................................................................ 4-16 Troubleshooting and Repair .................................................................................................... 4-24 Communication Card Specifications ....................................................................................... 4-26
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ROC306/ROC312 Instruction Manual TABLE OF CONTENTS (CONTINUED) APPENDIX A LIGHTNING PROTECTION MODULE............................................................A-1 A.1 A.2 A.3 A.4 A.5 A.6 A.7 B.1 B.2 B.3 B.4 B.5 B.6 B.7 C.1 C.2 C.3 C.4 C.5 C.6 C.7 C.8 C.9 D.1 D.2 D.3 D.4 D.5 D.6 D.7 Scope.........................................................................................................................................A-1 Section Contents .......................................................................................................................A-1 Product Description ..................................................................................................................A-1 Initial Installation ......................................................................................................................A-3 Connecting the LPM to Wiring.................................................................................................A-4 Troubleshooting and Repair......................................................................................................A-7 Lightning Protection Module Specifications ............................................................................A-7 Scope......................................................................................................................................... B-1 Section Contents ....................................................................................................................... B-1 Product Description .................................................................................................................. B-2 Installation................................................................................................................................. B-3 Operation................................................................................................................................... B-5 Troubleshooting and Repair.................................................................................................... B-27 Local Display Panel Specifications ........................................................................................ B-27 Scope......................................................................................................................................... C-1 Section Contents ....................................................................................................................... C-1 Analog Outputs to Analog Inputs ............................................................................................. C-2 Analog Outputs to Ammeter..................................................................................................... C-3 Discrete Outputs to Discrete Inputs .......................................................................................... C-3 Discrete Outputs to Pulse Inputs............................................................................................... C-4 Potentiometer to Analog Inputs ................................................................................................ C-5 Switch to Discrete Inputs .......................................................................................................... C-6 Switch to Pulse Inputs............................................................................................................... C-7 Scope.........................................................................................................................................D-1 Section Contents .......................................................................................................................D-1 Product Description ..................................................................................................................D-1 Installing a HART Interface Card.............................................................................................D-3 HART Interface Card Wiring ...................................................................................................D-5 HART Interface Card Troubleshooting ....................................................................................D-6 HART Interface Card Specifications ........................................................................................D-7
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1.3.1 CE Statement
This manual describes installation and maintenance procedures for a product that has been tested to comply with appropriate CE directives. To maintain compliance, this product must be installed and maintained according to the procedures described in this document. Failure to follow the procedures may compromise compliance.
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FLASHPAC
FLASHPAC
12
B A C
11
B A C
10
B A
B A C
B A C
ROC306
REMOTE OPERATIONS CONTROLLER
ROC312
REMOTE OPERATIONS CONTROLLER
B A
STATUS AUX
+BAT -BAT GND NO COM
INTERFACE
RESET
COMM
DSPL
STATUS AUX
INTERFACE
RESET
COMM
DSPL
AI
AI
AI
DI/PI
DI/PI
DO
AI
AI
AI
DI/PI
DI/PI
DO
+ -
+ -
+ -
+ -
+ -
N O
C O M
COM
+ -
+ -
+ -
+ -
+ -
N O
C O M
DOC0087C
DOC0088C
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DOC0095A
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General Information
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ROC306/ROC312 Instruction Manual To minimize interference with radio communications, locate the ROC away from electrical noise sources such as engines, large electric motors, and utility line transformers. Locate ROCs away from heavy traffic areas to reduce the risk of being damaged by vehicles. However, provide adequate vehicle access to aid monitoring and maintenance.
Class I is for locations where flammable gases or vapors may be present in the air in quantities sufficient to produce explosive or ignitable mixtures.
2. Division defines the probability of hazardous material being present in an ignitable
concentration in the surrounding atmosphere. Division 2 locations are locations that are presumed to be hazardous only in an abnormal situation.
3. Group defines the hazardous material in the surrounding atmosphere. Groups A to D are as
follows: Group A - Atmosphere containing acetylene. Group B - Atmosphere containing hydrogen, gases or vapors of equivalent nature. Group C - Atmosphere containing ethylene, gases or vapors of equivalent nature. Group D - Atmosphere containing propane, gases or vapors of equivalent nature. For the ROC to be approved for hazardous locations, it must be installed in accordance with the National Electrical Code (NEC) guidelines or other applicable codes. CAUTION When installing units in a hazardous area, installation and maintenance must be performed only when the area is known to be non-hazardous. Note: Measurement/Industry Canada approved units normally require a sealed installation. Refer to your local codes for specifics.
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ROC306/ROC312 Instruction Manual Solar power allows installation of the ROC in locations where line power is not available. The solar panels and batteries must be properly sized for the application and geographic location to ensure continuous, reliable operation. Information contained in the ROC/FloBoss Accessories Instruction Manual (Form 4637) can help you determine the solar panel and battery requirements to fit your application and location. As a site may have additional power requirements for radios, repeaters, and other monitoring devices, Fisher Controls Field Automation Systems offers power supply and converter accessories to minimize the number of separate power sources required for an installation. Although the ROC306 and ROC312 can operate on 8 to 30 volts dc power, it is good practice to install a low-voltage cutoff device to help protect batteries and other devices not powered by the ROC.
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ROC306/ROC312 Instruction Manual Table 1-1. Power Consumption of the ROC306, ROC312, and Powered Devices
Device Power Consumption (mW) 12V System 24v System Pmin Pmax Pmin Pmax Qty. Used Duty Cycle SubTotal (mW)
MCU (includes minimum Built-in I/O power consumption) Built-in AI Loop (ROC-powered) Built-in DI/PI (ROC powered) Built-in DO Relay Built-in Auxiliary DO Relay Local Display Panel Serial Comm Card Dial-up Modem Comm Card Leased-Line Modem Comm Card Radio Modem Card HART Interface Card I/O Modules Total from Table 1-2 (ROC312 only) Radio (from Section 1.6.3)
1050 130 0 0 0 25 135 395 110 110 80 N/A N/A 440 65 195 195 130 0 0 0
N/A
N/A N/A N/A N/A N/A N/A N/A N/A N/A N/A Total
Notes: 1. For the AI Loop channel, the Duty Cycle is the percent of time spent in the upper half of the operating range. 2. If the ROC has a HART card, be sure to include the power consumption of a Communications Card as well.
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I/O Module
AI Loop AI Differential AI Source AO Source RTD Input (Pmin is at -50 C; Pmax is at 100 C) DI Isolated DI Source PI Isolated PI Source Low Level PI SPI Isolated SPI Source DO Isolated DO Source (Pmax is at 57 mA) DO Relay 12V DO Relay 24V HART Interface Module
495 75 470 585 930 10 205 30 230 45 10 205 25 1585 N/A 470 1285 Total
Notes: 1. For analog I/O channels, the Duty Cycle is the percent of time spent in the upper half of the operating range. 2. The Pmax amount includes any power drawn a by ROC-powered field device, such as a transmitter.
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1.7.1 Startup
Apply power to the ROC. After internal checks are completed, the STATUS LED lights. The STATUS LED should light, and stay lit, to indicate that a valid reset sequence has been completed. Depending upon RAM size, it could take a few seconds for the STATUS LED to light. If any of the indicators do not light, refer to Section 2 of this manual for possible causes. Keep in mind that the ROC306 or ROC312 will start up on power that is as low as 8 volts; however, devices powered by the ROC may not operate at this level.
1.7.2 Operation
Once startup is successful, configure the ROC to meet the requirements of the application. The Configuration Software User Manual describes in detail the procedure for configuring the ROC. Once the ROC is configured and I/O is calibrated, it can be placed into operation. CAUTION ROC configuration must be performed only in an area known to be non-hazardous. The ROC can be operated from a host system using Fisher software or other compatible software. Consult with your Fisher Representative for more information on host system compatibility.
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Section 2.1 2.2 2.3 2.3.1 2.3.2 2.3.3 2.3.4 2.3.5 2.3.6 2.3.7 2.4 2.4.1 2.4.2 2.5 2.5.1 2.5.2 2.5.3 2.5.4 2.5.5 2.5.6 2.5.7 2.6 2.6.1 2.6.1.1 2.6.2
Page Number 2-1 2-1 2-2 2-2 2-5 2-7 2-9 2-12 2-13 2-13 2-14 2-14 2-15 2-16 2-16 2-16 2-18 2-19 2-20 2-20 2-21 2-22 2-22 2-22 2-23
2-1
ROC306/ROC312 Instruction Manual Information Section Fuses 2.6.3 RAM and Real-Time Clock Battery 2.6.4 Verifying the ROC can Communicate with ROCLINK 2.6.5 Verifying RAM 2.6.6 Verifying Battery Voltage 2.6.7 Performing a Cold Start 2.6.8 Performing a Cold Hard Cruel Start 2.6.9 Replacing a ROCPAC, FlashPAC, or RAM Memory Module 2.6.10 Replacing the Battery 2.6.11 Installing/Removing the MCU Assembly 2.6.12 Calibrating the Diagnostic Inputs 2.6.13 Testing Built-in Analog Inputs 2.6.14 Testing the Built-in Discrete/Pulse Inputs 2.6.15 Testing the Built-in Discrete Output 2.6.16 Testing the Auxiliary Output 2.6.17 ROC306 and ROC312 Specifications 2.7 Page Number 2-24 2-24 2-24 2-25 2-25 2-25 2-26 2-26 2-28 2-29 2-30 2-30 2-31 2-32 2-32 2-33
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COM PORTS
DOC0097A
Figure 2-1. Front and Back Views of MCU with Covers Removed The NEC V25+ is a 16-bit CMOS microprocessor featuring dual 16-bit internal data buses and a single 8-bit external data bus. The unit can address up to one megabyte of memory and features high-speed direct memory access. The on-board memory on the main circuit board includes 128 Kbytes of battery-backed, random access memory (RAM) for storing data, and 8 Kbytes of electrically erasable programmable read-only memory (EEPROM) for storing configuration parameters. Plug-in sockets are provided for the required FlashPAC or ROCPAC module and optional RAM module. A RAM module is not used along with a FlashPAC module. Refer to Sections 2.3.2, 2.3.3, and 2.3.4 for more information about these memory modules. One over-current device and a soldered fuse on the MCU circuit board provide input power protection. The over-current device protects the fuse. Another over-current device on the MCU circuit board protects the analog +T 24 volts dc outputs. The operator interface connector (labeled Interface) provides direct communication between the ROC and the serial port of an operator interface such as a notebook computer. The interface gives you access to the functionality of the ROC.
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ROC306/ROC312 Instruction Manual The display connector (labeled DSPL) links the MCU to an optional Local Display Panel (LDP). The LDP provides local monitoring of I/O and database parameters, as set up by using the configuration software. For a ROC with a FlashPAC, limited editing of parameter values can be performed with the LDP; refer to Appendix B. The LDP can also be used to perform a cold hard start if the ROCPAC is Version 1.09 or greater and the FlashPAC is Version 2.00 or greater (with the FlashPAC, the cold start uses factory defaults). To perform the cold start, hold down the left-most button of the LDP for 5 to 10 seconds during power-up. The following occurs: When using a ROC300-series unit with a FlashPAC, logs, ROC displays, and FSTs may be cleared by using the appropriate Cold Start option. If a Write to EEPROM or Write to Config Memory (which includes the FST run status) had been performed before the Cold Start, the FSTs will be in the same state after the Cold Start as when the Write to EEPROM was done (such as running if the FST was running). Note that FST registers are always cleared upon restart; therefore, use softpoints to load initial values for the FST. When using a ROC300-series unit with a ROCPAC, logs, ROC displays stored in ROC memory, and FSTs may be cleared by using the appropriate Cold Start option. Any FSTs that exist must be manually started after the Cold Start by setting the FST Status parameter to On in the FST Parameters point. If FSTs were cleared, then they must be loaded from disk using the FST Editor utility. CAUTION: Clearing FSTs sets them to zero size, which can cause processor-loading problems. The communications connector (labeled COMM) accesses an optional communications card installed on the MCU board. The communications card provides serial data communications, modem, radio modem, or leased-line modem communications. One terminal block on the front panel provides termination for the input power, ground, and an auxiliary discrete output. The auxiliary output is a discrete output that provides a normally-open relay contact. This output can be used to switch power to auxiliary devices, such as a radio. Six field I/O terminal blocks on the front panel provide termination for the built-in field I/O channels. The field I/O consists of three analog inputs, two discrete or pulse inputs, and one discrete output. On the ROC312, an I/O module board allows you to plug in a variety of I/O modules through the case cover. The I/O module board is fastened to the case cover. Two diagnostic analog inputs on the MCU circuit board monitor the voltage of the input power and the board temperature. LED indicators show the ROC status, auxiliary output relay state (labeled AUX), DI/PI input/output state, and DO relay state. The ROC status indicator, when on, indicates operation is normal; when blinking, it indicates the ROC is not running; when off, it indicates a missing or out-of-tolerance input voltage. The state indicators, when on, show the input or output is active.
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ROC306/ROC312 Instruction Manual On ROCPAC Version 1.09 or greater and FlashPAC Version 2.00 or greater, the RESET switch permits a cold hard start. When the switch is held down for five to ten seconds during ROC power-up, the cold start results; otherwise the switch has no effect. On units approved for Canadian custody transfer use, the RESET switch is disabled. As mentioned above, if there is an LDP connected to the ROC, you can also perform a cold start by holding down the left button for five to ten seconds during power-up. See the ROCLINK user manual for more information on performing a cold start. The MCU is housed in a metal case that protects the electronics from physical damage. For protection from outdoor environments, the ROC must be housed in a separate enclosure. Industry Canada (also called Measurement Canada) approved ROCs have the metal case cover installed with internal hexhead screws. The heads of these screws have a hole drilled through them that allow the units to be sealed with a wire.
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ROC306/ROC312 Instruction Manual When used with the ROCLINK software, a ROC with a FlashPAC module can save a configuration to disk as an .FCF file and later restore these configuration files back into a ROC with a FlashPAC. The ROCLINK software also provides a utility to upgrade from a ROCPAC to a FlashPAC (not applicable to Canadian Custody Transfer units). The configuration software includes diagnostic functions for viewing memory allocation and for loading programs into flash memory. Note: RAM modules must not be installed in a ROC with a FlashPAC. If a RAM module is present, the ROC may not operate properly. The RAM in a FlashPAC can store 87 history points, each holding 35 days of hourly values. Besides storing history data, the RAM in a FlashPAC stores user program data. The flash ROM portion of the FlashPAC is programmed with firmware at the factory; in addition, it can store user programs downloaded through a communications port on the MCU. Flash memory is available for loading user programs. User programs that were previously used in ROCs with ROCPACs require modification by the supplier of the program in order to be used in a ROC with a FlashPAC. Keep in mind that the following user programs are no longer needed, since they are permanently reside in the FlashPAC: 1992 AGA flow calculations Communications Enhancement Local Display Panel Enhancement Table 2-1 on Page 2-7 shows how the ROC memory is allocated. Each memory location range (for example, 00000 to 1FFFF) represents 128 Kbytes of memory.
FLASHPAC
DOC0292A
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Usage
Alarm/Event Logs, etc. History Data Area; part is for scratch-pad memory in FlashPAC History Data Area History Data in FlashPAC; User Programs for ROCPAC User Configuration Data Operating System and Applications User Program Data in FlashPAC; User Programs for ROCPAC User Program Code in FlashPAC; User Programs for ROCPAC Operating System Firmware
ROC306/ROC312 Instruction Manual Either a ROCPAC or FlashPAC (see Section 2.3.2) module is required for the ROC to operate. Backup power for the RAM in the ROCPAC is provided by a self-contained lithium battery. Figure 2-3 shows a ROCPAC module. The ROCPAC modules contain 128 Kbytes of read-only memory (ROM) and 128 Kbytes of randomaccess memory (RAM). The ROM contains the firmware; the RAM portion can store user programs. ROCs using a ROCPAC may require a RAM module (see Section 2.3.4) for additional user program or history database storage. For user programs, select the RAM based on the availability of memory at the address or location into which the program will be loaded. The ROCPAC modules available for the ROC300-Series products are listed in Table 2-2. Table 2-2. ROCPAC Selection Codes
Selection Code
RPS1H RPS2H RPS5H
Description
Operating System with Applications* and RAM Operating System with Applications* and RAM, with Modbus Protocol preloaded** Industry Canada Operating System with Applications*
* Applications include AGA Flow Measurement and Reporting, PID Loop Control, and FST Control. ** Modbus Protocol is also available separately on disk for downloading to the memory modules.
ROCPAC
DOC0106A
2-8
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RAM
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Qty
1 1
Size
128K 256K
Memory Slot
2 2
The 256-Kbyte RAM module is partitioned into two 128-Kbyte segments by setting switches located on the side of the module. Table 2-4 shows how the switch settings affect the way the module is used. Table 2-4. Switch Settings for 256-Kbyte RAM4H Module
1st 128 Kbyte Segment
History Database 1 User Programs Not Used Not Used History Database 1 History Database 1 User Programs User Programs
Memory Locations
20000 - 3FFFF 60000 - 7FFFF 40000 - 5FFFF A0000 - BFFFF 20000 - 3FFFF 40000 - 5FFFF 20000 - 3FFFF A0000 - BFFFF 60000 - 7FFFF 40000 - 5FFFF 60000 - 7FFFF A0000 - BFFFF
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ROC306/ROC312 Instruction Manual For history database storage in a ROC with a ROCPAC, the RAM requirement depends on the number of points and the number of days of archival. The maximum number of database points that can be archived is 90; however, the number of days for which data can be archived is reduced in the Base RAM. Refer to Table 2-6. Table 2-5. Estimating Database Memory Requirements
Number of Archived Database Points
1 to 11 12 to 30 30 additional 60 additional
Amount of Ram**
0 0 128 Kbytes 256 Kbytes
* Truncated to integer value. ** Adding RAM will not increase the days of hourly data for the first 30 database points.
If all database points are configured for the maximum 35-day storage of hourly values: The base RAM can store values for 11 points. 128 kilobytes of expansion RAM can store values for 30 additional points. 256 kilobytes of expansion RAM can store values for 60 additional points. The total number of points that can have values stored for 35 days is 71 points. For example, if a ROC with a 128K RAM module is configured for the maximum number of database points, then the number of days of storage for each point is: 12 days of hourly values for points 1 to 30 in the base RAM. 35 days of hourly values for points 31 to 60 in the RAM module. If a ROC with a 128K RAM module is configured for the maximum number of days (35) of storage of hourly values, then: The base RAM can store values for 11 points. The 128K RAM Module can store values for 30 points. The total number of points that can have values stored for 35 days is 41 points. Table 2-6 shows the relationship between the number of database points configured and the number of days of hourly data that can be archived for the base RAM.
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ROC306/ROC312 Instruction Manual Table 2-6. Base RAM Database Point Relationship
Number of Points
1 to 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
Number of Entries
840 768 696 648 600 576 528 504 480 456 432 408 384 384 360 336 336 312 312 288
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ROC306/ROC312 Instruction Manual One of the discrete outputs is called the auxiliary output (designated E6 by the configuration software). It can be used either for switching power to a device such as a radio or as a control output. The auxiliary output uses the NO and COM terminals located in the lower left-hand corner of the ROC front panel. Refer to Figure 2-5.
ROC306
STATUS AUX
+BAT -BAT GND NO COM
INTERFACE
RESET
COMM
DSPL
AI
AI
AI
DI/PI
DI/PI
DO
+ -
+ -
+ -
+ -
+ -
N O
C O M
DOC0092T
Figure 2-5. I/O Terminal Block Location The discrete or pulse inputs (DI/PI) are selected and configured using ROCLINK. The three selections for A4/A5 Functions are located in ROC > Flags > Advanced Features.
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2.4 Installation
The ROC306 or ROC312 typically mounts in a ROC enclosure, which has a backplate with tapped mounting holes to accommodate the unit as shown in Figure 2-6.
8.00 6.50
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DOC0095A
2.4.1 Mounting
Use the following procedure to mount the unit on a panel or in an enclosure. Equipment and Tools Required: Drill and drill bit (1/4") Tap and die Philips screwdriver
1. Locate four holes for number 8-32 screws, 6.5 inches (165 mm) between centers horizontally
and 8.5 inches (216 mm) vertically. If holes are not present, drill and tap them.
2. Partially insert the top two screws and place the keyhole slots of the ROC over them. 3. Insert the lower two screws and tighten all four screws.
To add I/O modules (ROC312 only), refer to Section 3. To add a communications card, refer to Section 4. If you need to install accessories for use with the ROC, such as a power supply or a Local Display Panel, refer to the ROC/FloBoss Accessories Instruction Manual (Form A4637). To add a RAM module to a ROC with a ROCPAC, refer to the following procedure.
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CAUTION Before installing a memory module, make sure the module connector pins are not bent. Bent pins can damage the mating connector. Do not attempt to straighten bent pins; instead, replace the module.
3. Align the key on the module socket with the key of the MCU socket; in this position, the R of
RAM on the label (see Figure 2-4) should be closest to the I/O terminals. Carefully insert the module in the socket and press it in firmly, but gently to seat the module. The module should move inward slightly. Verify that the module is seated in the connector by gently lifting up on the module. If it comes out easily, repeat the process.
4. Carefully position the retainer over the modules, and tighten the thumbscrews. Make sure that
desired memory allocations. Refer to Table 2-4 for the proper settings.
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ROC306
STATUS AUX
+BAT -BAT GND NO COM
INTERFACE
RESET
COMM
DSPL
AI
AI
AI
DI/PI
DI/PI
DO
+ -
+ -
+ -
+ -
+ -
N O
C O M
DOC0092Z
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+
ROC-POWERED CURRENT LOOP DEVICE
Vs
+ DOC4001A-mod.
Figure 2-8. Current Signal on Built-in Analog Input Figure 2-9 shows the wiring for a typical voltage signal. Note that the voltage signal is supplied by an externally powered device.
AI EXTERNAL/ SELF-POWERED DEVICE
I LIMIT
Vs
+ DOC4002A-mod.
2-18
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DI/PI
+ -
S+ + S-
VPS
2.5K
DOC4003A
Figure 2-10. Isolated Built-in Discrete/Pulse Input For use as a sourced input as shown in Figure 2-11, jumper terminals S+ and + together. Connect the field device positive wire to terminal - and the field negative lead to terminal S-. When the discrete field device conducts, the source power flows through the LED to show an active circuit and triggers the optical circuit to signal the ROC through terminal S- to ground.
DI/PI
JUMPER
S+ + S-
VPS
2.5K
+ -
DOC4004A
DO
SELF-POWERED DISCRETE DEVICE
+5V 1.2K
+ -
NO COM
CONTROL
DOC4005A
CONTROL
DOC4006A
EIA-232
2 3 6 4 1 9 8 7 5 2 3 6 4 1 9 8 7 5 RECEIVE TRANSMIT DTR DCD 3 2 3 2 6 4 1 9 8 7 5
+V
RTS GROUND
DOC0244A-306
Figure 2-14. Operator Interface Connector Wiring The DSPL connector is a parallel port for dedicated communications to an optional Local Display Panel. The cable supplied with the Local Display Panel plugs into this connector. One data communications port is available. The port is a 9-pin connector labeled COMM. This port provides access to external devices via an optional plug-in communications card. Section 4 details the communications card types available for the ROCs and has information on connecting wiring to the COMM connector.
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Config Memory flag as instructed in the ROCLINK User Manual. This action saves most of the ROC configuration (but not logs or FST programs) into the permanent memory accessed when a cold start is performed.
2. Save the current configuration data to disk by using the Download option as instructed in the
ROCLINK User Manual. This action saves the ROC configuration (but not FSTs) to a disk file.
3. Save all historical database logs (Minute, Hourly, and Daily) to disk using the Collect ROC
using the FST Editor are contained in the Function Sequence Table User Manual (Form A4625).
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ROC306
REMOTE OPERATIONS CONTROLLER
STATUS AUX
+BAT -BAT GND NO COM
INTERFACE
RESET
COMM
DSPL
AI
AI
AI
DI/PI
DI/PI
DO
+ -
+ -
+ -
+ -
+ -
N O
C O M
DOC0092A
Meaning
Successful startup and the processor is running. The processor is not running and is attempting to restart. Possible low battery, bad ROCPAC, or bad FlashPAC. No input power, circuit protection devices overloaded, insufficient voltage available to power up the ROC, or input power polarity reversed. Relay energized. Relay de-energized. Input active. Input not active. Relay energized. Relay de-energized.
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2.6.3 Fuses
The ROC306 and ROC312 use the overload protection devices listed in Table 2-8. The overload protection devices are not field replaceable. Table 2-8. Overload Protection Devices
ID
F1 PTR1 PTR2
Rating
3A 1.1A 0.25A
Use
100 VA power limiting fuse. Input power protection. Analog input 24-V dc power (T terminal).
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PRESENT. The problem could be a bad backup battery or a bad solder joint of the RAM chip.
and either end of Resistor R2, which is located at the top of the MCU card.
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ROC306/ROC312 Instruction Manual CAUTION During this procedure, all power is removed from the ROC and devices powered by the ROC. Ensure all connected input devices, output devices, and processes remain in a safe state when power is removed from the ROC and when power is restored to the ROC.
1. Back up your RAM to avoid losing data. Refer to Section 2.6.1, RAM Backup Procedure, on
page 2-22.
2. Remove power by unplugging the block on the power terminal block. 3. Remove the memory module retainer by loosening the two thumbscrews and sliding the
CAUTION Before installing a new memory module, make sure the module connector pins are straight. Bent pins can damage the mating connector. Do not attempt to straighten bent pins; instead, replace the module.
5. Align the key on the module socket with the key of the MCU socket. Carefully insert the
module in the socket and press it in firmly, but gently to seat the module. The module should move inward slightly. Verify that the module is seated into the connector by gently lifting up on the module. If it comes out easily, repeat the process.
6. Ensure that the foam insert (for an unused slot) is properly seated in the module retainer, then
carefully slide the retainer over the memory modules and tighten the thumbscrews. Make sure that the sloped surface of the retainer is down.
7. If a 256-Kbyte RAM module was replaced, be sure to set the RAM module switches the same
as the one that was removed. Refer to Table 2-4 for switch settings.
8. Plug in the five-terminal connector to restore power. If a ROCPAC or FlashPAC was replaced,
a cold hard start (uses EEPROM or Internal Config Memory values) will automatically be performed; this may take a few seconds.
9. Using the ROCLINK software, check the configuration data (including ROC displays) and
FSTs, and load or modify them as required. In addition, load and start any user programs as needed.
10. Verify that the ROC performs as required. 11. If you changed the configuration, save the configuration data to EEPROM or Internal Config
Memory (permanent memory). If you changed the configuration (including the history database and ROC displays) or FSTs, save them to disk. See Section 2.6.1 for more information on saving files.
Rev 9/01
2-27
page 2-22.
2. Remove power from the ROC at the power terminal plug in. 3. Remove the four screws from the front cover of the ROC. 4. Remove the screw from the communications card if necessary. 5. Remove the communications card. 6. Locate the unused battery socket (typically B2) on the processor board and insert the new
battery. Note: The battery located at B1 is installed at the factory while the battery at B2 is used to replace Battery B1 without interrupting the operation of the ROC.
7. Remove the old battery from the other battery socket (typically B1) by sliding the hold-down
clip to one side and lifting the battery from the MCU board. If the clip does not readily rotate, you may need to loosen the screw that secures the hold-down clip.
8. Move the hold-down clip to the new battery and tighten if necessary. 9. Replace the communications card. 10. Replace the communications cards screw. 11. Replace the front cover and four screws. 12. Replace the FlashPAC or ROCPAC. 13. Return power to the ROC at the power terminal plug in.
2-28
Rev 9/01
page 2-22.
2. Unplug the power connector from the ROC. 3. Unplug all connectors and I/O terminal blocks from the ROC. 4. Loosen the four screws that secure the backplate of the ROC case to the enclosure or other
panel.
5. Move the ROC up to slide the keyhole slots in the case backplate into position to fit over the
heads of the two alignment screws. Lift the ROC away from the backplate.
6. If you are reasonably sure that the memory modules are functional, you can remove them by
unscrewing the two thumbscrews of their retainer and then gently pulling each one from its socket. Keep in mind that all RAM is normally cleared during factory servicing. If the unit is a ROC312 with I/O modules installed, you can also remove the I/O modules.
7. The MCU must be returned as an assembly to your Fisher Representative for repair. The MCU
board must remain in the metal case when returned. If the ROC is equipped with a communications card or a HART Interface Card, the cards can be removed before returning the MCU assembly. Follow the procedure in Section 4.5 for removing these cards.
8. To install a new or repaired MCU assembly, reverse the procedure used for removal in the
previous steps.
9. Reconnect power to the ROC, such as by plugging in the power terminal connector.
Rev 9/01
2-29
FSTs, and load or modify them as required. In addition, load and start any user programs as needed.
11. Verify that the ROC performs as required. 12. If you changed the configuration, save the configuration data to EEPROM (permanent
memory). Also, if you changed the configuration (including the history database and ROC displays) or FSTs, save them to disk. See Section 2.6.1 for more information on performing these saves.
components.
2-30 Master Controller Unit and Related Components Rev 9/01
software to confirm that the input value changes. If the previous tests do not indicate a fault, the input is operational. Check the field wiring and transmitters for a fault.
The source voltage at terminal S+ should reflect the voltage of the ROC input power.
3. Connect a jumper wire between terminals S+ and + on the discrete input. Connect one end
of another jumper wire to terminal - on the same input. Touch the other end to terminal S-. The LED above the terminal block should light.
4. Connect the ROC to a computer running the ROCLINK Configuration Software. 5. Repeat step 3, using the configuration software to confirm that the input value changes.
If the previous tests indicate failure, replace the MCU assembly. Refer to Section 2.6.12. If the previous tests do not indicate a fault, then the input is operational. Check the field wiring and transmitters for a fault.
Rev 9/01
2-31
LED should come on, and the ohmmeter should show continuity. If the previous tests indicate failure, replace the MCU assembly. Refer to Section 2.6.12. If the previous tests do not indicate a fault, then the output is operational. Check the field wiring and devices for a fault.
relay. The AUX LED should come on and the ohmmeter should show continuity. Note: Use the AUX Out #1 flag (not available for FlashPAC) to turn the output on. You cannot turn the input off in this manner. If the previous tests indicate failure, replace the MCU assembly. Refer to Section 2.6.12. If the previous tests do not indicate a fault, then the output is operational. Check the field wiring and devices for a fault.
2-32 Master Controller Unit and Related Components Rev 9/01
Rev 9/01
2-33
2-34
Rev 9/01
Section Page Number 3.1 3-1 3.2 3-1 3.3 3-3 3.3.1 3-4 3.3.2 3-4 3.3.3 3-4 3.3.4 3-4 3.3.5 3-5 3.3.6 3-5 3.3.7 3-5 3.3.8 3-6 3.3.9 3-6 3.3.10 3-6 3.3.11 3-7 3.4 3-7 3.4.1 3-8 3.5 3-8 3.5.1 3-8 3.5.2 3-9 3.5.3 3-11 3.5.4 3-12 3.5.5 3-13 3.5.6 3-14 3.5.7 3-15 3.5.8 3-16 3.5.9 3-17 3.5.10 3-18 3.5.11 3-19 3.5.12 3-20 3.5.13 3-21
3-1
Input/Output Modules
ROC306/ROC312 Instruction Manual Information Section Page Number Low-Level Pulse Input Module 3.5.14 3-22 RTD Input Module 3.5.15 3-22 Calibrating the RTD Module 3.5.15.1 3-23 Connecting RTD Module Field Wiring 3.5.15.2 3-24 HART Interface Module 3.5.16 3-26 Troubleshooting and Repair 3.6 3-27 Analog Input Modules 3.6.1 3-27 Analog Output Modules 3.6.2 3-28 Check Current Loop Source Installations 3.6.2.1 3-28 Check Voltage Source Installations 3.6.2.2 3-29 Discrete Input Source Module 3.6.3 3-29 Discrete Input Isolated Module 3.6.4 3-30 Discrete Output Source Module 3.6.5 3-30 Discrete Output Isolated Module 3.6.6 3-30 Discrete Output Relay Module 3.6.7 3-31 Pulse Input Source and Isolated Modules 3.6.8 3-31 Testing High-Speed Operation 3.6.8.1 3-31 Testing Low-Speed Operation 3.6.8.2 3-32 Slow Pulse Input Source Module 3.6.9 3-32 Slow Pulse Input Isolated Module 3.6.10 3-32 Low-Level Pulse Input Module 3.6.11 3-33 RTD Input Module 3.6.12 3-33 HART Interface Module 3.6.13 3-34 Verify Integrity of Loop Power 3.6.13.1 3-34 Verify Communications 3.6.13.2 3-34 Removal, Addition, and Replacement Procedures 3.7 3-35 Impact on I/O Point Configuration 3.7.1 3-35 Removing/Installing an I/O Module with Power On 3.7.2 3-36 Removing/Installing an I/O Module with Power Off 3.7.3 3-37 I/O Module Specifications 3.8 3-38 Analog Input ModulesLoop and Differential 3.8.1 3-38 Analog Input Source Module 3.8.2 3-40 Analog Output Source Module 3.8.3 3-40 Discrete Input ModulesSource and Isolated 3.8.4 3-42 Discrete Output ModulesSource and Isolated 3.8.5 3-43 Discrete Output Relay Module 3.8.6 3-45 Pulse Input ModulesSource and Isolated 3.8.7 3-45 Slow Pulse Input ModulesSource and Isolated 3.8.8 3-47 Pulse Input ModuleLow Level 3.8.9 3-48 Resistance Temperature Detector (RTD) Input Module 3.8.10 3-49 HART Interface Module 3.8.11 3-50
3-2
Input/Output Modules
Rev 9/01
STATIC SENSITIVE
DOC0034C
Rev 9/01
Input/Output Modules
3-3
3-4
Input/Output Modules
Rev 9/01
Rev 9/01
Input/Output Modules
3-5
3-6
Input/Output Modules
Rev 9/01
module was installed. If a Lightning Protection Module is to be installed for this I/O channel, refer to Appendix A.
Rev 9/01
Input/Output Modules
3-7
AI LOOP
I LIMIT
+ -
A B C
+T
VS
+ DOC0153J
TO SELECT PROPER VALUE OF R1: VS = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC, 25 mA MAX R1 = 5 VOLTS I MAXIMUM
Figure 3-2. AI Loop Module Field Wiring for Current Loop Devices
3-8
Input/Output Modules
Rev 9/01
ROC306/ROC312 Instruction Manual Figure 3-3 shows a typical voltage signal input. Terminal B is the + signal input and terminal C is the - signal input. These terminals accept a voltage signal in the 0 to 5 volt range. Since terminal C connects to a signal ground (non-isolated logic ground), the analog input must be a single-ended. Ensure that no scaling resistor (R1) is installed when the module is used to sense a voltage signal.
R1=OPEN
AI LOOP
I LIMIT
+ -
SIGNAL = 1 TO 5 VDC
A B C
+T
VS
+ DOC0153T
Rev 9/01
Input/Output Modules
3-9
R1 = OPEN
N/C
AI DIFF
+
Vo
A B C
+ -
200K 200K
DOC0155A
Figure 3-4. AI Differential Module Field Wiring for Low Voltage Devices
R1
AI DIFF
N/C
A
Vo R2 TO SCALE R1 AND R2 FOR: Vo = VOLTAGE FROM ANALOG DEVICE = 5 TO 100 VDC R1 MUST BE LESS THAN 4.5K OHM (1.0K OHM TYPICAL) R2 = R1(Vo - 5) 5
B C
+ -
200K 200K
DOC0156A
Figure 3-5. AI Differential Module Field Wiring for Higher Voltage Devices For current loop devices, scaling resistor R1 generates a voltage across terminals B and C that is proportional to the loop current. When connecting current loop devices, the value of R1 must be selected such that the 5-volt input limit of the module is not exceeded under maximum operating current conditions. For 0 to 20 milliamps or 4 to 20 milliamps devices, the value of R1 would be 250 ohms. In this case, you can use the 250-ohm (0.1%, 1/8W) scaling resistor supplied by the factory. The formula for determining the value of R1 is given in Figure 3-6, where I Maximum is the upper end of the operating current range (such as 0.025 amps for a 0 to 25 milliamps device).
R1
A B C
N/C +
200K 200K
Vo
TO SELECT PROPER VALUE FOR R1: Vo = VOLTAGE FROM ANALOG DEVICE = 0 TO 5 VDC R1 = 5 VOLTS I MAXIMUM
DOC0154A
Figure 3-6. AI Differential Module Field Wiring for Current Loop Devices
3-10
Input/Output Modules
Rev 9/01
A
SIGNAL = 0 TO 5
+10Vdc +
V SRC
Vs
B C
Figure 3-7. AI Source Module Field Wiring for Voltage Devices The AI Source module can be used for monitoring loop current as shown in Figure 3-8. For current loop monitoring, scaling resistor R1 generates a voltage across terminals B and C that is proportional to the loop current (I). For example, a 250-ohm scaling resistor would accommodate either 0 to 20 milliamps, or 4 to 20 milliamps current loop transmitters (the transmitter must be able to operate on 10 volts dc or be powered from another source). This translates to a maximum operating input voltage of 5 volts dc, which is the upper limit of the module. When using a transmitter with a maximum operating current requirement different from 20 milliamps, R1 should be sized to achieve full scale deflection at 5 volts. The formula for determining a new value of R1 displays in Figure 3-8.
R1
+
AI SRC
V SRC
A B C
+10 Vdc
+
Vs
TO SELECT PROPER VALUE OF R1: Vs = SOURCE VOLTAGE FROM MODULE = 10 Vdc, 20 mA MAX R1 = 5 VOLTS I MAXIMUM
Figure 3-8. AI Source Module Field Wiring for Current Loop Devices
Rev 9/01
Input/Output Modules
3-11
AO SRC
+V +I
220
A B C
+
COM
LEVEL
DOC0158A (Modified)
REMOVE RESISTOR R1 WHEN LOOP RESISTANCE IS LESS THAN 100 OHMS I = 30 mA MAX
Figure 3-9. Analog Output Source Module Field Wiring for Current Loop Devices
R1=0
AO SRC
+V +I
220
A B C
+ Vo -
COM
LEVEL
DOC0159A
Figure 3-10. Analog Output Source Module Field Wiring for Voltage Devices
3-12
Input/Output Modules
Rev 9/01
DI SRC
VS
I
RW
A B C
3.3K
TO OPTIMIZE SCALING RESISTOR R1: VS 1 RW 3.3K R1 = I R1 + RW + 3.3K = LOOP RESISTANCE = 4.5K OHMS MAX I = LOOP CURRENT = 3 mA TYPICAL RW = RESISTANCE OF FIELD WIRING VS = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC
DOC0143A Modified
Rev 9/01
Input/Output Modules
3-13
DI ISO
3.3K
I VO RW
A B C
TO OPTIMIZE SCALING RESISTOR R1: VO 1 RW 3.3K R1 = I R1 + RW + 3.3K = LOOP RESISTANCE = 4.5K OHMS MAX I = LOOP CURRENT = 3 mA TYPICAL RW = RESISTANCE OF FIELD WIRING VO = VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC
3-14
Input/Output Modules
Rev 9/01
1 Amp N/C +
A B C
+ ROC-POWERED
DISCRETE DEVICE
VS
I LIMIT
DOC0145A
Rev 9/01
Input/Output Modules
3-15
A B C
COM
NO N/C
+ VO
CONTROL
DOC0146A (Modified)
TERMINAL A CONNECTION IS COMMON TERMINAL B CONNECTION TO BE MADE FOR NORMALLY OPEN APPLICATIONS TERMINAL C CONNECTION IS NO CONNECT VO = VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC, 1.0 A MAX
3-16
Input/Output Modules
Rev 9/01
NO COM NC
A B C
+ VO
DOC0147A
TERMINAL A CONNECTION TO BE MADE FOR NORMALLY OPEN APPLICATIONS TERMINAL B IS COMMON TERMINAL C CONNECTION TO BE MADE FOR NORMALLY CLOSED APPLICATIONS VO= VOLTAGE FROM DISCRETE DEVICE = 0 TO 30 VDC OR 0 TO 115 VAC, 5 A MAX
Rev 9/01
Input/Output Modules
3-17
PI SRC
VS
I
RW
A B C
2.2K
TO OPTIMIZE SCALING RESISTOR R1: VS 1 RW 2.2K R1 = I R1 + RW + 2.2K = LOOP RESISTANCE = 3.4K OHMS MAX I = LOOP CURRENT = 5 mA TYPICAL RW = RESISTANCE OF FIELD WIRING VS = SOURCE VOLTAGE FROM MODULE = 11 TO 30 VDC
3-18
Input/Output Modules
Rev 9/01
PI ISO
2.2K
A
+
VO
RW
B C
TO OPTIMIZE SCALING RESISTOR R1: VO 1 R1 = RW 2.2K I R1 + RW + 2.2K = LOOP RESISTANCE = 3.4K OHMS I = LOOP CURRENT = 5 mA TYPICAL RW = RESISTANCE OF FIELD WIRING VO = VOLTAGE FROM PULSE DEVICE = 11 TO 30 VDC
Rev 9/01
Input/Output Modules
3-19
SPI SRC A B
Rw TO OPTIMIZE SCALING RESISTOR R1: R1 Vs- 1 I - R w - 3.3K N/C
3.3K
Vs
+ DOC0151 Modified
R1 + Rw + 3.3K = LOOP RESISTANCE = 4.5K OHMS I = LOOP CURRENT = 3 mA R w = RESISTANCE OF FIELD V s = SOURCE VOLTAGE FROM MODULE = 11 TO 30
3-20
Input/Output Modules
Rev 9/01
SPI ISO
I
A B C
N/C
3.3K
+
VO RW
TO OPTIMIZE SCALING RESISTOR R1: R1 Vo - 1 I
+ DOC0152A
- R w - 3.3K
R1 + R w + 3.3K = LOOP RESISTANCE = 4.5K OHMS I = LOOP CURRENT = 3 mA R w = RESISTANCE OF FIELD V o = VOLTAGE FROM DISCRETE DEVICE = 11 TO 30 VDC
Rev 9/01
Input/Output Modules
3-21
B C
DOC0150A
3-22
Input/Output Modules
Rev 9/01
A B C
WHT
WHT
RED
RTD
DECADE BOX
A4464821
-50 C
80.31 OHMS 79.96 OHMS
100 C
138.50 OHMS 139.16 OHMS
Note: Resistance values for RTD probes with other alpha values can be found in the temperature-to-resistance conversion table for that probe.
1. Connect the decade box as shown in Figure 3-21. 2. Set the decade box to the -50 C resistance value corresponding to the RTD alpha value in
Table 3-1.
3. Enter the value displayed for Raw A/D Input as the value for Adjusted A/D 0% using the
Analog Inputs configuration screen for the RTD input. Refer to ROCLINK > Configure > I/O > AI Points Advanced tab.
4. Set the decade box to the 100 C resistance value given in Table 3-1. 5. Enter the value displayed for Raw A/D Input as the value for Adjusted A/D 100% using
the Analog Inputs Advanced configuration screen for the RTD input.
6. Enter -50 for Low Reading EU using the Analog Inputs configuration screen.
Rev 9/01 Input/Output Modules 3-23
A B C
DOC4007A Modified
Figure 3-22. RTD Input Module Field Wiring for Two-Wire RTDs Three-wire RTDs have an active element loop and a compensation loop. The active element loop connects across terminals A and B. The compensation loop connects across B and C. The compensation loop helps increase the accuracy of the temperature measurement by allowing the RTD module to compensate for the resistance of hookup wire used between the probe and RTD module. In operation, the RTD module subtracts the resistance between terminals B and C from the resistance between terminals A and B. The remainder is the resistance of only the active element of the probe. This compensation becomes more important as the resistance of the hookup wire increases with distance between the probe and the ROC. Of course, in order to perform properly, the compensation loop must use the same type, size, and length of hookup wire as the active element loop. The ROC RTD module is designed for only one compensation loop, and this loop is not isolated from the active element loop because terminal B is common to both loops. In the 3-wire RTD, the wires connect to module terminals A, B, and C, as shown in Figure 3-23. It is important to match the color coding of the RTD probe wires to the proper module terminal, because the probe wire colors vary between manufacturers. To determine which leads are for the compensation loop and which are for the active element, read the resistance across the probe wires with an ohmmeter. The compensation loop reads 0 ohms, and the RTD element reads a resistance value matching the temperature curve of the RTD.
3-24 Input/Output Modules Rev 9/01
A B C
WHT WHT
I SRC
DOC0161A Modified
Figure 3-23. RTD Input Module Field Wiring for Three-Wire RTDs RTDs with four wires normally have the compensation loop separate from the active element loop to increase the accuracy of the probe. Various colors are used for the probe wires. For example, some probes have wire colors of red and white for the RTD element loop and black leads for the compensation loop, while other probes use two red leads for the active element loop and two white leads for the compensation loop. The connections in Figure 3-24 connect a 4-wire RTD with compensation loop to the 3-wire RTD module. The RTD module designed for 3-wire use does not permit a 4-wire RTD to provide any additional accuracy over a 3-wire RTD.
RTD
RED
A B C
I SRC
DOC4008A
Figure 3-24. RTD Input Module Field Wiring for Four-Wire RTD With Compensation Loop Figure 3-25 shows the connections for a single-element, 4-wire RTD. The two leads for one side of the RTD are both red, and for the other side, they are both white.
RED
RTD
A
RED WHT WHT
B C
I SRC
DOC4009A
Rev 9/01
Input/Output Modules
3-25
+T
MUX
MODEM
+ -
3-26
Input/Output Modules
Rev 9/01
A module suspected of being faulty should be checked for a short circuit between its input or output terminals and the ground screw on the termination card. If a terminal not directly connected to ground reads zero (0) when measured with an ohmmeter, the module is defective and must be replaced.
Value
800 4000 0.0000 100.0 xxxxx
Corresponds To:
1 volt dc across scaling resistor Rs 5 volts dc across Rs EU value with 1 volt dc across Rs EU value with 5 volts dc across Rs Value read by AI module
When the value of Filtered Engineering Units (EU) is -25% of span as configured above, it is an indication of no current flow (0 mA), which can result from open field wiring or a faulty field device. When the value of Filtered EUs is in excess of 100% of span as configured above, it is an indication of maximum current flow, which can result from shorted field wiring or a faulty field device.
Rev 9/01
Input/Output Modules
3-27
ROC306/ROC312 Instruction Manual When the value of Filtered EUs is between the low and high readings, you can verify the accuracy of the reading by measuring the voltage across scaling resistor Rs (Vrs) with the multimeter. To convert this reading to the filtered EUs value, perform the following: Filtered EUs = [((Vrs - 1)/4) Span] + Low Reading EU, where Span = High Reading EU - Low Reading EU This calculated value should be within one-tenth of one percent of the Filtered EUs value measured by the ROC. To verify an accuracy of 0.1 percent, read the loop current with a multimeter connected in series with current loop. Be sure to take into account that input values can change rapidly, which can cause a greater error between the measured value and the calculated value. If the calculated value and the measured value are the same, the AI module is operating correctly.
3-28
Input/Output Modules
Rev 9/01
across the device and calculate the output EU value using the following formula. EU value = [((1000V/R - 4)/16) Span] + Low Reading EU, where Span = High Reading EU - Low Reading EU
2. Compare the computed value to the output EU value measured by the ROC with the ROCLINK
software. It is normal for the reading to be several percent off, depending on the accuracy tolerance of the device and how rapidly changes occur in the output value.
3. Calibrate the analog output EU values by increasing or decreasing the Adjusted D/A % Units
as needed.
4. If the analog output is unable to drive the field device to the 100% value, confirm the +V (1 to
5 volts) voltage is present at the field device. If the voltage is present and the device is not at the 100% position, the resistance value of the device is too large for the +V voltage. A field device with a lower internal resistance should be used. If the voltage is not present at the field device, but it is present at field wiring terminal B, there is excessive resistance or a break in the field wiring.
change to On.
3. With no jumper on terminals B and C, the LED should not be lit and the Status should be
Off.
4. If the unit fails to operate, make sure a correct value for the module resistor is being used.
Rev 9/01
Input/Output Modules
3-29
change to On.
3. With no input on terminals B and C, the LED should not be on and the Status should be Off. 4. If the unit fails to operate, make sure a correct value for the module resistor is being used.
configuration software.
2. With the output Status set to Off, less than 0.5 volts dc should be measured across pins B and
pin C.
3. With the output Status set to On, approximately 1.5 volts dc less than the system voltage
wired correctly, and verify the load current requirement does not exceed the 57-milliamp current limit value of the module.
configuration software.
2. Set the output Status to Off and measure the resistance across terminals A and B. No
3-30
Input/Output Modules
Rev 9/01
configuration software.
2. Set the output Status to Off and measure the resistance across terminals B and C. A reading
Rev 9/01
Input/Output Modules
3-31
should increase.
switching.
2. The module LED should cycle on and off and the total accumulated count (Accumd Pulses)
should increase.
should increase.
3-32
Input/Output Modules
Rev 9/01
C.
2. Connect a frequency counter across terminals B and C. Set the pulse generator to a value equal
read by the ROC are the same using the ROCLINK software.
reading across terminals A and B. The resistance value required can be determined by the temperature-to-resistance conversion chart for the type of RTD being used.
3. Use ROCLINK software to verify that the Raw A/D Input value changed and reflects the 0%
A/D value.
4. Change the resistance to reflect a high temperature as determined by the temperature-to-
Rev 9/01
Input/Output Modules
3-33
the HART devices. Zero voltage indicates an open circuit in the I/O wiring, a defective HART device, or a defective module.
request and response for each HART device connected to this channel.
2. Attach the other input probe to terminal C and examine the signal for a polling request and
Keep in mind that each device on one channel is polled before the devices on the other channel are polled. If a channel indicates no response, this could be caused by faulty I/O wiring or a faulty device. If the HART module tries to poll both channels simultaneously, this could be caused by a defective module, in which case the module must be replaced.
3-34
Input/Output Modules
Rev 9/01
Rev 9/01
Input/Output Modules
3-35
When removing a module, loosen the module retaining screw and lift the module straight up. It may be necessary to rock the module gently while lifting. When installing a module, tilt the module slightly so the pins on the module ID end (AI SRC, or DI SRC) are inserted first. This ensures the power input to the module is the first connection made during insertion. After the module is inserted, tighten the module retaining screw. Refer to Section 3.7.1, Impact on I/O Point Configuration, on page 3-35.
2. Remove or install the I/O module. 3. Perform a Warm start from the ROC Flags display in ROCLINK for Windows. 4. Check the configuration data (including ROC displays) and FSTs, and modify them as
required. If you increased or reduced the number of HART modules or changed their relative position, perform a warm start to cause the HART program to recognize the changes. Configure the HART points accordingly.
5. Verify that the ROC performs as required. 6. If you changed the configuration, save the configuration data to EEPROM or Internal Config
Memory.
7. If you changed the configuration, including the history database, FSTs, and ROC displays, save
them to disk. Refer to Section 2, Troubleshooting and Repair, for more information on performing saves.
3-36
Input/Output Modules
Rev 9/01
4. 5. 6.
7. 8. 9.
backup procedures. Disconnect the input power, such as unplugging the 5-terminal connector. Perform one of the following steps, depending on whether the module is to be removed or installed: If removing the module, loosen the module retaining screw and remove the module by lifting straight up. It may be necessary to rock the module gently while lifting. If installing the module, insert the module pins into the module socket. Press the module firmly in place. Tighten the module retaining screw. After the module is removed/installed, reconnect the input power. Check the configuration data (including ROC displays) and FSTs, and load or modify them as required. Load and start any user programs as needed. Refer to Section 3.7.1, Impact on I/O Point Configuration, on page 3-35. If you increased or reduced the number of HART modules or changed their relative position, perform a warm start to cause the HART program to recognize the changes. Configure the HART points accordingly. Verify that the ROC performs as required. If you changed the configuration, save the configuration data to permanent memory. If you changed the configuration, including the history database, FSTs, and ROC displays, save them to disk. Refer to Section 2, Troubleshooting and Repair, for more information on performing saves.
Input/Output Modules 3-37
Rev 9/01
3-38
Input/Output Modules
Rev 9/01
Rev 9/01
Input/Output Modules
3-39
3-40
Input/Output Modules
Rev 9/01
Rev 9/01
Input/Output Modules
3-41
3-42
Input/Output Modules
Rev 9/01
Rev 9/01
Input/Output Modules
3-43
3-44
Input/Output Modules
Rev 9/01
Rev 9/01
Input/Output Modules
3-45
3-46
Input/Output Modules
Rev 9/01
Rev 9/01
Input/Output Modules
3-47
3-48
Input/Output Modules
Rev 9/01
Rev 9/01
Input/Output Modules
3-49
3-50
Input/Output Modules
Rev 9/01
Rev 9/01
Communications Cards
4-1
4-2
Communications Cards
Rev 9/01
P1
J1
FB1 C1 U2
30
U1
1 2
C2
C4 U3
FB5 U6 C12 U5
C9 C10 C11
C6 C7 C8
C3
LED Indicators
R10
P2
J2
RP2
RP1
Y1
R11
C17
C18
R12
R14
30
RS-232
Figure 4-1. EIA-232 Serial Communications Card The current EIA-232 communications card includes LED indicators that display the status of the RXD, TXD, DTR, DCD, CTS, and RTS control lines. LED indicators are detailed in Table 4-1.
Rev 9/01
Communications Cards
COM PORTS
DOC0234A
1 2
30
C15
R7
R8
R9
4-3
NOTE: The last three LED indicators are used only on the dial-up modem communications card.
4-4
Communications Cards
Rev 9/01
P1 30
J1
FB1 C1 U2
U1 1 2 C2 R1 R2 CR7 R5 R6
RTS CTS DCD DTR TXD RXD
CR8
CR9
CR10
FB6 C14
R7
R8
LED Indicators
R9
U7
R10
P2
J2 30
U8
RP1
Y1
P3 2 4 RS-485 XMIT 1 2
C18
COM PORTS
DOC0235A
Figure 4-2. EIA-422/485 Serial Communications Card The current EIA-422/485 communications card includes LED indicators that display the status of the RXD, TXD, and RTS control lines. LED indicators are detailed in Table 4-1. The card has one jumper (P3) that applies to the EIA-422 mode. The default setting of this jumper allows a multi-drop configuration such as is normally possible with EIA-485 communications. Refer to Section 4.5.2 for more information.
Rev 9/01
Communications Cards
1 2
30
C15
4-5
30
FB1
R1
30
C1
R2 C2 C4
U2
P2
R5
R6
R26
P3 C9 U3 2W 4W 2W 4W C5 2W 4W ISO GND C8 2 4 P4 2 4 P5 2 4 P6 2 4
VR1 T1 T2
VR2
1 2
U1
C10 U6 C11
C15 C16 R13 R14 R15 CR7 CR8 R16 C17 R17 R18 R19 R20
R21
RXD
U7
C13
U4
C12
C20
LED Indicators
C14
R22 W1
P8
RTS CTS
C22
Y2
RP2
R23
RP1
Y1
R24
C25
C24 C23
FB5
FB6
C18
U9
1 3 5
P7
30
C26
R25
C28 C29
4-6
Communications Cards
COM PORTS
U10
DOC0247A
1 2
30
U8
J2
C21
C19
Rev 9/01
30
FB1
R1
30
C1
R2 C2 C4
U2
P2
R26
R5
R6
P3 C9 U3 2W 4W 2W 4W C5 2W 4W ISO GND C8 2 4 P4 2 4 P5 2 4 P6 2 4
VR1 T1 T2
VR2
1 2
U1
C10 U6 C11
LED Indicators
C15 C16 R13 R14 R15 CR7 CR8 R16 C17 R17 R18 R19 R20
R21
RXD
U4
U7
C13
C12
C20
C14
R22 W1
P8
CTS
RTS
C22
Y2
RP2
R23
RP1
Y1
R24
C25
C24 C23
FB5
FB6
U9
1 3 5
C18
P7
30
C26
R25
C28
C29
DOC0246A
Rev 9/01
Communications Cards
COM PORTS
U10
1 2
30
U8
J2
C21
C19
4-7
4-8
Communications Cards
Rev 9/01
LED Indicators
DOC0389A
Rev 9/01
Communications Cards
4-9
30
C1
CR1
R1 R2
P2
30
FB1
FB2 C2 U2 FB3 C3
U3
U1
1 2
J1
C4 U4 C5
P1
2
C6
FB5
C18 FB C13
RP1
RXD
FB4
C10
FB7
C14
C15
U8 P3
J2
OH
U5
R3 R4 C8 C9
U6 U7
FB
Y1
R5
C11
C12
FB8
RI
30
LED Indicators
C16
FB6
C7
4-10
Communications Cards
COM PORTS
C17
DOC0245A
1 2
30
C19
Rev 9/01
ROC312, some resistance may be encountered because of the connector that mates the I/O module board in the cover to the main circuit board.
2. Install the communications card onto the main circuit board. Figure 4-7 shows the correct
orientation for the communications card. Plug the card into its mating connectors on the main board and press gently until the connectors firmly seat.
3. Install the retaining screw to secure the card. For dial-up and leased-line communications
Rev 9/01
Communications Cards
4-11
COM PORTS
DOC0096A
Figure 4-8. Phone Jack Location Note: If you are installing a dial-up or leased-line modem card, it is recommended that you install a telephone-style surge protector between the RJ11 jack and the outside line.
4-12 Communications Cards Rev 9/01
the proper position as described in Table 4-2 and to set the output attenuation level as described in Table 4-3.
7. Reinstall the upper cover. If the unit is a ROC312, be sure to carefully mate the I/O board
connector in the cover with the connector on the main circuit board.
8. After installing the communications card, apply the LED identification decal to the window on
cations cards.
212
DECAL LOCATION
DOC0202A
Rev 9/01
Communications Cards
4-13
4-14
Communications Cards
Rev 9/01
ROC306/ROC312 Instruction Manual Table 4-3. Radio and Leased-Line Modem Card Attenuation Levels
ATTENUATION (dB)
-2 -4 -6 -8 -10
R2 VALUE (Ohms)
205 K 82.5 K 47.5 K 30.9 K 21.5 K
ATTENUATION (dB)
-12 -14 -16 -18 -20
R2 VALUE (Ohms)
15.8 K 11.5 K 8.66 K 6.65 K 5.11 K
NOTES: 1. All resistor values are nominal; 1% W resistors are acceptable. 2. Attenuation for leased or private-line operation or for a GE MCS radio is normally in this case, no resistor is needed. 3. Attenuation for a GE TMX radio is typically -20 dB. 4. Attenuation for an MDS radio is typically -10 dB.
Attenuation Resistor
R2
COM PORTS
DOC0096T
Rev 9/01
Communications Cards
4-15
1
DCD
2
RX RXOUT-
3
TX RX+ OUT+ RXA
4
DTR TX+
5
COM
6
DSR TX-
7
RTS
8
CTS
9
RI
TXA
COM RING1
PTT+
PTTTIP1
TIP2
RING2 TIP (RED) TIP2 (BLK) TIP1 (RED) TIP (RED) RING (GRN) RING1 (GRN) RING (GRN) DTR COM RING2 (YEL)
SPK
RXD
TXD
RI
SHUT DOWN
+5V
DSR
4-16
Communications Cards
Rev 9/01
COMM PORT
P2 RX TX DSR DTR DCD RI CTS RTS R D R R R D R D
EIA-232
21 19 24 17 23 18 20 22 15 2 3 6 4 1 9 8 7 5 2 3 6 4 1 9 8 7 5 RECEIVE TRANSMIT DSR DTR DCD RI CTS RTS COM
DOC0169B
Rev 9/01
Communications Cards
4-17
EIA-422
-RECEIVE +RECEIVE -TRANSMIT +TRANSMIT
R D
P2
21 19 24 17 23 18 20 22 15 2 3 6 4 1 9 8 7 5 2 3 6 4 1 9 8 7 5
P3 +5V
RTS ON DIR
R D
DOC0248A
4-18
Communications Cards
Rev 9/01
EIA-422/485 CARD
COMM PORT
P2
21 19 24 17 23 18 20 22 15 2 3 6 4 1 9 8 7 5 2 3 6 4 1 9 8 7 5
EIA-485
-OUT +OUT
R D
DOC0171B
Signal Line
TXA RXA PTT+ PTTCOM
Description
Transmit data Receive data Push-to-talk switch Push-to-talk return (may be grounded) ROC power supply ground
The radio modem uses a jumper (P6) to determine the use of the PTT return line. The setting of this jumper is described in Section 4.4.2. The radio modem board is shipped without a resistor installed in the R2 position. To modify the attenuation level, select a resistor as directed by Table 4-3 and insert it in the R2 position. Figure 4-14 shows the relationship between the radio modem signals and pin numbers for the communications port 9-pin connector.
Rev 9/01
Communications Cards
4-19
TRANSMIT R2 OPEN P8
TXA
RTS +5V
P7 1 7 4 3 5 6 8 2
ISO
DOC0242A Modified
Figure 4-14. Radio Modem Wiring Schematic The following signals, used only for monitoring or connecting to an analyzer, are available at connector P7 located at the bottom edge of the card. These signals are normally not active. To activate the signals, SHUTDOWN (pin 8) must be grounded by connecting a jumper between pin 8 and pin 2. All unused signals can be left unterminated.
P7 Terminal
1 2 3 4 5 6 7 8
Function
+5 VOLTS DC COM DCD TXD DTR RTS RXD SHUTDOWN
4-20
Communications Cards
Rev 9/01
RJ11
3 4 1 2
RXTA TXTA TXTB RXTB
2 3 4 5
P7 1 7 4 3 5 6 8 2
23 21 19 17 18 24 22 20 15
COM
1 2 3 4 9 6 7 8 5
1 2 3 4 9 6 7 8 5
TIP2 RING2
TIP1 RING1
DOC0215TJ
Figure 4-15. Leased-Line Modem Wiring Schematic The 9-pin COMM connector mounted on the ROC can be used to connect the modem to a private line. This connector is not FCC approved and cannot be used for leased-line operation. The signals present are:
COMM Port
1 2 6 9
Rev 9/01
Communications Cards
4-21
ROC306/ROC312 Instruction Manual The following signals, used only for monitoring or connecting to an analyzer, are available at connector P7 located at the bottom edge of the card. These signals are normally not active. To activate the signals, SHUTDOWN (pin 8) must be grounded to pin 2 using a jumper. All unused signals can be left unterminated.
P7 Terminal
1 2 3 4 5 6 7 8
Function
+5 VOLTS DC COM DCD TXD DTR RTS RXD SHUTDOWN
Figure 4-16 shows the relationship between the dial-up modem signals and pin numbers for the RJ11 and COMM port connectors. CAUTION Be careful to avoid shorting the +5 volt supply (pin 8 on the COMM port connector) to common (pin 5) or to any ground when wiring to the COMM port. Grounding pin 8 causes the ROC to halt operation and data may be lost once a restart is initiated.
4-22
Communications Cards
Rev 9/01
RJ11
NC 2 1 4 NC P2 3 3 4 1 2 BLK RED GRN YEL 2 3 4 5
MODEM
23 21 RXD +5V TTL/RS232 INTERFACE TXD DTR DSR RI 10K SHUTDOWN +5V 19 17 18 24 22 20 15 P3
DOC0216J
Figure 4-16. Dial-Up Modem Wiring Schematic The following signal lines (output only) are available at the COMM port for wiring to an analyzer or monitor:
COMM Port
1 2 3 4 5 6 7 8 9
Signal Line
SPK RXD TXD DTR COM RI SHUTDOWN +5V DSR
Description
Speaker Receive data Transmit data Data terminal ready Common Ring indicator Disable signal lines 5-volt dc power Data set ready
Rev 9/01
Communications Cards
4-23
the connectors, pull the card free from the communications card underneath it. If the 6-pin header connector is still in socket J9 on the main board (just below the bottom edge of the communications card), remove it.
4-24
Communications Cards
Rev 9/01
motion to disengage the connectors, pull the card free from the main circuit board.
8. To reinstall a communications card, orient the card with the COM PORTS arrow pointing
down. Plug the card into its mating connectors and gently press until the connectors firmly seat. Install the retaining screw to secure the card.
9. For a dial-up or leased-line modem card, connect the phone jack cable to the board connector
P2.
10. If you are installing a replacement modem card, be sure to set the jumpers on the card in the
proper position (see Section 4.4.2) and to set the output attenuation level (see Section 4.4.3).
11. If a HART card is to be reinstalled, take the 6-pin header connector plug it back into socket J9
on the main board. Align the HART card with the 6-pin header and the two connectors on the communications card. Gently press on the card until the connectors firmly seat. Install the retaining screw to secure the card.
12. Reinstall the upper cover[JM2]. If the unit is a ROC312, be sure to carefully mate the I/O board
FSTs, and load or modify them as required. In addition, load and start any user programs as needed.
16. Verify that the ROC performs as required.
If you changed the configuration, save the configuration data to permanent memory. Also, if you changed the configuration (including the history database and ROC displays) or FSTs, save them to disk. See Section 2 for more information on performing saves.
Rev 9/01
Communications Cards
4-25
4-26
Communications Cards
Rev 9/01
Rev 9/01
Communications Cards
4-27
4-28
Communications Cards
Rev 9/01
Rev 9/01
Communications Cards
4-29
4-30
Communications Cards
Rev 9/01
Rev 9/01
A-1
LPM-2
I/O WIRING
FRONT VIEW
SIDE VIEW
DOC0138A
Figure A-1. Lightning Protection Module In general, it is recommended a LPM be used to protect the circuitry for each field input or output. An LPM can be used with any type of input or output as long as the normal operating range of the input or output is less than the clamping release voltage of the LPM. The LPM cannot be used with a 120 volt ac signal on a DO Relay Module. The LPM is most often used with analog and pulse inputs. The LPM has little effect with an RTD module; however, the LPM protects the I/O rack and other modules.
A-2
Rev 9/01
FLASHPAC
12
B A
10 2 1
LPM-2
11
C B A C B A C B
I/O WIRING
DSPL LPM312
ROC312
REMOTE OPERATIONS CONTROLLER
B A
INTERFACE
RESET AI AI DO
COMM
LPM-2
DI/PI
DI/PI
+ -
+ -
+ -
+ -
N O
C O M
I/O WIRING
Rev 9/01
A-3
ROC306/ROC312 Instruction Manual CAUTION If you are installing an LPM on a ROC currently in service, and there is a field device connected to the I/O channel that will receive the LPM, make sure the field device will not be left in an undesirable state when it is disconnected from the ROC. CAUTION Do not use the lightning protection module with 120-volt ac signals.
1. Unplug the field wiring termination block from the channel for which the LPM is going
to be installed.
2. Plug the LPM into the field wiring terminal block socket located in step 1. 3. Connect the LPM ground wire to the ground bus bar. The ground bar must be connected to a
good earth ground. Do not use the power system ground for this connection.
4. Transfer any field wiring from the unplugged termination block to the built-in termination
A-4
Rev 9/01
DI/PI
LPM-2
DI/PI
DO
+ -
+ -
N O
C O M
LPMSGNL
Figure A-3. LPM Wiring for One Sourced Discrete or Pulse Input To protect two discrete or pulse inputs where one is isolated and the other is sourced, use the installation and wiring scheme shown in Figure A-4. To protect two discrete or pulse inputs where both are sourced, refer to Figure A-5.
212
DECAL LOCATION
DOC0202A
Figure A-4. LPM Wiring for Two Discrete or Pulse Inputs, One Sourced and One Isolated
Rev 9/01
A-5
DI/PI
LPM-2
DI/PI
LPM-2
DO
+ -
+ -
N O
C O M
LMPTWO2
Figure A-5. LPM Wiring for Two Discrete or Pulse Inputs, Both Sourced
A-6
Rev 9/01
Rev 9/01
A-7
A-8
Rev 9/01
Section Page Number B.1 B-1 B.2 B-1 B.3 B-2 B.4 B-3 B.5 B-5 B.5.1 B-5 B.5.2 B-7 B.5.3 B-7 B.5.4 B-8 B.5.4.1 B-9 B.5.4.2 B-10 B.5.4.3 B-11 B.5.4.4 B-12 B.5.4.5 B-13 B.5.5 B-14 B.5.5.1 B-14 B.5.5.2 B-15 B.5.5.3 B-15 B.5.5.4 B-16 B.5.6 B-17 B.5.7 B-18 B.5.7.1 B-18 B.5.7.2 B-19 B.5.7.3 B-20 B.5.7.4 B-20 B.5.8 B-22 B.5.9 B-23 B.5.10 B-23 B.5.11 B-24 B.5.12 B-24 B.5.12.1 B-25 B.5.12.2 B-25 B.6 B-27 B.7 B-27
B-1
>I/O SYS FST AGA PID MSG DB LCD UP DOWN ENTER MENU
B-2
Rev 9/01
B.4 Installation
A kit is available for field installations of the Local Display Panel (LDP) in a ROC enclosure that contains cutouts for the display panel in the door. The Local Display Panel kits FSACC-1/LCWH (white), /LCDAH (ANSI 61 gray), and /LCDRH (regal gray) include the items in the following list:
Description
LCD Sub-Assembly Window Gasket Display Cover Assembly 6-32 .25 Screws 6-32 Hex Nuts Flat Wire Clips RTV Sealant Cable Assembly
Quantity
1 1 1 1 2 3 2 1 1
Refer to Figure B-2 for how these parts fit together. Note that the panel is also referred to as the LCD.
LCD SUB-ASSEMBLY WINDOW GASKET
HEX NUT
SCREW
Rev 9/01
B-3
ROC306/ROC312 Instruction Manual Use the following steps to install the display panel with FSACC-1/LCDS, LCDR, LCDAH, or LCDRH.
1. Inspect the kit and verify that there are no missing parts. 2. Remove the cutout cover from the enclosure door. 3. Place two small drops of RTV sealant on the LCD sub-assembly to hold the window in place
RTV
RTV
WINDOW
gasket holes to the door studs with the RTV facing the door and press into place. Refer to Figure B-4.
INSIDE VIEW OF DOOR GASKET HOLES RTV
DOOR STUDS
GASKET
B-4
Rev 9/01
RTV
HOLES
the kit.
10. Connect the display cable assembly to the display port of the ROC. Use the flat wire clips to
hold the cable in place. Make sure the cable does not interfere with the door.
Rev 9/01
B-5
ROC306/ROC312 Instruction Manual Table B-1. Function Key Labels and Descriptions
Label
UP DOWN or DWN ENTER
Description
Moves the cursor (>) up one line at a time. If pressed and held for 5 to 10 seconds on ROC power-up, ROC performs a cold hard-start. Moves the cursor (>) down one line at a time. Activates the selection pointed to by the cursor and shows a menu or point display. In the event there are no points to display, the current menu display remains and the cursor returns to the beginning of the list. Returns to the menu display last used. Monitors a point display in an updating mode. For a ROC with a FlashPAC, by pressing the SCAN key (the label then changes to HOLD), the display is updated with current values from the ROC every second, and the display automatically scrolls through all points of the selected type at a rate of about 4 seconds per configured point. This scrolling mode continues until the HOLD key is pressed. For a ROC with a ROCPAC, by pressing the SCAN key (the label then changes to AUTO), the display is updated with current values from the ROC every 3 seconds for a duration of 2 minutes. After 2 minutes have elapsed, the display ceases to update values (reverts to a hold mode) and the key label changes back to SCAN. Brings up the next display if multiple displays exist. When NEXT is pressed at the end of the list, the first display in the list is brought up. This key is disabled during the SCAN mode. Brings up the previous display if multiple displays exist. When PREV is pressed at the head of the list, the first display in the list remains displayed. This key is disabled during the SCAN mode. This key applies only to ROCs with a ROCPAC. It stops the values on the display from being updated, functioning as a hold mode. When the key is pressed, the AUTO label changes to SCAN. This key applies only to ROCs with a FlashPAC. It stops the display from scrolling between points (but values continue to be updated once per second), holding the display at the current point. When the key is pressed, the HOLD label changes to SCAN. Available only when in an edit mode, this key cancels the current action and returns the last display. Increments the displayed character to the next character (when 9 is reached, it starts over at 0). Used to enter a password or to enter numeric values when editing parameters. Brings up a display prompting the user to enter a value.
MENU SCAN
NEXT
PREV
AUTO
HOLD
ESC INC
EDIT
B-6
Rev 9/01
Figure B-6. Typical Main Menu Display The menu displays have lists of items for selection. The UP or DOWN function keys move the cursor (>) through the menu list. After moving the cursor to the desired item, press the ENTER function key. If the item exists in the ROC configuration, a new display for the selected item appears. This display may be another menu or an information display. If the item does not exist, the cursor moves to the start of the menu display list. To return to the previous menu, press the MENU key. To return to the main menu, press the menu key until the main menu displays. The following paragraphs describe in detail the various displays available on the panel.
Description
Provides a menu from which the user can select monitored values from the five I/O groups: discrete inputs, discrete outputs, analog inputs, analog outputs, and pulse inputs. Provides four displays of system parameters and related information. Provides a menu for viewing points in the history database. Provides a point display for each configured AGA point. Provides a point display for each configured PID point. Provides a point display for each configured tank point (appears only for ROCs with a ROCPAC). Provides a point display for each configured FST point. Provides a point display for each configured FST message point. Provides eight displays that the user defines with the ROCLINK configuration software. For a FlashPAC ROC, it provides a menu that the user can use to select viewing or editing of parameters.
Rev 9/01
B-7
Description
Provides a point display for each configured discrete input. Provides a point display for each configured discrete output. Provides a point display for each configured analog input. Provides a point display for each configured analog output. Provides a point display for each pulse configured input.
B-8
Rev 9/01
Description
A 10-character identifier for the discrete input. The module rack letter and number of the discrete input (point) as installed in the system. The state of the discrete input. OFF in the field shows that the input is off or that a switch is open. ON shows that the input is on or that a switch is closed. The Status value can be changed in the manual mode to lock an input to either the OFF or ON state. Used only when the discrete input is configured as a timed duration input. This value is calculated at scan period intervals using the 0% count, 100% count, low reading EU, high reading EU, and TDI count parameters. The number of positive (0 to 1) transitions of the discrete input.
EU Value
Accumulator
Rev 9/01
B-9
Description
A 10-character identifier for the discrete output. The module rack letter and number of the discrete output (point) as installed in the system. The state of the discrete output. OFF in the field indicates that the output is off or that the relay is open. ON indicates that the output is on or that the relay is closed. Used only when discrete output is configured as a timed duration output. The output value is calculated from EU Value using the 0% Count, 100% Count, Low Reading EU, High Reading EU parameters. The number of positive (0 to 1) transitions of the discrete output.
EU Value
Accumulator
B-10
Rev 9/01
PT# A2 MENU
Description
A 10-character identifier for the analog input. A 10-character identifier for the engineering units assigned to the analog input. The value in engineering units. The module rack letter and number of the analog input (point) as installed in the system. An 8-bit field. If a bit is set to 1, the alarm is active. If a bit is set to 0 the alarm is cleared.
Figure B-11 shows the alarm code bits and the alarms they represent for an analog input point.
Alarm Code 0 0 0 0 0 0 0 0 Lo Alm Flag Lo Lo Alm Flag Hi Alm Flag Hi Hi Alm Flag
Manual Flag
A-D Failure Not Used Rate Alm Flag
Rev 9/01
B-11
PT# A8 MENU
Description
A 10-character identifier for the analog output. A 10-character identifier for the engineering units assigned to the analog output. The output value in engineering units. The module rack letter and number of the analog output (point) as installed in the system. An 8-bit field. If a bit is set to 1, the alarm is active. If a bit is set to 0 the alarm is cleared.
Figure B-13 shows the alarm code bits and the alarms they represent for an analog output point.
Alarm Code 0 0 0 0 0 0 0 0 Not Used Not Used Not Used Not Used
Manual Flag
D-A Failure Not Used Not Used
B-12
Rev 9/01
Description
A 10-character identifier for the pulse input. A 10-character identifier for the engineering units assigned to the pulse input. If the rate flag has been set to rate, then the EU/time will be displayed. If accumulation was selected, then the EUs accumulated since contract hour will be displayed. The module rack letter and number of the pulse input (point) as installed in the system. An 8-bit field. If a bit is set to 1, the alarm is active. If a bit is set to 0 the alarm is cleared.
Figure B-15 shows the alarm code bits and the alarms they represent for a pulse input point.
Alarm Code 0 0 0 0 0 0 0 0
Manual Mode
Not Used Not Used Rate Alarm
Low Alarm Low Low Alarm High Alarm High High Alarm
Rev 9/01
B-13
Description
20-character identifier for the location of the ROC. Number identifying the ROC address. Number identifying the ROC group. The current time and date kept by the real- time clock of the ROC.
B-14
Rev 9/01
Description
Identifies the part number and version of the firmware in the ROC. Identifies Fisher Controls International as creator of the firmware. Identifies the time and date that the firmware was created.
Rev 9/01
B-15
B-16
Rev 9/01
ENTER MENU
Figure B-20. DB Menu Display The display shown in Figure B-21 is a typical display for each historical database point. For a ROC with a ROCPAC, use the NEXT and PREV keys to move between the historical database points configured in the ROC. For a ROC with a FlashPAC, use the HOLD key to stop the display from automatically scrolling between points. To return to the DB menu display, press the MENU key. The DB point display shows the parameters listed in Table B-11. +T DB#1 CUR VAL 23.38 SCAN NEXT PREV MENU
Description
A 10-character identifier for the database point. Point for the selected RAM area. Point number can be 1 through 30 for each RAM area. The current value read for use by the historical database.
Rev 9/01
B-17
Description
A 10-character identifier for the AGA point. The current instantaneous flow rate in volume units/day. An 8-bit field. If a bit is set to 1, the alarm is active. If a bit is set to 0 the alarm is cleared.
Figure B-24 shows the alarm code bits and the alarms they represent for an AGA point.
B-18 Local Display Panel Rev 9/01
Manual Mode
No Flow Not Used Not Used
Low Alarm
Not Used
High Alarm
Not Used
Description
A 10-character identifier for the AGA point. The accumulated volume since contract hour. The accumulated volume for the day prior to contract hour.
Rev 9/01
B-19
Description
A 10-character identifier for the AGA point. The accumulated energy since contract hour. The accumulated energy for day prior to contract hour.
Figure B-27. Plate Change Password Display The password prompt appears as four asterisks (*) that represents the four characters of the password. To change an asterisk to a password character, press the INC (increase) key until the correct character appears. Once the correct character appears, press the NEXT key to move right to the next asterisk and use the INC to display the correct character. Continue this procedure for each asterisk until all four password characters display. Then, press the ENTER key to enter the Password. If the Password is valid, a new display appears, prompting you to select an AGA point. Use the PREV and NEXT keys to display the desired AGA point, and then press the ENTER key. Use ESC to return to the AGA menu display.
B-20 Local Display Panel Rev 9/01
ROC306/ROC312 Instruction Manual Upon selecting an AGA point, a display appears (see Figure B-28) showing the amount of time allowed before the LDP reverts to a view-only mode. You can edit the number of minutes by pressing the EDIT key or accept the default of 10 minutes. When you press the ENTER key, the display changes to show the time remaining. When the new plate is installed, press DONE to continue on to editing the plate size. Time Out (Minutes) 10 EDIT ENTER ESC
Figure B-28. Time Out Display If the orifice size has not changed, press the DONE key. A new display appears as shown in Figure B-29. To change the orifice size, you can use the DEC and INC keys to change the size in 1/8-inch increments, or you can use the EDIT key to enter the exact size. Plate Size = DEC INC DONE 4.000 EDIT
Figure B-29. Plate Size Editing Display If you press EDIT, the prompt appears as eight digits representing the size of the orifice. To change a digit, press the INC key until the correct numeral (or decimal point) appears. Once the correct number appears, press the NEXT key to move right to the next digit and use the INC to display the correct numeral. Continue this procedure for each digit. Then, press the ENTER key to enter the new value. If the value is different than the old value, a prompt asks you to verify that this value should be written to EEPROM (permanent memory). If you press YES, an entry is generated in the event log and you are returned to the AGA menu display. If you press NO, you exit the Plate Change routine without a change being registered to EEPROM.
Rev 9/01
B-21
Description
A 10-character identifier for the PID point. Indicates the running state of the PID; OVR for override or PRI for primary. The setpoint for the PID loop displayed. The operating mode, either AUTO or MAN. The input for the PID loop displayed. The corrected output for the PID loop displayed.
B-22
Rev 9/01
Description
A 10-character identifier for the tank point. The current liquid level in the tank measured in engineering units divided by the specific gravity. The calculated tank volume net gain or loss since contract hour.
Description
A 10-character identifier for the FST point. Indicates the current state of the FST; OFF, RUNNING, or TRACE.
Rev 9/01
B-23
Description
30-character text specified by argument 1 of the FST MSG command. 10-character identifier for the FST Registers point being displayed. The current value of the parameter specified by argument 2 of the FST MSG command.
B-24
Rev 9/01
INC
Figure B-36. LCD Password Display If the password is valid, the Initial Parameter Display shown in Figure B-37 appears and you can proceed to edit the LCD parameters. If a valid password has not been entered, the LCD menu is again displayed. To return to the LCD menu or escape from entering a password, press the ESC key.
Rev 9/01
B-25
ROC306/ROC312 Instruction Manual One parameter display is provided for each of the 24 available LCD parameters. To move between the parameter displays, use the NEXT and PREV keys. To change a parameter, press the EDIT key. To return to the LCD Menu display, press the MENU key. FST REG#6= 20.00
MENU
Figure B-37. Initial Parameter Display Selecting EDIT from the Initial Parameter Display causes the Parameter Editing Display to appear as shown in Figure B-38. This display prompts the user to enter a new value for the parameter. FST REG#6= 20.00 20.00000 NEXT ENTER ESC
INC
Figure B-38. Parameter Editing Display The parameter prompt appears as up to eight characters representing the value of the parameter. To change a digit to the desired numeral, press the INC key until the correct numeral appears. Once the correct number appears, press the NEXT key to move right to the next digit and use the INC to display the correct numeral. Continue this procedure until all digits are displayed. The sign (+ or -) can also be changed as needed. Then, press the ENTER key to enter the new value. If the value is different than the old value, an entry is generated in the event log. Note: IF you want the changed values to be saved to permanent memory (EEPROM or Internal Config Memory), use the ROCLINK software. To exit from editing an LCD parameter and return to the Initial Parameter Display, press the ESC key.
B-26
Rev 9/01
Rev 9/01
B-27
B-28
Rev 9/01
Rev 9/01
I/O Simulation
C-1
AI LOOP
I LIMIT
+V +I
220
A B C
+ -
A B C
+T + -
Vs
COM
LEVEL
DOC0176A
AO SRC
R1=0
R1=OPEN
AI DIFF
+V +I
A B C
A B C
N/C
+ -
200K 200K
220
COM
LEVEL
DOC0177A
Figure C-2. Current Loop AO Source Module to AI Differential Module The analog output source module simulates a transmitter feeding a 0 to 5 volt dc signal to an analog input differential module. Figure C-3 shows wiring connections.
AO SRC
R1=0 R1=250
AI DIFF
+V +I
A B C
A B C
N/C
+ -
200K 200K
220
COM
LEVEL
DOC0178A
C-2
I/O Simulation
Rev 9/01
+V +I
220
A B C + AMPS
COM
LEVEL DOC0179A
R1=0
AO SRC
+V +I
220
A B C
+ VOLTS -
COM
LEVEL DOC0180A
R1=10
DI ISO
3.3K
A B C
A B C
I LIMIT
DOC0181A
Rev 9/01
I/O Simulation
C-3
ROC306/ROC312 Instruction Manual Figure C-7 shows how to use a discrete output isolated module to simulate relay contacts to a discrete input source module.
DO ISO
+5V
CONTROL
R1=10
DI SRC A B C A B C
3.3K Vs
DOC0182A
R1=10
PI ISO
2.2K
SSR
A B C
A B C
I LIMIT
DOC0183A
Figure C-8. DO Source Module to PI Isolated Module Figure C-9 shows how to use a discrete output isolated module simulate a relay contact to a pulse input source module.
DO ISO
+5V
CONTROL
R1=10
PI SRC
Vs
A B C
A B C
2.2K
DOC0184A
C-4
I/O Simulation
Rev 9/01
R1=250
AI LOOP A
5K OHMS
+T + -
I LIMIT
Vs
B C
DOC0185A
Figure C-10. Potentiometer Input to AI Loop Module Figure C-11 shows how to use a potentiometer and power source to simulate a transmitter feeding a 4 to 20 milliamp current signal to an analog input differential module.
R1=OPEN
R2 +
AI DIFF A
N/C
5K OHMS
B C
+ -
200K 200K
AUX PWR = 12 VDC, R2 = 8.2K OHMS AUX PWR = 24 VDC, R2 = 20K OHMS
DOC0186A
Rev 9/01
I/O Simulation
C-5
DI ISO
3.3K
SWITCH
A B C
N/C
+
DOC0187A
Figure C-12. Switch Input to DI Isolated Module Figure C-13 shows how to use a switch to simulate relay contacts to a discrete input source module.
R1=10
DI SRC
Vs
A
SWITCH
N/C
3.3K
B C
+ -
DOC0188A
C-6
I/O Simulation
Rev 9/01
PI ISO
2.2K
SWITCH
A B C
N/C + -
DOC0190A
Figure C-14. Switch to PI Source Module Figure C-15 shows how to use a switch and power supply to simulate a device transmitting discrete pulses (turbine meter) to a pulse input isolated module.
R1=10
PI SRC A
SWITCH
N/C
2.2K
Vs
B C
+ -
DOC0189A
Rev 9/01
I/O Simulation
C-7
C-8
I/O Simulation
Rev 9/01
Rev 9/01
D-1
C1 U1 U2
C2
C3
U3
U5 C11 C10
C9
30
U6
C15 C16 CR1 CR2 R7 C18 C19 C20 CR3 CR4 CR5 CR6 CR7 CR8
C17
RP1
P2
RP3
P3
DOC0121A
Figure D-1. HART Interface Card In the point-to-point mode, digital communications is superimposed on the 4-to-20 milliamp analog signal (which can still measure the process variable) through a built-in analog input. This mode allows communications with one HART device per fixed analog input point. In the multi-drop mode, as many as five HART devices can be connected in parallel to a single builtin analog input. Like the point-to-point mode, digital communications are superimposed on the 4 to 20 milliamp signal; however, the analog signal is used only to measure the current consumed by the multi-drop loop. With all three built-in analog input points in the multi-drop mode, the ROC can support a maximum of 15 HART devices.
D-2
RP2
R2
P1
30
Rev 9/01
Rev 9/01
D-3
PID LABEL
HART CARD
MOUNTING SCREW
A
6-PIN HEADER
J9 SOCKET
HARTCRD
ROC312, some resistance may be encountered because of the connector that mates the I/O module board in the cover to the main circuit board.
2. Verify that the PID label on the main card shows PN W48032X0012 or greater. 3. Ensure that a communications card is installed on the main circuit board. If not, install one
main board just below the bottom edge of the communications card. See Figure D-2 (Side View). If the J9 socket is not present, then the ROC is not HART-compatible.
5. Align the HART card with the 6-pin header and the two connectors on the communications
card. Gently press on the card until the connectors firmly seat.
6. Install the mounting screw to secure the HART card. Refer to Figure D-2. 7. Reinstall the upper cover. If the unit is a ROC312, be sure to carefully mate the I/O board
connector in the cover with the connector on the main circuit board.
D-4
Rev 9/01
T + -
I LIMIT
Vs
VS = 8 TO 30 VDC
DOC0203J
+ -
Rev 9/01
D-5
terminal.
2. Verify the channel is active by observing the oscilloscope trace for signs of communications
activity. There should be a request and response message burst for each device connected, with one second of time from the start of one request to the start of the next request. If a channel indicates no response, this may indicate faulty I/O wiring or a faulty device. If a channel shows no polling request (even after ensuring proper configuration), the HART card is defective and must be replaced.
D-6
Rev 9/01
Rev 9/01
D-7
D-8
Rev 9/01
GLOSSARY OF TERMS
A
AGA American Gas Association. AI Analog Input. AO Analog Output. Analog Analog data is represented by a continuous variable, such as a electrical current signal. AP Absolute Pressure. ASCII American (National) Standard Code for Information Interchange.
B
BTU British Thermal Unit, a measure of heat energy. Built-in I/O I/O channels that are fabricated into the ROC and do not require a separate module. Also called on-board I/O.
C
COM1 Port on the ROC364 that may be used for host communications, depending on the installed communications card. On the ROC407, this port is built-in and dedicated to RS-232 serial communications. COM2 Port on the ROC364 or ROC407 that may be used for host communications, depending on the installed communications card. COMM Port on the ROC306 or ROC312 that may be used for host communications, depending on the installed communications card. Configuration Typically, the software setup of a device, such as a ROC, that can often be defined and changed by the user. Can also mean the hardware assembly scheme. CSA Canadian Standards Association. CTS Clear to Send modem communications signal.
Rev 9/01
Glossary of Terms
G-1
D
DB Database. dB Decibel. A unit for expressing the ratio of the magnitudes of two electric signals on a logarithmic scale. DCD Carrier Detect modem communications signal. DI Discrete Input. Discrete Input or output that is non-continuous, typically representing two levels such as on/off. DO Discrete Output. DMM Digital multimeter. DP Differential Pressure. DSR Data Set Ready modem communications signal. DTR Data Terminal Ready modem communications signal. Duty Cycle Proportion of time during a cycle that a device is activated. A short duty cycle conserves power for I/O channels, radios, etc. DVM Digital voltmeter. DVS Dual-Variable Sensor. Provides static and differential pressure inputs to a FloBoss 503 Flow Manager.
E
EEPROM Electrically Erasable Programmable ROM, a form of permanent memory. EDS Electronic Static Discharge. EIA-232 Serial Communications Protocol using three or more signal lines, intended for short distances. EIA-422 Serial Communications Protocol using four signal lines. EIA-485 Serial Communications Protocol requiring only two signal lines. Can allow up to 32 devices to be connected together in a daisy-chained fashion. EMF Electro-motive force. EMI Electro-magnetic interference. EU Engineering Units.
G-2 Glossary of Terms Rev 9/01
F
Firmware Internal software that is factory-loaded into a form of ROM. In the ROC, the firmware supplies the software used for gathering input data, converting raw input data calculated values, storing values, and providing control signals. FlashPAC Module Memory module (uses Flash ROM and RAM) that contains the operating system, applications firmware, and communications protocol in a ROC300-Series unit. Flash ROM A type of read-only memory that can be electrically re-programmed. It is a form of permanent memory (needs no backup power). FM Factory Mutual. FSK Frequency shift keyed. FST Function Sequence Table, a type of program that can be written by the user in a high-level language designed by Fisher Controls.
G
GFA Ground fault analysis. GND Electrical ground, such as used by the ROC power supply. GP Gauge Pressure.
H
HART Highway Addressable Remote Transducer. hw Differential pressure.
I, J
I/O Input/Output. I/O Module Module that plugs into an I/O slot on a ROC to provide an I/O channel. See Section 3.2 of this manual for a listing of available types of I/O modules. IEC Industrial Electrical Code.
K
Kbytes Kilobytes. kHz Kilohertz.
Rev 9/01
Glossary of Terms
G-3
L
LCD Liquid Crystal Display. Display only device used for reading data. LDP Local Display Panel. A display-only device that plugs into a ROC300-Series unit via a parallel interface cable. The LDP consists of a 4-line by 20-character alphanumeric display and four pushbuttons used to access information stored by the ROC. LED Light-emitting diode. LOI Local Operator Interface. Refers to the serial (RS-232) port on the ROC through which local communications are established, typically for configuration software running on a PC. LPM Lighting Protection Module. Use this module to provide lightning and power surge protection for ROCs that use I/O Modules.
M
mA Milliamp(s); one thousandth of an ampere. MCU Master Controller Unit. Modular I/O I/O channels that are provided on a ROC by means of I/O modules. See I/O Module. Modbus A popular device communications protocol developed by Gould-Modicon. MPU Micro-processor Unit. MVS Multi-Variable Sensor. The MVS provides differential pressure, static pressure, and temperature inputs to the ROC407 for orifice flow calculation. mW Milliwatts, or 0.001 watt. mV Millivolts, or 0.001 volt.
N
NEC National Electrical Code. NEMA National Electrical Manufacturers Association.
O
OH Off-Hook modem communications signal. Off-line Accomplished while the target device is not connected (by a communications link). For example, off-line configuration is configuring a ROC in a electronic file that is later loaded into the ROC. Ohms Units of electrical resistance.
G-4
Glossary of Terms
Rev 9/01
ROC306/ROC312 Instruction Manual On-line Accomplished while connected (by a communications link) to the target device. For example, on-line configuration is configuring a ROC while connected to it, so that current parameter values are viewed and new values can be loaded immediately. OP Operator Port; see LOI. Opcode Type of message protocol used by the ROC to communicate with the ROCLINK software, as well as host computers with ROC driver software.
P, Q
Parameter A property of a point that typically can be configured or set by the user. For example, the Point Tag ID is a parameter of an Analog Input point. Parameters are normally edited by using configuration software running on a PC. Pf Flowing pressure. PC Personal computer. PID Proportional, Integral, and Derivative feedback control. PI Pulse Input. PID Proportional, Integral, and Derivative control action. Point Software-oriented term for an I/O channel or some other function, such as a flow calculation. Points are defined by a collection of parameters. Point Number The rack and number of an I/O point as installed in the ROC system. PRI Primary PID control loop. Protocol A set of standards that enables communication or file transfers between two computers. PSTN Public switched telephone network. PT Process Temperature. PTT Push-to-talk signal. Pulse Transient variation of a signal whose value is normally constant. PV Process variable.
Rev 9/01
Glossary of Terms
G-5
R
Rack For a ROC, a rack is a row of slots into which I/O modules may be plugged. The rack is given a letter to physically identify an I/O channel location, such as A for the first rack. Built-in I/O channels are assigned a rack identifier of A, while diagnostic I/O channels are considered to be in rack E. RAM Random Access Memory. In a ROC, it is used to store history, data, most user programs, and additional configuration data. RBX Report-by-exception. In a ROC, it always refers to spontaneous RBX in which the ROC contacts the host to report an alarm condition. RFI Radio frequency interference. RI Ring Indicator modem communications signal. ROC Remote Operations Controller, Fisher Controls microprocessor-based unit that provides remote monitoring and control. ROCLINK Configuration software, Version 2.0 or later, used to configure ROC units to gather data, as well as most other functions. ROCPAC Module ROM (and RAM) module that contains the operating system, applications firmware, and communications protocol in a ROC300-Series unit. ROM Read-only memory. Typically used to store firmware. RTD Resistance Temperature Detector. RTS Ready to Send modem communications signal. RTV Room Temperature Vulcanizing, typically a sealant or caulk like silicone rubber. RXD Received Data communications signal.
S
SAMA Scientific Apparatus Makers Association. Script A uncompiled text file (such as keystrokes for a macro) that is interpreted by a program to perform certain functions. Typically, scripts can be easily created or edited by the end-user to customize the software. Soft Points A type of ROC point with generic parameters that can be configured to hold data as desired by the user. SP Setpoint, or Static Pressure. SPI Slow Pulse Input
G-6 Glossary of Terms Rev 9/01
ROC306/ROC312 Instruction Manual SPK Speaker. SRAM Static Random Access Memory. Stores data as long as power is applied; typically backed up by a lithium battery or supercapacitor.
T-Z
TDI Timed Discrete Input, or Timed Duration Input. TDO Timed Discrete Output, or Timed Duration Output. Tf Flowing temperature. TLP Type (of point), Logical (or point) number, and Parameter number. TXD Transmitted Data communications signal.
Rev 9/01
Glossary of Terms
G-7
G-8
Glossary of Terms
Rev 9/01
INDEX
A
Accessories ROC/FloBoss Accessories Instruction Manual .......1-2 Active Time .................................................................1-8 AGA............................................................................ B-7 AGA Point Displays ................................................. B-18 Alarm Code Bits Display 1 .................................. B-19 Display 1 .............................................................. B-18 Display 2 .............................................................. B-19 Display 3 .............................................................. B-20 Alarm Code............................................................... B-18 Alarm Code Bits ................................... B-11, B-12, B-13 Analog Inputs Alarm Code Bits................................................... B-11 Diagnostic Inputs ..................................................2-13 Differential ..............................................................3-4 Differential Wiring..................................................3-9 Loop ........................................................................3-4 Loop Wiring............................................................3-8 Point Display........................................................ B-11 Point Display Parameters ..................................... B-11 Source .....................................................................3-4 Source Wiring .......................................................3-11 Testing Built-in .....................................................2-30 Troubleshooting ....................................................3-27 Wiring Built-in ......................................................2-18 Analog Outputs Alarm Code Bits................................................... B-12 Analog Outputs to Analog Inputs........................... C-2 AO Source to AI Differential as Current Loop ...... C-2 AO Source to AI Differential as Voltage Input...... C-2 AO Source to AI Loop as Current Loop ................ C-2 AO Source to Ammeter.......................................... C-3 AO Source to Voltmeter......................................... C-3 Checking Voltage Source Installations .................3-29 Point Display........................................................ B-12 Point Display Parameters ..................................... B-12 Source .....................................................................3-4 Source Wiring .......................................................3-12 Troubleshooting ....................................................3-28 Antenna........................................................................1-5 AT Command ..............................................................4-8 Attenuation Levels Communications Cards .........................................4-14 AUTO ......................................................................... B-6 AUX................................................................... 2-4, 2-23 Auxiliary Outputs Testing...................................................................2-32 Wiring ...................................................................2-20
B
Backup Procedure RAM..................................................................... 2-22 Base RAM Database Point Relationship................... 2-12 BAT........................................................................... 2-16 Battery....................................................................... 2-24 Bell and CCITT standards........................................... 4-7 Built-in I/O Channels ................................................ 2-12
C
Calibration Diagnostic Inputs.................................................. 2-30 I/O Modules............................................................ 3-8 RTD Module ........................................................ 3-23 CCITT standards ......................................................... 4-7 Class I.......................................................................... 1-6 Clock Battery .................................................................. 2-24 CMOS ......................................................................... 2-3 Cold.............................................................................B-2 Cold Hard Cruel Start................................................ 2-26 Cold Start .................................................................... 2-5 COMM ............................................................... 2-4, 4-21 Communications Cards ............................................... 4-1 Attenuation Levels................................................ 4-14 Dial-up Modem ...................................................... 4-8 EIA-232.................................................................. 4-3 EIA-422/485........................................................... 4-5 HART Interface Card .............................................D-1 Installation ............................................................ 4-11 Jumpers................................................................. 4-14 Leased-Line Modem............................................... 4-7 LED Indicators ....................................................... 4-4 Product Descriptions .............................................. 4-2 Radio Modem ......................................................... 4-6 Replacing.............................................................. 4-24 Specifications ....................................................... 4-26 Troubleshooting.................................................... 4-24 Wiring................................................................... 4-16 Communications Wiring ........................................... 2-21 Configuration ............................................................ 1-12 I/O Point ............................................................... 3-35 Control Type .............................................................B-22 Creation.....................................................................B-15 Cruel Start ................................................................. 2-26 CTS ............................................................................. 4-4 Current Loop AO Source Module to AI Differential Module.......C-2 AO Source Module to AI Loop Module.................C-2 AO Source to Ammeter ..........................................C-3 Index I-1
Rev 9/01
D
Database DB Menu Display ................................................ B-17 Memory Requirements..........................................2-11 Point Relationship .................................................2-12 Points ....................................................................2-11 Storage ..................................................................2-10 DB............................................................................... B-7 DC Power Source ......................................................2-16 DCD.............................................................................4-4 Decade Box................................................................3-23 Determining FlashPAC Version ..................................2-7 Determining ROCPAC Version...................................2-9 DI/PI ..........................................................................2-13 Diagnostic Inputs .......................................................2-13 Dial-up Modem Communications Cards .....................4-8 Wiring ...................................................................4-22 Discrete Inputs Isolated....................................................................3-4 Isolated Wiring......................................................3-14 Point Display.......................................................... B-9 Point Display Parameters ....................................... B-9 Source .....................................................................3-4 Source Troubleshooting ........................................3-29 Source Wiring .......................................................3-13 Testing Built-in .....................................................2-31 Wiring Built-in......................................................2-19 Discrete Outputs Discrete Outputs to Discrete Inputs ....................... C-3 Discrete Outputs to Pulse Inputs ............................ C-4 DO Isolated to DI Source....................................... C-4 DO Isolated to PI Source ....................................... C-4 DO Source to DI Isolated....................................... C-3 DO Source to PI Isolated ....................................... C-4 Isolated....................................................................3-5 Isolated Troubleshooting.......................................3-30 Isolated Wiring......................................................3-16 Point Display........................................................ B-10 Point Display Parameters ..................................... B-10 Relay .......................................................................3-5 Relay Troubleshooting..........................................3-31 Relay Wiring.........................................................3-17 Source .....................................................................3-5 Source Troubleshooting ........................................3-30 Source Wiring .......................................................3-15 Testing Built-in .....................................................2-32 Wiring Built-in......................................................2-20 Display Format ........................................................... B-7 Display Panel, Local ....................................................2-4 Division 2 ....................................................................1-6 Dry Relay Contacts...............................................3-4, 3-5 DSPL ...........................................................................2-4 DSR .............................................................................4-4 I-2 Index
E
E2 ...............................................................................2-13 E5 ...............................................................................2-13 EDIT ........................................................................... B-6 EIA-232 Communications Cards .................................4-3 Wiring ...................................................................4-17 EIA-422/485 Communications Cards ..........................4-5 Wiring ...................................................................4-18 Electrically Erasable Programmable Read-Only Memory EEPROM.................................................................2-3 ENTER........................................................................ B-6 Environment Requirements...........................................................1-5 Temperature ..........................................................2-13 ESC ............................................................................. B-6 Estimating Database Memory Requirements .............2-11 EUs.............................................................................3-28
F
Figure 1-1. Typical ROC306 and ROC312 Controllers... ....................................................................................1-4 Figure 1-2. ROC306 and ROC312 Outline and Mounting Dimensions ................................................1-4 Figure 2-1. Front and Back Views of MCU with Covers Removed ....................................................................2-3 Figure 2-2. Typical FlashPAC Module .......................2-6 Figure 2-3. Typical ROCPAC Module .......................2-8 Figure 2-4. Typical RAM Module ..............................2-9 Figure 2-5. I/O Terminal Block Location .................2-13 Figure 2-6. Mounting Dimensions ............................2-14 Figure 2-7. Power Wiring Connections.....................2-17 Figure 2-8. Current Signal on Built-in Analog Input ....... ..................................................................................2-18 Figure 2-9. Voltage Signal on Built-in Analog Inputs ..... ..................................................................................2-18 Figure 2-10. Isolated Built-in Discrete/Pulse Input.......... ..................................................................................2-19 Figure 2-11. Sourced Built-in Discrete/Pulse Input ......... ..................................................................................2-19 Figure 2-12. Built-in Discrete Output .......................2-20 Figure 2-13. Auxiliary Discrete Output ....................2-20 Figure 2-14. Operator Interface Connector Wiring.......... ..................................................................................2-21 Figure 2-15. Indicator Locations...............................2-23 Figure 3-1. Typical I/O Module ..................................3-3 Figure 3-2. AI Loop Module Field Wiring for Current Loop Devices .............................................................3-8 Figure 3-3. AI Loop Module Field Wiring for Voltage Devices.......................................................................3-9 Figure 3-4. AI Differential Module Field Wiring for Low Voltage Devices ...............................................3-10 Rev 9/01
H
Hard Cruel Start .........................................................2-26 HART Interface Card..................................................D-1 Installation..............................................................D-3 Specifications .........................................................D-7 Troubleshooting .....................................................D-6 Wiring ....................................................................D-5 Wiring Schematic...................................................D-5 HART Interface Module ..............................................3-7 Troubleshooting ....................................................3-34 Wiring ...................................................................3-26 Hazardous Location Approval .....................................1-6 Highway Addressable Remote Transducer - HART ....3-7 Historical Database Current Value ....................................................... B-17
I
I/O ............................................................................... B-7 I/O Channels Built-in ..................................................................2-12 I/O Menu Display ................................................................... B-8 Point Types............................................................. B-8 I/O Module Board ......................................................2-13 I/O Modules Calibration...............................................................3-8 Illustration ...............................................................3-3 Installation...............................................................3-7 Point Configuration ...............................................3-35 Power Consumption Table .................................... 1-10 Removing and Installing .......................................3-37 Troubleshooting ....................................................3-27 Wiring .....................................................................3-8 I/O Simulation............................................................. C-1 I/O Terminal Block Location .....................................2-13 Inactive Time ...............................................................1-8 INC.............................................................................. B-6 Indicators....................................................................2-23 Inputs Calibrating Diagnostic...........................................2-30 Diagnostic .............................................................2-13 Installation..................................................................2-14 Communications Cards .........................................4-11 Ground Wiring ........................................................1-7 Guidelines ...............................................................1-5 HART Interface Card .............................................D-3 I/O Module-Power Off ..........................................3-37 I/O Module-Power On...........................................3-36 I/O Modules ............................................................3-7 I/O Wiring Requirements ........................................1-8 Local Display Panel ............................................... B-3 LPM .......................................................................A-3 Mounting Dimensions ...........................................2-14 Power Requirements ...............................................1-6 RAM Modules.......................................................2-15 Index Rev 9/01
G
GND...........................................................................2-16 Ground Wiring...........................................................2-16 Group A..............................................................................1-6 B..............................................................................1-6 C..............................................................................1-6 D .............................................................................1-6
I-4
J, K
Jumpers Communications Cards .........................................4-14 P3 ..........................................................................4-14 P4 ..........................................................................4-14 P5 ..........................................................................4-14 P6 ..........................................................................4-14 P7 ................................................................ 4-20, 4-22
L
LCD ............................................................................ B-7 LCD Panel....................................................................2-4 LCD Point Displays .................................................. B-24 LDP..............................................................................2-4 Leased-Line Modem Communications Card ...............4-7 Attenuation Levels ................................................4-14 Jumpers .................................................................4-14 Wiring ...................................................................4-21 LED Indicators................................................... 2-4, 2-23 AUX......................................................................2-23 Communications Cards ...........................................4-4 DI/PI......................................................................2-23 DO.........................................................................2-23 Locations...............................................................2-23 ROC Functions......................................................2-23 Status.....................................................................2-23 Lightning Protection Module Installation..............................................................A-3 LPM .......................................................................A-1 Specifications .........................................................A-7 Troubleshooting .....................................................A-7 Wiring ....................................................................A-4 Local Display Panel .....................................................2-4 Display Format....................................................... B-7 DM Menu Display................................................ B-17 Installation.............................................................. B-3 LDP ........................................................................ B-1 Main Menu Items ................................................... B-7 Location Requirements ................................................1-5 Loop Status ............................................................... B-22 Low-Level Pulse Input.............................. 3-6, 3-22, 3-33 LPM Lightning Protection Module .................................A-1
N
National Electrical Code NEC........................................................................ 1-6 NEXT ..........................................................................B-6
O
OH............................................................................... 4-4 Output PID Loop ..............................................................B-22 Overload Protection Devices..................................... 2-24 Overview..................................................................... 1-3
P, Q
P3 Jumper.................................................................. 4-14 P4 Jumper.................................................................. 4-14 P5 Jumper.................................................................. 4-14 P6 Jumper.................................................................. 4-14 P7 Jumper......................................................... 4-20, 4-22 PID ..............................................................................B-7 PID Loop Output...................................................................B-22 PID Point Displays....................................................B-22 Parameters ............................................................B-22 Pin 2 ................................................................. 4-20, 4-22 Pin 8 ................................................................. 4-20, 4-22 Plate Change..............................................................B-20 Points................................................................2-11, B-17 Configuration........................................................ 3-35 Relationship Database .......................................... 2-12 Tag ID ........................................................B-17, B-18 Polarity ...................................................................... 1-11 Potentiometer Input to AI Differential Module...........C-5 Potentiometer Input to AI Loop Module .....................C-5 Potentiometer to Analog Inputs...................................C-5 Power DC Power Source ................................................. 2-16 I/O Requirements ................................................... 1-8 Index I-5
M
Main Menu Display .................................................... B-7 Master Controller Unit MCU .......................................................................2-1 Removing and Replacing ......................................2-29 Memory Estimating Requirements ......................................2-11 Rev 9/01
S
Scaling Resistor ...........................................................3-4 SCAN.......................................................................... B-6 Setpoint ..................................................................... B-22 SHUTDOWN................................................... 4-20, 4-22 Site Requirements ........................................................1-5 Slow Pulse Inputs Isolated ....................................................................3-6 Isolated Troubleshooting.......................................3-32 Isolated Wiring......................................................3-21 Source......................................................................3-6 Source Troubleshooting ........................................3-32 Source Wiring .......................................................3-20 Specifications HART Interface Card .............................................D-7 Lightning Protection Module .................................A-7 RTD Input Module ................................................3-49 Startup .............................................................. 1-11, 1-12 Station Address ......................................................... B-14 Station Group ............................................................ B-14 Station Name............................................................. B-14 STATUS ....................................................................2-23 Surge Protection Device...............................................1-7 Switch Settings for 256 Kbyte RAM Module ...................2-10 Switch Input to DI Isolated Module ....................... C-6 Switch Input to DI Source Module......................... C-6 Switch to Discrete Inputs ....................................... C-6 Switch to PI Isolated Module ................................. C-7 Switch to PI Source Module................................... C-7 Switch to Pulse Inputs ............................................ C-7 SYS ............................................................................. B-7 SYS Parameter Displays ........................................... B-14 Display 1 .............................................................. B-14 Display 2 .............................................................. B-15 Display 3 .............................................................. B-15 Index Rev 9/01
R
Radio Modem Communications Card .........................4-6 Attenuation Levels ................................................4-14 Jumpers .................................................................4-14 Radio Modem Communications Cards ........................4-6 Wiring ...................................................................4-19 Radio Power Consumption ........................................1-10 Radio Power Control ............................................1-3, 2-5 RAM Database Point Relationship .................................2-12 RAM Module...............................................................2-9 Backup Procedure .................................................2-22 Determining RAM Requirements .........................2-10 Installation.............................................................2-15 RAM Modules and Their Use ...............................2-10 ROC Memory Map .................................................2-7 Switch Settings......................................................2-10 Random Access Memory RAM .......................................................................2-3 Remote Operations Controllers - ROC ........................1-1 Repair................................................................2-22, 3-27 Reset Cold Hard Cruel Start ...........................................2-26 RESET .........................................................................2-5 Resistance Temperature Detector - RTD Input................. .................................................................. 3-2, 3-6, 3-49 Resistor ........................................................................3-4 I-6
T
Table 1-1. Power Consumption of the ROC306, ROC312, and Powered Devices .................................1-9 Table 1-2. Power Consumption of I/O Modules .......1-10 Table 2-1. ROC Memory Map ....................................2-7 Table 2-2. ROCPAC Selection Codes ........................2-8 Table 2-3. RAM Module Usage................................2-10 Table 2-4. Switch Settings for 256-Kbyte RAM4H Module .....................................................................2-10 Table 2-5. Estimating Database Memory Requirements .................................................................................2-11 Table 2-6. Base RAM Database Point Relationship ........ .................................................................................2-12 Table 2-7. Indicator Descriptions..............................2-23 Table 2-8. Overload Protection Devices ...................2-24 Table 3-1. Calibration Resistance Values .................3-23 Table 3-2. Analog Input Module Typical Configuration Values ......................................................................3-27 Table 4-1. Communications Card LED Indicators......4-4 Table 4-2. Jumper Positions for the Modem Cards...4-14 Table 4-3. Radio and Leased-Line Modem Card Attenuation Levels ...................................................4-15 Table 4-4. ROC300-Series Communications Card Signals......................................................................4-16 Table B-1. Function Key Labels and Descriptions .... B-6 Table B-2. Main Menu Items of the Local Display Panel .................................................................................. B-7 Table B-3. I/O Menu Point Types.............................. B-8 Table B-4. Discrete Input Point Display Parameters ....... .................................................................................. B-9 Table B-5. Discrete Output Point Display Parameters..... ................................................................................ B-10 Table B-6. Analog Input Point Display Parameters ......... ................................................................................ B-11 Table B-7. Analog Output Point Display Parameters ...... ................................................................................ B-12 Table B-8. Pulse Input Point Display Parameters .... B-13 Table B-9. SYS Parameter Display 1....................... B-14 Table B-10. SYS Parameter Display 2..................... B-15 Table B-11. DB Point Display Parameters .............. B-17 Table B-12. AGA Point Display 1 Parameters ........ B-18 Table B-13. AGA Point Display 2 Parameters ........ B-19 Table B-14. AGA Point Display 3 Parameters ........ B-20 Table B-15. PID Point Display Parameters.............. B-22 Table B-16. TNK Point Display Parameters............ B-23 Table B-17. FST Point Display Parameters ............. B-23 Table B-18. MSG Point Display Parameters ........... B-24 Tank .......................................................................... B-23 Temperature ...............................................................2-13 Terminal Block ............................................................2-4 Testing Auxiliary Output ...................................................2-32 Built-in Analog Inputs...........................................2-30 Built-in Discrete Output ........................................2-32 Rev 9/01 Index
U
UP ...............................................................................B-6
V
Version ......................................................................B-15 Version Name Parameter ..................................... 2-7, 2-9 Voltage Input AO Source Module to AI Differential Module.......C-2 Voltage Output AO Source Module to Voltmeter............................C-3 Volume......................................................................B-23
W-Z
Wiring Analog Input Differential Module.......................... 3-9 Analog Input Loop ................................................. 3-8 Analog Input Source............................................. 3-11 Analog Output Source .......................................... 3-12 Auxiliary Outputs ................................................. 2-20 Built-in Analog Inputs.......................................... 2-18 Built-in Discrete Inputs ........................................ 2-19 Built-in Discrete Outputs...................................... 2-20 Built-in Pulse Inputs ............................................. 2-19 Communications................................................... 2-21 Communications Cards ........................................ 4-16 DC Power Source ................................................. 2-16 Dial-up Modem Communications Cards .............. 4-22 Discrete Input Isolated.......................................... 3-14 Discrete Input Source ........................................... 3-13 Discrete Output Isolated ....................................... 3-16 I-7
For information, contact your local sales representative or: Emerson Process Management Flow Computer Division Marshalltown, Iowa 50158 U.S.A. Website: www.EmersonProcess.com/flow
I-8
Index
Rev 9/01