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Glass-passivated double diffused rectifier diodes featuring low forward voltage drop, fast reverse recovery and soft recovery characteristic. Intended for use in TVreceivers, monitors and switched mode power supplies. The devices are supplied in the conventional leaded SOD100 package.
Glass-passivated double diffused rectifier diodes featuring low forward voltage drop, fast reverse recovery and soft recovery characteristic. Intended for use in TVreceivers, monitors and switched mode power supplies. The devices are supplied in the conventional leaded SOD100 package.
Glass-passivated double diffused rectifier diodes featuring low forward voltage drop, fast reverse recovery and soft recovery characteristic. Intended for use in TVreceivers, monitors and switched mode power supplies. The devices are supplied in the conventional leaded SOD100 package.
fast, soft-recovery FEATURES SYMBOL QUICK REFERENCE DATA Low forward volt drop V R = 200 V/ 400 V/ 600 V/800 V Fast switching Soft recovery characteristic I F(AV) = 8 A High thermal cycling performance Isolated mounting tab I FSM 60 A t rr 135 ns GENERAL DESCRIPTION Glass-passivated double diffused rectifier diodes featuring low forward voltage drop, fast reverse recovery and soft recovery characteristic. The devices are intended for use in TVreceivers, monitors and switched mode power supplies. The BY229F series is supplied in the conventional leaded SOD100 package. The BY229X series is supplied in the conventional leaded SOD113 package. PINNING SOD100 SOD113 PIN DESCRIPTION 1 cathode 2 anode tab isolated LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT BY229F- / BY229X- 200 400 600 800 V RSM Peak non-repetitive reverse - 200 400 600 800 V voltage V RRM Peak repetitive reverse voltage - 200 400 600 800 V V RWM Crest working reverse voltage - 150 300 500 600 V V R Continuous reverse voltage - 150 300 500 600 V I F(AV) Average forward current 1 square wave; = 0.5; - 8 A T hs 83 C sinusoidal; a = 1.57; - 7 A T hs 90 C I F(RMS) RMS forward current - 11 A I FRM Peak repetitive forward current t = 25 s; = 0.5; - 16 A T hs 83 C I FSM Peak non-repetitive forward t = 10 ms - 60 A current t = 8.3 ms - 66 A sinusoidal; T j = 150 C prior to surge; with reapplied V RWM(max) I 2 t I 2 t for fusing t = 10 ms - 18 A 2 s T stg Storage temperature -40 150 C T j Operating junction temperature - 150 C 1. Neglecting switching and reverse current losses. k a 1 2 1 2 case 1 2 case September 1998 1 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery ISOLATION LIMITING VALUE & CHARACTERISTIC T hs = 25 C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V isol Peak isolation voltage from SOD100 package; R.H. 65%; clean and - - 1500 V both terminals to external dustfree heatsink V isol R.M.S. isolation voltage from SOD113 package; f = 50-60 Hz; - - 2500 V both terminals to external sinusoidal waveform; R.H. 65%; clean heatsink and dustfree C isol Capacitance from pin 1 to f = 1 MHz - 10 - pF external heatsink THERMAL RESISTANCES SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT R th j-hs Thermal resistance junction to with heatsink compound - - 4.8 K/W heatsink without heatsink compound - - 7.2 K/W R th j-a Thermal resistance junction to in free air. - 55 - K/W ambient STATIC CHARACTERISTICS T j = 25 C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT V F Forward voltage I F = 20 A - 1.5 1.85 V I R Reverse current V R = V RWM ; T j = 125 C - 0.1 0.4 mA DYNAMIC CHARACTERISTICS T j = 25 C unless otherwise stated SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT t rr Reverse recovery time I F = 1 A; V R > 30 V; -dI F /dt = 50 A/s - 100 135 ns Q s Reverse recovery charge I F = 2 A; V R > 30 V; -dI F /dt = 20 A/s - 0.5 0.7 C dI R /dt Maximum slope of the reverse I F = 2 A; -dI F /dt = 20 A/s - 50 60 A/s recovery current September 1998 2 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery Fig.1. Definition of t rr , Q s and I rrm Fig.2. Maximum forward dissipation, P F = f(I F(AV) ); square wave current waveform; parameter D = duty cycle = t p /T. Fig.3. Maximum forward dissipation, P F = f(I F(AV) ); sinusoidal current waveform; parameter a = form factor = I F(RMS) /I F(AV) . Fig.4. Maximum non-repetitive rms forward current. I F = f(t p ); sinusoidal current waveform; T j = 150C prior to surge with reapplied V RWM . Fig.5. Typical and maximum forward characteristic; I F = f(V F ); parameter T j Fig.6. Maximum Q s at T j = 25C and 150C 100% time dI dt F I R I F I rrm trr 25% Qs 1ms 10ms 0.1s 1s 10s tp / s IFS(RMS) / A BY229 80 70 60 50 40 30 20 10 0 IFSM 0 1 BY229F VF / V IF / A 30 20 10 0 2 0.5 1.5 max typ Tj = 150 C Tj = 25 C 0 2 4 6 8 10 12 BY329 IF(AV) / A PF / W 20 15 10 5 0 Ths(max) / C 150 54 78 102 126 0.5 0.2 0.1 D = 1.0 D = tp tp T T I t Vo = 1.25 V Rs = 0.03 Ohms 1 100 BY329 -dIF/dt (A/us) Qs / uC 10 1 0.1 10 2 A IF = 10 A 10 A 1 A 1 A 2 A Tj = 150 C Tj = 25 C 0 2 4 6 8 BY329 IF(AV) / A PF / W 15 10 5 0 4 2.8 2.2 1.9 a = 1.57 Ths(max) / C 150 78 102 126 Vo = 1.25 V Rs = 0.03 Ohms September 1998 3 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery Fig.7. Maximum t rr measured to 25% of I rrm ; T j = 25C and 150C Fig.8. Typical junction capacitance C d at f = 1 MHz ; T j = 25C Fig.9. Transient thermal impedance Z th = f(t p ) 1 10 100 BY329 -dIF/dt (A/us) trr / ns 1000 100 10 1 A IF = 10 A Tj = 150 C Tj = 25 C 10A 1A 1us 10us 100us 1ms 10ms 100ms 1s 10s 0.001 0.01 0.1 1 10 BY229F pulse width, tp (s) Transient thermal impedance, Zth j-hs (K/W) D = tp tp T T P t D 1 100 100 10 1 10 1000 BY329 Cd / pF VR / V September 1998 4 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.10. SOD100; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10.2 max 5.7 max 3.2 3.0 0.9 0.5 4.4 max 2.9 max 4.4 4.0 seating plane 7.9 7.5 17 max 0.55 max 1.3 13.5 min 5.08 0.9 0.7 M 0.4 top view 3.5 max not tinned 4.4 k a September 1998 5 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery MECHANICAL DATA Dimensions in mm Net Mass: 2 g Fig.11. SOD113; The seating plane is electrically isolated from all terminals. Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". 10.3 max 3.2 3.0 4.6 max 2.9 max 2.8 seating plane 6.4 15.8 max 0.6 2.5 2.54 5.08 1 2 3 max. not tinned 3 0.5 2.5 0.9 0.7 M 0.4 15.8 max. 19 max. 13.5 min. Recesses (2x) 2.5 0.8 max. depth 1.0 (2x) September 1998 6 Rev 1.200 Philips Semiconductors Product specification Rectifier diodes BY229F, BY229X series fast, soft-recovery DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. September 1998 7 Rev 1.200