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LCD TV

SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91J
MODEL : 32LK310 32LK310-MA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Printed in Korea P/NO : MFL67082603 (1102-REV00)
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ................................................................................. 3
SPECIFICATION....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING........................................................................... 14
BLOCK DIAGRAM.................................................................................. 17
EXPLODED VIEW .................................................................................. 18
SVC. SHEET ...............................................................................................
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by acci dental shorts of the ci rcui try that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1M and 5.2M.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instruments
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF

Copyright LG Electronics. Inc. All right reserved.


Only for training and service purposes
LGE Internal Use Only
- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Al ternati vel y, obtai n and wear a commerci al l y avai l abl e
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Mi ni mi ze bodi l y mot i ons when handl i ng unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500F to 600F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500F to 600F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500F to 600F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
onl y unti l the sol der fl ows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
si de of t he ci rcui t board. (Use t hi s t echni que onl y on I C
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
4.1. Model Specification
1. Application range
This spec sheet is applied to LCD TV used LP91J chassis.
2. Specification
Each part is tested as below without special appointment.
1) Temperature : 255C (779F), CST : 405C
2) Relative Humidity : 6510%
3) Power Voltage
: Standard input voltage(100~240 V@50/60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawi ng and speci f i cat i on by part number i n
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC : CE, IEC
No Item Specification Remark
1. Market Central and South America
2. Broadcasting system NTSC, PAL-M, PAL-N
3. Available Channel BAND NTSC
VHF 2~13
UHF 14~69
CATV 1~125
4. Receiving system Upper Heterodyne
5. Video Input NTSC, PAL-M/N 22LK310 : Rear 1EA,
26/32LK310 : Rear 1EA, Side 1EA
6. Component Input Y/Cb/Cr, Y/ Pb/Pr Rear
7. RGB Input RGB-PC, S/W Upgrade Rear
8. HDMI Input HDMI-DTV, Only PCM MODE 26/32LK310 Rear 2EA
22LK310 Rear 1EA
9. Audio Input (4EA) PC Audio, Component, AV (2EA) L/R Input (22LK310/311: AV Audio Input 1EA)
10. RS-232C Remote control, Commercial control Rear
11. USB Input (1EA) Divx, MP3, JPEG Only Side
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 7 -
LGE Internal Use Only
5. Component Video Input (Y, PB, PR)
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
No
Specification
Proposed Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
6. RGB
(Analog PC, RGB-DTV - NOT SUPPORT)
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 8 -
LGE Internal Use Only
7. HDMI input - PC
(Spec. out but it can be shown the picture at only HDMI/DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
8. HDMI input (DTV)
No
Specification
Proposed Remarks
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 9 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV, LP91J
chassis.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 C 5 C of temperature and 65 % 10 % of relative
humidity if there is no specific designation.
4) The input voltage of the receiver must keep 100-220 V,
50/60 Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) Input Tool-Option/Area option.
(3) Download the EDID
- EDID datas are automatically download when adjusting
the Tool Option2
(4) ADC Calibration - RGB / Component
(4) Check SW Version.
3.2. SET assembly adjustment items
(1) Input Area option
(2) Adjustment of White Balance : Auto & Manual
(3) Input Tool-Option/Area option
(4) Intelligent Sensor Inspection Guide
(5) Preset CH information
(6) Factoring Option Data input
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
(2) Download steps
1) Execute ISP Tool program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the Connect button and confirm Dialog Box
3) Click the Config. button and Change speed I2C Speed
setting : 350 Khz ~ 400 Khz
4) Read and write bin file.
Cl i ck (1)Read tab, and then l oad downl oad fi l e
(XXXX.bin) by clicking Read.
1
Filexxx.bin
5) Click (2)Auto tab and set as below.
6) Click (3)Run.
7) After downloading, you can see the (4)Pass message.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the USB port.
2) Automatically detect the SW Version.
-> S/W download process is executed automatically.
3) Show the message Copy the file from the Memory
4) After Finished the Download, Automatically DC Off -> On
5) If the TV is Turn on, Check the updated SW Version and
tool option.
4.2. Input tool option.
Adjust tool option refer to the BOM.
- Tool Option Input : PCBA Check Process
- Area Option Input : Set Assembly Process
After Input Tool Option and AC off
Before PCBA check, you have to change the Tool option and
have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
(1) Profile : Must be changed the option value because being
different with some setting value depend on module
maker, inch and market
(2) Equipment : adjustment remote control.
(3). Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remote control.)
(If not changed the option, the input menu can differ the
model spec.)
Refer to Job Expression of each main chassis assembly
(EBTxxxxxxxx) for Option value
Caution : Dont Press IN-STOP key after completing the
function inspection.
4.3. EDID Download method
Recommend that dont connect HDMI and RGB(D-SUB) cable
when downloading the EDID. If not possible, recommend that
connect the MSPG equipment.
There are two methods of downloading the EDID data
4.3.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2 seconds.
4.3.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not.
If tool option is wrong, HDMI EDID data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear OK, then complete.
4.3.3. RS-232C command Method
(1) Command : AE 00 10
* Caution
Don t connect HDMI and RGB(D-SUB) cabl e when
downloading the EDID.
If the cables are connected, Downloading of EDID could be
failed.
- 10 -
LGE Internal Use Only Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes


4.3.4. EDID data
(1) Analog(RGB): 128bytes>
(2) HDMI 1 : 256Bytes
(3) HDMI 2 : 256Bytes
4.4. ADC Calibration
4.4.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60 Hz 100 % Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : Component by using D/E
(CH +/-) and press ENTER(A ).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear.
4.4.2. ADC Calibration - RGB
4.4.2.1. Method of Using External pattern
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60 Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is 0 0 0 0.
5) Select 0. ADC calibration : RGB by using D/E (CH +/-)
and press ENTER(A ).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
- 11 -
LGE Internal Use Only Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK
OK
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 15 01 03 08 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B A1 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
40 35 00 BC 88 21 00 00 1C 0E 1F 00 80 51 00 1E 30
50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 00 55
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 10 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 2A
0 1 2 3 4 5 6 7 8 9 A B C D E F
0 00 FF FF FF FF FF FF 00 1E 6D 01 00 01 01 01 01
10 01 15 01 03 80 46 27 78 0A D9 B0 A3 57 49 9C 25
20 11 49 4B 21 08 00 45 40 01 01 61 40 01 01 01 01
30 01 01 01 01 01 01 01 1D 00 72 51 D0 1E 20 6E 28
40 55 00 C4 8E 21 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 BC 77 21 00 00 1C 00 00 00 FC 00 4C
60 47 20 54 56 0A 20 20 20 20 20 20 20 00 00 00 FD
70 00 3A 3F 1C 44 0F 00 0A 20 20 20 20 20 20 01 C2
80 02 03 25 F1 4F 84 07 01 16 02 03 11 12 13 14 05
90 20 22 1F 10 23 09 07 07 83 01 00 00 68 03 0C 00
A0 20 00 80 1E 00 01 1D 00 80 51 D0 1C 20 40 80 35
B0 00 BC 88 21 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10
C0 3E 96 00 13 8E 21 00 00 18 8C 0A A0 14 51 F0 16
D0 00 26 7C 43 00 C4 8E 21 00 00 98 01 1D 80 18 71
E0 1C 16 20 58 2C 25 00 C4 8E 21 00 00 9E 00 00 00
F0 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 1A
4.4.2.1. Method of Using Internal pattern
(1) Apply model
22/26/32LK310/311
(2) Process
1) Change the Input to RGB mode..
2) Press ADJ key on R/C for adjustment.
3) Enter Password number. Password is 0 0 0 0.
4) Select 0. ADC calibration : RGB by using D/E (CH +/-)
and press ENTER(A ).
5) ADC adjustment is executed automatically .
6) When ADC adjustment is finished, this OSD appear.
* Caution : No need to connect external input cable.
* Caution : Adjustment result is applied after SET Off/On
4.5. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-control.
2) SW Version check
Check SW VER : V3.xx
5. PCB assembly adjustment method
5.1. Input Area-Option
(1) Profile : Must be changed the Area option value because
being different of each Countrys Language and
signal Condition.
(2) Equipment : adjustment remote control.
(3) Adjustment method
- The input methods are same as other chassis.(Use IN-
START Key on the Adjust Remote control.)
Ref er t o Job Expressi on of each mai n chassi s ass y
(EBTxxxxxxxx) for Option value.
5.2. Adjustment of White Balance
(For Automatic Adjustment)
- Purpose : Adj ust the col or temperature to reduce the
deviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,
Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
- Adjustment mode : Three modes - Cool / Medium / Warm
- Required Equipment
1) Remote controller for adjustment
2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV( ch : 9 ),
(should be used in the calibrated ch by CS-1000)
3) Auto W/B adjustment instrument(only for Auto adjustment)
5.2.1 Adjustment of White Balance (For automatic adjustment)
* LP91J Support RS-232C & I2C Interface For ADC/DDC
Adjustment.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(WB 00 FF) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, 00)
(4) Release the adjust mode of white balance
- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
- 12 -
LGE Internal Use Only Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
OK
MODEL : 32LK310
SW VER : V3.04
Mode : Home Use UTT 6
ADC CAL. RGB : NG
RGB: OK HDMI1 : NG
Component SD : OK HDMI2 : NG
Component HD : OK
Tool Option 1 816
Tool Option 2 4181
Area Option 40
Opti on 1 0
Opti on 2 0
System Control
System Control 2
Power Off History
Davinci/Auto Test
Area Option ETC
Lang. Group NTSC-ALL
MODEL : 32LK310
SW VER : V3.04
Mode : Home Use UTT 6
ADC CAL. RGB : NG
RGB: OK HDMI1 : NG
Component SD : OK HDMI2 : NG
Component HD : OK
Tool Option 1 816
Tool Option 2 4181
Area Option 40
Opti on 1 0
Opti on 2 0
System Control
System Control 2
Power Off History
Davinci/Auto Test
Area Option ETC
Lang. Group NTSC-ALL

5.2.2. Adjustment of White Balance (for Manual adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing POWER
ON key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push Exit key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter 0000 (Password)
6) Select 3. W/B ADJUST
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E (CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F /G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool/ Medium/ Warm) : Fix the
one of R/G/B gain and change the others
11) When adjustment is completed, Enter COPY ALL.
12) Exit adjustment mode using EXIT key on R/C.
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G.
2. x, y < target
i) First decrease the B gain,
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
- 22LK310/311(Small size inchs color coordinate is different
from others, so use below table)
- To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : Select Vivid and change Dynamic Contrast :
Off, Dynamic Colour : Off -> Picture Mode change ->
Vivid(User)
(If you miss the upper condition, the coordinates of W/B can
be lower than the spec.
- 13 -
LGE Internal Use Only Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
Coordinate
Mode
x y
Temp uv
Cool 0.269 0.002 0.273 0.002 13,000 K 0.000
Medium 0.285 0.002 0.293 0.002 9,300 K 0.000
Warm 0.313 0.002 0.329 0.002 6,500 K 0.003
Coordinate
Mode
x y
Temp uv
Cool 0.285 0.002 0.293 0.002 9,300 K 0.000
Medium 0.295 0.002 0.305 0.002 8,000 K 0.000
Warm 0.313 0.002 0.329 0.002 6,500 K 0.003
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 14 -
TROUBLESHOOTING
No power
(LED indicator off)
Check 24V, 12V, 3.5V
of Power B/D
Check short of Main B/D
or Change Power B/D
Pass
Check Output of
IC1001, IC1003, IC1007
Check P400 Connector
Change LED Assembly
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assembly
Change IC1002, IC1008, Q1003
Pass
Check short of IC1001,
IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Fail
No Raster
[B]: Process
Check LED status
On Display Unit
Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802
Fail
Change Inverter Connector
Or Inverter Fail
Pass
Fail
Pass
Change LVDS cable
Fail
Check LVDS Cable
Pass
Check Panel Link Cable
Or Module
Change Panel Link Cable
Or Module
Check Inverter Connector
Or Inverter
Pass
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 15 -
No Raster on PC Signal
Check Input source Cable
And Jack
Pass
Re-soldering or
Change the defect part
Pass
Check the Input/Output
Of IC201 Fail
Re-soldering or
Change the defect part,
Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/Output
Of J202 Fail
Pass
Check the Input/Output
Of IC800 Fail
Re-soldering or
Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source
Cable And Jack
Pass
Re-soldering or
Change the defect part
Check the Input/Output
Of IC800 Fail
Pass
Re-soldering or
Change the defect part
Repeat [A], & [B] Process
Check The Input/Output
Of JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source
Cable And Jack
Pass
Check the Input/Output
of JK301, JK302
Fail
Re-soldering or
Change the defect part
Pass
Pass
Check the Input/Output
of IC300, IC301
Fail
Re-soldering or
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/Output
of IC800
Fail
Re-soldering or
Change the defect part
Repeat [A], & [B] Process
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 16 -
No Sound
Check The Input Sourse
Check The Input/Output
Of IC600
Re-soldering or
Change the defect part Fail
Pass
Pass
Check The Speaker Change Speaker
Fail
Check The Speaker Wire
Pass
Change The Source Input
Fail
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source
Cable And Jack
Pass
Check Input source
Cable And Jack
Pass
Check The Input/Output
of JK102
Re-soldering or
Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Pass
Check the Input/Output
of IC800 Fail
Re-soldering or
Change the defect part
Pass
Check The Input/Output
Of TU500
Re-soldering or
Change the defect part
Pass
Fail
Pass
Check the Input/Output
of IC800
Fail
Re-soldering or
Change the defect part
Repeat [A], & [B] Process
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
- 17 -
BLOCK DIAGRAM
R G B - P C
( J K 2 0 2 )
T U N E R
( T U 5 0 0 )
C O M P O N E N T / A V 1
A u d i o o u t ( J K 1 0 2 )
A
V
2
(
J
K
2
0
1
)
A
V
_
L
I
N
/
R
I
N

:
5
0
0
m
V
r
m
s
S
P
K
_
L

S
P
K
_
R
C
O
M
P
O
N
E
N
T
_
L
/
R

:
5
0
0
m
V
r
m
s

A
V
_
V
I
N
:
1
V
p
p
N
T
P
3
2
0
0
L
C
O
M
P
_
Y
/
P
b
/
P
r
I
R

&

L
E
D

(
P
2
0
1
)
H
D
M
I
_
D
A
T
A
0
T
U
_
M
A
I
N
C
O
M
P
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E
N
T
_
Y
/
P
b
/
P
r
:

1
/
0
.
7
V
p
p
A
V
_
V
I
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C
O
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P
_
L
I
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/
R
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N

L
_
C
H
R
_
C
H
A
V
_
L
I
N
/
R
I
N

P C - S O U N D
( J K 2 0 3 )
I
2
S
_
M
C
L
K
I
2
S
_
S
D
O
I
2
S
_
W
S
I
2
S
_
S
C
K

T
M
D
S
L
I
P
S
R
L
_
O
N
/
I
D
I
S
P
_
E
N
P
A
N
E
L
_
S
T
A
T
U
S
E
-
D
I
M
O
P
C
_
O
U
T
E
E
P
R
O
M
(
2
4
L
C
2
5
6
)
S
e
r
i
a
l

F
l
a
s
h
(
M
X
2
5
L
6
4
)
E
E
P
R
O
M

H
D
C
P
(
2
4
W
C
0
8
)
E
E
P
_
S
C
L
/
S
D
A
E
E
P
_
S
C
L
/
S
D
A
T
X
C
E
2

T
X
C
E
3

T
X
C
L
K
E

T
X
C
E
1

T
X
C
E
0
T
X
C
O
1

T
X
C
O
3

T
X
C
O
2

T
X
C
O
0

T
X
C
L
K
O

M
_
S
C
L
/
S
D
A
M
A
I
N

S
C
L
A
E
R
M
a
t
r
i
x
(
L
G
E
4
7
6
7
A
)
(
I
C
8
0
0
)
E
E
P
R
O
M
2
4
C
0
2
I
C
3
0
2

T
U
5
0
0

I
C
8
0
2
I
C
8
0
3
I
C
8
0
1
I
C
6
0
0
P
4
0
2
P
4
0
3
M
_
S
C
L
/
S
D
A
S
I
D
E
R E A R
H
D
M
I
3
(
J
K
3
0
3
)
U
S
B
(
J
K
2
0
4
)
R S - 2 3 2 C
( J K 2 0 0 )
U S B ( S V C )
( J K 2 0 5 )
H D M I 1
( J K 3 0 1 )
H D M I 2
( J K 3 0 2 )
E
E
P
R
O
M
2
4
C
0
2
I
C
3
0
1

E
E
P
R
O
M
2
4
C
0
2
I
C
3
0
0

E
E
P
R
O
M
2
4
C
0
2
I
C
3
0
0

D
D
C
_
S
C
L
1
/
S
D
A
1
D
D
C
_
S
C
L
2
/
S
D
A
2
D
D
C
_
S
C
L
3
/
S
D
A
3
C
o
n
t
r
o
l
l
e
r
S
T
3
2
3
2
C
D
R
I
C
2
0
0

R
X
D
/
T
X
D
E
E
P
R
O
M
2
4
C
0
2
I
C
2
0
1

D
S
U
B
_
S
C
L
/
S
D
A
P
4
0
1
S
P
I
_
C
Z
/
D
O
S
P
I
_
C
L
K
/
D
I
H
D
M
I
_
D
A
T
A
1
H
D
M
I
_
D
A
T
A
2
U
S
B

D
N
/
D
P
P
C
_
R
/
G
/
B
P
C
_
V
S
/
H
S
T
X
D
/
R
X
D
P
C
_
A
U
D
_
L
/
R
T
X
C
O
4

T
X
C
E
4

F H D L V D S c o n n e c t o r
H D L V D S c o n n e c t o r
D
D
R
2

S
D
R
A
M
(
5
1
2
M

B
y
t
e
)
I
C
9
0
0
D
D
R
2
_
C
K
E
D
D
R
2
_
W
E
Z
D
D
R
2
_
D
Q
S
0


D
D
R
2
_
M
C
L
K
D
D
R
2
_
B
A
0
/
1
D
D
R
2
_
D
Q
S
1

D
D
R
2
_
O
D
T
D
D
R
2
_
D
Q
M
0
/
1
S
I
D
E
_
V
I
N
S
I
D
E
_
L
I
N
/
R
I
N

LGE Internal Use Only Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
- 18 -
3
0
0
5
0
0
5
1
0
1
2
0
A
1
0
2
0
0
8
0
0
5
3
0
5
5
0
8
1
0
9
0
0
9
1
0
5
4
0
5
2
1
4
0
0
A
2
1
A
2
A
5
L
V
1
O
p
t
i
o
n
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CVBS_LIN
ZD100
SD05
ZD103
SD05
ZD105
SD05
CVBS_VIN
CVBS_RIN
ZD104
SD05
ZD101
SD05
ZD102
SD05
D101
30V
D100
30V
D104
30V
D105
30V
COMP2_Y
COMP2_PB
COMP2_PR
COMP2_L
COMP2_R
R109
75
R108
75
R107
75
R104
220K
R118
12K
R117
12K
R119
12K
R120
12K
R113
10K
R115
10K
R116
10K
R100
220K
R111
220K
R112
220K
R110
75
R114
10K
R121
75
JP102
Q102
RT1C3904-T112
E
B C
R105
470
MNT_VOUT_T
P_12V_SMALL_15V
JP101 R101
220
R102
402
READY
R103
68
Q101
ISA1530AC1
E B
C
R106
47
C104
5600pF
50V
ZD106
30V
ZD107
30V
C101 10uF
16V
Q105
RT1C3904-T112
E
B C
MUTE_LINE
R124
1K
C103
5600pF
50V
R122
0
R123
1K
Q103
RT1C3904-T112
E
B C
Q106
RT1C3904-T112
E
B C
MNT_LOUT
Q104
RT1C3904-T112
E
B C
C102 10uF
16V
MNT_ROUT
R125
0
MUTE_LINE
JK101
PPJ238-01
NON_AUDIO_OUT
5D [GN2]O-SPRING
6D [GN2]E-LUG
4D [GN2]CONTACT
7E [BL2]E-LUG-S
5E [BL2]O-SPRING
7F [RD2]E-LUG-S
5F [RD2]O-SPRING_1
5G [WH2]O-SPRING
4H [RD2]CONTACT
5H [RD2]O-SPRING_2
6H [RD2]E-LUG
6A [YL1]E-LUG
5A [YL1]O-SPRING
4A [YL1]CONTACT
5B [WH1]O-SPRING
4C [RD1]CONTACT
5C [RD1]O-SPRING
6C [RD1]E-LUG
JK102
PPJ239-03
AUDIO_OUT
5J [GN2]O-SPRING
6J [GN2]E-LUG
4J [GN2]CONTACT
7K [BL2]E-LUG-S
5K [BL2]O-SPRING
7L [RD2]E-LUG-S
5L [RD2]O-SPRING_1
5M [WH2]O-SPRING
4N [RD2]CONTACT
5N [RD2]O-SPRING_2
6N [RD2]E-LUG
6D [WH1]E-LUG
5D [WH1]O-SPRING
7E [RD1]E-LUG-S
5E [RD1]O-SPRING_1
7F [YL1]E-LUG-S
5F [YL1]O-SPRING_1
4F [YL1]CONTACT_1
5G [WH1]O-SPRING_2
4H [RD1]CONTACT_2
5H [RD1]O-SPRING_2
6H [RD1]E-LUG
1 9 INPUT1
COMPONENT / AV IN / AV AUDIO OUT
GAIN X 4
POP NOISE
POP NOISE
AUDIO_OUT OPTION BLOCK
2010/11/22 LK310
LP91J
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
U
S
B

D
O
W
N

S
T
R
E
A
M
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SIDE_LIN
SIDE_RIN
ZD203
5.6B
SIDE_AV
SIDE_V
ZD202
5.6B
SIDE_AV
IR_OUT
+3.5V_MST
TXD
R204
4.7K
IC200
ST3232CDR
3
C1-
2
V+
4
C2+
1
C1+
6
V-
5
C2-
7
T2OUT
8
R2IN
9
R2OUT
10
T2IN
11
T1IN
12
R1OUT
13
R1IN
14
T1OUT
15
GND
16
VCC
R205
4.7K
RXD
+3.5V_MST
ZD200
SD05
DSUB_SDA
PC_VS
ZD201
SD05
PC_B
DSUB_SDA
PC_AUD_R
PC_G
DSUB_SCL
IC201
CAT24C02WI-GT3
RGB_EEPROM_CATAL
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
DDC_WP
PC_HS
PC_AUD_L
DSUB_SCL
PC_R
D202
30V
CDS3C30GTH
D203
30V
CDS3C30GTH
D200
30V
D201
30V
D206
30V
SIDE_AV
D205
30V
SIDE_AV
D204
30V
D209
30V
C203
0.1uF
16V
C200
0.1uF
16V
C201
0.1uF
16V
C202
0.1uF
16V
C205
0.01uF
R202
100
R203
100
R227
75
SIDE_AV
R223
220K
READY
R222
220K
READY
R226
12K
SIDE_AV
R228
12K
SIDE_AV
R211
75
R212
75
R213
75
R214
4.7K
R215
4.7K
R231
220K
R232
220K
R233
10K
R234
10K
R235
12K
R236
12K
R220
4.7K
R221
4.7K
R216
100
R217
100
R218
100
C208
0.1uF
50V
OCP_READY
C209
10uF
16V
OCP_READY
L200
120OHM
OCP_READY
+5V_USB
R209
1K
OCP_READY R210
4.7K
OCP_READY
R237
0
Non_OCP
C210
10uF
6.3V
R207
68
R208
68
C213
68pF
50V
C211
68pF
50V
R219
4.7K
READY
L201
500 C212
220uF
16V
C214
100uF
16V
D213
OCP_READY
A AC
C
R238
510
OCP_READY
R224
10K
SIDE_AV
R225
10K
SIDE_AV
JK200
SPG09-DB-009
1
2
3
4
5
6
7
8
9
10
JK201
PPJ235-01
SIDE_AV
4A [YL]O-SPRING
5A [YL]E-LUG
3A [YL]CONTACT
4B [WH]O-SPRING
3C [RD]CONTACT
4C [RD]O-SPRING
5C [RD]E-LUG
JK202
SPG09-DB-010
6630TGA004Q
RED
1
GREEN
2
BLUE
3
GND_1
4
DDC_GND
5
RED_GND 6
GREEN_GND
7
BLUE_GND 8
NC 9
SYNC_GND 10
GND_2
11
DDC_DATA
12
H_SYNC
13
V_SYNC
14
DDC_CLOCK
15
SHILED 16
JK203
PEJ027-01
6B T_TERMINAL2
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3 E_SPRING
D211
ENKMC2838-T112
A1
C
A2
+5V_MULTI
R200
0
D207
30V
D208
30V
D210
30V
USB_DN
USB_DP
ZD204
30V
READY
ZD205
30V
READY
JK205
KJA-UB-0-0037
REAR_USB
1
2
3
4
5
R229
0
REAR_USB
USB_DL_P
R230
0
REAR_USB
USB_DL_N
USB_DL_P
USB_DL_N
IC202
AP2191SG-13
OCP_READY
3
IN_2
2
IN_1
4
EN
1
GND
5
FLG
6
OUT_1
7
OUT_2
8
NC
+3.5V_MULTI
JK204
KJA-UB-4-0004
SIDE_USB
1
2
3
4
5
IC201-*1
R1EX24002ASAS0A
RGB_EEPROM_RENESAS
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
2 9 INPUT2
2010/11/22
USB
Its possibel to 27~47ohm
** 1A Design
SIDE AV
RS-232C
PC EDID
PC SOUND
Close to SIDE_USB
PC
LK310
LP91J
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+5V_HDMI_2
HPD_MST_2
TMDS2_RX2-
CEC
TMDS2_RXC-
TMDS2_RXC+
TMDS1_RXC-
TMDS2_RX0+
+5V_HDMI_2
HPD_MST_1
CEC
TMDS1_RX2+
TMDS2_RX1+
+5V_MULTI
+5V_HDMI_1
TMDS2_RX0-
TMDS1_RX1-
TMDS2_RX1-
TMDS1_RX2-
+5V_MULTI
+5V_HDMI_1
TMDS1_RX0-
TMDS1_RX1+
TMDS1_RX0+
TMDS2_RX2+
TMDS1_RXC+
DDC_SDA2
DDC_SCL2
DDC_SDA1
DDC_SCL1
JP301
JP300
JP302
JP303
Q301
2SC3875S
RT1C3904-T112
E
B
C
Q300
2SC3875S
RT1C3904-T112
E
B
C
D300
KDS184S
A
1
C
A
2
D301
KDS184S
A
1
C
A
2
IC301
CAT24C02WI-GT3
HDMI2_EEPROM_CATAL
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
IC300
CAT24C02WI-GT3
HDMI1_EEPROM_CATAL
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
DDC_WP
DDC_WP
BSS83
Q303
READY
S
B
D
G
CEC
+3.3V_MST
CEC_C
D304
30V READY
CDS3C30GTH
D303
30V
MMBD301LT1G
READY
R301
10K
R303
1K
R300
10K
R302
1K
R315
68K
READY
R313
0
R305 100
R304 100
C301
0.01uF
R331 100
R306 100
R307 100
C302
0.01uF
R327 100
R308
10K
R310
10K
R309
10K
R311
10K
R316
56K
READY
JK302
YKF45-7058V
14
NC
13
CEC
5 DATA1_SHIELD
20
SHIELD
12
CLK-
11
CLK_SHIELD
2 DATA2_SHIELD
19
HPD
18
+5V_POWER
10 CLK+
4 DATA1+
1 DATA2+
17
DDC/CEC_GND
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16
SDA
7 DATA0+
6 DATA1-
15
SCL
JK301
YKF45-7058V
14
NC
13
CEC
5
DATA1_SHIELD
20
SHIELD
12
CLK-
11
CLK_SHIELD
2
DATA2_SHIELD
19
HPD
18
+5V_POWER
10
CLK+
4
DATA1+
1
DATA2+
17
DDC/CEC_GND
9
DATA0-
8
DATA0_SHIELD
3
DATA2-
16
SDA
7
DATA0+
6
DATA1-
15
SCL
R319
10K
+5V_HDMI_3
+5V_MULTI
TMDS3_RX1-
DDC_SCL3
HPD_MST_3 Q302
2SC3875S
RT1C3904-T112
E
B
C
TMDS3_RX0+
+5V_HDMI_3
R312
10K
DDC_WP
R318 100
TMDS3_RXC+
JK303
KJA-ET-0-0032
14 NC
13 CEC
5 DATA1_SHIELD
20
JACK_GND
12 CLK-
11 CLK_SHIELD
2 DATA2_SHIELD
19 HPD
18 +5V_POWER
10 CLK+
4 DATA1+
1 DATA2+
17 DDC/CEC_GND
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16 SDA
7 DATA0+
6 DATA1-
15 SCL
JP305
TMDS3_RXC-
DDC_SDA3
R320
10K
R314
1K
TMDS3_RX1+
CEC
TMDS3_RX2+
R317 100
JP304
C300
0.01uF
25V
TMDS3_RX2-
R329 100
IC302
CAT24C02WI-GT3
HDMI3_EEPROM_CATAL
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
D302
KDS184S
A
1
C
A
2
TMDS3_RX0-
IC301-*1
R1EX24002ASAS0A
HDMI2_EEPROM_RENESAS
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
IC300-*1
R1EX24002ASAS0A
HDMI1_EEPROM_RENESAS
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
IC302-*1
R1EX24002ASAS0A
HDMI3_EEPROM_RENESAS
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
HDMI 3 9
OPTION
SW_HPD : USE SW HPD (Default)
MST_HPD : USE MST HPD
LP91J
LK310 2010/11/22
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
TXCE1-
TXCE1+
TXCE0-
TXCE0+
TXCE3+
TXCE3-
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE0+
TXCE0-
TXCE1+
TXCE1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
TXCO3-
TXCO3+
TXCLKO-
TXCLKO+
TXCO2-
TXCO2+
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
TXCO1-
TXCO1+
TXCE1+
TXCE1-
TXCO0-
TXCO0+
TXCE0+
TXCE0-
TXCE4+
TXCE4-
TXCO4+
TXCO4-
C402
47pF
50V
READY
R413
22
IR-OUT
C400
470pF
50V
NON_19_22INCH
KEY1
ZD400
5.6B
FHD BRIDING
L405 120ohm
NON_19_22INCH
ZD401
5.6B
FHD BRIDING
+3.5V_MST
ZD402
5.6B
L401
FHD BRIDING
500-ohm
IR_OUT
R412
10K
IR-OUT
Q401
2SC3052
IR-OUT
E B
C
L400
FHD BRIDING
500-ohm
SUB_SCL
L403
120ohm
KEY2
Q403
2SC3052
IR-OUT
E
B
C
+3.5V_MST
IR
SUB_SDA
C407
0.1uF
26_32INCH
+3.3V_MST
+3.5V_MST
C408
0.1uF
26_32INCH
L404 120ohm
NON_19_22INCH
+3.3V_MULTI_MST
C406
0.1uF
50V
READY
C404
47uF
16V
KEY2
C410
100pF
50V
19_22INCH
KEY1
C409
100pF
50V
19_22INCH
+5V_+12V_LCD
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-
+3.3V_MULTI_MST
OPC_EN
E-DIM
OPC_OUT
C405
100pF
50V
C401
100pF
50V
L408
19_22INCH
L409
19_22INCH
L407
120ohm
L402
120ohm
R406
4.7K
R409
4.7K
R407
10K
IR-OUT
R410
10K
IR-OUT
R401
47K
IR-OUT
R420
4.7K
VESA
R421
0
JEIDA
R423
0
READY
R416 0
OPC_ENABLE
R422
470
OPC_ENABLE
L406
120-ohm
P402
FF10001-30
26_32INCH_HD_WAFER
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
+3.5V_MST
Q404
RT1C3904-T112
OPC_ENABLE
E B
C R424
1K
OPC_ENABLE
R400
10K
Q400
2SC3052
E
B
C
+3.3V_MULTI_MST
R405
10K
R403
10K
Q402
2SC3052
E
B
C
+3.5V_MST
R408
10K
R411
4.7K
R404
0
READY
R402
0
READY
C403
470pF
50V
NON_19_22INCH
SUB_SCL
LED_R
P404
12507WR-03L
19_22INCH
1
KEY1
2
KEY2
3
GND
4
P403
FF10001-30
19_22INCH 1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
+5V_+12V_LCD
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-
SMALL_NC2
SMALL_NC1
SMALL_OPC_OUT
SMALL_NC3
SMALL_OPC_EN
SMALL_NC4
R414
0
HD_NOT AUO_IPS
R418 0
OPC_ENABLE
R419 0
LVDS_SEL
R415
0
HD_normal
SMALL_OPC_EN
SMALL_NC3
SMALL_NC4
SMALL_NC1
SMALL_OPC_OUT
SMALL_NC2
P400
12507WR-12L
1
SCL
2
SDA
3
GND
4
KEY1
5
KEY2
6
5V_ST
7
GND
8
LED_B/LG_LOGO
9
IR
10
GND
11
ST_3.3V
12
LED_R/BUZZ
13
.
SMALL_NC5
SMALL_NC5
P401
TF05-51S
51P_FFC_WAFER_FHD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
+5V_+12V_LCD
R431 0
SHARP 42FHD
R432
0
NON_Small CMO
R425 0
HD_normal
R429 0
AUO/SHARP 42FHD
R428 0
AUO/SHARP 42FHD
R427 0
AUO/SHARP 42FHD
R426 0
AUO/SHARP 42FHD
+3.3V_MULTI_MST
R433
4.7K
READY
R434
0
NON CMO FHD
R435 0
NON CMO 42FHD
R436 0
NON CMO 42FHD
R437 0
NON CMO 42FHD
R438 0
NON CMO 42FHD
R417 0
OPC_ENABLE
R439 0
READY
R440
4.7K
READY
R441
0
READY
+3.3V_MULTI_MST
R442
4.7K
SHARP 42FHD
R443
0
AUO FHD
+3.3V_MULTI_MST
R444 0
NON AUO 42FHD
LVDS,CTR KEY 4 9
CONTROL KEY
OPC_EABLE
OPC_OUTPUT
External VBR
PANEL WAFER
IR
**OPC_ENABLE : USE LGD Module
FHD
26inch AUO : OPEN
26inch SHARP : Pull down
51 47 46 45 44 43 42 41 28
SHARP 32INCH FHD
R444 R431 R442
R443 R421
R420 R416 R417 R418
R423
R438 R429
O X X
X
X X X O
R428
27 26
R437
R434
25
R433 R427
12
R426
11 10
R436
9
R435
O R434 O O
VESA
IPS 32INCH FHD O X X
X
VESA
X X X O X X O R434 X X O O
SHARP 32INCH FHD
O O O O
LP91J
LK310 2010/11/22
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MAIN_SIF
0.01uF
C501
50V
M_SDA
C502
27pF
50V
+5V_TUNER
TV_MAIN
M_SCL
+5V_TUNER
C504
50V
READY
C500
27pF
50V
L502
READY
10uH
C507
82pF
50V
READY
C508
10uF
16V
L500
120-ohm
READY
Q502
ISA1530AC1
E
B
C
R502
4.7K
R506
220
R507
220
C505
100uF
16V
READY
C506
100uF
16V
READY
R505
47
R504
47
C503
0.1uF
50V
R500
0
R501
0
TU500
TAFJ-Z001D
PAL_TUNER
5
MOPLL_AS
11
VIDEO
2
NC_2
10
NC_4
4
RF_AGC
1
NC_1
9
SIF
8
NC_3
3
+B[5V]
7
SDA
6
SCL
12
GND
13
SHIELD
TU500-*1
TAFJ-H001F
5
MOPLL_AS
11
VIDEO
2
NC_2
10
NC_4
4
RF_AGC
1
NC_1
9
SIF
8
NC_3
3
+B[5V]
7
SDA
6
SCL
12
GND
13
SHIELD
TUNER 5 9
Near the pin
LP91J
LK310 2010/11/22
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THERMAL
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C644
0.1uF
C637
0.1uF
M
_
S
D
A
C606
1000pF
C616
22000pF
C623 22000pF +1.8V_DVDD
C651
1000pF
50V
C632
0.47uF
MULTI_PW_SW
C605
0.1uF
+1.8V_DVDD
C615
0.1uF
50V
C629
0.1uF
+3.3V_MULTI_MST
C643
0.1uF
C617
0.1uF
50V
C602
0.1uF
C647
0.01uF
SPK_R+
M
_
S
C
L
C610
0.1uF
C611 22000pF
SPK_L+
+1.8V_AVDD
SPK_L-
C669
0.1uF
+16V_NTP
+16V_NTP
SPK_R-
C601
100pF
C625
22000pF
+1.8V_AVDD
C672
0.01uF
C648
0.01uF
C603
1000pF
SW_RESET
C673
0.47uF
C671
0.01uF
C626
0.1uF
C613
0.01uF
50V
SPK_L-
SPK_R+
+1.8V_DVDD
SPK_R-
SPK_L+
+1.8V_AVDD
+1.8V
I2S_MCLK
I
2
S
_
S
D
O
I
2
S
_
W
S
I
2
S
_
S
C
K
C619
390pF
C621
390pF
C630
390pF
C634
390pF
C608
1uF
C618
1uF
C624
1uF
C614
1uF
C607
0.1uF
50V
C642
10uF
35V
C600
10uF
16V
C604
10uF
16V
C609
10uF 16V
R604
3.3
R608
12
R611
12
R610
12
R638
12
R663
4.7K
R623
4.7K
R626
3.3
R625
3.3
R601 100
R600
3.3K
R
6
7
6
1
0
0
R
6
7
7
1
0
0
R
6
7
8
1
0
0
R602
100
R603
100
R658
12
R653
12
R621
12
R654
12
R628
4.7K
R667
4.7K
R671
3.3
R635
3.3
L605
MLB-201209-0120P-N2
0LCML00003B
120-ohm
L606
MLB-201209-0120P-N2
0LCML00003B
120-ohm
C638
33pF
50V
READY
C639
33pF
50V
READY
+3.3V_MST
R630
10K
Q603
RT1C3904-T112 E
B
C
R629 10K
MULTI_PW_SW
R627
0
READY
R624
0
READY
L608
MLB-201209-0120P-N2
L609
MLB-201209-0120P-N2
L610
MLB-201209-0120P-N2
L611
MLB-201209-0120P-N2
C612
68uF
35V
C640
68uF
35V
L607
AD-9060
EAP61008401
2S
1S 1F
2F
L603
AD-9060
EAP61008401
2S
1S 1F
2F
P600
SMAW250-H04R
1
2
3
4
R631
47K
READY
R673 0
IC600
NTP-3200L
1 BST1A
2 VDR1A
3 RESET
4 AD
5 DVSS_1
6 VSS_IO
7 CLK_I
8 VDD_IO
9 DGND_PLL
10 AGND_PLL
11 LF
12 AVDD_PLL
13 DVDD_PLL
14 TEST0/GND
1
5
D
V
S
S
_
2
1
6
D
V
D
D
1
7
S
D
A
T
A
1
8
W
C
K
1
9
B
C
K
2
0
S
D
A
2
1
S
C
L
2
2
M
O
N
I
T
O
R
_
0
2
3
M
O
N
I
T
O
R
_
1
2
4
M
O
N
I
T
O
R
_
2
2
5
F
A
U
L
T
2
6
V
D
R
2
B
2
7
B
S
T
2
B
2
8
P
G
N
D
2
B
_
1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_2
32 PVDD2B_1
33 PVDD2B_2
34 PVDD2A_1
35 PVDD2A_2
36 OUT2A_1
37 OUT2A_2
38 PGND2A_1
39 PGND2A_2
40 BST2A
41 VDR2A
42 NC
4
3
V
D
R
1
B
4
4
B
S
T
1
B
4
5
P
G
N
D
1
B
_
1
4
6
P
G
N
D
1
B
_
2
4
7
O
U
T
1
B
_
1
4
8
O
U
T
1
B
_
2
4
9
P
V
D
D
1
B
_
1
5
0
P
V
D
D
1
B
_
2
5
1
P
V
D
D
1
A
_
1
5
2
P
V
D
D
1
A
_
2
5
3
O
U
T
1
A
_
1
5
4
O
U
T
1
A
_
2
5
5
P
G
N
D
1
A
_
1
5
6
P
G
N
D
1
A
_
2
57
[
E
P
]
G
N
D
R605
4.7K
R617
1K
MNT_LOUT
+12V_AUDIO
R614
10K
R616
4.7K
C635 33pF
50V
C633
6800pF
50V
R606
1K
R615
6.8K
C627 33pF
50V
C628
0.01uF
50V
Q601
RT1C3904-T112
E
B C
R613
5.6K
C622
6800pF
50V
+12V_AUDIO
MNT_ROUT
MNT_L_AMP
C631
0.1uF
16V
R609
6.8K
C620
0.1uF
16V
Q602
RT1C3904-T112
E
B C
MNT_R_AMP
R607
10K
+12V_AUDIO
R612
5.6K
IC601
S324
AUDIO_OUT_OP AMP_AUK
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8 OUT3
9 INPUT3-
10 INPUT3+
11 GND
12 INPUT4+
13 INPUT4-
14 OUT4
IC601-*1
AS324MTR-E1
AUDIO_OUT_OP AMP_BCD
3
IN1+
2
IN1-
4
VCC
1
OUT1
6
IN2-
5
IN2+
7
OUT2
8
OUT3
9
IN3-
10
IN3+
11
GND
12
IN4+
13
IN4-
14
OUT4
AUDIO 6 9
Main AMP
AMP :GAIN X 4
AUDIO_OUT OPTION BLOCK
LP91J
LK310 2010/11/22
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
D
D
R
2
_
A
[
2
]
DDR2_D[1]
D
D
R
2
_
A
[
6
]
DDR2_D[5]
D
D
R
2
_
A
[
1
0
]
DDR2_D[0]
DDR2_D[10]
D
D
R
2
_
A
[
1
2
]
DDR2_D[14]
D
D
R
2
_
A
[
0
]
DDR2_D[6]
D
D
R
2
_
A
[
5
]
DDR2_D[3]
D
D
R
2
_
A
[
4
]
DDR2_D[4]
DDR2_D[12]
D
D
R
2
_
A
[
9
]
DDR2_D[11]
D
D
R
2
_
A
[
8
]
DDR2_D[8]
DDR2_D[7]
DDR2_D[15]
DDR2_D[9]
D
D
R
2
_
A
[
3
]
DDR2_D[13]
D
D
R
2
_
A
[
1
1
]
DDR2_D[2]
D
D
R
2
_
A
[
1
]
D
D
R
2
_
A
[
7
]
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
TXCE4+
TXCE4-
TXCO0+
TXCO0-
TXCO1+
TXCO1-
TXCO2+
TXCO2-
TXCLKO+
TXCLKO-
TXCO3+
TXCO3-
TXCO4+
TXCO4-
MULTI_PW_SW
R859 10
A
R
8
1
2
5
6
SUB_SDA
+1.8V_DDR
COMP2_PB
DDR2_DQM0
R
8
2
5
1
0
0
C828 0.047uF
K
E
Y
1
R
L
_
O
N
C864
0.01uF
C
8
8
2
0
.
1
u
F
I
2
S
_
S
C
K
TMDS2_RX2- C833 0.1uF
I
2
S
_
M
C
L
K
U
S
B
_
D
N
R882 100
MAIN_SIF
PC_G
R
8
0
2
4
1
0
0
R844 33
C830 0.047uF
P
A
N
E
L
_
S
T
A
T
U
S
TMDS2_RX0+
C842 0.1uF
SW_RESET
R
X
D
C858
0.01uF
TMDS2_RX2+
+3.3V_MULTI_MST
C
8
1
3
0
.
1
u
F
X
8
0
1
1
2
M
H
z
R874 10
R
8
3
9
1
M
C812
4.7uF 10V
RL_ON
M
_
S
D
A
+3.3V_MST
EEP_SCL
E
-
D
I
M
SIDE_RIN
R862 10
AR805
56
DDR2_DQM1
E
E
P
_
S
C
L
C
E
C
_
C
C866
10uF
C860
0.01uF
R834 47
A
R
8
1
3
5
6
S
Y
S
_
R
E
S
E
T
S
P
I
_
C
Z
I
2
S
_
S
D
O
C815 0.1uF
TMDS2_RXC+
D
D
C
_
S
C
L
1
C837 0.047uF
P
O
W
E
R
_
S
W
R832 47
TMDS2_RXC-
C848 0.1uF
AR810
56
C838 0.1uF
+1.2V_VDDC_MST
+3.3V_MULTI_MST
SW800
JTP-1127WEM
1
2 4
3
C811
0.1uF
D
D
R
2
_
C
A
S
Z
PANEL_ON
C835 1000pF
C849 0.1uF
PC_B
+3.3V_MULTI_MST
C829 0.047uF
D
D
R
2
_
B
A
1
DISP_EN/VAVS_ON
D
D
R
2
_
R
A
S
Z
DDR2_D[0-15]
R854 10
COMP2_Y
A
R
8
1
8
3
3
C832 0.047uF
P
C
_
A
U
D
_
L
P
C
_
V
S
C
V
B
S
_
L
I
N
SPI_DI
C
8
8
3
0
.
1
u
F
D
D
R
2
_
B
A
0
EEP_SCL
C859
0.01uF
+3.3V_MULTI_MST
DDR2_DQS0M
SIDE_LIN
SIDE_V
C831 0.047uF
C803
0.01uF
TMDS2_RX1+
+1.8V_DDR
D
D
C
_
S
D
A
1
SUB_SCL
D
S
U
B
_
S
D
A
R890 10
R881 100
IC803
CAT24WC08W-T
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
D
D
R
2
_
C
K
E
S
P
I
_
C
L
K
+3.3V_MULTI_MST
DDR2_DQS1M
C807
0.01uF
D803
KDS181
U
S
B
_
D
P
+3.3V_MST
R
8
0
2
5
1
0
0
+3.3V_MULTI_MST
AR809
56
I
-
D
I
M
SPI_CZ
C
8
0
8
0
.
1
u
F
C804 0.1uF
R
8
5
2
5
6
I
RE
E
P
_
S
D
A
DDR2_A[0-12]
CVBS_VIN
R851 10
DDR2_DQS1P
TMDS2_RX0-
+3.3V_MULTI_MST
DDR2_DQS0P
R869 10
R837 47
DDR2_MCLKZ
D
D
R
2
_
W
E
Z
T
X
D
AR806
56
C834 0.047uF
EEP_SDA
TMDS1_RXC+
C
O
M
P
2
_
R
M
_
S
C
L
+3.3V_MULTI_MST
P
C
_
H
S
TMDS1_RX2-
C850 0.01uF
+3.3V_MULTI_MST
C870
47uF
25V
+3.3V_MULTI_MST
R835 470
R891 10
D802
KDS181
TV_MAIN
C
8
1
8
1
0
0
0
p
F
COMP2_PR
Q804
RT1C3904-T112
26_32INCH E
B
C
C867
0.1uF
R
8
0
2
6
1
0
0 P_24V_SMALL_15V
C
8
4
0
0
.
0
1
u
F
C861 2.2uF
HPD_MST_1
R873 10
R880 10
SPI_DO
P
C
_
A
U
D
_
R
A
R
8
1
4
5
6
+1.2V_VDDC_MST
R
8
0
2
3
1
0
0
TMDS2_RX1-
D
D
C
_
S
C
L
2
R858 10
R892 10
TMDS1_RX1+
R871 10
TMDS1_RX2+
EEP_SDA
A
R
8
0
0
5
6
D801
KDS181
D
D
R
2
_
O
D
T
TMDS1_RXC-
S
P
I
_
D
I
I
2
S
_
W
S
DDR2_MCLK
C826 0.047uF
TMDS1_RX0-
R872 10
R879 10
HPD_MST_2
C853 0.1uF
D
S
U
B
_
S
C
L
C865
0.01uF
C
O
M
P
2
_
L
C
8
0
9
1
0
u
F
1
6
V
+1.8V_DDR
C862
0.01uF
+1.2V_VDDC_MST
TMDS1_RX1-
C
8
2
0
4
.
7
u
F
R
8
2
4
1
0
0
R
8
2
9
1
0
0
K
E
Y
2
A
R
8
1
5
5
6
TMDS1_RX0+
C857
0.01uF
C
V
B
S
_
R
I
N
C856 2.2uF
C869 0.1uF
+3.5V_MST
C814
0.1uF
50V
PC_R
SPI_CLK
R843 33
C
8
4
4
0
.
1
u
F
R856 10
D
D
C
_
S
D
A
2
S
P
I
_
D
O
P_12V_SMALL_15V
+3.5V_MST
POWER_DET
P
O
W
E
R
_
D
E
T
Q803
RT1C3904-T112
E
B
C
+3.5V_MST
SYS_RESET
R
8
0
1
2
1
0
0
C877
0.01uF
C878
0.01uF
C879
0.01uF
T
X
D
R
X
D
C
8
6
3
0
.
1
u
F
Q800
ISA1530AC1
E
B
C
C8000
2.2uF
16V
READY
+3.3V_MST
DDC_WP
OPC_EN
R877
4.7K
R8004
4.7K
R817
4.7K
R800
0
READY
R8001
0
R840 390
R814 47
R816 47
R818 47
R838 47
R833 47
R836 47
R803 470
R804 47
R815 47
R897 47
R802 47
R831 47
R857 47
R830 47
R875 47
R876 47
R846 100
R847 100
R863 4.7K
R864 4.7K
R865 4.7K
R866 4.7K
R
8
6
7
1
K
R
8
6
8
1
K
R
8
0
2
1
1
0
0
R
8
0
2
2
1
0
0
R
8
5
0
1
0
0
R
8
4
9
1
0
0
R
8
9
5
1
0
0
R
8
0
1
7
0
R
E
A
D
Y
R
8
0
1
6
0
R
E
A
D
Y
R
8
0
3
3
0
R
E
A
D
Y
R8020
10K
R8003
10K
C800 0.047uF
C801 0.047uF
C827 0.047uF
C825 0.047uF
C847 0.047uF
C845 0.047uF
C843 0.047uF
C836 0.047uF
C868 0.1uF
C846 1000pF
R884
1K
READY
R889
1K
R811
1K
READY
R883
1K
R8028
4.7K
R8027
4.7K
R812 22
R813 22
C819 0.1uF
C806 0.1uF
C805 0.1uF
R896 4.7K
Small_HD
R8010 4.7K
Small_HD
R8005 22
R8006 22
C871
4.7uF
10V
READY
L800 120-ohm
L
8
0
1
1
2
0
-
o
h
m
L802
120-ohm
C
8
2
3
2
.
2
u
F
C
8
2
4
2
.
2
u
F
C
8
2
1
2
.
2
u
F
C
8
7
3
2
.
2
u
F
C
8
2
2
2
.
2
u
F
C
8
7
4
2
.
2
u
F
C
8
0
2
2
.
2
u
F
C
8
7
5
2
.
2
u
F
R819 3.3K
D
S
U
B
_
S
D
A
L
E
D
_
R
Q805
RT1C3904-T112
READY
E
B
C
DDC_WP
R828
10K
READY
R878
4.7K
R893 4.7K
R861
1K
R8037
0
26_32INCH
R886
2K
R885
150 R860 1K
R8000
10K
R8007
33K
26_32INCH
R855
10K
R853
1K
R888
100
R887
33K
C
8
1
7
2
0
p
F
C
8
1
6
2
0
p
F
R8036
20K
C810 1uF
+3.3V_MULTI_MST +3.3V_MULTI_MST
R8011 4.7K
Small_FHD
R898 4.7K
Non_Small_FHD
R8010-*4
4.7K
LGD Joker
R8010-*1
4.7K
Apollo
R896-*5 4.7K
O/S Joker
R898-*2
4.7K
Apollo
R896-*2 4.7K
Small_FHD
R898-*5 4.7K
O/S Joker
R8010-*5
4.7K
26" FHD
R8011-*3 4.7K
Non_Small_HD
R8011-*1
4.7K
100Hz
R8011-*4 4.7K
26" FHD
R896-*1
4.7K
Non_Small_HD
R898-*1 4.7K
100Hz
R8010-*2
4.7K
Non_Small_FHD
R896-*4 4.7K
26" FHD
R896-*3 4.7K
LGD Joker
R8011-*2
4.7K
Apollo
R8010-*3
4.7K
Small_FHD
R898-*4 4.7K
26" FHD
R898-*3 4.7K
LGD Joker
R8011-*5 4.7K
O/S Joker
C851
0.1uF
OLP
R
8
0
4
0
1
0
0
H
D
M
I
3
_
S
I
D
E
R
8
0
1
1
0
H
D
M
I
3
_
S
I
D
E
R
8
0
3
9
1
0
0
H
D
M
I
3
_
S
I
D
E
T
M
D
S
3
_
R
X
0
-
T
M
D
S
3
_
R
X
0
+
D
D
C
_
S
C
L
3
T
M
D
S
3
_
R
X
C
+
R
8
2
0
1
0
H
D
M
I
3
_
S
I
D
E
R
8
2
2
1
0
H
D
M
I
3
_
S
I
D
E
H
P
D
_
M
S
T
_
3
R
8
4
1
1
0
H
D
M
I
3
_
S
I
D
E
T
M
D
S
3
_
R
X
2
+
D
D
C
_
S
D
A
3
R
8
2
1
1
0
H
D
M
I
3
_
S
I
D
E
T
M
D
S
3
_
R
X
1
-
R
8
4
8
1
0
H
D
M
I
3
_
S
I
D
E
T
M
D
S
3
_
R
X
2
-
R
8
2
3
1
0
H
D
M
I
3
_
S
I
D
E
T
M
D
S
3
_
R
X
C
-
T
M
D
S
3
_
R
X
1
+
R
8
0
5
1
0
H
D
M
I
3
_
S
I
D
E
C
8
7
6
0
.
0
1
u
F
IC804
KIA7427F
READY
2
GND
3 OUT 1 VCC
R808
4.7K
READY
C839
2.2uF 10V
READY
C841
0.22uF
16V
READY
R807
0
READY
IC800
LGE4765A (Matrix basic_NON_SRS)
1 RXBCKN
2 RXBCKP
3 RXB0N
4 RXB0P
5 HOTPLUGB
6 RXB1N
7 RXB1P
8 AVDD_33_1
9 RXB2N
10 RXB2P
11 RXACKN
12 RXACKP
13 RXA0N
14 RXA0P
15 AVDD_33_2
16 RXA1N
17 RXA1P
18 GND_1
19 RXA2N
20 RXA2P
21 HOTPLUGA
22 REXT
23 VCLAMP
24 REFP
25 REFM
26 BIN1P
27 SOGIN1
28 GIN1P
29 RIN1P
30 BINM
31 BIN0P
32 GINM
33 GIN0P
34 SOGIN0
35 RINM
36 RIN0P
37 AVDD_33_3
38 GND_2
39 BIN2P
40 GIN2P
41 SOGIN2
42 RIN2P
43 CVBS6
44 CVBS5
45 CVBS4
46 CVBS3
47 CVBS2
48 CVBS1
49 VCOM1
50 CVBS0
51 VCOM0
52 AVDD_33_4
53 CVBSOUT
54 GND_3
55 SIF0P
56 SIF0M
57 VDDC_1
58 AUL5
59 AUR5
60 AUVRM
61 AUOUTL2
62 AUOUTR2
63 AUOUTL1
64 AUOUTR1
6
5
A
U
L
0
6
6
A
U
R
0
6
7
A
U
L
1
6
8
A
U
R
1
6
9
A
U
L
2
7
0
A
U
R
2
7
1
A
U
L
3
7
2
A
U
R
3
7
3
A
U
C
O
M
7
4
A
U
L
4
7
5
A
U
R
4
7
6
G
N
D
_
4
7
7
A
U
V
R
P
7
8
A
U
V
A
G
7
9
A
V
D
D
_
A
U
8
0
G
N
D
_
5
8
1
V
D
D
C
_
2
8
2
D
D
C
A
_
C
K
8
3
D
D
C
A
_
D
A
8
4
D
D
C
D
A
_
C
K
8
5
D
D
C
D
A
_
D
A
8
6
D
D
C
D
B
_
C
K
8
7
D
D
C
D
B
_
D
A
8
8
G
P
I
O
2
0
8
9
V
D
D
P
_
1
9
0
V
D
D
C
_
3
9
1
U
A
R
T
2
_
R
X
9
2
U
A
R
T
2
_
T
X
9
3
D
D
C
D
C
_
C
K
9
4
R
X
C
C
K
N
9
5
R
X
C
C
K
P
9
6
D
D
C
D
C
_
D
A
9
7
R
X
C
0
N
9
8
R
X
C
0
P
9
9
G
N
D
_
6
1
0
0
R
X
C
1
N
1
0
1
R
X
C
1
P
1
0
2
A
V
D
D
_
D
M
1
0
3
R
X
C
2
N
1
0
4
R
X
C
2
P
1
0
5
H
O
T
P
L
U
G
C
1
0
6
U
S
B
1
_
D
M
1
0
7
U
S
B
1
_
D
P
1
0
8
S
C
K
1
0
9
S
D
I
1
1
0
S
D
O
1
1
1
S
C
Z
1
1
2
P
W
M
0
1
1
3
P
W
M
1
1
1
4
P
W
M
2
1
1
5
P
W
M
3
1
1
6
L
V
A
4
P
1
1
7
L
V
A
4
M
1
1
8
L
V
A
3
P
1
1
9
L
V
A
3
M
1
2
0
L
V
A
C
K
P
1
2
1
L
V
A
C
K
M
1
2
2
L
V
A
2
P
1
2
3
L
V
A
2
M
1
2
4
L
V
A
1
P
1
2
5
L
V
A
1
M
1
2
6
L
V
A
0
P
1
2
7
L
V
A
0
M
1
2
8
V
D
D
P
_
2 129 LVB4P
130 LVB4M
131 LVB3P
132 LVB3M
133 LVBCKP
134 LVBCKM
135 LVB2P
136 LVB2M
137 LVB1P
138 LVB1M
139 LVB0P
140 LVB0M
141 AVDD_LPLL
142 GND_7
143 VDDC_4
144 GPIO150/I2C_OUT_MUTE
145 GPIO151/I2C_OUT_SD2
146 GPIO152/I2C_OUT_SD3
147 GND_8
148 GPIO51
149 GPIO52
150 GPIO53
151 GPIO54
152 GPIO55
153 GPIO56
154 GPIO57
155 GPIO58
156 VDDP_3
157 VDDC_5
158 B_MDATA[4]
159 B_MDATA[3]
160 GND_9
161 B_MDATA[1]
162 B_MDATA[6]
163 AVDD_DDR_1
164 B_MDATA[11]
165 B_MDATA[12]
166 GND_10
167 B_MDATA[9]
168 B_MDATA[14]
169 AVDD_DDR_2
170 B_DDR2_DQM[1]
171 B_DDR2_DQM[0]
172 GND_11
173 B_DDR2_DQS[0]
174 B_DDR2_DQSB[0]
175 AVDD_DDR_3
176 VDDP_4
177 GND_12
178 B_DDR2_DQS[1]
179 B_DDR2_DQSB[1]
180 AVDD_DDR_4
181 B_MDATA[15]
182 B_MDATA[8]
183 GND_13
184 B_MDATA[10]
185 B_MDATA[13]
186 AVDD_DDR_5
187 B_MDATA[7]
188 B_MDATA[0]
189 B_MDATA[2]
190 B_MDATA[5]
191 B_MCLK
192 B_MCLKZ
1
9
3
G
N
D
_
1
4
1
9
4
A
V
D
D
_
M
E
M
P
L
L
1
9
5
M
V
R
E
F
1
9
6
A
_
O
D
T
1
9
7
A
_
R
A
S
Z
1
9
8
A
_
C
A
S
Z
1
9
9
A
_
M
A
D
R
[
0
]
2
0
0
A
_
M
A
D
R
[
2
]
2
0
1
A
_
M
A
D
R
[
4
]
2
0
2
G
N
D
_
1
5
2
0
3
A
_
M
A
D
R
[
6
]
2
0
4
A
_
M
A
D
R
[
8
]
2
0
5
A
_
M
A
D
R
[
1
1
]
2
0
6
A
_
W
E
Z
2
0
7
A
_
B
A
D
R
[
1
]
2
0
8
A
_
B
A
D
R
[
0
]
2
0
9
A
_
M
A
D
R
[
1
]
2
1
0
A
_
M
A
D
R
[
1
0
]
2
1
1
A
V
D
D
_
D
D
R
_
6
2
1
2
A
_
M
A
D
R
[
5
]
2
1
3
A
_
M
A
D
R
[
9
]
2
1
4
A
_
M
A
D
R
[
1
2
]
2
1
5
A
_
M
A
D
R
[
7
]
2
1
6
A
_
M
A
D
R
[
3
]
2
1
7
A
_
M
C
L
K
E
2
1
8
V
D
D
C
_
6
2
1
9
I
2
S
_
I
N
_
W
S
/
G
P
I
O
6
7
2
2
0
I
2
S
_
I
N
_
B
C
K
/
G
P
I
O
6
8
2
2
1
I
2
S
_
I
N
_
S
D
2
2
2
I
2
S
_
O
U
T
_
M
C
K
2
2
3
I
2
S
_
O
U
T
_
W
S
2
2
4
V
D
D
P
_
5
2
2
5
G
N
D
_
1
6
2
2
6
V
D
D
C
_
7
2
2
7
I
2
S
_
O
U
T
_
B
C
K
2
2
8
I
2
S
_
O
U
T
_
S
D
2
2
9
S
P
D
I
F
O
2
3
0
U
A
R
T
2
_
R
X
/
I
2
C
M
_
S
D
A
2
3
1
U
A
R
T
2
_
T
X
/
I
2
C
M
_
S
C
K
2
3
2
U
A
R
T
1
_
R
X
/
G
P
I
O
8
6
2
3
3
U
A
R
T
1
_
T
X
/
G
P
I
O
8
7
2
3
4
G
N
D
_
1
7
2
3
5
G
N
D
_
1
8
2
3
6
U
S
B
0
_
D
M
2
3
7
U
S
B
0
_
D
P
2
3
8
S
A
R
0
2
3
9
S
A
R
1
2
4
0
S
A
R
2
2
4
1
S
A
R
3
2
4
2
A
V
D
D
_
M
P
L
L
2
4
3
X
O
U
T
2
4
4
X
I
N
2
4
5
G
P
I
O
1
3
4
2
4
6
G
P
I
O
1
3
5
2
4
7
G
P
I
O
1
3
8
2
4
8
G
P
I
O
1
3
9
2
4
9
G
P
I
O
1
4
0
2
5
0
I
R
I
N
2
5
1
H
S
Y
N
C
0
2
5
2
V
S
Y
N
C
0
2
5
3
H
S
Y
N
C
1
2
5
4
V
S
Y
N
C
1
2
5
5
C
E
C
2
5
6
H
W
R
E
S
E
T
IC800-*1
Only Divx
1 RXBCKN 2 RXBCKP 3 RXB0N 4 RXB0P 5 HOTPLUGB 6 RXB1N 7 RXB1P 8 AVDD_33_1 9 RXB2N 10 RXB2P 11 RXACKN 12 RXACKP 13 RXA0N 14 RXA0P 15 AVDD_33_2 16 RXA1N 17 RXA1P 18 GND_1 19 RXA2N 20 RXA2P 21 HOTPLUGA 22 REXT 23 VCLAMP 24 REFP 25 REFM 26 BIN1P 27 SOGIN1 28 GIN1P 29 RIN1P 30 BINM 31 BIN0P 32 GINM 33 GIN0P 34 SOGIN0 35 RINM 36 RIN0P 37 AVDD_33_3 38 GND_2 39 BIN2P 40 GIN2P 41 SOGIN2 42 RIN2P 43 CVBS6 44 CVBS5 45 CVBS4 46 CVBS3 47 CVBS2 48 CVBS1 49 VCOM1 50 CVBS0 51 VCOM0 52 AVDD_33_4 53 CVBSOUT 54 GND_3 55 SIF0P 56 SIF0M 57 VDDC_1 58 AUL5 59 AUR5 60 AUVRM 61 AUOUTL2 62 AUOUTR2 63 AUOUTL1 64 AUOUTR1 65
AUL066
AUR067
AUL168
AUR169
AUL270
AUR271
AUL372
AUR373
AUCOM74
AUL475
AUR476
GND_477
AUVRP78
AUVAG79
AVDD_AU80
GND_581
VDDC_282
DDCA_CK83
DDCA_DA84
DDCDA_CK85
DDCDA_DA86
DDCDB_CK87
DDCDB_DA88
GPIO2089
VDDP_190
VDDC_391
UART2_RX92
UART2_TX93
DDCDC_CK94
RXCCKN95
RXCCKP96
DDCDC_DA97
RXC0N98
RXC0P99
GND_6100
RXC1N101
RXC1P102
AVDD_DM103
RXC2N104
RXC2P105
HOTPLUGC106
USB1_DM107
USB1_DP108
SCK109
SDI110
SDO111
SCZ112
PWM0113
PWM1114
PWM2115
PWM3116
LVA4P117
LVA4M118
LVA3P119
LVA3M120
LVACKP121
LVACKM122
LVA2P123
LVA2M124
LVA1P125
LVA1M126
LVA0P127
LVA0M128
VDDP_2
129 LVB4P 130 LVB4M 131 LVB3P 132 LVB3M 133 LVBCKP 134 LVBCKM 135 LVB2P 136 LVB2M 137 LVB1P 138 LVB1M 139 LVB0P 140 LVB0M 141 AVDD_LPLL 142 GND_7 143 VDDC_4 144 GPIO150/I2C_OUT_MUTE 145 GPIO151/I2C_OUT_SD2 146 GPIO152/I2C_OUT_SD3 147 GND_8 148 GPIO51 149 GPIO52 150 GPIO53 151 GPIO54 152 GPIO55 153 GPIO56 154 GPIO57 155 GPIO58 156 VDDP_3 157 VDDC_5 158 B_MDATA[4] 159 B_MDATA[3] 160 GND_9 161 B_MDATA[1] 162 B_MDATA[6] 163 AVDD_DDR_1 164 B_MDATA[11] 165 B_MDATA[12] 166 GND_10 167 B_MDATA[9] 168 B_MDATA[14] 169 AVDD_DDR_2 170 B_DDR2_DQM[1] 171 B_DDR2_DQM[0] 172 GND_11 173 B_DDR2_DQS[0] 174 B_DDR2_DQSB[0] 175 AVDD_DDR_3 176 VDDP_4 177 GND_12 178 B_DDR2_DQS[1] 179 B_DDR2_DQSB[1] 180 AVDD_DDR_4 181 B_MDATA[15] 182 B_MDATA[8] 183 GND_13 184 B_MDATA[10] 185 B_MDATA[13] 186 AVDD_DDR_5 187 B_MDATA[7] 188 B_MDATA[0] 189 B_MDATA[2] 190 B_MDATA[5] 191 B_MCLK 192 B_MCLKZ 193 GND_14
194 AVDD_MEMPLL
195 MVREF
196 A_ODT
197 A_RASZ
198 A_CASZ
199 A_MADR[0]
200 A_MADR[2]
201 A_MADR[4]
202 GND_15
203 A_MADR[6]
204 A_MADR[8]
205 A_MADR[11]
206 A_WEZ
207 A_BADR[1]
208 A_BADR[0]
209 A_MADR[1]
210 A_MADR[10]
211 AVDD_DDR_6
212 A_MADR[5]
213 A_MADR[9]
214 A_MADR[12]
215 A_MADR[7]
216 A_MADR[3]
217 A_MCLKE
218 VDDC_6
219 I2S_IN_WS/GPIO67
220 I2S_IN_BCK/GPIO68
221 I2S_IN_SD
222 I2S_OUT_MCK
223 I2S_OUT_WS
224 VDDP_5
225 GND_16
226 VDDC_7
227 I2S_OUT_BCK
228 I2S_OUT_SD
229 SPDIFO
230 UART2_RX/I2CM_SDA
231 UART2_TX/I2CM_SCK
232 UART1_RX/GPIO86
233 UART1_TX/GPIO87
234 GND_17
235 GND_18
236 USB0_DM
237 USB0_DP
238 SAR0
239 SAR1
240 SAR2
241 SAR3
242 AVDD_MPLL
243 XOUT
244 XIN
245 GPIO134
246 GPIO135
247 GPIO138
248 GPIO139
249 GPIO140
250 IRIN
251 HSYNC0
252 VSYNC0
253 HSYNC1
254 VSYNC1
255 CEC
256 HWRESET
R
8
0
6
0
R
8
2
7
0
R
8
2
6
0
R
8
7
0
0
R
8
9
4
0
R
8
9
9
0
R
8
0
3
4
0
R
8
0
3
5
0
MNT_VOUT_T
R845 4.7K
READY
IC802
MX25L6445EMI-10G
3 NC_2
2 VCC
4 NC_3
1 NC_1/SIO3
6 NC_5
5 NC_4
7 CS#
8 SO/SIO1 9 WP#/SIO2
10 GND
11 NC_6
12 NC_7
13 NC_8
14 NC_9
15 SI/SIO0
16 SCLK
MUTE_LINE
R809 4.7K
READY
+3.3V_MST
R810 1K AUDIO_OUT
MNT_L_AMP
MNT_R_AMP
R8009 22K
C855 0.01uF
R8008 22K
C854 0.01uF
R8038 1K AUDIO_OUT
R
8
0
0
2
0
IC801
AT24C256C-SSHL-T
MAIN_EEPROM_ATMEL
3
A2
2
A1
4
GND
1
A0
5
SDA
6
SCL
7
WP
8
VCC
7 9 MSTAR
I2S_OUT
EEPROM
H
D
M
I
_
1
[MODE SELECTION]
H
D
M
I
_
2
C804/C805/C806:Close to IC
as close as possible
RESET
C
l
o
s
e

t
o

I
C
w
i
t
h

w
i
d
t
h

t
r
a
c
e
Close to IC as close as possible
HDCP EEPROM
U
S
B

P
A
R
T
SERIAL FLASH 64M
4.7K X
4.7K
4.7K
X 4.7K
R8010
X
R898
Non Small FHD
4.7K
X 4.7K
Small HD
*H/W OPTION
4.7K
4.7K 4.7K
100HZ
4.7K
4.7K 4.7K
Apollo
Non Small HD
R8011
X
X
X
4.7K
X
R896
X
Small FHD (22")
4.7K
X
** Small HD : 19/22/26 Inch
** Non Small FHD : Normal(non 100Hz) FHD Model
4.7K LGD Joker 4.7K X 4.7K
** LGD Joker : LF Series (10BIT FHD, LED ON/OFF)
4.7K 26" FHD 4.7K 4.7K 4.7K
X O/S Joker 4.7K 4.7K 4.7K
** 26" FHD : 10BIT,LED ON/OFF
** O/S Joker : LF Series (8BIT FHD, LED ON/OFF)
** Small FHD (22"): 8BIT,LED ON/OFF
Closed IC
HDMI_3
AUDIO_OUT OPTION BLOCK
LP91J
LK310 2010/11/22
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
DDR2_A[0]
DDR2_A[12]
DDR2_A[11]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_D[0-15]
DDR2_D[0]
DDR2_D[1]
DDR2_D[2]
DDR2_D[3]
DDR2_D[4]
DDR2_D[5]
DDR2_D[6]
DDR2_D[7]
DDR2_D[8]
DDR2_D[9]
DDR2_D[10]
DDR2_D[11]
DDR2_D[12]
DDR2_D[13]
DDR2_D[14]
DDR2_D[15]
+1.8V_DDR
DDR2_A[0-12]
DDR2_BA0
DDR2_BA1
DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE
DDR2_ODT
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DDR2_DQS0P
DDR2_DQS1P
DDR2_DQM0
DDR2_DQM1
DDR2_DQS0M
DDR2_DQS1M
+1.8V_DDR
+1.8V_DDR
DDR2_D[0-15]
V_REF
R900
56
R901
56
R902
56
R903
56
R904
56
R905
56
+1.8V_DDR
R906
150
READY
V_REF
C919
10uF
10V
R
9
0
7 1
K
R
9
0
8 1
KC905
1000pF
C918
0.1uF
C920
2.2uF
16V
C904
0.01uF
C917
0.01uF
C908
0.01uF
C916
0.01uF
C907
0.01uF
C915
0.01uF
C906
0.01uF
C914
0.01uF
C913
0.01uF
C903
0.01uF
C912
0.01uF
C902
0.01uF
C911
0.01uF
C910
0.01uF
C901
0.01uF
C909
0.01uF
C900
0.01uF
50V
IC900
K4T51163QI-HCF7
J2 VREF
J8 CK
H2 VSSQ_2
B7 UDQS
N8 A4
P8 A8
L1 NC_4
L2 BA0
R8 NC_3
K7 RAS
F8 VSSQ_3
F3 LDM
P3 A9
M3 A1
N3 A5
K8 CK
R3 NC_5
L3 BA1
J7 VSSDL
L7 CAS
F2 VSSQ_4
B3 UDM
M2 A10/AP
K2 CKE
R7 NC_6
M7 A2
N7 A6
M8 A0
J1 VDDL
K3 WE
E8 LDQS
P7 A11
K9 ODT
A2 NC_1
N2 A3
P2 A7
H8 VSSQ_1
F7 LDQS
A8 UDQS
R2 A12
L8 CS
E2 NC_2
E7 VSSQ_5
D8 VSSQ_6
D2 VSSQ_7
A7 VSSQ_8
B8 VSSQ_9
B2 VSSQ_10
P9 VSS_1
N1 VSS_2
J3 VSS_3
E3 VSS_4
A3 VSS_5
G9 VDDQ_1
G7 VDDQ_2
G3 VDDQ_3
G1 VDDQ_4
E9 VDDQ_5
C9 VDDQ_6
C7 VDDQ_7
C3 VDDQ_8
C1 VDDQ_9
A9 VDDQ_10
R1 VDD_1
M9 VDD_2
J9 VDD_3
E1 VDD_4
A1 VDD_5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
DDR2
DDR2 8 9
DDR2 MEMORY
Close to DDR2 IC
Close to DDR2 IC
LP91J
LK310 2010/11/22
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only
T
H
E
R
M
A
L
T
H
E
R
M
A
L
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
R1003
10K
26_32INCH
0.01uF
C1046
50V
RL_ON
LD1002
SAM2333
0.01uF
C1057
50V
2SC3875S
Q1000
26_32INCH
1
2
3
0.01uF
C1011
50V
0.01uF
C1021
50V
R1065
33K
26_32INCH
C1056
1uF
25V
R1049
33K
R1048
10K Q1001
RT1C3904-T112 E
B
C
0.01uF
C1010
50V
C1005
0.1uF
50V
C1009
100uF
16V
POWER_SW
R1002
10K
Q1004
RT1C3904-T112
E
B
C
R1068
10K
R1069
1.6K
R1070
22K
C1048
1uF
25V
0.01uF
C1053
50V
R1005
1.2K
P_3.5V
+16V_NTP
+3.5V_MST
+3.5V_MST
+3.3V_MST
+5V_+12V_LCD
+3.5V_MULTI
+3.5V_MST
+5V_MULTI P_12V_SMALL_15V
P_3.5V
+3.5V_MST +3.5V_MULTI
PANEL_ON
C1058
0.1uF
50V
C1019
10uF
16V
C1045
10uF
16V
P_24V_SMALL_15V
R1065-*1
10K
19_22INCH
+1.2V_VDDC_MST
C1054
0.1uF
50V
+1.8V_DDR
+1.8V
+3.5V_MULTI
C1014
0.1uF
16V
IC1001
BD9130EFJ-E2
3
ITH
2
VCC
4
GND
1
ADJ
5
PGND
6
SW
7
PVCC
8
EN R1044
10K
R1045
2K
R1053
3.3K
C1016
10uF
10V
C1022
10uF
6.3V
C1015
0.1uF
50V
C1023
0.1uF
50V
R1043
12K
C1060
560pF
50V
C1055
2200pF
50V
READY
R1078
3.3
READY C1059
10uF
16V C1013
10uF
16V
C1017
10uF
16V C1018
10uF
16V
IC1002
AP1117EG-13
1
ADJ/GND
2 OUT 3 IN
R1050
2.2K
R1051
2.2K
R1052
2.2K
C1043
68uF
35V
L1003
500
R1054
120
R1055
56
L1004
120-ohm
L1005
19_22INCH
120-ohm
L1006
26_32INCH
120-ohm
L1007
120-ohm
L1013
120-ohm
L1002
2.2uH
R1020
10K
C1027
68uF
35V
READY
+3.5V_MULTI
C1036
1uF
25V
READY
C1037
1uF
25V
READY
C1038
1uF
25V
READY
0.1uF
C1040
50V
I
C
1
0
0
4
A
P
1
1
1
7
E
G
-
1
3

1
A
D
J
/
G
N
D
2
O
U
T
3
I
N
110
R1019
110
R1025
C1042
100uF
16V
0.1uF
C1039
50V
R1027
330
+5V_TUNER
R1026
330
+5V_USB
C1041
100uF
16V
I
C
1
0
0
0
A
P
1
1
1
7
E
G
-
1
3

1
A
D
J
/
G
N
D
2
O
U
T
3
I
N
C1047
0.1uF
16V
C1049
0.1uF
16V
READY
P1000
FW20020-24S
26_32INCH
19 12V
14 GND
9 3.5V
4 24V
18 INV ON
13 GND
8 GND
3 24V
17 12V
12 3.5V
7 GND
2 24V
16 GND
11 3.5V
6 GND
1 Power on
20 A-Dim
15 GND
10 3.5V
5 GND
21 12V 22 P-Dim
23 GND/P-Dim2 24 Error out
R1028 0
19_22INCH
OLP
R1015
0
NON_19_22INCH
R1023
0
OPC_OUT
R1037
6.8K
OPT
+3.5V_MULTI
0
R1021
BIG_NON_AUO
0
R1017
BIG_AUO/IPS
DISP_EN/VAVS_ON
+3.3V_MULTI_MST
0
R1035
BIG_LGD/SHARP FHD
R1029 100
EXCEPT_BIGCMO
E-DIM
C1012
1uF
25V
OPT
R1030
100
BIG_CMO
Q1002
2SC3052
E
B
C
I-DIM
C1008
0.1uF
16V
OPT
R1047
10K
0 R1034
BIG_AUO
PANEL_STATUS
R1031 0
BIG_CMO
R1046
3.3K
R1032 0
19_22INCH
R1040
4.7K
READY
P1001
SMAW200-12
19_22INCH
1
15V
2
15V
3
GND
4
GND
5
3.5V
6
3.5V
7
GND
8
OLP
9
INVERTER_ON
10
PWM_Dim
11
A_Dim
12
NC
P_24V_SMALL_15V
P_24V_SMALL_15V
P_24V_SMALL_15V
P_3.5V P_3.5V
P_12V_SMALL_15V
R1010
0
19_22INCH
R1001
4.7K
26_32INCH
L1010
120-ohm
READY
ZD1000
3.6V
READY
L1011
120-ohm
READY
ZD1001
3.6V
READY C1061
100uF
16V
READY
C1007
0.1uF
50V
2SC3875S
Q1005
26_32INCH
1
2
3
R1004
0
READY
R1000
4.7K
26_32INCH
R1061
4.7K
R1062
100K
R1066
4.7K
READY
R1067
100K
C1052
10uF
16V
+3.5V_MULTI
C1071
10uF
16V
C1072
0.1uF
16V
R1006
100K
READY
R1063
12K
1%
R1064
10K
1%
C1068
2.2uF
10V
C1070
2.2uF
10V
C1067
2.2uF
10V
C1065
2.2uF
10V
R8044
470K
R8043
470K
R1041
12K
1%
R1042
10K
1%
R1071
0
26_32INCH
R1072
0
19_22INCH
R1033 0
BIG_LGD
R1073
47K
READY
ZD1002
3.6V
READY
+3.3V_MULTI_MST
100uF
C1028
16V
READY
C1063
0.1uF
50V
C1062
10uF
6.3V
+1.8V
IC1008
AP1117EG-13
1
ADJ/GND
2 OUT 3 IN
R1079
56
R1077
120
R1076
0
READY
+3.5V_MST
C1066
100pF
50V
READY
C1069
100pF
50V
READY R1080
10K C1044
2.2uF
10V
POWER_SW
R1081
10K
C1051
10uF
6.3V
C1073
0.1uF
50V
C1074
1uF
25V
READY
R1082
0
READY
R1083
0
SHARP HD
IC1007
MP20045DQ-LF-Z
3
VOUT_1
2
VIN_2
4
VOUT_2
1
VIN_1
5
FB
6
GND
7
PG
8
EN
9
EP[GND]
IC1005
MP20045DQ-LF-Z
3
VOUT_1
2
VIN_2
4
VOUT_2
1
VIN_1
5
FB
6
GND
7
PG
8
EN
9
EP[GND]
R1084
0
READY
1K
R1038
NON_OPC
1K
R1039
HD_OPC
R1060
6.2K
NON_OPC
R1075
6.2K
HD_OPC
Q1003
AO4813
EBK60706901
3
S1
2
G2
4
G1
1
S2
5
D1_1
6
D1_2
7
D2_1
8
D2_2
P_12V_SMALL_15V +12V_AUDIO
L1012
120-ohm
AUDIO_OUT
C1075
47uF
25V
AUDIO_OUT
0.01uF
C1076
50V
AUDIO_OUT
R1058
9.1K
C1030
10uF
25V
C1031
10uF
25V
L1009
3.6uH
NR8040T3R6N
IC1006
AOZ1073AIL
3 AGND
2 VIN
4 FB
1 PGND
5 COMP
6 EN
7 LX_1
8 LX_2
C1035
100pF
50V
OPT
R1057
10K
C1029
10uF
16V
P_12V_SMALL_15V
C1032
0.1uF
50V
L1008
500
C1033
0.1uF
16V
C1024
2200pF C1004
100pF
50V
P_12V_SMALL_15V
+3.5V_MULTI
R1013
10K
IC1003
AOZ1073AIL
3 AGND
2 VIN
4 FB
1 PGND
5 COMP
6 EN
7 LX_1
8 LX_2
C1002
10uF
25V
L1000
500
L1001
3.6uH
NR8040T3R6N
C1003
0.1uF
50V
C1001
10uF
25V
R1014
9.1K C1050
2200pF
+5V_MULTI
C1020
10uF
16V
C1006
10uF
16V
C1026
10uF
16V
C1025
10uF
16V
R1018
10K
1%
R1011
24K
1%
R1012
51K
5%
R1008
10K
1%
R1007
51K
5%
R1009
1.5K 5%
C1034
0.1uF
16V
C1064
0.1uF
16V
R1016
1
R1022
1
C1077
10uF
6.3V
9 9
POWER
LED Block
**5V_MULTI->3.3V->1.2V
**Switch 12V:P12V **Switch 3.5V:3.5.V_MULTI
**DC-DC CONVERTER
OUT:6.8V
*ST 3.5V->3.3V
OUT:1.27V
NTP,AUDIO DSP
DDR2, Vref
V0 = 0.8*(1+(R2/R1))
MAX 2A R1
R2
MAX 1A
V0 = 0.8*(1+(R1/R2))
V0 = 1.25*(1+(R2/R1))
R1
R2
OUT:1.85V
Close to Q1003
**DC-DC CONVERTER
V0 = 0.8*(1+(R1/R2))
LGD PIN No
Err_out
V4:VBR-A
V5:VBR-A
PWM_DIM
<OS MODULE PIN MAP>
PWM_DIM
INV_ON
INV_ON
GND PWM_DIM
18
SHARP
INV_ON
24
20
PWM_DIM
INV_ON
NC
Err_out
AUO CMO(09)
A-DIM
22
NC
*12V -> 5V_MULTI
**12V->TUNER 5V
Err_out
IPS
NC
INV_ON
PWM_DIM
PWM_DIM
SMALL
A-DIM
INV_ON
NC
Err_out
closed IC1007
R1
MAX 1A
NTP,AUDIO DSP
OUT:1.85V
R2
R2
3A
R1
R2
3A
R1
LP91J
LK310 2010/11/22
EAX64045802
Copyright 2011 LG Electronics. Inc. All rights reserved.
Only for training and service purposes
LGE Internal Use Only