1

Product L1-L2 Service Manual LIGHTING

Service Manual for DELL:Lighting, Venue Pro

Applicable for All Regions
US EU
9J.16RXX.XXX 9J.16SXX.XXX
850/1900/2100 900/2100/AWS



Version: 007
Date:2011/03/04
Notice:
- For ASP to input specific Legal Requirement in specific NS regarding to responsibility and
liability statements.
First Edition (Mar, 2010)
2
Content Index

1. About This Manual.....................................................................................3
1.1 Trademark............................................................................................................. 3
2. General Safety Instructions......................................................................4
2.1 SAFETY: General Safety....................................................................................... 4
3. Specification ..............................................................................................6
3.1 Function and Features .......................................................................................... 6
3.2 HW Specification................................................................................................... 6
3.3 SW Specification ................................................................................................... 9
4. Disassembly and Assembly Procedure ................................................11
4.1 Disassembly Procedure .......................................................................................11
4.2 Assembly Procedure ............................................................. !
5. Firmware & Image update process........................................................68
5.1 Firmware & Image update by Service Tool.......................................................... 68
5.1.1 How to set up the drivers in the PC?................................................................ 68
5.2 Firmware & Image update by Service Tool......................................................... 72
6. Diagnostic Program (Manual Test) ........................................................78
6.1 Introduction: ........................................................................................................ 78
6.2 Diagnostic Program Testing (Customer Interface Testing-CIT)............................ 78
6.3 How to get the Diagnostic Test Report by Service Tool?..................................... 94
7. Cosmetic Inspection Criteria..................................................................99
8. Lighting Service Repair Critical Issue................................................113
8.1 PVK Issue .........................................................................................................113
8.2 Network lock issue .............................................................................................113
8.3. Replace CPU Issue..........................................................................................113
8.4. Znue Mode and Composite Mode/ Non-shipment SW and Shipment SW........114
9. Generic Troubleshooting Guide ..........................................................115
9. Replace Internal SD card ...................................................................................115
9.2 Generic Troubleshooting Guide..........................................................................116

3

1. About This Manual

This manual contains information about maintenance and service of DELL products. Use
this manual to perform diagnostics tests, troubleshoot problems, and align the DELL
product.

1.1 Trademark
The following terms are trademarks of Dell Inc.: Dell

Importance

Only trained service personnel who are familiar with this Dell Product shall perform
service or maintenance to it. Before performing any maintenance or service, the
engineer MUST read the Safety Note.

































4
2. General Safety Instructions
You can find additional Safety Best Practices information on the Regulatory Compliance
website at www.dell.com/regulatory_compliance.

2.1 SAFETY: General Safety
Check the voltage rating before you connect the equipment to an electrical outlet. The
voltage and frequency available at the outlet should match the rating on your device.

Do not use your equipment in a wet environment.

Do not use damaged equipment, including exposed, frayed, or damaged power cords.

If your equipment does not operate normally in particular, if there are any unusual
sounds or smells coming from it unplug it immediately and contact an authorized
dealer or service center.

CAUTION: Use of controls, adjustments, procedures, connections, or signal types other than
those specified in your documentation may result in exposure to shock, electrical hazards,
and/or mechanical hazards.

Use only the Dell AC adapter approved for use with this device. Use of another AC
adapter may cause a fire or explosion.

Place the AC adapter in a ventilated area, such as desk top or on the floor, when you
use it to run the device or to charge the battery. Do not cover the AC adapter with
papers or other items that will reduce cooling also, do not use the AC adapter inside a
carrying case.

Ensure that nothing rests on the cables and that the cables are not placed where they
may be tripped over.

Do not use AC powered equipment during an electrical storm.

The AC adapter may become hot during normal operation of your device. Use care
when handling the adapter during or immediately after operation.

Use only the Dell-provided AC power cable with the AC adapter. Use of any other power
cable may damage the device or AC adapter or may present risk of fire or electric shock.


Do not use an auto adapter DC power cable connected via either an automobile
cigarette lighter adapter or an empower-type connector in vehicles with high voltage (24
VDC)

5
Stereo headsets:

Observe the following guidelines when connecting your equipment:
Check and ensure that the connector port is of the right type before connecting the
cable/headset to your device.
Use caution when gently placing the earpiece into each ear. The seal should be tight,
but do not push beyond the ear canal opening.

CAUTION: Excessively loud volume could damage your hearing. Turn down the volume before
you connect the headphones, and then raise the volume to comfortable level. The volume
should be turned down if you cannot hear people speaking near you.

SAFETY: Battery

CAUTION: Risk of explosion if battery is replaced by an incorrect type. Dispose of used
batteries according to the instruction.

A damaged battery may pose a risk of personal injury. Damage may include impact or
shock that dents or punctures the battery, exposure to a flame, or other deformation. Do
not disassemble the battery. Handle a damaged or leaking battery pack with extreme
care. If the battery is damaged, electrolyte may leak from the cells or fire may result
which may cause personal injury.
Keep the battery away from children.
Do not expose (store or place) your portable device or battery pack to a heat source
such as a radiator, fireplace, stove, electric heater, or other heat generating appliance or
otherwise expose it to temperatures in excess of 65C (149F). When heated to
excessive temperatures, battery cells could vent or explode, posing risk of fire.
Do not carry a battery pack in your pocket, purse, or other container where metal objects
(such as keys) could short-circuit the battery terminals. The resulting excessive current
flow can lead to extremely high temperatures and may cause damage to the battery
pack or surrounding materials, or personal injury, such as burns.
For Canada:








6

3. Specification
3.1 Function and Features
OS Windows Phone 7 (multi-touch UI)
Platform Qualcomm QSD8250 + Qualcomm PM7540 + Qualcomm RTR6285
Band
UMTS 850/1900/2100 GSM/EDGE 850/900/1800/1900 (AT&T US)
UMTS 900/2100/AWS GSM/EDGE 850/900/1800/1900 (T-Mobile US & EU)
HSDPA/HSUPA HSDPA 7.2Mbps /HSUPA 5.76 Mbps
Display 4.1 WVGA Samsung AMOLED
Camera 5M AF Camera
Video H.263/H.264, .3GP, MPEG4, WMV, DivX 4.x/5.x/6.x
Sound MP3, WMA, AAC, AAC+, eAAC+, AMR, Midi
Messaging Email,
Browser IE
Storage
8Gb Nand Flash + 4Gb LP DDR SDRAM
MicroSD card slot, 8GB microSD card
Connectivity WLAN802.11b/g, Bluetooth 2.1 EDR, USB 2.0 HS
Dimensions 64.4x121.6x14.9 mm (TBD)
Weight 199 g (TBD)
Battery 1400 mAh
Others
G-sensor, e-compass, proximity sensor, ambient light sensor, FM radio, GPS,
micro USB I/O
Accessory Data cable, Travel charger, Stereo Headset

3.2 HW Specification
Streak MID Hardware Specifications
Features Descriptions

Baseband
DBB+ABB Qualcomm QSD8250
PMIC Qualcomm PM7540 + TI TPS65023

RF
Transceiver Module Qualcomm RTR6285
GSM Band Support GSM/GPRS/EDGE Quad-band (850/900/1800/1900)
UMTS Band Support
UMTS/Band 1,2,5 (UMTS 2100/1900/850) for AT&T US
UMTS/Band 1,4,8 (UMTS 2100/AWS/900) for T-Mobile US & EU

7
GPS
GPS Qualcomm gpsOne solution ( Embedded in Qualcomm platform )

MCP (Memory)
MCP Vendor Hynix
Capacity 8Gbit (NAND)+4Gbit (LP DDR SDRAM)
Package 137-Ball FBGA, 10.5mmx13mm, 0.8mm pitch
NAND
Power supply voltage 1.7 to 1.95 V
Density 8Gbit = (1K+32) Words x 64 Pages x 8192 Blocks
NAND technology SLC
Nand page support 2K byte (1K words)
Interface x16 bus width. - Multiplexed Address/ Data
Unique ID for copyright protection
DDR-SDRAM
Power supply voltage 1.7 to 1.95 V
Density
4Gbit (16Mb x 4Bank x32bit /CS0 & CKE0 + 16Mb x 4Bank x32bit
/CS1 & CKE1)
Interface x32 bus width


WiFi/Bluetooth/FM
Azurewave AW-NH620A
Module
integrated Broadcom solution of BCM4329 WiFi/Bluetooth/FM SoC
WiFi
Single-band 2.4GHz IEEE 802.11b/g
Interface SDIO
Bluetooth
Specification Bluetooth Core Specification version 2.1+EDR features
Transmit Power Power class 1.5 device ,up to 5dBm transmit power
Interface UART / PCM (for audio gateway)
FM
Freq. 76-MHz to 108-MHz FM bands supported
RDS support
RDS and RBDS demodulator and decoder with filter and buffering
functions
Interface I2C

USB2.0
Data Rate (USB2.0
compliance)
Support low-speed (1.5 Mbps), full-speed (12 Mbps) and high-speed
(480 Mbps)

Audio
Microphone Knowles SPU0410LR5H-QB
Receiver 2403 260 00041 (NXP)
Loud Speaker 2403 260 00001 (NXP)
Headphone amplifier
TPA6136A2 (TI) 25-mW DIRECTPATH STEREO HEADPHONE
AMPLIFIER WITH POP SUPPRESSION
Loudspeaker amplifier PM7540 internal speaker driver (Class AB), 500mWatt into 8 ohm

LCD
LCD Module Vendor / Part
Number
Samsung / AMS410GJ02-0
8
Interface RGB-24 bits, SPI-3 line
Display Resolution 16.7M color , 480 RGB (H) x 800 (V)
Color depth 16/18/24bits
Display type AMOLED
Driver IC S6E63M0 By Samsung Electronics LDI
Contrast ratio 2000 (Min)
Optical response time 0.1ms @25oC
NTSC 90%(Min)
Brightness (w/o cover lens) 240 cd/m2 (Max)
Uniformity 90% @25oC

LCD Touch Panel
LCD Touch Panel Vendor /
Part Number
TPK / TCP41T4
Touch Panel Type Capacitive Sensor, Multi-touch
Interface I2C w/ Interrupt
Touch Driver IC Atmel MXT224 IC
Scan rate 60Hz (at least)

5M Camera
Module Vendor / Part Number Abico / QS56A883
Module dimension 8.5mm x 8.5mm x 6.25mm
Sensor Vendor / part number OmniVision / OV5642
active array size 2592x1944
lens size 1/4"
AF Support AF
Camera interface Parallel
Output format support
RAW RGB, RGB565/555/444, CCIR656, YUV422/420, YCbCr422,
and compression
Others Embedded ISP processing

Key
Key location
Side key : Volume Up, Volume Down, Power On, Dual Position -
Camera shutter Key
Main key :QWERTY keypad (37 keys)
Sensor key : Back, Start, Search (Capacitive sensor key / Atmel
solution)

SD
SD slots 1 internal (SD non-removable)
Interface Four-bit SD mode
SD Compliance SD Memory Card Physical Layer Specification version 2.0
Capacity Support Up to 32 GB SD/MMC memory cards
Internal SD capacity 8GB
Internal SD vendor SanDisk

Ambient Light Sensor
Vendor / Part Number TAOS / TSL2771
Control Interface I2C
Resolution 16 Bits
Light Spectrum close to human eyes (Peak sensitivity wavelength = 550nm)

9
E-Compass Sensor
Vendor / Part Number YAMAHA / YAS529 (3-axis electronic compass IC)
Control Interface I2C

G Sensor
Vendor / Part Number BOSCH / BMA150 (3-axis G sensor IC)
Control Interface I2C

Proximity Sensor
Vendor / Part Number TAOS / TSL2771
Solution TSL2771(TOAS) + IR LED SFH4650(OSRAM)
Control Interface I2C

Charging IC
Vendor / Part Number SUMMIT / SMB136
Charging input path
Automatic Input Current Limit for universal USB/AC/DC adapter
compatibility
Charging current limiting Programmable input current limiting.
Input voltage range +4.35 to +6.2V
Control Interface I2C

Gauge IC
Vendor / Part Number TI / BQ27500
Control Interface I2C
Battery Low Indication Interrupt Warning

Battery
Package Vendor / Part Number Foxlink / 8390-ZD01-0170
Cell type Sanyo UF613756F 1400mAh
Type of batteries Lithium Ion
Voltage 3.7V
Environmental using conditions
CHARGE: 0~45 C, 85%RH Max.
DISCHARGE: -20~50 C, 85%RH Max.

Accessory
USB Data Cable
For PC USB Sync / Charging with CLA / Charging with USB Power
Supply
USB Power Supply Mini-PSU, Charging with USB Data Cable
Earbuds 3.5phi headset with microphone and hook key


3.3 SW Specification
Windows Phone 7 Application
Alarms
Calculator
Calendar
Camera
Games
Internet Explorer
10
Maps
Marketplace
Messaging
Music + Videos
Office (OneNote; Excel; Word; PowerPoint; SharePoint)
People
Phone
Pictures
Settings
Email client
Start screen
Voice command
Bing search

Bluetooth profiles
Bluetooth 2.1 + EDR Stack
Bluetooth headset 1.1 profile
Bluetooth EDR (High Speed)
Bluetooth Hands Free 1.5 profile
Bluetooth A2DP 1.0 profile
Bluetooth PBAP

Preloaded Applications
TMO US Family Room
TMO US My Account
TMO US Pageonce
TMO US TeleNav GPS Nav
TMO US Mobile TV
MSFT Newsroom





11

4. Disassembly and Assembly Procedure
4.1 Disassembly Procedure

Disassembly tools

Two screw drivers (T5, cross), a metal tweezers, a plastic tweezers (contact lens tweezers), a Lifter.

Consumables for disassembly
4G.16R49.001 ADHESIVE HINGE SPK GLEOS1A


Cross
T5
4G.16R49.001 Green
12
Dis-Assembly Process (Total time elapsed: 00:08:15)
1. Turn off the device.

2. Push away up and open the battery cover. (5 s)


3. Removing the Battery. (5 s)

13
4. Adhere DSC key film (4K.16R11.001) on camera key (10 s)


5. Peel off the tamper evident label (4E.16R03.001)(10 s)

Ink printed on case4
Blank area on label
Attention:
Stick a tamper evident label to case4 after all is
repaired.

Attention:
End-user cant take out the SD card, so we
can check the label is good or fail.
14

6. Use T5 screw driver to screw off six screws on case4. (30 s)

Attention:
Please make sure the torque of screw must not exceed
0.7 0.15kgf cm
15
7. Insert the Lifter to the gap BTW case3 bezel and case4. Then, move along the gap as
below. (45 s)





Right side
Top side
Left side
Right side
Bottom side
16
8. Bend the case4 outward at MicroSD card rib as below and release case4. (10 s)



9. Use the plastic tweezers to release sub PCB (5E.16R11.001)from case4 hooks (blue
circles) as below. (10 s)

17
10. Use the plastic tweezers to release vibrator. (5 s)


11. Use the metal tweezers to release SPK FPC. (15 s)


12. Use the metal tweezers to release ESD tape (10 s)

18
13. Release case4 sheet (10 s)


14. Use the head of plastic tweezers to push out power key (10 s)

Attention:
Please be careful to push out power key and do not
damage the power key painting surface.
19
15. Use the plastic tweezers to release hook (10 s)


16. Use the plastic tweezers to release sub FPC 10 pins BtB (10 s)


17. Use the plastic tweezers to release keypad FPC 20 pins BtB (10 s)


20
18. Use the plastic tweezers to release slide FPC two 40 pins BtBs (20 s)




21
19. Using the plastic tweezers to release the camera BtB. (5 s)

20. Using the plastic tweezers to release audio jack BtB (5 s)


22
21. Using the plastic tweezers to release SPK (10 s)

Attention:
Remove the old slide SPK cushion
(4G.16R39.001) and stick a new slide SPK
cushion to slider module first when replacing the new
SPK to the slider module.
Do not remove SPK if SPK is OK.

23
22. Using cross screw driver to screw off three screws on slider module. (20s)


23. Release case3 bezel from bottom side. (10 s)


Attention:
Please make sure the torque of screw must not exceed
0.5 0.15kgf cm
24
24. Release keypad module. (5 s)

25. Use plastic tweezers to release keypad FPC module as below(20 s)




25

Attention:
Please be careful to remove the keypad FPC module
to avoid its tail (BtB side) crack
26
26. Using plastic tweezers to release sub FPC. (10 s)




27. Use T5 screw driver to screw off four screws on slider module. (20 s)

27
2.8. Insert the Lifter to the gap BTW case1 and slider module. Then, move along the gap as
below (45 s)





28


29
2.9. Release the slider module. (15 s)




30. Using plastic tweezers to release touch panel BtB. (10 s)

Attention:
First, open the slide hinge to make the hole bigger ,
then release the slider module.
Please be careful to disassembly the slider module
and do not yield the slider FPC on the OLED panel.
30
31. Using tweezers to release fixed cushion at bottom side of case1. (10 s)


32. Release OLED panel from case1 (10 s)


Attention:
Release the cushion slowly and carefully.
31
33. Using tweezers to take out the receiver (15 s)


34. Using plastic tweezers to release ZIF connector as below(15 s)


35. Using plastic tweezers to release slider FPC as below (25 s)

Attention:
Please be careful to push out the receiver and do not
damage the membrane of the receiver.
32


- 33 -

4.2 Assembly Procedure
Assembly tools



Consumables for disassembly
4G.16R49.001 ADHESIVE HINGE SPK GLEOS1A

Cross
T5
Primer
(3H.01105.001)
4G.16R49.001 Green
- 34 -

Assembly Process (Total time elapsed: 00:13:15)

1. Stick the receiver (2C.45017.131) to the case1 (6K.16R05.005). (15 s)


2. Remove the release films from case1 as below. (15 s)




Attention:
Please make sure the direction of receiver spring is
upward
Direction of Receiver spring
- 35 -

3.
Apply Primer(3H.01105.001) on Touch Panel(5F.3014L.021) with a brush. (10 s)


4. Remove the protective film from Touch Panel (5F.3014L.021). (5 s)


5. Stick Touch Panel on the case1 as below. (50 s)
Apply Primer
Do not apply on
IR & Light
sensor hole

- 36 -






FPC through case1 hole
FPC through case1 hole
Press to make sure touch Panel stick well
Press to make sure touch Panel stick well
- 37 -



Press to make sure touch Panel stick well
- 38 -

6. Remove the release films from case1 as below and stick FPC on case1. (20 s)




Align FPC with case1 rib
Stick FPC on
case1
- 39 -


7. Stick MYLAR 10 PINS BTB GLEOS1A (4K.16R29.001) on case 1 . (5 s)



Before

Align Mylar with red line
- 40 -

8. Stick Cushion (4G.16R44.001) on Case 1. (10 s)

9. Assemble slider FPC (5D.16R06.014) on LCDM (5F.0714L.022) as below. (40 s)




Open ZIF connector cover
Assembly ZIF connector
Remove release film on
LCDM
- 41 -







Remove release film on FPC
Align FPC with black line on LCDM
Align FPC with black line on LCDM
Remove release film on FPC
- 42 -


10. Assemble case1 and LCDM as below. (35 s)



Align FPC with black line on LCDM
Remove protective Film
Remove protective Film
Assemble case1 and
LCDM
- 43 -




11. Stick Mylar LCDM hinge (4K.16R09.003) on LCDM components (10 s)

Attention:
Please make sure Mylar covers all components on LCDM
Assembly BtB connector
Remove release Film
Align the FPC hole with case1 rib and stick on
- 44 -

12. Assembl case 1 and FILM SCREW CASE2 GLEOS1A (4K.16R20.001) (30 s)

Before


After


13. Assemble tape adhesive(4G.16R37.001) on sliding module.





14. Assemble case1 and sliding module (6E.16R01.004). (30 s)
(4G.16R37.001)
Let FILM SCREW hole aimed case 1 boss hole
Tape adhesive cant be over the line, and
exposed after case1 and hinge assembly.
- 45 -






Attention:
Please make sure slider FPC through sliding module hole
before assemble ase1 and sliding module to avoid slider
FPC damage.
Let FPC through sliding module hole
Attention:
The jig is only for the touch panel and Case1 being
replaced.
- 46 -

15. Press Touch Panel by Jig (10 s)


16. Use T5 screw driver to screw four screws (8F.00T96.2R2) on slider module. (20 s)







Attention:
Please make sure the torque of screw must not exceed
1.2 0.15kgf cm
- 47 -


17. Assemble keypad FPC (5D.16R05.013) on sliding module. (35 s)







Align FPC holes with sliding module
hole
Align FPC holes with sliding module rib Remove release film
Remove protective film
- 48 -


18. Assemble keypad (4B.16R09.002 or 4B.16R09.012) on case3 bezel assy (6K.16R06.001). (10 s)

- 49 -


19. Assemble case3 bezel assy on sliding module. (15 s)




Attention:
Please make sure case3 bezel two hooks are complete
inserted into sliding module to avoid interference during
sliding.
- 50 -

20. Using cross screw driver to screw three screws (8F.8A52R.2R4) on slider module. (20s)

21. Assemble sub FPC(5D.16R03.012) on sliding module. (15 s)







Remove release film
Align FPC hole with
sliding module hole
Attention:
Please make sure the torque of screw must not exceed
0.5 0.15kgf cm
- 51 -


22. Stick CUSHION DSC 2ND GLEOS1A (4G.16R47.001 ) on Camera (5F.180QF.012) (10s)


Before After




Align Cusion with red line
- 52 -


23. Assemble Audio Jack (5D.16R02.014) and Camera (5F.180QF.012) on main PCB (10s)


24. Assemble main PCB on sliding module as below (50 s)




Assemble sub FPC and keypad FPC BtB
Assemble slider FPC
BtB
Assemble slider FPC
BtB
Let main PCB into two hooks on the bottom
- 53 -





25. Assemble MYLAR SPK GLEOS1A (4K.16R30.001) on the SPK. (10 s)


Before



After





Let main PCB into hook on the top
Aling Mylar with red line

- 54 -


26. Assemble SPK (2C.40290.051) on the sliding module (15 s)


27. Assemble SHD Tape (4G.16R36.001) on the main PCB (10 s)



Remove the release film
Direction of SPK spring
- 55 -

28. Assemble MYLAR DSC KEY GLEOS1A (4K.16R27.001) (10 s)

Before




After





















Align Mylar with red line
- 56 -

29. Assemble TAPE GPS CONDUCTIVE GLEOS1A (4G.16R48.001) on the hinge. (10 s)


Before


After









align the red line
- 57 -



30. Assemble SPK CSN (4G.16R28.002) on the main PCB (20 s)



- 58 -


31. Assemble case4 sheet (3K.16R03.002) on case4 (6K.16S07.003) as below. (20 s)




Direction of groove
- 59 -


32. Assemble Vibrator (2C.46043.011) on case4 (10 s)


Vibrator
- 60 -

33. Assemble SPK FPC (4H.16R15.013) on case4 (10 s)


34. Assemble PWR key (4B.16R13.002) on case4 (10 s)

35. Assemble sub PCB (5E.16R11.001) on case4 (10 s)


Three hooks to fix sub PCB
Align FPC hole with case4 rib
- 61 -

36. Assemble ESD Tape (4G.16R33.002) on case4 (10 s)




37. Assemble TAPE DSC CONDUCTIVE GLEOS1A(4G.16R45.001) on case 4 (10 s)


.


After

38. Assemble DSC CSN(4G.16R38.002) on case4 (10 s)
Align with case4 rib
Align Tape with red line

Attention:
Tape DSC Conductive must paste in
the range of DSC CVR sheet edge
- 62 -


39. Assemble case4 and sliding module (10 s)




Attention:
Please make sure Top hook of case4 has click into the
sliding module
- 63 -

40. Assemble Tank mylar (4K.16R32.001) on case4. (10 s)




41. Assemble seal label (4E.16R03.001) on case4. (10 s)


Tank mylar should be aligned the wall, and
cant over the case4 surface.
- 64 -

42. Use T5 screw driver to screw six screws (8F.00T16.3R8) on case4. (30 s)


43. Assemble Warranty label (4E.G8702.002 ). (5 s)



44. Assemble Battery (2C.214L0.001). (5 s)

Attention:
Please make sure the torque of screw must not
exceed 0.7 0.15kgf cm
Warranty label (4E.G8702.002 )
- 65 -


45. Assemble battery cover (6K.16R04.004). (5 s)


46. Stick FILM battery cover GLEOS1A(4K.16R23.001) on battery cover(10 s)









Let protect film aimed battery cover edge
- 66 -


47. Exchange the protect file on the touch panel with film TP Protect (4K.16R17.001). (10 s)

48. Exchange the protect file on case 1 with film Protect case 1 x 2pcs (4K.16R16.001) (20 s)

- 67 -

49. Exchange the protect file on case 4 side rail with Film Side Rail x 2pcs (4K.16R14.001) (20 s)













50. Assemble the screw mylar(4K.16R07.002), and exchange the protect film on case2 back side with
film Protect case 2 (4K.16R18.001) (20 s)





Attention:
Please make sure the screw mylar can not over
the screw hole.
Screw mylar(4K.16R07.002)
Protect film(4K.16R18.001)
- 68 -

5. Firmware & Image update process
5.1 Firmware & Image update by Service Tool
5.1.1 How to set up the drivers in the PC?
Instruction:
Drivers: Need the two drivers to make sure that the service tool is functioning well. The setup package only install
driver at the first time.

LightningUSBDriver Auto set up in the PC when you install Service Tool. But user needs to
install the driver.
Zune Driver and Zune Software Need follow up process.

Install Lightning USB Driver:
1. Lightning USB Driver will be launched automatically after user has finished installing the
service tool.
2. Use default settings, click Next or Install buttons to complete installation.



- 69 -




- 70 -


Driver installation finishes here, and the installer will continue with Zune install (if included).

Install Zune Software
If Zune Software is included in the service package, it will be automatically launched. Otherwise,
you are strongly recommended to search for and download the Zune from Zune or Microsoft
website, whichever available. If Zune is not properly installed in the PC, the download function
will not work as expected.

Instructions:
1. Click Accept when Microsoft License Terms page shows up.
2. It takes a while to prepare and install the Zune Software.
3. Wait until the Zune Software Installation Complete pop up. Click Close
Click Accept to continue.
Wait patiently.
- 71 -

Click Close to finish.

Important
Download cannot proceed if Zune Software is executing, and thus, never launch the Zune
Software when you are using the service tool.

- 72 -

5.2 Firmware & Image update by Service Tool
Requirement :
Lighting Image file folder
Lighting Service Tool L1-L2
Lighting Min-USB cable

Naming Rule
In the EM mode, the SW naming rule is below. If you are into the OS modedevice about, the SW
naming is defined by Microsoft. The rule is still defining now, will update it when rule is down.


Region/Country Code table:

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Service Tool file configuration:

Instill the Lighting Service Tool in the PC.



Turn on the Lighting Service Tool.
Report: You can turn on the report to get the all report.
Driver: You can turn on the report to get the all driver.

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Firmware & Image Upgrade Process
Important notice:
Lighting SW download mode is the Zune Mode and the device default setting is
the Zune Mode for user use.
We cant do any Service Tool function in Zune mode, so we need upgrade Non-
shipment SW version in device for the service Tool function and repair purpose.
After finished the all repair process, please upgrade shipment SW in the
Device.
Non-shipment SW N- GLEOS1A302933
Shipment SW GLEOS1A302933

a. SW download

Launch LightningServiceTool.exe and you will be prompted to input COM Port. Please input the
COM port number shown at Qualcomm WinMobileDiagnostics 3199. Here, you should input 102,
and click OK.

Figure 1


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Figure 2
Then, the main dialog will show up.

Figure 3
Please switch to Zune Mode to continue with Download function. The purpose of Download is to
update the firmware of the device. You must have the firmware file, a file with .ffu extension.
Click on browse to select a ffu file, and then click Download.
PS: Please key-in or screen the IMEI number for the report, because the Microsoft cant do any
thing in the Tool.

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Figure 4

While download is in progress, a terminal will show up and disappear as the download finishes.

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How to get the download report?
1. Please find the Report Lighting download log.





2. Please find the file and open it. LEOS1A_354000030026498_20100319145439.xml



Download report content:


IMEI P/N Download time
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6. Diagnostic Program (Manual Test)
6.1 Introduction:
The Diagnostic Program can to perform the unit function test. Before or after repair the device, you
should run this program to check the unite function.
The Lightings diagnostic program is calling Customer Interface Testing-CIT , which is a device-side
test, done with an application inside the mobile phone called EM Application, which totally has 15 test
items as shown in below.
There are fifteen test items:
[01] TOUCH_PAD
[02] SDCARD
[03] SIMCARD
[04] AUDIO_LOOP
[05] BATTERY Test
[06] CHARGING Test
[07] VIBRATOR
[08] SLIDER
[09] LED_TEST
[10] ECOMPASS Test
[11] GSENSOR
[12] LCD_DISPLAY
[13] BACKLIGHT
[14] KEYPAD
[15] CAMERA

6.2 Diagnostic Program Testing (Customer Interface Testing-CIT)
How to into the Diagnostic Program (Customer Interface Testing-CIT)?
1. Press Power on the device.
2. Please download non-shipment SW image.
3. Pretend that you are calling somebody with number ##634#, and EM will display.
4. Choice the EM mode, you can see the CIT.
5. Press the Customer Interface Test into the mode.
6. Finish the CIT, please reset your phone for factory reset and close the EM mode.
7. Into the Settingaboutreset your phone. The end-user cant see the EM mode.
Please check the EM is closed
before ship to end-user.
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Diagnostic Program testing (Customer Interface Testing-CIT)
Before we start the test, please prepare an earphone and a charger (or a micro USB cable connected to
a computer), and ensure that the SD card and the SIM card have been inserted properly. For operation
details, please refer to the following instructions listed in Table 3:

Detail operation instructions Display
1. Launch EM Application, and you will see the display
as the next figure. Press the Start button to enter
EM Application. During the test, the keypad and all
keys are locked (unless the keypad test item itself),
and user interaction is only enabled through the
touch screen.

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2. The first test item is IC test. This is an automatic
test so please just wait the application to determine
by itself whether the item passes or fails.

3. The second test item is LCD test. Here, a 3x3 plain
grid is shown, and user is intended to tap on each
cell of the grid. Once the LCD responds to user
finger touch, the color of the cell will turn green, as
shown in the next figure. Please finish all the cells
to pass this item test, and the display of the next
test item will follow immediately as this test item
finishes.

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4. The next test item is SD card test. This is an
automatic test to test whether the device can detect
the existence of SD card. Please be noted that SD
card must be inserted to pass the test. If the test
passes, the next test will show up immediately,
while if the test fails, the Fail button at the bottom
will be enabled and user has no other choice
except to tap on the Fail button to continue the test.

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5. SIM Card test is also an automatic test and the
behavior of this item is similar to that of SD Card
test.

6. The following test item is audio test. Plug in the
earphone that has been prepared in advance. The
OK button will be enabled only after earphone has
been detected.

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Please blow on the phones microphone and
listen from the earphone, pretending that you are
talking on the phone and listening using an earphone.


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Next, blow on earphone microphone and listen
from the phone receiver, pretending that you are
listening to a phone call and speaking using an external
microphone connected to it.

Next, blow on the earphone microphone again
but listen from the phones loudspeakers, which are
located at the bottom of the phone device.

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Now, unplug the earphone and continue with
the MP3 test. You should hear MP3 music playing from
the loudspeaker.

7. The next test item is battery test. This is an
automatic test and you will be prompted to the next
test item after the battery information has been
displayed..

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8. Next is charging test. Follow the instruction
displayed on screen and select OK to continue. If
charger is detected, Charger Status will show
Charging and the display is switched to the
display of the next test item. Please do not use a
fully-charged battery to do this test.

9. Vibrator test is quite straightforward. Select "Pass"
if the phone is vibrating and "Not" otherwise.

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10. The following test is slider test. Please move the
slider up, and then down, and the Slider Status
should reflect to the slider movement and show
Open and Close respectively. If the test item
passes, the display will forward you to the next test
item.

11. There are 3 LEDs to be paid attention to: ensure
that the keypad backlight, frontkey backlight and
camera light are on.

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12. Compass test is an automatic test, wait for the
result and move on to the next step.

13. The next is GSensor test. Flip over the phone so
that the screen faces down, then return it to normal
position and wait for the result.

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14. The objective of LCD Display is to examine if the
LCD has any bad pixels. Please watch carefully
and ensure that no bad pixel exists on either one of
the sequence of different background colors: white
red blue green black RGB.



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15. The next test is backlight test. Select Pass if the
screen blinks three times and Not otherwise.

16. The objective of Keypad test is to guarantee that all
keys attached to the phone are functioning well,
including keypad, front keys (back key, start key,
search key) and keys at the right side of the phone
(volume up/down keys, camera key). Press each
key separately and the corresponding character(s)
displayed on screen will disappear.

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17. The last test item is camera test. Press Go to
camera and take a picture shoot.

18. End of the test.

Table 1


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6.3 How to get the Diagnostic Test Report by Service Tool?

1 If you need the Diagnostic Test Report, please upgrade the Non-shipment SW version and change to
Composite mode.
2 How to Into the Composite mode? Please in to the EM mode and select the Service Center. Please choice the
Composite icon and Key in *#301# into the Composite mode.
3 Plug USB cable, the device would change to the following mode
4 Tool would automatic detect connection and show the information of the device. The Tool just can show the
last testing result.
5 After finish all repair reprocess, please run the Data Clean function to change the Zune mode and
close EM.
6 After finish the Data clean, please upgrade shipment SW version for the user mode.
6.1 No connection
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6.2 Connected with all PASS item

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7 Report: You can go to the Report and find the folder Device Information.
The all report will store in the there and the format is the XML.



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a. How to into Composite Mode?
Instructions:
Composite Mode is only can do any function with service Tool, but cant release to
customer. Pleas make sure device is the Zune Mode before ship out.
1. Pretend that you are calling somebody with number ##634#, and EM will display.
2. Choose Service Centre.
3. Scroll to bottom and choose Composite mode, then input the secret number *#301#
4. The device will reboot itself and In the Composite mode.


Tap on the middle icon for keypad, input ##634# and press call.

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The EM will show as follow, choose Service Centre.

Then scroll to bottom and choose Composite

Sorry Application will show as following, input *#301*
Input *#301# in the edit box.
Then, press ok and wait for the phone to reset by itself.

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7. Cosmetic Inspection Criteria
Table 1: Surface Class
Surface Class
Item Part Description Class AA Class A Class B Class C Class D
1 Touch panel
(window area)

(Border
area)

2 Front case


3 Bezel L & R


4 Rear Case


5 Battery Cover


6 Camera Lens


7 Flash Lens


8 Volume Key


9 Power Key


10 Camera Key


11 Vibe key


12 Receiver Metal mesh


13 Acoustic Metal mesh


14 Chrome ring


15
Rear case under Battery
Cover



16 Battery cover back side


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Figure 1: Front View







Touch panel
(Border area)
Class A

Front case
Class A
Touch panel
(Window area)
Class AA

Bezel left
Class A
Bezel right
Class A
Receiver metal
mesh
Class A
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Figure 2: Back View



Flash Lens
Class A
Camera Lens
Class AA
Battery cover
Class A
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Figure 3: Top View














Figure 4: Bottom View













Power key
Class A
Rear case
Class A
Chrome ring
Class A
Acoustic metal
mesh
Class A
Rear case
Class A
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Figure 5: Side View











Figure 6: Inside View

Vibes key
Class A
Volume key
Class A
Camera key
Class A
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Rear case under
Battery Cover
Class B
Battery cover back
side
Class B
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Table 2: Assembly Gap & bump Table
Item Component1 Component2
Min
(mm)
Max
(mm)
Design value
(mm)
Direction Fig #
1 Touch panel Front case 0 0.35 0.1 Y 8
2 Touch panel Bezel L & R 0 0.35 0.1 X 8
3 Rear case Front case 0 0.3 0.1 Z 9
4 Rear case Bezel L & R 0 0.3 0.1 X 9
5 Rear case Battery cover 0 0.3 0.1 Z 9
6 Battery cover Bezel L & R 0 0.3 0.1 X 10
7 Volume key Bezel R 0 0.4 0.15 All round 11
8 Camera key Bezel R 0 0.4 0.15 All round 11
9 Vibe key Bezel L 0 0.4 0.15
All round
(except the
moving direction)
11
10 Power key Rear case 0 0.4 0.15 All round 9
11 Chrome ring Rear case 0 0.3 0.1 All round 9
12 Rear Case I/O connector 0 0.40 0.2 All round 9
13 Volume key Bezel R 0 0.4 0.2 X 14
14 Camera key Bezel R 0.1 0.5 0.3 X 14
15 Vibe key Bezel L 0.3 0.7 0.5 X 14
16 Power key Rear case 0 0.4 0.2 Y 15
17 Camera lens Center of DSC 0 1.1 0 X;Y 13
18 Main lens artwork LCM AA area 0 0.55 0 X;Y 12


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Figure 8:








Figure 9:






x
y
z
#1 Max 0.35

#1 Max 0.35

#2 Max 0.35

#2 Max 0.35
x
z
y
#3 Max 0.3

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Figure 10


#12 Max 0.4
#4 Max 0.3

#4 Max 0.3
#11 Max 0.3

#10 Max 0.4
#5 Max 0.3

x
y
z
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#6 Max 0.3

#6 Max 0.3
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Figure 11










z
y
x
#7 Max 0.4

#9 Max 0.4
#8 Max 0.4

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Figure 12








x
y
z
X2
X1
Y1

Y2
#18
Display skew
Y-axis
|Y1-Y2|
#23
Display skew
X-axis
|X1-X2|
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Figure 13





Figure 14






x
y
z
y
x
z
#14 Max 0.5

#13 Max 0.4

#15 Max 0.7

Cmos Lens
edge

Cmos Lens
edge

X1 X2
Y2
#17
DSC shift
X-axis
|X1-X2|
#17
DSC shift
Y-axis
|Y1-Y2|
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Figure 15







#16 Max 0.4

x
y
z
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8. Lighting Service Repair Critical Issue
8.1 PVK Issue
Reason and Requirement:
Windows 7 phone needs the single PVK with each IMEI for the cloud service.
The internal SD card need match device when first power on.
The internal SD card cant take out by end-user.
Action:
1. Please put the internal SD card before assembly.
2. Please re-download image after assembly.
3. Tamper evident label avoid end-user take out the SD card.

8.2 Network lock issue
Reason and Requirement:
Windows 7 have high security requirement needs the FSN and RSA number when
network lock the device.
Only replace new flash need network lock, if needed.
Action:
1. Add the FSN and RSA information in the Shipment data.
2. Request the Dells ITS to modify the data transfer process.

8.3. Replace CPU Issue
Reason and Requirement:
Windows 7 have high security requirement, the CPU has the secure key link with Flash.
If we replace CPU, we should also change Flash together. Because the flash can read
the original Secure key and cant power on the device.
Action:
1. When you replace the CPU, please also change Flash together.
2. Base on our experience, the CPU failure rate is very low.

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8.4. Znue Mode and Composite Mode/ Non-shipment SW and Shipment SW
Reason and Requirement:
The device default setting is Znue Mode with shipment SW version.
The Znue Mode is the user mode and is only for the download use.
The only Non-shipment SW and change the mode from Zune mode to Composite Mode.
The only Non-shipment SW and Composite Mode can do the service repair with the
service Tool and Jig.
Before ship to end-user, please make sure the device is on the Znue Mode with
shipment SW version. Its very important. If its not the Znue Mode, the end-user cant
use the device.
Action:
1. Please download Non-shipment SW and change mode to Composite Mode for the
service repair purpose.
2. After finished all Service repair process, please change mode to Zune mode(Run Date
Clean) and upgrade the Shipment SW version for the end-user use.
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9. Generic Troubleshooting Guide
9. Replace Internal SD card
Please be noticed the internal SD only can use the 5D.16R14.021, others will be incompatible.

5D.16R14.021 #CARD SD 8GB SDSDQ-8192-859

1. Please take in the internal SD card before assembly and SW download.
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9.2 Generic Troubleshooting Guide

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