WP3-P09-100628 - D3 2 Smart Wireless Sensor Network Platform

Smart Monitoring of
Historic Structures

D3.2Smartwirelesssensornetworkplatform
Grant Agreement number: 212939
Project acronym: SMooHS
Project Title: Smart Monitoring of Historic Structures
Funding Scheme: Collaborative Project
Date of latest version of Annex I against
which the assessment will be made:
2010-02-20
Report: D3.2 Smart wireless sensor network platform
Period covered by this report: From 2009-11-01 to 2010-03-31
Dissemination level: CO (project partners incl. Commission)
Authors Krger (TTI); Bahr (TTI), Bachmaier (IWB), Lehmann (MPA), Willeke
(TTI)
Project coordinator: Dr. Markus Krger
Project coordinator organisation: MPA Universitt Stuttgart, Germany
Tel: +49 711 6856 6789
Fax: +49 711 6856 6797
Email: markus.krueger@mpa.uni-stuttgart.de
Project web site address: http://www.smoohs.eu
Doc. Name: WP3-P09-100628- D3 2 Smart wireless sensor network platform.doc

SMooHS WP3-P09-100628- D3 2 Smart wireless sensor network platform.doc
Rev. 2010-07-07 2/52
Table of Contents
1 Summary ............................................................................................................................. 4
2 Introduction .......................................................................................................................... 5
3 Related work ....................................................................................................................... 6
4 Structural health monitoring system .................................................................................... 7
4.1 Environmental Influences and Damage Processes ................................................... 7
4.2 Benefits of SHM on Historic Structures ...................................................................... 7
4.3 Principle system layout .............................................................................................. 7
5 Aspects of flexible and reliable sensor node hardware ....................................................... 9
6 Realization of a robust sensor node hardware .................................................................. 10
6.1 Processor board with wireless communication ........................................................ 11
6.2 Power supply ........................................................................................................... 13
6.3 Multi-sensor board for strain gauges, vibration, temperature and humidity ............. 14
6.3.1 General description ...................................................................................... 14
6.3.2 Features ....................................................................................................... 15
6.3.3 Technical data .............................................................................................. 15
6.4 Acceleration sensor board for piezo- and PVDF-sensors ........................................ 16
6.5 Inclination and tilt sensor board ............................................................................... 17
6.5.2 Features ....................................................................................................... 18
6.5.3 Technical data .............................................................................................. 18
6.6 Air velocity sensor board .......................................................................................... 19
6.6.2 Features ....................................................................................................... 20
6.6.3 Technical data .............................................................................................. 20
6.7 Impedance converter board system for electrochemical analysis and impedance
spectroscopy ..................................................................................................................... 21
6.7.2 Features ....................................................................................................... 22
6.7.3 Technical data .............................................................................................. 22
6.8 Electrometer with multiplexer ................................................................................... 23
6.8.2 Features ....................................................................................................... 24
6.8.3 Technical data .............................................................................................. 25
7 Structural health monitoring software ................................................................................ 26
7.1 Principal structure of the SHM system software ...................................................... 26
7.2 Sensor network and data transfer software ............................................................. 27
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7.2.1 Sensor network protocol .............................................................................. 27
7.2.2 Wboot Sensor node boot loader ............................................................... 27
7.2.3 Miranda sensor node application software................................................ 27
7.2.4 Starcatcher radio to serial forwarder ......................................................... 28
7.2.5 Uranus forwarder ...................................................................................... 28
7.2.6 Jupiter base station and forwarder ............................................................ 28
7.2.7 Callisto on-site control ............................................................................... 28
7.3 Data storage ............................................................................................................ 28
7.3.1 Galaxy SQL data base .............................................................................. 28
7.3.2 Data Base Overview .................................................................................... 28
7.3.3 Mars SQL interpreter ................................................................................ 29
7.4 Data analysis ........................................................................................................... 29
7.4.1 In-mote data analysis ................................................................................... 29
7.4.2 Database analysis ........................................................................................ 30
7.5 User interfaces ......................................................................................................... 31
7.5.1 Administration software tools ....................................................................... 31
7.5.2 Data readout software tools ......................................................................... 32
7.5.3 Data export software tools ........................................................................... 33
7.6 Planemos Application builder ................................................................................ 33
8 Status of work .................................................................................................................... 34
9 Conclusions and outlook ................................................................................................... 36
10References ........................................................................................................................ 37
11Appendix ........................................................................................................................... 38
11.1 Hardware Description............................................................................................... 38
11.1.1 Processor and Communication Board ......................................................... 38
11.1.2 Power module .............................................................................................. 40
11.1.3 Multi-sensor board ....................................................................................... 41
11.1.4 Tilt and inclination sensor ............................................................................ 43
11.1.5 Air sensor ..................................................................................................... 44
11.1.6 Impedance Sensor ....................................................................................... 46
11.1.7 Electrometer ................................................................................................. 47
11.2 Database Description ............................................................................................... 49

Rev. 2010-07-07 4/52
1 Summary
Historic structures are often characterized by their extraordinary architecture, design or material.
The conservation of such structures for future generations of the European population is one of the
main tasks of monument conservators. To conserve historic structures it is increasingly important
to understand the deterioration processes mainly caused by the environment. To obtain more
detailed information about the deterioration processes in certain cases continuous monitoring
systems have been installed. However, most of these monitoring systems were only weather or air
pollution data acquisition systems and basic models for data analysis are used. The real influence
of the environment to the structure or the structural material is often neglected. That means that
the structural resistance is calculated from the measurements and not determined by sufficient
sensors. Another facet is that most monitoring systems require cabling, which is neither
aesthetically appealing nor in some cases applicable due to the needed fastening techniques. This
is particularly significant for historical monuments and other cultural heritage.
This report shows the cutting edge of competitive and smart wireless sensor network hardware and
software for monitoring historic structures. A special focus is on the hardware including appropriate
low power signal conditioning with respect to reliable and event-based data acquisition. The report
is introduced by a chapter of the general setup of the WSN architecture.
In detail, the following system components are included: a main board, similar to the main board in
a personal computer, as a central component. It offers processing capabilities and optional storage
capacity. It offers connectors where one or two signal conditioning boards can be attached to and it
carries a radio frequency module for the transmission of data. The main board is powered by a
power supply circuit that is powered by either batteries or a solar power module. For details on the
solar power modules tested on the platform, refer to D3.4 "Power supply technologies".
When it comes to the supported sensor types, the system already supports sensor boards for six
sensors and further adaptation boards are under development. One of the central sensor boards
developed to date is the multi-sensor board, capable of measuring air temperature and air
humidity, three-dimensional vibrations and up to two channels of external resistive sensors, as for
example temperature sensor, strain sensors or displacement transducer.
The electrometer sensor board allows the detection of moisture and salt induced electrical potential
in walls. Together with a third type of sensor board, which allows complex impedance
measurements; this covers the application area of damp walls and salinization effects, which is
important for many historical buildings.
Moving walls is an issue in larger structures, which will be measurable by our inclination sensor
adaptation board with high accuracy. Recording of airflow is supported with a hot-wire anemometer
sensor. Event-triggered evaluation of acoustic emission is going to be a main focus.
The software system that operates the wireless sensors is proprietary and adapted especially for
long-term, low-power operation. It consists of a bootloader function that is responsible for radio
transmission and for over-the-air software updates. On top of this bootloader resides the sensor
board specific application. It is responsible for the acquisition of raw data and for the proper
conversion and preprocessing of raw data before transmission.
The base station runs on the Linux operating system and an application handles the forwarding of
data via a secure virtual connection, using a built-in mobile connection modem.
A database system is the final destination of acquired data, where it can be read-out directly from
the database by using secured access accounts. Else, data is retrievable online in various formats
via a web interface. It can also be downloaded in common spreadsheet software formats.
Rev. 2010-07-07 5/52
2 Introduction
The use of wireless monitoring systems often are supposed to have several advantages compared
to wired monitoring systems, that is for example easy installation, cost-effectiveness and
autonomous operation over longer periods providing remote control and analysis features.
Therefore, a lot of research and development activities are ongoing with regard to wireless
monitoring systems to be applied on civil engineering structures like bridges [1, 2] as well as on
historic structures [3]. At first glance, continuous monitoring with wireless sensor networks seems
to be a perfect solution to get more detailed information about structures than from visual
inspection only. However, wireless monitoring is often not that simple if the monitoring task is more
complex than simply acquiring and transferring relatively basic data like temperature or humidity
every hour. For such simple tasks, many competitive solutions with adequate reliability in the form
of data loggers, partly also equipped with wireless communication, are now commercially available.
The situation becomes challenging if the desired monitoring is focused on acquiring and analyzing
data like stress, strain, inclination, salt and moisture content inside materials or even vibration or
acoustic emissions caused by fracture processes that require higher sampling rates. The main
problem in this context is the power supply (primary batteries are most common) so that the
wireless monitoring hard- and software is subject to several restrictions. To remain cost-effective
and practicable, a balance between the monitoring task respective to the expected result from the
monitoring and the time and effort to perform the continuous monitoring must be found. This is why
wireless monitoring systems frequently have to be customized for the desired monitoring objective.
Thus, structural health monitoring is also to be seen as an interdisciplinary engineering task.

Rev. 2010-07-07 6/52
3 Related work
Most of the wireless sensor networks under development consist of several multi-sensor nodes,
called motes, and a minimum of one base station, which also could have an integrated modem
(GPRS/UMTS etc.) for internet connection and remote control. With respect to power consumption,
network robustness, and the possibility to build up big meshes multihop-networks are often the
best solution for monitoring large structures.
The motes are the main components of a wireless monitoring system. There are different tasks a
sensor mote has to perform, which are to collect and digitize data from different sensors, to store
sensor data, to analyze data with simple algorithms, to send and receive selective and relevant
data to and from other nodes as well as the central unit and to work for an adequate time period
without a wired power supply. There are many different wireless sensors that have been developed
by researchers all over the world to be used for structural health monitoring (SHM). A
comprehensive review of available wireless sensing units is given by Lynch and Loh [4] that show
the cutting edge at that time. However, a lot of shortcomings especially with respect to reliability
are obvious. The biggest problem is still the conflict between power consumption, storage capacity
and system bandwidth. The system bandwidth is mainly restricted by the wireless communication
throughput that is limited. That is why multihop network algorithms, mote clustering and in-mote
data processing and reduction are considered in the recent research [4, 5, 6, 7]. Another drawback
is the lack of adequate sensors especially with respect to sensitivity, reliability and robustness as
well as their integration into a mote [8].
Although numerous commercialized smart sensors are also available together with some
application software from different companies (Dust Networks, Microstrain, Millenial Net,
Sensametrics, Sensicast, Testo etc.), most of these sensor networks are in a basic configuration
just wireless data acquisition systems for evaluation purposes that only transmit measured raw
data to a central base station for further processing. Moreover, most of the systems do not fulfill the
requirements with respect to robustness, long-term stability, long-term battery operation or sensor
reliability.
Rev. 2010-07-07 7/52
4 Structural health monitoring system
4.1 Environmental Influences and Damage Processes
Historic materials and historical structures have been under environmental influence for centuries
or even millenniums. These influences induce damage processes in the building materials that
lead to a degraded state of the structures eventually. The degradation effects can add up and
destroy the valuable object that monument authorities try to preserve for future generations.
Environmental influences are manifold and have their origin in physical and chemical effects. This
comprises decomposition by light, rain, salts, gases and others. To prevent the degradation or the
destruction of historic objects, restorers and conservators try to chemically and physically conserve
and protect the object and in some cases have to reconstruct parts. For the restorers and
conservators, it is of great importance to know and understand the main factors responsible for the
damage.
4.2 Benefits of SHM on Historic Structures
By knowing the main causes for damaging effects, best countermeasures for preservation and
conservation can be taken and the remedies are adapted to the specific structure. To this end,
understanding environmental effects is necessary. To this effect, all relevant environmental
quantities have to be recorded and analyzed by relating the resulting effects to the physical and
chemical values. Damage processes are usually slow and medium to long-term measurements are
necessary.
The knowledge resulting from the SHM measurements can be used for the discovery and
confirmation of general correlations but it can also be used to erect an object specific treatment
plan, if correlations are already known but influencing factor for the specific object are unknown.
4.3 Principle system layout
Wire-based measurement systems for SHM consist of several sensors applied to the structure at
relevant locations. Sensors are available for a plethora of physical quantities, and have to be
chosen according to the application demands. The sensor readings are analog-digital converted in
a central unit, where the digital data is also stored. Many systems allow online-retrieval of recorded
data (compare Figure 1, left side).
In contrast to these aforementioned systems, wireless systems have no central data acquisition
unit but one or several sensors are connected to a (usually) small data acquisition unit, which is
called a measurement node. The complete measurement system consists of several independent
nodes, linked to each other by a radio communication link, hence building a wireless sensor
network. Additional elements of the system are the gateway, which relays the measurement data
to a long-distance network for remote access, and a database to save data storage for later
retrieval and optional post-processing. The WSN is operated remotely from an operation and
maintenance terminal (O&M). See Figure 1, right side, for a general layout of a WSN.
Figure 2 gives a more detailed view on the general system layout. The autonomous wireless
sensor nodes are depicted deployed on a building, sending their information via Smartswitches if
necessary, to a mandatory base station, called Smartgate. The Smartgate includes a wide area
mobile connection, used for controlling the system and for sending data to the central database
and web server (Smartserver) within the operator's premises. The customer can then access the
information via a web access (refer to chapter 7 for details).
Please read on in chapter 6 for the technical realization of the system.
Rev. 2010-07-07 8/52
Equipment bus
S
Measurement
Equipment
Database &
Webserver
Short-range
Wireless
Gateway
Operation Terminal
Wireless Sensor Nodes Wired Sensors
Operation Terminal
Cellular mobile network
IP
IP
Database &
Webserver

Figure 1: Wired SHM schematic with central measurement unit where individual sensors are
connected to, versus the proposed wireless SHM with autonomous sensor nodes relaying
measured data via a short-range transmission and (optionally) long-range mobile networks

LAN/WLAN
Client
Mobile phone
(PDA)
Data transfer & remote maintenance
Alarm
-SM
S
WWW
Client Mobile
Smartserver
WS
Smartmote
WS
LAN/WLAN
Smartgate
WS
Smartswitch
WS

Figure 2: General system layout

Rev. 2010-07-07 9/52
5 Aspects of flexible and reliable sensor node hardware
System and data reliability with respect to the desired operation period and desired accuracy are of
utter importance in terms of structural health monitoring under harsh environments. In addition to
these fundamental aspects, wireless monitoring should be more than just acquiring diverse
measurands at different locations of a structure and then storing it in a database. If the monitoring
task and the expected result are well-considered, immediate data processing of the data is
recommended to avoid collecting large amounts of senseless data no one will look at afterwards. If
such immediate data processing is considered, wireless monitoring becomes intelligent and of
direct practical use. Therefore, distributed computing strategies, which include data acquisition,
data analysis and data reduction are of utter importance.
With respect to the restrictions of a sensor node event based data acquisition may become of
interest or rather becomes an obligatory task if a critical short event occurs during the time the
monitoring system is in sleep mode, thus not capable to recognize this event. Event based
monitoring is useful if temporary loads or other influences stress the structure, e.g. trains, trucks,
wind, snow or rain, earthquakes or structural failure itself. That means that an object specific event
triggers the measurement progress.
Some examples of event based monitoring concepts supported by sufficient hardware are reported
by several researchers. A case study on which event based monitoring was successfully tested
was the detection of a train crossing the bridge [9]. The task was to measure dynamic strain of
steel girders during a train crossing a bridge. The train detection was conducted by using a MEMS
vibration sensor on each mote that could be configured by software to trigger the system. The
MEMS sensor provides a vibration detection mode while using only little power. If a train crosses
the bridge the vibration is recognized by the MEMS sensor that then wakes up the microcontroller
from sleep mode by interrupt. After that, the measurement procedure starts within a few
milliseconds. The procedure was acquiring dynamic strain during train crossing with a sampling
rate of 100 samples/s using resistive strain gauges. The collected data was first stored temporarily
inside the mote and then transmitted to the base station consecutively after the train has passed.
This procedure was necessary to reduce data loss rate.
One of the most challenging examples of event based monitoring is acoustic emission analysis,
which is useful to detect and also to characterize or localize fracture processes. Qualitative
acoustic emission analysis techniques often require very sensitive sensors and high-speed data
acquisition systems, because the full waveforms are analyzed. Due to the hard- and software
restrictions it is obvious that only certain quantitative acoustic emission analysis techniques could
be implemented into a wireless sensor network. In terms of acoustic emission analysis hit rate
(relevant acoustic events per second) determination, beam forming techniques for localizing
acoustic events as well as signal characterization and classification techniques have been
investigated and possible solutions for both hard- and software have been discussed [9, 10, 11, 12,
13, 14]. Although not all mentioned concepts have fully been implemented into a mote and further
investigations are necessary, the concepts of acoustic emission data analysis in wireless sensor
networks are promising.

Rev. 2010-07-07 10/52
6 Realization of a robust sensor node hardware
Figure 3 shows an example of an actual development. It shows a wireless sensor mote equipped
with low-power microcontroller, wireless transceiver, primary batteries and several sensor boards
for multiple sensing. The hardware is optimized to work under harsh environmental conditions as
they occur in case of structural health monitoring and supports several ultra-low power modes.
Therefore, the sensor node is water and dust protected (IP65) and could work in a temperature
range of -20C to 80C. Different kinds of sensors could be attached to the wireless mote
simultaneously that is various MEMS (Microelectromechanical systems) sensors with digital output,
e.g. for the acquisition of acceleration, temperature, humidity, inclination, solar radiation etc.
Additionally analog sensors like resistive strain gauges or piezo-based vibration sensors are
connectable by using especially developed electric circuits for the signal conditioning. This modular
concept allows for customization and optimization for specific monitoring objectives.

Multi-Sensor Board
Multi-Sensor Board
Acceleration Sensor Board
Wireless
Communication
Module
(Backside of
Processor Board)
Processor
Board
Programming
Adapter
(USB/JTAG)
Power
Supply
Wireless Sensor

Figure 3. Robust wireless sensor node (mote) for multiple sensing and modular node components
( www.smartmote.de).

The basic functionality common to all sensor nodes, e.g. communication, data processing etc., is
integrated into the so-called processor board. This processor board allows also the interfacing of
different sensors not requiring specific signal conditioning. In addition to this processor board,
several sensor boards were developed for interfacing sensors requiring a specific signal
conditioning functionality that is not provided by the processor board. These sensor boards are
connected to the processor board. Currently, two sensor boards are available: a signal conditioning
board for interfacing piezo- and PVDF- sensors for acoustic emission and dynamic analysis and a
multi-sensor signal conditioning board for strain gauges, displacement transducers and pressure
Rev. 2010-07-07 11/52
cells in combination with temperature/humidity and vibration measurements. Sensor boards for
high precision inclination measurements and for high-impedance potential measurements as well
as for high-impedance resistivity measurements in the field of electrochemical analysis are under
development.
6.1 Processor board with wireless communication
The main components of the processor board presented here are a microcontroller equipped with
FRAM for data storage and a low power radio chip for the wireless communication (see Figure 4).
The low power operation of the processor board is due to the ultra low power microcontroller
MSP430 F1611 featuring 10kB of RAM and 48kB of program memory (flash). This 16-bit RISC
processor features several power-down modes with extremely low sleep-current consumption that
permits the sensor node to run for a long time period. The MSP430 has an internal digitally
controlled oscillator (DCO) that may operate up to 8MHz. However, the jitter and accuracy of the
internal DCO shows a strong variation with respect to temperature and supply voltage. This aspect
is supposed to be problematic especially with respect to the usage of the internal A/D-conversion
at higher sampling rates as well as time synchronization accuracy. Therefore, the MSP430
operates either with an external ceramic oscillator at 6 MHz or with an external 32768 Hz crystal
watch on our processor board.
Six of the eight external ADC ports of the MSP430 were split up to two separate connectors with
three ADC ports each to which different sensors or sensor boards could be attached. The
maximum reliable total sampling rate for all ports was tested to be approximately 100 kHz at 12 bit
resolution. The two remaining ADC ports are used to monitor the actual power supply voltage as
well as actual current consumption of the sensor node. The I
2
C and SPI ports, which are also
integrated into the microcontroller, are mainly used to control additional sensors and signal
conditioning boards. The MSP430 also includes a 3-port DMA controller. For data storage FRAM
(Ferroelectric random access memory) was supposed to be the best choice, because of its high
addressing speed, low power operation and non-volatile storage capability. Up to four FRAM
modules with 256 kB each could be attached to the processor board providing a maximum of 1MB
storage capacity.
The processor board is equipped with a Chipcon IC (CC2420) soldered separately on an
interchangeable module for the wireless communication. It permits power management to ensure
low power consumption. The CC2420 is controlled by the TI MSP430 microcontroller through a
separate SPI port and a series of digital I/O to avoid data collisions with the digital sensors. The
radio may be shut off by the microcontroller for reducing the power consumption. The theoretically
achievable maximum data throughput rate of the system is 250 kbps.
Details can be found in appendix 11.1.1.
Rev. 2010-07-07 12/52
Radio Transceiver
CC2420
F-RAM Memory
8Mbit
4 x FM25H20
Sensor-Board Connector 2
MCU
MSP430F1611
2.4 GHz ISM
Sensor-Board Connector 1
32 kHz
USB-Connector
Programming Board
JTAG-Connector
USB to UART
FT232R
MCU Board
USB
UART
UART
GIO
Power
I
2
C/SPI 0
GIO Power
IO
SPI
IO
6 MHz
Power Supply
Battery
Power
Management
Supercap
XIN
XOUT
XT2IN
XT2OUT
Ext. Keyboard
Solar
Modul
Power
Keyboard
Adaptation
JTAG
K
e
y
b
o
a
r
d
C
o
n
n
e
c
t
o
r
Supply Connector
GIO Power
3.3V
Reg.
Supply Connector
Misc.
Power GIO JTAG UART
Supply Connector
UART JTAG
GIO
GIO Power
Serial ID
DS28CM00
VREF
VREF
Ext.
VREF
Mem Ctrl Mem Ctrl
SPI SPI 1
optional
Power
Ext. Solarpanel
I
2
C I
2
C/SPI 0
ADC
ADC
ADC
ADC
ADC

Figure 4. Principle sketch of the processor board, power supply and programming board.

The processor board is mounted headfirst, opposite to the other modules, so that the radio board is
on top.

Figure 5. Processor board front and back with mounted radio board.
Rev. 2010-07-07 13/52
6.2 Power supply
The sensor node is primary powered by one or two Li-SOCl
2
batteries with each 7.3 Ah @ 3.6 V.
This type of battery has a very long lifetime with a small drop of voltage and capacity due to ageing
or temperature changes. The battery operates in the temperature range from -55C to +85C;
however the operation at temperatures different from ambient may lead to some capacity
reduction. The actual voltage of the battery and the current consumption can be monitored for
estimating the remaining lifetime of the sensor node. As secondary power supply one or two solar
cells (optimal voltage at MPP 5.2V to 6V) can be attached to the sensor node. The power provided
by the solar cell is regulated and stabilized by an electronic circuit to avoid power fluctuation that
could lead to miscellaneous behavior in terms of reliable data acquisition and analysis. The usage
of additional supercaps (high energy density capacitors 1.5F, 5V) allows for temporary powering
the sensor node only with the solar cell during daylight condition even if relatively high current is
needed, which might be the case of full operation of all node components. The power regulation
circuit provides a maximum power output of 150 mA at 3.3 V. As long as the capacitors and the
solar power module provide enough energy, the sensor node uses solar power. If the voltage level
falls below 3.4V, power supply is automatically switched to battery operation until the solar cell has
charged the supercaps to approximately 4.4V again.
With the batteries mentioned, the lifetime of a sensor node is estimated to be at least several
months or years. Note that the lifetime strongly depends on the type of embedded sensors, the
data acquisition and measurement rate, the processing effort and data transmission rate. For
achieving a long lifetime for the system, it is essential to run the sensor nodes in power down mode
most of the time.
It is possible to connect a plastic foil keyboard with low current LEDs to this board. All components
which are necessary to operate a keyboard (3 LEDs, RESET button and 2 function buttons) are
mounted on the board.

Figure 6. Power supply board for battery power and solar power.


Rev. 2010-07-07 14/52
6.3 Multi-sensor board for strain gauges, vibration, temperature and
humidity
6.3.1 General description
The multi-sensor board (see Figure 7) is primarily developed to support any type of sensors
requiring a Wheatstone bridge-type signal conditioning for an accurate measurement of changes of
electric resistance (e.g. piezo-resistive, ceramic-thick film or steel membrane based). Many
different sensors for the measurement of strain, stress, load, displacement, inclination, soil
pressure etc. can be attached to this signal conditioning board. With small changes in the
hardware setup also PT100 elements for temperature measurements could be used. The board
performs the digitalization of the sensor signals. It communicates with the processor board using
the I
2
C bus. The board is equipped with two ZMD31050 differential sensor signal conditioner
devices for operating two independent sensors simultaneously. The ZMD31050 is a CMOS
integrated circuit for highly accurate amplification and sensor-specific correction of bridge sensor
signals. The IC provides digital compensation of sensor offset, sensitivity, temperature drift and
non-linearity of an integrated 16-bit RISC micro controller running a correction algorithm with
coefficients stored in a non-volatile EEPROM (Electrically Erasable Programmable Read-Only
Memory). These coefficients can be programmed from the processor board, for example during a
calibration process. In addition, the IC can interface a separate temperature sensor.
Sensor-Connector 2
ZMD 31050
Multi-Sensor Board
ZMD 31050
Sensor-Board Connector
GIO Power
I
2
C PW
Sensor-Connector 1
Power
Switch
Accelero
meter
IO
HUM.
TEMP.
PW I
2
C INT PW I
2
C
EN
optional
I
2
C/SPI 0

Figure 7. Principle sketch of Multi-Sensor Board.
Because measuring with a Wheatstone-bridge circuit needs considerable power (power mainly
depends on the impedance of the used strain gauge), the signal conditioning board can be
switched off and on by an electronic switch that is controlled by the processor board via the GIO
interface. The bi-directional digital interface (I
2
C) is also used for simple software controlled one-
shot calibration procedure, in order to program a set of calibration coefficients into the on-chip
EEPROM. Thus a specific sensor and the ZMD31050 are digitally connected.
For measuring air temperature and humidity, a MEMS sensor (SHT15 from Sensirion) that is
equipped with a digital interface could be connected to the multi-sensor board. The SHT15 digital
humidity and temperature sensor is a fully calibrated MEMS sensor that offers high precision and
excellent long-term stability. The digital technology integrates two sensors and readout circuitry on
one single chip.
Measuring time series with high sampling rates is energy consuming and also limited by the
system bandwidth and the storage capability. It is therefore advisable to sample a measurand only
Rev. 2010-07-07 15/52
when signals of interest are expected. This often means to sample signals only if a certain
amplitude threshold is exceeded. Especially in case of dynamic strain measurements, such an
event driven data acquisition is indispensible. Hence, a vibration detection mechanism/device was
developed, which enables power-consuming measurements only in case of vibration exceed
certain level.
The chosen solution is an acceleration sensor, SMB380 from Bosch Sensortec GmbH, Germany,
which features energy saving modes. The functional principle of the chosen vibration detection
solution is briefly described: The on-chip routines measure periodically the acceleration and detect
if a given threshold is exceeded. Then the SMB380 generates an interrupt to wake up the MSP430
C and the ZMD chips and to start with predefined measurement routine.
For the setting of the SMB380's parameters, a software tools is available. Once an optimal setting
is found, it can be stored to the SMB380's EEPROM and is then fixed even without power. In the
any motion detection mode, which was tested and found to be suitable e.g. to detect trains
crossing a bridge, the sensor consumes just about 200A, which guarantees long battery
operation.

Figure 8. Multi-Sensor Sensor Board and Temperature/Humidity Add-on sensor.

6.3.2 Features
Wheatstone bridge measurements (Pt-elements, strain gauges etc. using -, - or full-
Wheatstone bridge)
Software programmable (offset, gain etc.)
Event detection using optional MEMS acceleration sensor
Optional Temperature/Humidity Measurements
6.3.3 Technical data
Table 1: Multi-sensor board specifications, Rev. 2.2 (Wheatstone bridge)
Item / Parameter Symbol Value
Supply voltage 3V to 3.6V
Supply current
Sleep mode
Operation mode (without sensor)

A
SM

A
OM

12A
6mA (typ.)
Response time
Rev. 2010-07-07 16/52
From sleep mode
From operation mode
20ms
40ms
No. of input channels Ch1, Ch2 2
Input range 2mV/V to 280mV/V
Resolution 15 bit
Max. sampling rate 3.9 kHz
Ambient Temperature -40 to +85C
Ambient Humidity Not specified
Add-ons (optional)
Bosch SMB380 (Event detection)
Sensirion SHT15

Vibration detection
Temp. /Hum. measurement
Red = preliminary, values have to be checked


6.4 Acceleration sensor board for piezo- and PVDF-sensors
During a former research project (www.sustainablebridges.net), different kinds of acceleration
sensors were tested for evaluating their fitness for acoustic emission analysis. However, no
commercially available MEMS sensors fulfilled the requirement of acoustic emission analysis.
Especially their performance with respect to bandwidth, sensitivity, signal to noise ratio and/or
power consumption did not meet the requirements. Therefore, other sensors (piezo and PVDF) are
used for acoustic emission analysis or other higher frequency vibration analysis. For those
sensors, a signal conditioning board (acceleration sensor board) was designed and manufactured
that allows for an event-based data acquisition (see Figure 9).
The signal conditioning board for piezo- and PVDF-sensors is equipped with two amplifiers that
have a programmable gain (gain factor: 100, 1000), low pass filters and an analog trigger
(threshold) that is adjustable in 256 steps by the software running on the processor board. Each
acceleration sensor board has two independent analog channels for performing simultaneously the
signal conditioning of the two sensors. The analog trigger option, which could be used before or
after the analog filtering, allows for running the processor board in power down mode most of the
time. Only if relevant events occur and a certain threshold is exceeded, an interrupt is initiated that
could switch the processor board into working mode for a predefined time that can be controlled by
the microcontroller. The acceleration board itself needs about 800 W in working mode so a
lifetime of several months up to years could be reached just working with a battery. A low pass
anti-aliasing filter is also implemented to meet the requirements of the analog to digital conversion.
The cut off frequency of the low pass filter can be adjusted to fit the selected sampling rate.
The acceleration sensor board is not designed only for acoustic emission analysis usage. It can be
used as a signal conditioning board for vibration analysis, too. This can be achieved by just a few
changes in the low pass filtering module.
Rev. 2010-07-07 17/52
S
E
L

Figure 9. Principle sketch of Acceleration Sensor Board.

6.5 Inclination and tilt sensor board
The inclination and tilt sensor board (see Figure 10) is primarily developed to support an additional
external inclination sensor module, which is equipped with up to two VTI SCA830-D07 or similar
sensors for 1- or 2-axis inclination measurements. The inclination module, which is mounted on the
monitored surface of the structure, is connected to the sensor board via two cables, supplying the
module with electrical power and with a digital SPI interface for communication with the processor
board. The SCA830-D07 is a MEMS sensor that primarily contains the sensing element, a 16-bit
analog to digital converter, a temperature sensor for temperature compensation purposes, a non-
volatile memory, a SPI interface and some self diagnostic features. The sensor module is equipped
with up to two SCA830-D07 sensors that are mounted orthogonally in the module to ensure 2-axis
measurements.
Because the MEMS sensors need considerable power, the inclination and tilt sensor board can be
interface.
Additionally the sensor board is equipped with a Bosch SMB380 acceleration sensor for
acceleration measurements or motion detection. Furthermore for air temperature and humidity
measurements a Sensirion SHT15 sensor can be connected. The SMB380 and the SHT15
sensors are already explained in chapter 6.3.1.

Rev. 2010-07-07 18/52
Sensor-Connector 2
Inclination Interface Board
GIO Power
PW
Sensor-Connector 1
Power
Switch
Accelero
meter
IO
HUM.
TEMP.
PW I
2
C INT PW I
2
C
EN
optional
I
2
C/SPI 0
Sensor-Connector 2
Sensor-Connector 1
ZMD 31050
VTI SCA830
SPI PW IO
SPI
External Inclination Sensor

Figure 10. Principle sketch and picture of inclination and tilt-sensor board.

6.5.2 Features
2-axis inclination measurements with high resolution
Software programmable
Optional Temperature /Humidity Measurements
Table 2: Inclination and tilt sensor board specification
Supply voltage 3 V to 3.6 V
Supply current
Sleep mode
Operation mode (with 2 SCA830-D07)

A
SM

A
OM

12 A
10 mA (typ.)
Response time
From sleep mode

95ms
No. of channels Ch1, Ch2 2 one axis inclinometers
orthogonally installed
Input range -90 to +90
Resolution 0.00179 (range +/-3)
Rev. 2010-07-07 19/52
Max. sampling rate 125 Hz
Amplitude response 6.25 Hz
Add-ons (optional)
Sensirion SHT15

Vibration detection

Details can be found in appendix 11.1.4 .

6.6 Air velocity sensor board

Figure 11: Principle sketch of the air velocity sensor adaptation board
The air velocity sensor board (see Figure 11 and Figure 12) is primarily developed to support the
Omrom D6F-V03A1 MEMS flow sensor but actually any sensor equipped with a DC output in the
range of 0 to 3.6 V, a supply voltage of about 2.7 to 3.6 V and a supply current of less than 150 mA
may be connected. The D6F-V03A1 is able to measure air flow in the range of 0 to 3 m/s with an
accuracy of +/-10%. The analog to digital conversion is done by the internal A/D-converter of the
microprocessor with a resolution of 12 bit.
The second channel of the board is used for external temperature measurement with a PT100 or
other RTD sensor. It is equipped with the ZMD31050 differential sensor signal conditioner device,
which is already explained in chapter 6.3.1. With small changes in the hardware it is also possible
to connect any sensor based on a Wheatstone-bridge.
Because the two channels need considerable power, the air velocity sensor board can be switched
off and on by an electronic switch that is controlled by the processor board via the GIO interface.
Additionally, the sensor board is equipped with a Bosch SMB380 acceleration sensor for
acceleration measurements or motion detection. For air temperature and humidity measurements,
Rev. 2010-07-07 20/52
a Sensirion SHT15 sensor can be connected. The SMB380 and the SHT15 sensors are already
explained in chapter 6.3.1.

6.6.2 Features
Measurement of the air velocity on channel 1 (or other sensors with DC output)
Wheatstone bridge measurements on channel 2 (Pt-elements, strain gauges etc. using -,
- or full- Wheatstone bridge)
Channel 2 software programmable (offset, gain etc.)

Figure 12. Air velocity sensor board with flow sensor
Table 3: Air velocity sensor board specifications
Supply voltage 3.15 to 3.6 V
Supply current
Sleep mode

A
SM

A
OM

12A
about 20 mA
Rev. 2010-07-07 21/52
Operation mode (with sensors)
Response time
From sleep mode
From operation mode

No. of channels Ch1
Ch2
Air velocity sensor
RTD Temperature Sensor
Input range channel 1 0 to 3 m/s
Accuracy channel 1 +/-10 %
Ambient Temperature channel 1 -10 to +60C
Ambient Humidity channel 1 Max. 85% RH
Input range channel 2 2mV/V to 280mV/V
Resolution channel 2 15 bit
Max. sampling rate channel 2 3.9 kHz
Ambient Temperature channel 2 -40 to +85C

Impedance converter Add-ons (optional)
Sensirion SHT15

Vibration detection


6.7 Impedance converter board system for electrochemical analysis
and impedance spectroscopy
Sensor-Connector 2
AD 5933
Impedance Converter Board
GIO
Power
I
2
C PW
Sensor-Connector 1
Power
Switch
HUM.
TEMP.
IO
Freq.
Divider
PW I
2
C PW IO
EN
optional
I
2
C/SPI 0 ADC
Buffer

Figure 13: Principle sketch of the impedance converter board
Rev. 2010-07-07 22/52
The impedance converter board (see Figure 13 and Figure 14) is primarily developed for
electrochemical analysis and impedance spectroscopy at historical or modern structures. The
board performs the excitation, measurement and digitalization of external impedance connected to
the board via two electrodes. It communicates with the processor board using the I
2
C bus. The
main item on the board is the Analog Devices AD5933 integrated circuit. The AD5933 is a high
precision impedance converter system, which combines a programmable frequency generator with
a 12 bit 1 MSPS analog-to-digital converter and a DSP engine. For each output frequency, a real
and an imaginary data word is calculated. Furthermore a temperature sensor for temperature
compensation purposes and an I
2
C interface are integrated on the chip.
To measure impedance below 1 kOhm an external buffer is required and for output frequencies
below 1 kHz an external programmable clock generator can be used, both are already
implemented on the board.
Because the integrated circuits need considerable power, the impedance converter board can be
interface.
equipped with a digital interface can be connected to the multi-sensor board. The SHT15 sensor is
already explained in chapter 6.3.1.
6.7.2 Features
1 MSPS 12 bit impedance converter system
Software programmable (frequency sweep, excitation, gain etc.)

Figure 14. Impedance converter board

Table 4: Impedance converter system board specifications
Rev. 2010-07-07 23/52
Supply voltage 3 to 3.6 V
Supply current
Sleep mode
Operation mode

A
SM

A
OM

12 A
18 mA
No. of channels Ch1
Input range 100 to 10 M
Resolution 12 bit
Max. sampling rate 1 MHz
Max. frequency 100 kHz
Add-ons (optional)
Sensirion SHT15



6.8 Electrometer with multiplexer
The electrometer board (see Figure 15 and Figure 16) is primarily developed to measure potential
differences caused by electrochemical cells with very high internal resistance. Therefore the
electrometer board must have an extremely high input resistance. This is ensured by using at the
input circuit of the board an operational amplifier with a very low bias current. The LMP7721 made
by National Semiconductor that is used here has a typical bias current of only 3 fA at ambient
temperature.
The board acts as an impedance converter and level shifter with extremely high input impedance
and low output impedance. The signal at the output of the board is digitized by the 12 bit analog-to-
digital converter of the microprocessor. There are three charge pumps on the board to supply the
operational amplifiers and the multiplexer with the required supply voltages.
An additional relay multiplexer extends the numbers of input channel from one to eight. The eight
inputs of the multiplexer can be switched via the I
2
C bus sequentially to the input of the
electrometer board.
equipped with a digital interface can be connected to the multi-sensor board. The SHT15 sensor is
already explained in chapter 6.3.1.
Rev. 2010-07-07 24/52

Figure 15. Principle sketch of the Electrometer board

6.8.2 Features
Extremely high input resistance of 100 GOhm (If required up to 100 TOhm may be possible)
Eight software selectable input channels with additional multiplexer
Optional Temperature/Humidity measurements

Rev. 2010-07-07 25/52

Figure 16. Electrometer board and multiplexer

Table 5: Specifications of the electrometer board with multiplexer
Supply voltage 3V to 3.6V
Supply current
Sleep mode
Operation mode (without sensor)

A
SM

A
OM

12A

Response time
From sleep mode
From operation mode

Not specified
Not specified
No. of channels
Single use
In combination with Multiplexer

Ch1
Ch1 - CH8

1
8
Input range -2V to +2V
Resolution 12 bit
Input resistance ~100 G
Add-ons (optional)
Sensirion SHT15



Rev. 2010-07-07 26/52
7 Structural health monitoring software
7.1 Principal structure of the SHM system software
To operate the WSN, a complex but flexible architecture of software components has been coded,
which interact to form the WSN. To each of the hardware components, as described in chapter 6,
belongs a software component that operates this component. A block diagram of the software
system is shown in Figure 17. The measurement nodes (Smartmotes) are the core of the system.
The Smartmotes run two components: the sensor node boot loader (Wboot) and the sensor node
application software, called Miranda. For details on this software, refer to chapters 7.2.2 and 7.2.3.
The Smartswitch is an optional system unit, which is not necessary for small-scaled deployments.
The software component Uranus, running on the Smartswitch, is therefore postponed.
The Smartgate is the central node in the WSN and offers base station functionality. It is composed
of the Starcatcher application, which receives the radio messages from all the Smartmotes and
forwards them to the Jupiter application. Starcatcher can be seen as the radio interface component
of the Jupiter application. Jupiter is a component that manages the WSN. Command messages
can be injected into the network and also data can be displayed. The Callisto application is optional
and is used for on-site-interaction with the object.

miranda
Application (Data
Acquisition, Data
analysis)
wboot
Bootloader
uranus
Forwarder
jupiter
Forwarder
mars
SQL interpreter
(PHP-Skript)
V
I
-
S
e
r
v
e
r

(
L
a
b
v
i
e
w
-
V
i
s
)
galaxy
MySQL Data Base
Data analysis
toolbox
2.4GHz
LAN/WLAN
GPRS/UMTS
LAN/WLAN
SQL interpreter
Smartmote
WS
Smartswitch
WS
Smartgate
WS
Smartserver
WS
planemos
Application builder
callisto
On-Site control
Smartgate
WS
Smartswitch
WS
Smartserver
WS
Smartmote
WS
miranda:
mir_shtup, mir_DMS
starcatcher
Serial forwarder
starcatcher
Serial forwarder
2.4GHz

Figure 17: Principle sketch of the SHM system software components including name conventions.
Rev. 2010-07-07 27/52
The Smartserver is a hardware unit which is detached from the rest of the WSN. For details refer to
the system description in chapter 4. A software component called Mars receives the data from the
WSN and inserts the data into a database (Galaxy). The VI-Server, running National Instruments
LabVIEW, handles the requests for online visualization of the data. The requests to these
visualization tools originate from a web server, which is not shown in this sketch. The application
builder software (Planemos) handles the update process of the sensor nodes with Miranda
applications.
7.2 Sensor network and data transfer software
7.2.1 Sensor network protocol
The individual nodes erect a wireless sensor network by exchanging radio messages with their
neighbors or with the base station. The protocol that regulates the interchange of messages is a
customized protocol, implemented by TTI. To simplify matters and moreover to make the protocol
as power-saving as possible, a routing-free direct-path transmission, request-based protocol was
devised which establishes a star topology. The routing-free direct-path transmission can be
substituted by a multi-hop subsystem for large-scale deployments, where the forwarding of data
from several star networks by Smartswitches would be uneconomic and a tree topology is
desirable.
The protocol realizes a low payload overhead for common tasks (~ 50 % less than ZigBee) which
results to minimum power consumption (again ~ 50 % less than ZigBee). This is realized by 1) an
early split between Wboot and Miranda data on a very low level, and 2) an acknowledge-request-
based-only transmission. This means that requests for sending a command can be sent to the
network nodes only with the acknowledgement of another message that has been sent before.
7.2.2 Wboot Sensor node boot loader
The sensor boot loader can be seen as the operating system of the sensor nodes. It provides a
common interface for basic radio transmission routines to the application software (refer to chapter
7.2.3). Furthermore, it provides support functions like a sleep timer, enabling the application to
power down to a low-power mode during inactive periods, and read/write accesses routines for the
microcontroller flash memory.
The operation of the boot loader (and of the application software) is supervised by a watchdog.
The watchdog resets the software to an initial state, if it is not responding any more. This is a
fallback safety feature, avoiding the "loss", i.e. the non-responsiveness, of a sensor node. The
watchdog is automatically configured and cleared periodically by the boot loader.
The boot loader is also capable of loading software updates into the node. In this mode, the
software update is transmitted wirelessly to the node and flashed into the internal memory. A CRC
check is provided to guarantee the error-free transmission of the software package. It is even
possible to auto-start the application when the CRC check is valid. This update feature is usually
used to load newer version of the Miranda software, however, it is even possible to install a new
boot loader over the air.
7.2.3 Miranda sensor node application software
The Miranda packages represent the application software, which is specific to the signal adaptation
board (refer to chapter 6), which is build into a specific node. In general, this software component
handles the data acquisition, data format conversion and data analysis. It can also store data to
additional flash memory, if the node is equipped like that.
Data acquisition is done by either using the microcontroller's internal analog-to-digital converter or
specialized measurement hardware on the signal conditioning board. The software accomplishing
this task is therefore as diverse as the underlying hardware. The general program flow, however, is
Rev. 2010-07-07 28/52
common to all Miranda applications. Firstly, the data is acquired from the hardware, then data is
converted to a common format, post-processed (optional) and then sent to the Smartgate
WS
base
station, using the Wboot radio driver. Afterwards, the sensor node is set to a sleep mode, to save
energy. After the measurement interval has expired, the whole measurement cycle starts over.
Be referred to Table 8 in chapter 8 for details on the status of availability of the Miranda application
software packages.
7.2.4 Starcatcher radio to serial forwarder
The Starcatcher software is software running on a Smartmote
WS
that is directly connected to USB-
Port of a Smartswitch
WS
or a Smartgate
WS
. It is designed to provide a reliable connection between
the Smartmotes
WS
and the Smartswitch
WS
or Smartgate
WS
units. This application can be seen as
the radio interface of the Jupiter application. Its coupling with the Jupiter package is therefore tight.
Its task is to forward data from the nodes to the Uranus or Jupiter application, and to forward
command is opposite direction from Uranus or Jupiter to the network. Additionally, the sending of
software update to the nodes is done by this component.
7.2.5 Uranus forwarder
The Uranus software is a stripped-down version of the Jupiter software. It is designed for use in
multi-star networks in large deployments. It communicates with the mars component to put data
into the Galaxy data base.
The Uranus component is running on a Linux system or an embedded Linux system.
7.2.6 Jupiter base station and forwarder
The Jupiter software is basically similar to the Uranus software but has some advanced features. It
supports UMTS/GPRS modem support for wide area mobile network connections and provides a
data interface for the Callisto software.
The Uranus component is running on a Linux system or an embedded Linux system.
7.2.7 Callisto on-site control
Callisto is the software package that provides direct on-site control. This can be used for
immediate interaction with the object under observation. For example in a church where the air
humidity is monitored, the on-site control component could provide an interface to a acclimatization
appliance, or even only a window-opening control system, to reduce the humidity by ventilation or
heating under certain conditions. This software is still under evaluation and not finished yet.
7.3 Data storage
7.3.1 Galaxy SQL data base
Galaxy is the link between the nodes and the user interface. Nodes and user interface never talk to
each other directly; moreover, they always use the Galaxy as a link. That guaranties a common
interface and the possibility to use more than one user interface. It also cares for all the
synchronization and data storage.
7.3.2 Data Base Overview
The database layout is designed to allow both a quick insertion of new data items into the structure
and a quick retrieval of information items for further processing, analysis and visualization. Galaxy
is a relational database with tables as shown in Figure 18.
Rev. 2010-07-07 29/52

Figure 18: Data base structure: each square stands for one table

For more details on the database layout, refer to chapter 11.2.
7.3.3 Mars SQL interpreter
The Mars software is written in PHP. On the one hand, it is used to load data into the galaxy data
base. For security reasons direct SQL access is not permitted. On the other hand, simple PHP
scripts readout the database and print it in simple HTML sites for client access. The scripts are
simple and for debugging only.
7.4 Data analysis
After raw data is gathered with the above described system, the data has to be analyzed regarding
the sought-after information and to reduce the amount of data. These goals are achieved by a two-
step analysis procedure. First, some basic data filtering and reduction is done within the motes
themselves, e.g. by using hardware filter components to disregard noise or by averaging of data.
Then, in a second step after the transmission and storage, the data can be post-processed and
analyzed in depth.
7.4.1 In-mote data analysis
In wireless sensor networks, low power consumption is of utmost importance. Of the factors that
account for the most power consumption in wireless sensor nodes, radio transmission is on the
first ranks. Current drain is linear with the time a sensor needs to transmit data. This is also true for
mote processing power; however, data processing of one byte is less costly in the sense of
power consumption than the radio transmission of one byte. It is hence interesting to reduce
transmission times as much as possible. Preprocessing of data so called in-mote data analysis
can be used to reduce the acquired data to useable information. The principles used for this,
comprise standard approaches from information theory, like compression by differencing
(transmission of deltas only) but include also more complex analysis that are application specific.
An example for such an analysis is the analysis of vibration time series to retrieve the natural
frequencies.
Rev. 2010-07-07 30/52
At present, no reduction routines are implemented in-mote. Transmission of deltas-only is a first
step, which will be implemented during the next timeframe.
7.4.2 Database analysis
The database analysis is controlled by the individual user, who requests a data analysis via a web
server user interface (cf. Figure 19). The web server does not handle the request on its own, but
forwards it to the analysis server running National Instruments LabVIEW. This server retrieves the
data to analyze from the database server (which coincides with the web server in this architecture).
The data is then accordingly analyzed and the analysis results are returned as Portable Network
Graphics (png) via the web server to the client web browser.
Customers
1. Request analysis
via web interface
2. Request analysis
Web server
(public access)
Database server
(local access only)
LabVIEW analysis server
(local access only)
3. Retrieve data
4. Return analysis results
5. Send html
and graphics

Figure 19 - Database analysis architecture
The modular database analysis architecture was chosen to guarantee a stability of the entire
system while maintaining a high flexibility and to ensure maximum data integrity on the database
server by limiting the required access from the analysis and web servers to read-only. The use of a
LabVIEW analysis server allows the easy implementation of a considerably large ready-to-use data
analysis toolbox.
Rev. 2010-07-07 31/52

Figure 20 - LabVIEW analysis server code
In an initial step, only the interfaces between the four members of the analysis server architecture,
as well as the graphical display of the raw data were implemented. The LabVIEW analysis server
main code is shown in Figure 20. During the remaining time frame of the project, the various types
of analysis will be developed and implemented.
7.5 User interfaces
7.5.1 Administration software tools
For operation and maintenance (O&M) of the wireless sensor network, technical tools have been
developed that allow a technically adept administrator to configure the network with respect to
measurement tasks, networking parameters and general system settings.

S: 30 SM_TEMP id: 76 temp: 26.70
S: 30 SM_TEMP id: 77 temp: 26.70
S: 2c SHT15 5: 24.48 36.79
S: 30 SHT15 22.33 26.28
S: 2c SM_AIRFLOW id: 6: 0.00 m/s 0
S: 31 SHT15 5: 22.36 24.35
sn 98
L: Set Cmd Node: 98
S: 98 SM_VOLTAGE id: 34 Voltage: 1511.6 mV
load emeterapp.bin
.. ..loading .. ..
Figure 21: Example trace of administration tool

The administration is considered to be done via a web interface. Having in mind the complexity of
the administration and allowing for the current development phase where progress is fast and
software still changes rapidly, the O&M is done with specialized tools.
Rev. 2010-07-07 32/52
7.5.2 Data readout software tools
Apart from the administrative tools that have been implemented to operate and maintain the
wireless sensor network, the data readout software tools are designed to bring the customer an
easy-to-use and easy-to-understand graphical user interface for data readout and visualization.
The data visualization and data retrieval have been decided to be implemented as a set of online-
tools.
For each project, the customer gets a web page as a starting point. See Figure 22 for an example.
Here, the user rights management is handled and links to the individual retrieval, visualization and
analysis tools are offered.
Figure 23 depicts exemplarily a data visualization tools for temperature and humidity values on a
medieval church in southwest Germany. Temperature and humidity are shown at the exact places
where the sensors are installed in the church. By using this tool, a quick impression of the
measurement values can be obtained.

Figure 22 - Web-interface start page, with the offered retrieval and visualization tools circled in red

Rev. 2010-07-07 33/52

Figure 23 Data visualization of temperature and humidity data of a church in Germany
7.5.3 Data export software tools
As mentioned in chapter 7.5.2, data retrieval can be triggered by another online tool. This tool
offers the download of information stored in the data base. Parameters include the start and end
time, the desired sensors and measurement type.
Data can be obtained in Excel file format, Open Document file format or as comma separated
values.
It is also possible to access the database online via a query language. This way of extracting data
for post processing is favored, over file export, as data is more up-to-date then.
7.6 Planemos Application builder
Planemos is the connection between the Galaxy SQL data base and the binary files of the Miranda
application software. After the compiler builds the Miranda software, Planemos loads it into the
database. From there it can be uploaded to the motes. Planemos also writes into the database
where configuration values are stored. This is needed to tell the user interface what possible
configurations are implemented in this Miranda application.
Rev. 2010-07-07 34/52
8 Status of work
Table 6: Basic sensor node components
Progress
Processor board Available
Wireless transceiver unit Available
Power supply
Dual power regulation
Battery operation
Solar cell operation

Available
Available
Available
Housing (casing) Available
Programming adapter (USB/JTAG) Available

Table 7: Sensor and signal conditioning
Progress
Air temperature & relative humidity Available
Material temperature Available
Local strain and deformation Available
Large distance and deformation Available (only wire transducer)
Acceleration sensors:
Event detection
Modal analysis
Acoustic emission analysis

Available
Available (on request)
Almost finished
Inclination Available
Barometric pressure (on request)
Air velocity Available
Material moisture:
potential mapping sensors
resistive measurement

Under development
Under development
Solar irradiance (on request)
UV light (on request)
Ozone (on request)
Rev. 2010-07-07 35/52

Table 8: Wireless Sensor Node Operating System and Application Software
Progress
Bootloader (Wboot) Available
Application Software Packages (Mirandas)
Environmental temperature and humidity
Body temperature (Pt100)
Electrometer (potential measurements)
Air flow sensing
Strain measurements
Impedance measurements
Acoustic emission analysis

Available
Available
Available
Available
Almost finished
Almost finished
Under development
Web-Interface Almost finished
Online-Analysis (basic tools) Available
Analysis packages
Time Series
Dew point analysis
further analysis

Available
Almost finished
(on request)
Forwarder (Uranus) (on request)
Base Station Software (Jupiter) Available
Radio to serial forwarder (Starcatcher) Available
On-site control (Callisto) (on request)
Database system (Galaxy) Available
Application builder (Planemos) (on request)
Rev. 2010-07-07 36/52
9 Conclusions and outlook
Wireless sensor networks using intelligent data acquisition and processing could enormously
reduce the costs for structural health monitoring to a small percentage of a conventional wired
monitoring system. This will increase its application and thus more detailed information could be
obtained from the structural behavior as well as the actual condition of the building structure. This
will enable engineers to use more precisely information for the structural analysis and repair as
well as lifetime prediction. For that reason, diverse wireless monitoring systems and promising
distributed computing strategies were developed or are under investigation. Reliability, especially
with respect to long-term monitoring, is still challenging and the high complexity in customizing and
assembling monitoring systems is in contrast to easy handling and usability. For that purpose more
practicable modular concepts must be developed like it is described shortly in this report for the
sensor node hardware. The detection of abnormal or critical events is one aspect, in which
hardware could play a decisive role. Solutions for that must be further investigated and developed.
In combination with intelligent distributed computing strategies, structural health monitoring will
then be intrinsically efficient and will help reduce maintenance costs.

Rev. 2010-07-07 37/52
10 References
1 Meyer, J., R. Bischoff, G. Feltrin, M. Krger, O. Saukh, S. Bachmaier. 2007. Sustainable Bridges
5.7 - Prototype Implementation of a Wireless Sensor Network, Report of Sustainable Bridges
project, http://www.sustainablebridges.net/main.php/SB5.7.pdf?fileitem=11681876.
2 Kim, S., S. Pakzad, D. Culler, J. Demmel G. Fenves, S. Glaser, M. Turon. 2007. Health Monitoring
of Civil Infrastructures Using Wireless Sensor Networks, in Proc. of the 6th International Conf. on
Information Processing in Sensor Networks. ACM Press. 254-263.
3 Grosse, C.U., G. Pascale, S. Simon, M. Krger, A. Troi, C. Colla, V. Rajcic, M. Lukomski. 2008.
Recent Advances in Smart Monitoring of Historic Structures, Proc. 8th European Conference on
Research for Protection, Conservation and Enhancement of Cultural Heritage (CHRESP), Ljubljana,
Slovenia, November 2008.
4 Lynch, J.P., K. Loh. 2006. A summary review of wireless sensors and sensor networks for structural
health monitoring, in Shock and Vibration Digest, 38:2, 91-128.
5 Gao, Y., B. Spencer. 2008. Structural Health Monitoring Strategies for Smart Sensor Networks,
Newmark Structural Laboratory Report Series (NSEL Report Series ISSN 1940-9826) Newmark
Structural Engineering Laboratory, University of Illinois at Urbana-Champaign, 2008-05.
6 Ruiz-Sandoval, M. 2004. Smart sensors for civil infrastructure systems, Ph.D. Dissertation,
University of Notre Dame, Indiana.
7 Wang, Y. 2007. Wireless sensing and decentralized control for civil structures: theory and
Implementation, Ph.D. Thesis, Department of Civil and Environmental Engineering, Stanford
University, Stanford, CA.
8 Nagayama, T., B. Spencer. 2007. Structural Health Monitoring Using Smart Sensors, Newmark
Structural Laboratory Report Series (NSEL Report Series ISSN 1940-9826) Newmark Structural
Engineering Laboratory, University of Illinois at Urbana-Champaign, 2007-01.
9 Meyer, J., R. Bischoff, G. Feltrin, M. Krger, P. Chatzichrisafis, C. Grosse. 2007. Sustainable
Bridges 5.8 - Data analysis and reduction methodologies for wireless sensor networks, Report of
Sustainable Bridges project,
http://www.sustainablebridges.net/main.php/SB5.8.pdf?fileitem=11681877.
10 Grosse, C.U., M. Krger, P. Chatzichrisafis. 2007. Acoustic emission techniques using wireless
sensor networks, in International Conference Sustainable Bridges Assessment for Future Traffic
Demands and Longer Lives, Wrocaw, Poland, October 10-11, 2007, pp. 191-200.
11 Grosse, C.U., M. Krger, S.D. Glaser, G.C. McLaskey. 2008. Bridge monitoring using wireless
sensors and acoustic emission techniques, in Proc. EM08, Inaugural International Conference of
the Engineering Mechanics Institute, Department of Civil Engineering, University of Minnesota, USA.
(Eds. R. Ballarini, B. Guzina, and S. Wojtkiewicz), paper m2303, Minneapolis 2008, on CD, 7 p.
12 Grosse, C.U., M. Krger, S. Bachmaier. 2008. Wireless monitoring of structures including acoustic
emission techniques, in Proc. Int. Conf. on Conc. Repair, Rehabilitation and Retrofitting (ICCRRR),
Cape Town, South Africa, Nov. 2008, Balkema Publ. Rotterdam (eds. M. Alexander et a.).
13 Krger, M., C.U. Grosse, J. Kurz. 2006. Acoustic emission analysis techniques for wireless sensor
networks used for structural health monitoring, in IABMAS'06 - Third International Conference on
Bridge Maintenance, Safety and Management, Porto.
14 Krger, M., C.U. Grosse, J. Kurz. 2007. Sustainable Bridges 5.5 - Technical Report on Wireless
Sensor Networks Using MEMS for Acoustic Emission Analysis Including Other Monitoring Tasks,
Report of Sustainable Bridges project,
http://www.sustainablebridges.net/main.php/SB5.5.pdf?fileitem=11681873.

Rev. 2010-07-07 38/52
11 Appendix
11.1 Hardware Description
11.1.1 Processor and Communication Board
Pin definitions
Table 9: MCU Sensor board connector X1 and X2
Item / Parameter Pin MCU-X1 MCU-X2
General-purpose digital I/O pin/slave in/master out of
USART0/SPI mode, I2C data USART0/I2C mode
P1 I2C_SDA_SI I2C_SDA_SI
General-purpose digital I/O pin/slave out/master in of
USART0/SPI mode
P2 SO SO
General-purpose digital I/O pin/external clock input
USART0/UART or SPI mode, clock output USART0/SPI
mode, I2C clock USART0/I2C mode
P3 I2C_SCL_SCLK I2C_SCL_SCLK
General-purpose digital I/O pin/slave transmit enable
USART0/SPI mode
P4 GIO10 GIO10
General-purpose digital I/O pin/Timer_A, clock signal at
INCLK
P5 GIO4
General-purpose digital I/O pin/Timer_A, compare: Out1
output/Comparator_A input
P5 GIO5
General-purpose digital I/O pin/ACLK output P6 GIO3
General-purpose digital I/O pin/conversion clock 12-bit
ADC/DMA channel 0 external trigger
P6 GIO8
output
P7 GIO2
General-purpose digital I/O pin/transmit data out
USART0/UART mode
P7 GIO11
output
P8 GIO1
General-purpose digital I/O pin/receive data in
USART0/UART mode
P8 GIO12
output
P9 GIO0
General-purpose digital I/O pin/main system clock MCLK
output
P9 GIO13
Digital supply voltage, positive terminal. Supplies all digital
parts.
P10 DVCC DVCC
Reset input, nonmaskable interrupt input port, or bootstrap
loader start (in Flash devices). Connected via 1nF to GND
and pull up resistor 47k to DVCC
P11 \RESET \RESET
Digital supply voltage, negative terminal. Supplies all digital
parts.
P12 GND GND
General-purpose digital I/O pin/analog input a7 12-bit
ADC/DAC12.1 output/SVS input
P13 ADC7
General-purpose digital I/O pin/analog input a2 12-bit ADC P13 ADC2
General-purpose digital I/O pin/analog input a6 12-bit P14 ADC6
Rev. 2010-07-07 39/52
ADC/DAC12.0 output
General-purpose digital I/O pin/analog input a3 12-bit ADC P15 ADC3 ADC0
Output of positive terminal of the reference voltage in the
ADC12 / or external reference voltage via Ref-IC and solder
bridge
P16 VREF+OUT VREF+OUT
Negative terminal for the reference voltage for both sources,
the internal reference voltage, or an external applied
reference voltage
P17 VEREF-_IN VEREF-_IN
Analog supply voltage, negative terminal. Supplies only the
analog portion of ADC12 and DAC12.
P18 AGND AGND

Table 10: MCU Sensor board connector X4 and X5
Digital supply voltage, negative terminal. Supplies all
digital parts.
P1 GND GND
Digital supply voltage, negative terminal. Supplies all
digital parts.
P2 GND GND

Table 11: MCU supply board connector X3
Item / Parameter Pin MCU-X3
Main supply voltage input, positive terminal. (+3.6V max) P1 VCC
Main supply voltage input, negative terminal. This is the main ground. P2 GND
Main supply voltage input, negative terminal. This is the main ground. P3 GND
General-purpose digital I/O pin/input for external resistor defining the DCO
nominal frequency
P4 GIO7
Analog ground. Supplies all analog parts. Can be connected via resistor 0R0 to
GND
P5 AGND
General-purpose digital I/O pin/Timer_A, capture: CCI1A input, compare: Out1
output
P6 P_DVCC
General-purpose digital I/O pin/Timer_A, compare: Out0 output P7 GIO9
General-purpose digital I/O pin/Timer_A, compare: Out2 output/Comparator_A
input
P8 GIO6
General-purpose digital I/O pin/switch all PWM digital output ports to high
impedance Timer_B TB0 to TB6/SVS comparator output
P9 GIO16
General-purpose digital I/O pin/auxiliary clock ACLK output P10 GIO15
General-purpose digital I/O pin/submain system clock SMCLK output P11 GIO14
Test clock. TCK is the clock input port for device programming test and
bootstrap loader start
P14 TCK
Test mode select. TMS is used as an input port for device programming and
test.
P15 TMS
Test data input or test clock input. The device protection fuse is connected to
TDI/TCLK.
P16 TDI
Test data output port. TDO/TDI data output or programming data input terminal P17 TDO
Reset input, nonmaskable interrupt input port, or bootstrap loader start (in Flash
devices). Connected via 1nF to GND and pull up resistor 47k to DVCC
P18 \RESET
Rev. 2010-07-07 40/52
General-purpose digital I/O pin/receive data in USART1/UART mode P19 UART1RX
General-purpose digital I/O pin/transmit data out USART1/UART mode P20 UART1TX

I
2
C addressing
The address of the silicon serial number chip DS28CM00 (IC8) is fixed at 0x50.

11.1.2 Power module
Pin definitions
Table 12: Power supply board connector X5 connected to MCU-X3
Not used, grounded via resistor 47k. Set MCUs port to input or to output low if
not other ways used
P1 UART1TX
Not used, grounded via resistor 47k. Set MCUs port to input or to output low if
not other ways used
P2 UART1RX
Resetting the MCU, connected via 10nF to ground and to X6 for reset button P3 \RESET
Open P4 TDO
Open P5 TDI
Open P6 TMS
Open P7 TCK
Measuring the current consumption at the ILIM-pin of IC5. Set MCUs port to
analog input. The max. value is about 0.5V if VCC is shorted
P8 ADC5
Measuring the battery voltage or the main supply voltage VCC, this is selectable
via 0R0 resistor. The voltage is divided by 2. Set MCUs port to analog input
and MCUs reference to 2.5V for converting
P9 ADC4
Digital output via resistor 330R to X6, anode LED (green) on external keyboard.
H = LED on
P10 GIO14
Digital output via resistor 330R to X6, anode LED (yellow) on external keyboard.
H = LED on
P11 GIO15
Digital output via resistor 330R to X6, anode LED (red) on external keyboard. H
= LED on
P12 GIO16
Connected to X6 via 1F to GND and pull up resistor 47k to VCC. Used for
function key on external keyboard. Set MCUs port to input. L = button pressed
P13 GIO6
Connected to X6 via 1F to GND and pull up resistor 47k to VCC. Used for
function key on external keyboard. Set MCUs port to input. L = button pressed
P14 GIO9
Connected via resistor 47k to GND. Set MCUs port to input. L = no connection
with PC via USB (signal is used on programmer board)
P15 P_DVCC
Analog ground. Supplies all analog parts. This line is connected via resistor 0R0
to GND
P16 AGND
Power state signal, connected via pull up resistor 100k to VCC. Important: Set
MCUs port to input! This signal is internal used for the power management. H =
battery power, L = solar power
P17 GIO7
Main supply voltage output, negative terminal. This is the main ground. P18 GND
Main supply voltage output, negative terminal. This is the main ground. P19 GND
Main supply voltage output, positive terminal. (+3.6V max) P20 VCC

Rev. 2010-07-07 41/52
Table 13: Connector X6 for plastic foil keyboard
Item / Parameter Pin X6
Output to anode low current LED P1 LED_RED
Output to anode low current LED P2 LED_GREEN
Output to anode low current LED P3 LED_YELLOW
Digital ground. Supplies all digital parts. P4 GND
Function button, switch to GND P5 USERINT_EXT
Function button, switch to GND P6 LED_on_off
Reset button, switch to GND P7 \RESET
Open P8 VCC_OUT

Table 14: Connector X7 for extern power (for example a small solar module)
Supply voltage input, negative terminal. This is the main ground. P1 GND
Supply voltage input, positive terminal. (optimal +5.2V to +6V) P2 V-EXT1

Table 15: Connector X8 for extern power (for example a small solar module)
Supply voltage input, negative terminal. This is the main ground. P1 GND
Supply voltage input, positive terminal. (optimal +5.2V to +6V) P2 V-EXT2

11.1.3 Multi-sensor board
Pin definitions
Table 16: Multi-sensor board connector X1 connected to MCU-X1 or to MCU-X2
I
2
C serial data, SHT15 serial data P1 I2C_SDA_SI I2C_SDA_SI
Open P2 SO SO
I
2
C serial clock, SHT15 serial clock P3 I2C_SCL_SCLK I2C_SCL_SCLK
Programmable I/O1 of ZMD31050 (IC101), remove
resistor R113 if not used and set MCUs port to output
low if not other ways used
P4 GIO10

GIO10

Power on Ch1 and Ch2 (L = power on, H = power off) P5 GIO4 GIO5
Event detection (INT, output of SMB380) P6 GIO3 GIO8
P7 GIO2 GIO11
P8 GIO1

GIO12

P9 GIO0

GIO13

Supply voltage. Supplies all digital and analog parts. P10 DVCC DVCC
Rev. 2010-07-07 42/52
Open P11 \RESET \RESET
Digital ground. Supplies all digital parts. P12 GND GND
Open, set MCUs port to output low if not other ways
used
P13 ADC7 ADC2
Analog output of ZMD31050 (IC101) P14 ADC6 ADC1
Open P16 VREF+OUT VREF+OUT
Not used, connected to AGND P17 VEREF-_IN VEREF-_IN
Analog ground. Supplies all analog parts P18 AGND AGND

Table 17: Multi-sensor board connector X4, connected to MCU-X4 or to MCU-X5
Open P1 GND GND
Open P2 GND GND

Socket definition
Table 18: Sensor connector BU101 and BU201, female sockets 4-pin
Item / Parameter Pin BU101 BU201
Normally negative supply to the sensor bridge
(configurable)
P1 Measuring
circuit IC101
Measuring
circuit IC102
Normally negative signal from sensor bridge
(configurable)
P2 Measuring
circuit IC101
Measuring
circuit IC102
Normally positive signal from sensor bridge (configurable) P4 Measuring
circuit IC101
Measuring
circuit IC102
Normally positive supply to the sensor bridge
(configurable)
P3 Measuring
circuit IC101
Measuring
circuit IC102

Figure 24. Female socket 4-pin, front side.

I2C addressing
Each ZMD31050 chip has a base address 0x78 that is always valid, but it is possible to program a
second address into the EE-Prom of the ZMD31050.

Table 19: I2C addresses
Item / Parameter Position IC101 IC201
Module connected with MCUs connector X1 Slot 1 0x74 0x75
Rev. 2010-07-07 43/52
Module connected with MCUs connector X2 Slot 2 0x76 0x77

11.1.4 Tilt and inclination sensor
Pin definitions
Table 20: Inclination and tilt sensor board connector X1 connected to MCU-X1 or to MCU-X2
I
2
C serial data, SPI serial data (master out, slave in),
SHT15 serial data
P1 I2C_SDA_SI I2C_SDA_SI
SPI serial data (master in, slave out) P2 SO SO
I
2
C serial clock, SPI serial clock, SHT15 serial clock P3 I2C_SCL_SCLK I2C_SCL_SCLK
Chip select, digital input of SCA830 (IC5), active low
enables serial data communication of IC5. This line is
connected via connector BU101 to the line CSB2 of
the external sensor board. If the power of the external
sensor board is switched off, hold this line low! A high
will provide a current flow into IC5.
P4 GIO10

GIO10

Active low enables the SPI-bus at the connector
BU201 and power on the external sensor board
P5 GIO4 GIO5
enables serial data communication of IC4. This line is
connected via connector BU201 to the line CSB1 of
the external sensor board. If the power of the external
sensor board is switched off, hold this line low! A high
will provide a current flow into IC4.
P7 GIO2 GIO11
used
P8 GIO1

GIO12

used
P9 GIO0

GIO13

used
P13 ADC7 ADC2
used
P14 ADC6 ADC1
used
P15 ADC3 ADC0

Table 21: Inclination and tilt sensor board connector X4, connected to MCU-X4 or to MCU-X5
Open P1 GND GND
Open P2 GND GND
Rev. 2010-07-07 44/52

Table 22: Sensor connector BU101, female socket 3-pin
Item / Parameter Pin Extern sensor board
Ground, supplies the external sensor board P1 GND
enables serial data communication of IC5 on the external
sensor board
P3 CSB2
Supply voltage, switched. Supplies the external sensor
board
P4 VDD

Socket definition
Item / Parameter Pin Extern sensor board
enables serial data communication of IC4 on the external
sensor board
P1 CSB1
SPI serial data, switched (master out, slave in) P2 MOSI
SPI serial data, switched (master in, slave out) P4 MISO
SPI serial clock, switched P3 SCK

Figure 25. Female sockets 4-pin and 3-pin, front side.

11.1.5 Air sensor
Pin definitions
Table 24: Air velocity sensor board connector X1 connected to MCU-X1 or to MCU-X2
I
2
C serial data, SHT15 serial data P1 I2C_SDA_SI I2C_SDA_SI
Open P2 SO SO
I
2
C serial clock, SHT15 serial clock P3 I2C_SCL_SCLK I2C_SCL_SCLK
P4 GIO10

GIO10

Power on sensor bridge (ZMD31050) and air velocity
sensor (L = power on, H = power off)
P5 GIO4 GIO5
Programmable I/O2 of ZMD31050 (IC101), remove P7 GIO2 GIO11
Rev. 2010-07-07 45/52
used
P8 GIO1

GIO12

used
P9 GIO0

GIO13

used
P13 ADC7 ADC2
Analog output of air velocity sensor, set the internal
MCUs reference to 2.5V for converting
P15 ADC3 ADC0

Table 25: Air velocity sensor board connector X4, connected to MCU-X4 or to MCU-X5
Open P1 GND GND
Open P2 GND GND

Socket definition
Item / Parameter Pin BU101
Normally negative supply to the sensor bridge
(configurable)
P1 Measuring circuit IC101
Normally negative signal from sensor bridge
(configurable)
Normally positive signal from sensor bridge (configurable) P4 Measuring circuit IC101
Normally positive supply to the sensor bridge
(configurable)

Item / Parameter Pin Air velocity sensor
Ground. Supplies the air velocity sensor P1 GND
Ground. Supplies the air velocity sensor P2 GND
Analog output of the air velocity sensor P4 Vout
Supply voltage, switched. Supplies the air velocity sensor P3 VCC

Rev. 2010-07-07 46/52

I2C addressing
Each ZMD31050 chip has a base address 0x78 that is always valid, but it is possible to program a
second address into the EE-Prom of the ZMD31050.

11.1.6 Impedance Sensor
Pin definitions
Table 28: Impedance converter board connector X1 connected to MCU-X1 or to MCU-X2
I
2
C serial data, SHT15 serial data (selectable) P1 I2C_SDA_SI I2C_SDA_SI
Open P2 SO SO
I
2
C serial clock, SHT15 serial clock (selectable) P3 I2C_SCL_SCLK I2C_SCL_SCLK
Select measuring frequency, input DIVA (bit0) of
oscillator-IC LTC6930
P4 GIO10 GIO10
Power on oscillator and measuring circuits (L = power
on, H = power off)
P5 GIO4 GIO5
SHT15 serial data (selectable) P6 GIO3 GIO8
Select measuring frequency, input DIVC (bit2) of
P7 GIO2 GIO11
SHT15 serial clock (selectable) P8 GIO1 GIO12
Select measuring frequency, input DIVB (bit1) of
P9 GIO0

GIO13

used
P13 ADC7 ADC2
used
P14 ADC6 ADC1
used
P15 ADC3 ADC0

Table 29: Impedance converter board connector X4, connected to MCU-X4 or to MCU-X5
Rev. 2010-07-07 47/52
Open P1 GND GND
Open P2 GND GND

Socket definition
Table 30: Connector BU101 to measuring object, female socket 4-pin
Analog ground P1
Measuring frequency output to measuring object P2
Measuring signal input from measuring object P4
Analog ground P3

Table 31: Connector BU201, female socket 4-pin
Open P1
Open P2
Open P4
Open P3


I2C addressing
The AD5933 chip has a base address 0x0D.
11.1.7 Electrometer
Pin definitions
Table 32: Electrometer board connector X1 connected to MCU-X1
Open P1 I2C_SDA_SI
Open P2 SO
Open P3 I2C_SCL_SCLK
Open, set MCUs port to output low if not other ways used P4 GIO10
Rev. 2010-07-07 48/52
Open P10 DVCC
Open P11 \RESET
Open P12 GND
Open, set MCUs port to output low if not other ways used P13 ADC7
Open P16 VREF+OUT
Not used, connected to AGND at X2 P17 VEREF-_IN
Open P18 AGND

Table 33: Electrometer board connector X2 connected to MCU-X2
I
2
C serial data, SHT15 serial data (selectable) P1 I2C_SDA_SI
Open P2 SO
I
2
C serial clock, SHT15 serial clock (selectable) P3 I2C_SCL_SCLK
Power on measuring circuits and enables the SPI-bus at the connector BU1
(H = power on, L = power off)
P5 GIO5
SHT15 serial data (selectable) P6 GIO8
SHT15 serial clock (selectable) P8 GIO12
Supply voltage. Supplies all digital and analog parts. P10 DVCC
Open P11 \RESET
Digital ground. Supplies all digital parts. P12 GND
Analog output of the measuring amplifier, set the internal MCUs reference
to 2.5V for converting
P15 ADC0
MCUs internal reference voltage, used for the measuring amplifier. Activate
this MCUs output.
P16 VREF+OUT
Not used, connected to AGND P17 VEREF-_IN
Analog ground. Supplies all analog parts P18 AGND

Table 34: Electrometer board connector X5, connected to MCU-X5
Open P1 GND
Open P2 GND

Rev. 2010-07-07 49/52
Socket definition
Table 35: Connector BU1 to scanner board, female socket 4-pin
Item / Parameter Pin Multiplexer
Positive supply +5V for the scanner board P1 VCC
I
2
C serial clock P2 SCL
I
2
C serial data P4 SDA
GND P3 GND

Table 36: Connector BU2, female socket 4-pin
Open P1
Open P2
Open P4
Open P3

Table 37: Connector BU101of scanner board, female socket 4-pin
VCC input, positive supply +5V P1
SDA, I
2
C serial data P2
SCL, I
2
C serial clock P4
GND P3


I2C addressing
The multiplexer has an I
2
C address of 0x20, but it is possible to change the address with hardware.

11.2 Database Description
Table 38: Table structure for table Cluster
Field Type Description Example
clusterid int
project int
Rev. 2010-07-07 50/52
name varchar(32)
description varchar(400)
sensors varchar(4096) Comma separated list of sensor IDs 1,2,3
Clusters are used to define a group of sensors.

Table 39: Table structure for table Command
cmdid int index
mote int Mote to process command
cmd varchar(40) Cmd text R 1000 2
timesend timestamp CURRENT_TIMESTAMP
timeanswer timestamp Time when answer is incoming
answer varchar(40) Ok 1234

Command transfer table. The user interface writes commands. The Gates are looking for
commands for their motes.
Table 40: Table structure for table Gates
gateid int
project int
name varchar(32)

Each gate has its entry

Table 41: Table structure for table Motes
moteid int 0x27
gate int 0
x int X GPS Coordinate
y int Y GPS Coordinate
z int Z GPS Coordinate
Miranda int flashed Miranda ID 2
Wboot int flashed Wboot ID 1
Rev. 2010-07-07 51/52
Each mote has its entry.

Table 42: Table structure for table Project
projectid int
name varchar(32)
date timestamp CURRENT_TIMESTAMP

Table 43: Table structure for table SHT15data
dataid int(10) 125445
sensor int(10) 1
time timestamp CURRENT_TIMESTAMP 1/12/2009 11:40:34
temp float 1.56
hum float 40.56
Data Table for all SHT15 data.

Table 44: Table structure for table SensorType
typeid int 1
name varchar(32) SHT15
description varchar(400) temperature and humidity sensor
tablename varchar(20) SHT15data

Table 45: Table structure for table Sensors
sensorid int 1
mote int 0x27
type int 1
With drypack sealed
waterproof
position varchar(32) Church floor south west

Table 46: Table structure for table Software
Rev. 2010-07-07 52/52
softwareid int 1 2
name varchar(32) Wboot Miranda SHT15app
svn int 125 120
description varchar(400) Wboot version 125
SHT15app version
Johanniskirche
crc int 0x1234 0x5678
length int 0x978 0x1234
data var(32000) //binary //binary

Table 47: Table structure for table SoftwareParameter
pramid int 1
software int 2
name varchar(32) sleep time
description varchar(400) measurement interval
address int 0x1080
length int 2
type int 1
upperlimit int 1200
lowerlimit int 1

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