Indian Telephone Industry

Raebareli




Vocational Training

Report

In

ITI Ltd. Raebareli





Prepared by: Prateek Srivastava
Electronics & Communication
Final Year (4
th
year)
Feroze Gandhi Institute of Engineering & Technology


INTRODUCTION






This Report on Vocational Training of the undersigned is
based on the actual observations, informations obtained, study/ actual
work done by the undersigned regarding facilities available/ activities
being performed in ITI Limited, Raebareli.





(PRATEEK SRIVASTAVA)




























Preface



For effective learning of technical knowledge & concepts, theory and
practical make a vicious circle i.e. each strengthen the other. While
vocational trainings undertaken at times while doing an engineering
Graduation help a lot in further undertaking the theoretical concepts
taught in the class room, the theoretical concepts help a lot in having a
deeper appreciation of industrial activities and various alternatives of
solving a problem.

Keeping the above in view the undersigned underwent a vocational
training programmed from 11-06-2008 to 07-07-2008 at Rae Barely unit
of M/S ITI Limited, the first Public Sector Undertaking of free India,
established in 1948 with corporate office at Bangalore and having
manufacturing plants at Bangalore complex, Naini (Allahabad), Rae
Barely, Shrinagar, Mankapur (Gonda), Palakhad, Electronic City Unit
(ECU) at Bangalore. The efforts have been done to understand the basics
of working of various departments/ systems of Raebareli unit of this
telecommunication company while laying special emphasis on their Tool
design and Tool Room Departments.

The undersigned also designed two press Tools (one for piercing
operation and another for Blanking operation), one injection Maudling
Tool and J igs & Fixtures. The undersigned also observed/ studied the
manufacturing of tools in their Tool Room Shops on the convectional as
well as some Special Purpose Machines (SPM).

The undersigned is confident that this vocational training will
definitely help in furtherance of theoretical knowledge and technical
concepts during onward course curriculum.






(PRATEEK SRIVASTAVA)

ACKNOWLEDGEMENT



Firstly, I would like to place on record my thankfulness to
Management of ITI Limited and their Human Resource Development
Department for giving me an opportunity to do my vocational training in
ITI Ltd., Raebareli. It has been a wonderful experience to visit public
sector unit totally dedicated to the manufacturing of telecom equipments.
I have received immense help and co-operation during my
vocational training from DGM(ITI),HRD I express my deep sense of
gratitude to all the above gentlemen who helped me to learn a lot of
things in practical aspects of industrial activities.
I am also thankful to the other staff members.










By: Prateek Srivastava
ELECTRONIC & COMMUNICATION
FEROZE GANDHI INSTUTE OF ENGINEERING & TECHNOLOGY
RAEBARELI














CONTENTS

Sl. No. Name Of The Chapter Page No.
1

2

3

4

5

6
Brief Company Profile

Electronics Switching Line-1

Electronics Switching Line-2

Surface Mount Technology

GSM Technology

Wave Soldering


6

8

16

18

23

34






INTRODUTION OF COMPANY

It is the objective of every country either developed or developing to
productivity of important product by providing different kind of facilities
in order to improve the national income & to complete market.
It limited first public sector undertaking being setup after independence it
was established in 1948 as a dept. undertaking which was converted into
limited company in 1950.
The foundation stone of ITI RBL was laid by the Prime Minister Miss
Indira Gandhi in October 1973 for to manufacturing of step by step
exchange equipment at RBL.
ITI Ltd has following unit
ITI Ltd Raebareli
ITI Ltd Manikapur
ITI Ltd Banglore
ITI Ltd Naini
ITI Ltd Palghat
ITI Ltd Srinager
1.
Brief company profile

M/S ITI Ltd. Rae Barely is an ISO 9001:2000 accredited public Sector
Undertaking established in the year 1974 with Registered and Corporate
Office located at Bangalore. From a small beginning it has grown into a
mammoth Multi Division Enterprise with state of the art manufacturing
plant located at Doorbhash Nagar, in Raebareli City which is well
connected by train, road as well as by air from Lucknow and is one &
half hour drive from Lucknow. The Company is dealing with diverse
technologies continuously phasing out old technologies and phasing in
new technologies, the Company has Technology/ alliance with the
reputed Telecommunication giants/ leaders as given below:

Prominent among collaborators are ASCOM Switzerland for Switching
Mode Power Supply system. Lucent technologies for GSM Mobile
Communication Systems and Wireless on Local Loop. Westech Korea for
FWT WLL CDMA System the Centre for Development of Tele-Metrics
(C-DOT) has provided indigenous technologies for Rural Automatic
Exchanges (RAX) and Main Automatic Exchanges of medium and large
capacities. ITI BG has provided technologies for HDSL & DPG products.
ITI Raebareli Plant is planning to have non DOT/ BSNL orders such as
Defense, Railways, and Power Sectors. In IT Sector also Raebareli plant
has plants in software development and other allied works. ITI
Raebarelis contribution to National Telecommunication Net work is up
to 3.1 million lines. ITI Limited Raebareli is ISO 9001:2000 Quality
System Certified Company from Kema Quality B.V.Netherland.


The ITI Raebareli has broadly been divided into two sub divisions i.e.
i) ESL -I (ELECTRONIC SWITCHING LINE - 1)
ii) ESL -II (ELECTRONIC SWITCHING LINE - 2)

THE PRODUCTS OF THE COMPANY
ESL -1 DIVISION
a) SMPS Power Plant system
b) HDSL - types-1 to 4 (HDSL LINE DRIVER (2PAIR)
c) INSTALATION WORK OF GSM
d) CorDECT WLL
PHASED OUT PRODUCT
e) TDMA PMP System
f) Digital Pair Gain (0+4)CABLE SEVER
ESL -II DIVISION
a) C-DOT DIGITAL SWITCHING SYSTEM
b) FWT +MOBILE
c) GSM
















2.
ESL-I (Electronics Switching Line)
The ESL-I department can be broadly divided into two main parts namely:
-
1. SMPS (Switched Mode Power Supply)
2. CorDECT-WLL

SMPS PROJECT

SWITCHED MODE POWER SUPPLY (SMPS)

The power system is intended primarily to provide uninterrupted
DC power to Telecom Exchange and current for charging the batteries.
The system works from commercial AC mains which is rectified and
regulated to -54V DC and is fed to the equipment (exchange). The system
has provision to connect a maximum of three sets of VRLA (valve
regulated lead acid) batteries and facility to charge them simultaneously
to ensure that uninterrupted DC power is always available to the
exchange.
SMPS is a power supply, which is used for supplying power to the
exchanges. In ESL-I, SMPS project is divided into two main parts: -
(I). Production
(II). Testing

The production part of the SMPS comprises with the assembling of
the components on the Printed Circuit Board (PCB) of the cards needed in
the manufacturing of the SMPS. Components are first kitted and then
inserted on the PCB. This is called first insertion. Then these are soldered
using wave soldering. Sometimes there may be shortage of some
components. In that case, instead of waiting for the supply of those
components, the PCB is sent for wave soldering. Then on arrival of the
required components, the PCB is sent for second insertion, in which
soldering is done manually.




Main Store

Kit store


Component Card
Forming Preparation


First Insertion Stage

Quality Control

Wave Soldering

Second Insertion

Testing

Card Packing

Testing Section involves card testing and then module testing. This is
essential for the correct functioning of the SMPS. Testing is done in
several stages, manually, electronically and software based. The modules
are also tested against any adverse conditions of very hot atmosphere in
the BURN IN Room where the SMPS system is tested at the temperature
of 55-degree Celsius and above, for 72 hours. They are tested at the
maximum value of their output. These all tests are done to maintain the
quality of the SMPS.




The power system -48V, 600A has the following features:
Multirack configuration having one main and two extension
racks.
Facility to parallel a maximum of 6 nos. of 100A (5600W)
rectifier modules operating from three phase 400V (phase to
phase) 50Hz AC.
Termination for three sets of VRLA batteries and exchange.
System input: Three phase, four wire and 50Hz supply. The
power system has a single bus called auto float/charge bus.
Depending upon the status of the batteries, the output DC voltage
is maintained at 54.0 V with tolerance of 0.5V under auto float condition.
During auto charge the maximum DC voltage reached across the bus is -
55.2V.The exchange, battery and rectifier modules are connected in
parallel.
The system employs natural convection cooling and has AC input
distribution, DC output distribution, protection and alarm circuitry
for rectifier, battery and equipment.
FUNCTIONAL DESCRIPTION OF POWER SYSTEM
The 48V/600A-power system consists of the following multi-rack
configuration:
One main and two extension racks.
AC distribution arrangement in each rack.
Rectifier modules (6 nos. max.).
DC distribution arrangement in main rack.
Power system controller card in main rack.
Display and alarm card in main rack.
TEMCO (temperature compensation) card in main rack.
TECHNICAL SPECIFICATION

FOR MODULE:
1. Input voltage:
320V to 480V rms three phase(nominal voltage: 400V)
Frequency: 45Hz - 65Hz
2. Output voltage:
Float mode:
nominal voltage: -54.0V with tolerance 0.5V
adjustment range: -48.0V to -56.0V
Charge mode: -55.2V (max)
3. Rated current: 100A
4. Psophmetric noise: Less than 4mV without battery floated.
Less than 2mV with battery floated.
5. Input power factor: Greater than 0.98 with 50% to 100% load
at nominal input.
6. Efficiency: Greater than 90% at full load and nominal input.

7. Protection:
Short circuit protection.
Input over/under voltage protection.
Output over voltage protection.
Constant current features settable from 50A to 100A in auto
float/charge mode.




Alarms and indicating lamps:
auto float/charge : green LED
over voltage: red LED
alarm (DC output fail/under voltage): red LED
over-load (voltage drop):amber/yellow LED
mains ok : green LED
CARDS USED IN SMPS
The various types of cards used in the SMPS are follows: -
IFC 52
Mastin
Secin 1(1400W)
Secin 3(5600W)
Primin 1(1400W)
Primin 3(5600W)
PSC card(power supply controller card)
Display and Alarm card
TEMCO card
SMPS MODULE
INTRODUCTION: The SMPS 48V-5600W is a three phase, unity
power factor power supply with a wide input voltage range of 3 x
185Vac to 275Vac (with neutral wire) and with a useful output power of
5600 W delivered to the load. This unit has been developed for cost
effective but highly intelligent modular telecommunication power
system.
Primary application of the rectifiers SMPS 48V-5600W are in the supply
of Telecom Equipment, where it can provide temperature dependent
charging of back-up batteries without using power system controllers.
The connection-cooled unit may be operated up to 60-degree Celsius
ambient air temperature. The rectifier operates from a nominal 3*230Vac
rms (with neutral wire) source. The main frequency may vary from 45Hz
to 65Hz. Total harmonic distortion (THD) of the input current
waveform is below 5%. The output of the rectifier conforms to the
generic requirements of telecommunication power supplies in terms of
noise, voltage programmable as well as over voltage.
Two modes in which SMPS works are:
1. Auto Float
2. Auto Charge
TYPES OF SMPS MODULES

1.48V/1400W/25A SMPS:
Single-phase unity power factor supply with a very wide input voltage
range of 150Vac to 275Vac and with a useful output power of 1400W
delivered to the load. This unit has been developed for cost effective but
highly intelligent module telecommunication power system.
2.48V/5600W/100A SMPS:
Three phase unity power factor. Power supply with a wide input voltage
range of 3 x 185Vac to 275Vac and with useful output power supply of
5600W delivered to the load. Work of both SMPS is same-SMPS
48V/1400W is used where, we need lower power supply like that in rural
areas and SMPS 48V/5600W are used where we need wide range of
power supply to exchange.
ADVANTAGES
best regulation
feed back
best efficiency
best controlling
usable at high frequency
over temperature and over load protection
GENERAL DESCRIPTION OF OPERATION

The SMPS 48V-5600W rectifier is a state-of-the-art switch-mode power
supply. It is composed of three identical single-phase sub-modules (R, S
and T) as shown in the block diagram.
The sub-modules are connected between neutral and one of the phases (R,
S and T) on the input, and in parallel on the output. All '-' wires are
protected by circuit breakers which are mechanically coupled.
The Interfacing Card IFC-52 provides:
All reference voltages and protection to the sub-modules.
Signalization and manual interface (adjustment potentiometers
and test jacks) for the whole unit, and
Communication with power system controller. Each of the sub-
modules consists of two cascaded power converters performing:
POWER FACTOR CORRECTION:
Power Factor (PF) correction circuit is based on a boost topology. The
boost converter has the inherent advantage of continuous input current
waveform which relaxes the input filter requirement. The performance of
the basic boost cell is improved by proprietary Snubber circuit, which
reduces the switching losses of the power semiconductor due to non-zero
switching times. Also the snubber circuit also decreases the
electromagnetic interference generated primarily during the turn off
process of the boost diode. The output of the boost converter is a
stabilized 400V voltage.


DC/DC CONVERSION: Further conversion of the stabilized high
voltage output of the power factor corrector circuit is necessary to
generate the isolated low voltage output and to provide the required
protection functions for telecommunication application. These tasks are
achieved in the DC/DC converter circuit, which is based on a full-bridge
topology. The full-bridge circuit is operated by phase-shift pulse-width
modulation with current-mode control. This control method provides zero
voltage switching conditions for all primary side power semi-conductor
effectively reducing switching losses and electromagnetic interference.
An advanced solution reduces the stresses on the output rectifier diodes.
Proper operation of the power converters is managed by supervised by
the housekeeping electronics. Remote commanding and monitoring of the
modules are possible through a power system controller.


























3.
ESL-II (Electronics Switching Line)


CARD REPAIRING CENTRE : The card sent to the fieldwork, if
damaged, during use are sent to the card repair center. The cards usually
repaired are of the C-DOT DSS MAX exchanges, which are coming from
all over India.
The repair of the cards, which is currently on the work, is: -

LCC
CCM
TIC
HNS

These various cards collected are from the centres at Lucknow,
Delhi & KolKota. The Line Control Card is a terminal for the subscriber.
The cards provide signaling interface towards terminal interface
controller. These cards also feed current to the subscriber line.

The CCM card is similar to the LCC card except that there is an
extra Child card added for the metering purpose.

In the card repair centre the testing of the card is done by the
interfacing software which work on the UNIX operating system. This
software performs a number of tests on the card, which eventually helps
the user to locate the area of the fault.

The main functional blocks, which are to be tested, are as follows: -

Amplification & Echo Suppression
Current feed circuit
Ring feed relay driver circuit
Sensor and ring trip detection logic
Signaling mux & scan/drive functions
Voice multiplexing and selection
Diagnostic function & active/ stand logic

Types of tests applied for the testing of the cards: -

1. Current test
2. On hook, off hook tests
3. Voice test
4. Ring test
5. Loop back test
6. Test access test
7. Copy 1 select
8. Copy 0 select
9. Battery reversal
10. TIC communication test

By running the above tests we can locate the problem up to block
level if any of the above tests in a particular line fails. After the checking
by the software the block or the area of the fault is located then the exact
fault is identified by manual checking. Once the faulty component is
located it is then replaced by a new component and the repaired card is
again sending back to the field.


























4.
Surface Mount Technology

Surface mount technology (SMT) is the practice & method of attaching
leaded & nonleaded electrical components to the surface of a conductive
pattern that does not utilizes leads in feed through holes. Surface mount
technology is the latest trend in electronics manufacturing. It started way
back in 1986 that has been more than a decade now.
The need of SMT arises due to the following factors:

Need for SMT
Automation
The development of surface mount devices started a new era in
Electronics Manufacturing. Earlier the manufacturing process was too
complicated. The manufacturing process required lot of men, & time, but
thanks to the SMT that the manufacturing process can be fully automated.
The cards are manufactured through Design for manufacturing process
which can be a defined one. It has given rise to standardization so that all
the products made from a company perform same .
Lowering Cost of Manufacturing
The cost of manufacturing has greatly reduced due to SMT. Earlier
lot of people were required for manufacturing now, a few can do the
Fig.1: Surface Mount Technology
same. The failures of manufactured equipments has greatly reduced due
to SMT. Also the prices for Through hole components were more than
the SMT, the defects were more in The traditional technology so we can
see how much does it effects the cost of manufacturing. We can see how
the prices for TV sets have greatly came down in the last decade.
Reducing time to market
Due to automation the time required for manufacturing & then
sending to market has greatly reduced. We can see if the production time
would be more & demand is high as it is today then the prices would have
gone high for electronic gadgets. Also the Manufacturers have to lose
business due to this.This also has played a major role in development of
SMT in electronics.
Type of Surface Mount Devices
There are various types of Surface Mount Components or
SMD (Surface Mount Devices) available in the industry .
1. Chip components: These components are very small size. These
consist of resistors, capacitors, diodes, LEDs etc.They are available as
small as0.6(l) x 0.3(w) mm .

2. SOTs: These are known as small outline transistors. This category
comprises of components like, standard transistors, UJ T, SCR, Triacs,
Diacs, etc.




3. SOICs: These are known as small outline Integrated Circuits These are
the ICs that can be directly mounted on the board with no requirement of
insertion




4. TSSOPs: These are known as Thin Shrink Small outline Packages
These are also ICs that can be directly mounted on the board but the pitch
between pins very less of order 0.5mm & thickness of the ICs very thin of
order 1.5 mm..



5. QFPs: These are known as Quad Flat Packages These are also ICs that
can be directly mounted on the board but the pitch between pins very less
of order 0.5mm & has pins on all four sides.




6. PLCC: These are known as Plastic Leaded Chip Carrier These are
also ICs that can be directly mounted on the board but these have J type
leads i.e. The leads are bend under the body of the IC. A PLCC has J -type
leads on all 4 sides & if it has a J -leads on two sided then it is called SOJ .


7. BGA: These are known as Ball Grid Array These are also ICs that can
be directly mounted on the board but these have leads in the form of balls
underneath the body. These BGAs are the latest trend in the SMT.


8. Surface Mount Connectors: These are the connectors which can be
directly mounted on the board. The connectors include connectors in
which PLCC, SOJ & BGA can be mounted.

For Other parts Vocabulary is given as under


























BGA Ball Grid Array PPGA Plastic Pin Grid Array
BLP Bottom Leaded Package QFP Quad Flat Pack IC
COB Chip on Board QSOP Quarter-size SOP
COF Chip On Flex SMC Surface Mount Component
COG Chip On Glass SMT Surface Mount Technology
CPGA Ceramic Pin Grid Array SFP Small form Factor Package
CSP Chip Scale Package SOIC Small Outline IC
FCOF Flip Chip On Flex SON Small Outline Non-leaded
FCOG Flip Chip On Glass SOP Small Outline Package
LOC Lead On Chip SOT Small Outline Transistor
LCCC Leadless Ceramic Chip Carrier SSOP Shri nk small-Outline Packag.
IPCs Integrated Passive Components TAB Tape Automated Bond
MCM Multi Chip Module TBGA Tape Ball grid Array
MELF Metal Electrode Face TOB Tab on Board
PLCC Plastic Leaded Chip Carrier TOF Tab on Flex
PGA Pin Grid Array TOG Tab on Glass











5.
GSM Technology

History of GSM
During the early 1980s, analog cellular telephone systems were
experiencing rapid growth in Europe, particularly in Scandinavia and the
United Kingdom, but also in France and Germany. Each country
developed its own system, which was incompatible with everyone else's
in equipment and operation. This was an undesirable situation, because
not only was the mobile equipment limited to operation within national
boundaries, which in a unified Europe were increasingly unimportant, but
there was also a very limited market for each type of equipment, so
economies of scale and the subsequent savings could not be realized.
The Europeans realized this early on, and in 1982 the
Conference of European Posts and Telegraphs (CEPT) formed a study
group called the Group Special Mobile (GSM) to study and develop a
pan-European public land mobile system. The proposed system had to
meet certain criteria:
Good subjective speech quality
Low terminal and service cost
Support for international roaming
Ability to support handheld terminals
Support for range of new services and facilities
Spectral efficiency
ISDN compatibility
In 1989, GSM responsibility was transferred to the European
Telecommunication Standards Institute (ETSI), and phase I of the GSM
specifications were published in 1990. Commercial service was started in
mid-1991, and by 1993 there were 36 GSM networks in 22 countries.
Although standardized in Europe, GSM is not only a European standard.
Over 200 GSM networks (including DCS1800 and PCS1900) are
operational in 110 countries around the world. In the beginning of 1994,
there were 1.3 million subscribers worldwide, which had grown to more
than 55 million by October 1997. With North America making a delayed
entry into the GSM field with a derivative of GSM called PCS1900, GSM
systems exist on every continent, and the acronym GSM now aptly stands
for Global System for Mobile communications. The developers of GSM
chose an unproven (at the time) digital system, as opposed to the
then-standard analog cellular systems like AMPS in the United States
and TACS in the United Kingdom. They had faith that advancements
in compression algorithms and digital signal processors would allow
the fulfillment of the original criteria and the continual improvement
of the system in terms of quality and cost. The over 8000 pages of
GSM recommendations try to allow flexibility and competitive
innovation among suppliers, but provide enough standardization to
guarantee proper networking between the components of the system.
This is done by providing functional and interface descriptions for
each of the functional entities defined in the system.








Architecture of GSM Network
A GSM network is composed of several functional entities, whose
functions and interfaces are specified. The GSM network can be divided
into three broad parts. The Base Station Subsystem controls the radio link
with the Mobile Station. The Network Subsystem, the main part of which
is the Mobile services Switching Center (MSC), performs the switching
of calls between the mobile users, and between mobile and fixed network
users. The Mobile Station and the Base Station Subsystem communicate
across the Um interface, also known as the air interface or radio link. The
Base Station Subsystem communicates with the Mobile services
Switching Center across the A interface.






Mobile Station :-

The mobile station (MS) consists of the mobile equipment (the terminal)
and a smart card called the Subscriber Identity Module (SIM). The SIM
provides personal mobility, so that the user can have access to subscribed
services irrespective of a specific terminal. By inserting the SIM card into
another GSM terminal, the user is able to receive calls at that terminal,
make calls from that terminal, and receive other subscribed services. The
mobile equipment is uniquely identified by the International Mobile
Equipment Identity (IMEI). The SIM card contains the International
Mobile Subscriber Identity (IMSI) used to identify the subscriber to the
system, a secret key for authentication, and other information. The IMEI
and the IMSI are independent, thereby allowing personal mobility. The
SIM card may be protected against unauthorized use by a password or
personal identity number.
Base Station Subsystem :-

The Base Station Subsystem is composed of two parts, the
Base Transceiver Station (BTS) and the Base Station Controller (BSC).
These communicate across the standardized Abis interface, allowing (as
in the rest of the system) operation between components made by
different suppliers.
The Base Transceiver Station houses the radio tranceivers that
define a cell and handles the radio-link protocols with the Mobile Station.
In a large urban area, there will potentially be a large number of BTSs
deployed, thus the requirements for a BTS are ruggedness, reliability,
portability, and minimum cost.
The Base Station Controller manages the radio resources for
one or more BTSs. It handles radio-channel setup, frequency hopping,
and handovers, as described below. The BSC is the connection between
the mobile station and the Mobile service Switching Center (MSC).
Network Subsystem :-
The central component of the Network Subsystem is the
Mobile services Switching Center (MSC). It acts like a normal switching
node of the PSTN or ISDN, and additionally provides all the functionality
needed to handle a mobile subscriber, such as registration, authentication,
location updating, handovers, and call routing to a roaming subscriber.
The MSC provides the connection to the fixed networks (such as the
PSTN or ISDN). Signalling between functional entities in the Network
Subsystem uses Signalling System Number 7 (SS7), used for trunk
signalling in ISDN and widely used in current public networks.
The Home Location Register (HLR) and Visitor Location
Register (VLR), together with the MSC, provide the call-routing and
roaming capabilities of GSM. The HLR contains all the administrative
information of each subscriber registered in the corresponding GSM
network, along with the current location of the mobile. The location of
the mobile is typically in the form of the signalling address of the VLR
associated with the mobile station. The actual routing procedure will be
described later. There is logically one HLR per GSM network, although it
may be implemented as a distributed database.
The Visitor Location Register (VLR) contains selected
administrative information from the HLR, necessary for call control and
provision of the subscribed services, for each mobile currently located in
the geographical area controlled by the VLR. Although each functional
entity can be implemented as an independent unit, all manufacturers of
switching equipment to date implement the VLR together with the MSC,
so that the geographical area controlled by the MSC corresponds to that
controlled by the VLR, thus simplifying the signalling required. Note that
the MSC contains no information about particular mobile stations --- this
information is stored in the location registers.
The other two registers are used for authentication and
security purposes. The Equipment Identity Register (EIR) is a database
that contains a list of all valid mobile equipment on the network, where
each mobile station is identified by its International Mobile Equipment
Identity (IMEI). The Authentication Center (AuC) is a protected
database that stores a copy of the secret key stored in each subscriber's
SIM card, which is used for authentication and encryption over the radio
channel.
SERVICES PROVIDED BY GSM
From the beginning, the planners of GSM wanted ISDN
compatibility in terms of the services offered and the control signalling
used. However, radio transmission limitations, in terms of bandwidth and
cost, do not allow the standard ISDN B-channel bit rate of 64 kbps to be
practically achieved.
A variety of data services is offered. GSM users can send
and receive data, at rates up to 9600 bps, to users on POTS (Plain Old
Telephone Service), ISDN, Packet Switched Public Data Networks, and
Circuit Switched Public Data Networks using a variety of access methods
and protocols, such as X.25 or X.32.


FIG : FAX SERVICE
Other data services include Group 3 facsimile, as described in
ITU-T recommendation T.30, which is supported by use of an appropriate
fax adaptor. A unique feature of GSM, not found in older analog systems,
is the Short Message Service (SMS).

FIG : SMS - SHORT MOBILE SERVICE
SMS is a bidirectional service for short alphanumeric (up to 160 bytes)
messages. Messages are transported in a store-and-forward fashion. For
point-to-point SMS, a message can be sent to another subscriber to the
service, and an acknowledgement of receipt is provided to the sender.
SMS can also be used in a cell-broadcast mode, for sending messages
such as traffic updates or news updates. Messages can also be stored in
the SIM card for later retrieval.




GSM RADIO LINK

CALL ROUTING

Unlike routing in the fixed network, where a terminal is
semi-permanently wired to a central office, a GSM user can roam
nationally and even internationally. The directory number dialed to reach
a mobile subscriber is called the Mobile Subscriber ISDN (MSISDN),
which is defined by the E.164 numbering plan. This number includes a
country code and a National Destination Code which identifies the
subscriber's operator. The first few digits of the remaining subscriber
number may identify the subscriber's HLR within the home PLMN.
An incoming mobile terminating call is directed to the
Gateway MSC (GMSC) function. The GMSC is basically a switch which
is able to interrogate the subscriber's HLR to obtain routing information,
and thus contains a table linking MSISDNs to their corresponding HLR.
A simplification is to have a GSMC handle one specific PLMN. It should
be noted that the GMSC function is distinct from the MSC function, but
is usually implemented in an MSC.
The routing information that is returned to the GMSC is the
Mobile Station Roaming Number (MSRN), which is also defined by the
E.164 numbering plan. MSRNs are related to the geographical numbering
plan, and not assigned to subscribers, nor are they visible to subscribers.
The most general routing procedure begins with the GMSC
querying the called subscriber's HLR for an MSRN. The HLR typically
stores only the SS7 address of the subscriber's current VLR, and does not
have the MSRN (see the location updating section). The HLR must
therefore query the subscriber's current VLR, which will temporarily
allocate an MSRN from its pool for the call. This MSRN is returned to
the HLR and back to the GMSC, which can then route the call to the new
MSC. At the new MSC, the IMSI corresponding to the MSRN is looked
up, and the mobile is paged in its current location area (see Figure 4).

Figure 4: CALL ROUTING IN GSM




























6.
Wave Soldering

RULES OF SOLDERING MACHINE:-

Wave soldering machine, correctly controlled will be produce the
highest quality joints at the lowest card.

1. Soldering is a process, will produce consistent results if properly
controlled.

2. Touch up the faulty soldered joint is costly, unreliable and
unnecessary.

3. Anything that reduces solder joints defects is cost effective.

4. Design handling, assembly and maintenance are all part of the
soldering process and must be properly controlled.

5. Solder ability of boards and component accounts for 60% of all
faulty soldered joint.

6. Never use parts that fail solder ability testing, the ultimate cost is
so high.

7. Soldering problems are solved by process control not move
inspection and touch up .

8. Everyone concern with soldering process must be formal and
properly trained.











THEORY OF SOLDERING

Before we can discuss the details of the materials and
Machines used in the soldering process. It is essential that
the fundamental theory is clearly understood, without this
Understanding it will be difficult to visualize what occurs
When a solder joint is formed, and the effect of various parts
of a process. We will therefore focus the theory of as the first
part of Wave soldering.

Wetting
Soldering v Glueing
Wetting non wetting
Cleanliness
Capillary action
Pallet and conveyors
Controls
The basic components of the Wave Soldering Machine are as followes:
1. Fluxer
2. Pre-heater
3. Solder Pot and Pump
4. Conveyor
5. Instrumentation and Controls







Preheater
Increase throughput (faster conveyor)
Reduce thermal shock (for chip caps)
Dry off flux (reduce blow holes)
Activate flux (better soldering results)

Flux and Fluxer
It applies flux. The flux is applied through
Wave
Foam
Spray

Wave Geometry
It has single & Dual wave. Single side is for through hole
components & dual wave is required for SMDs.