New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21

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The current trend in electronics toward higher performance products that are smaller and
lighter than ever before goes hand-in-hand with higher density mounting of increasingly
miniaturized semiconductor devices that contain more and more terminals. In addition, the
environmental restrictions on the use of hazardous substances in electric and electronic
equipment as mandated by the RoHS Directive in the E.U. have eliminated the use of
leaded solder. These societal changes are bringing about a stronger demand for more
precision and accuracy in reliability testing.
In response to this need for better reliability testing, we at Espec have developed the
TCC-150W Rapid-rate Thermal Cycle Chamber. This model exhibits rapid temperature
change of at least 20C per minute (average chamber temperature change with no
specimens), and offers high-performance temperature cycles with linear control capacity at
a maximum 15C per minute with specimens.


Photo 1 The Rapid-rate Thermal Cycle Chamber TCC-150W















Toshifumi Nakasuji Environmental Test Business Headquarters, Business Control Department
Norihiro Kajiguchi Technical Development Headquarters, Technical Center
Topic 2
New product: Rapid-rate Thermal Cycle Chamber TCC-150W
Introduction
1
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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We previously noted that products now are higher performance as well as smaller and
lighter than ever before, and contain higher density mounting of increasingly miniaturized
semiconductor devices with more terminals. This situation creates new problems.


Higher density mounting of semiconductor devices has led to extremely high operating
temperatures. Turning a device on or off creates a temperature cycle inside the equipment.
This in turn creates repeated thermal expansion/contraction between the device and the
PCB, causing the differences in the coefficient of thermal expansion of each material to
produce thermal distortion, which creates stress on the solder joints. This process is a
major cause of failure. (Refer to Fig.1.)



Fig.1 Stress on solder joints caused by temperature cycles
















Device and mounting changes
2
2-1 Effects of the temperature cycle
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

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Summary of standards
Number of standard : IEC 60749-25 (JESD22-A104B)
Name of standard : Temperature cycling
Range of application : Solder joints of semiconductors and assembly PCBs
Temperature range : -40/125C, 0/100C, -25/125C, etc.
Temperature ramp rate : Specimen temperature max. 15C/min.
(10 to 14C/min. recommended)











The miniaturization of semiconductor devices and their increased number of terminals has
led to the change from QFP (Quad Flat Packages) to BGA (Ball Grid Arrays) and CSP (Chip
Scale Packages). (Refer to Fig.2.)


Fig.2 Device structural changes
New JEDEC standards (JESD22-A104B) have been issued for evaluating solder joints.
When using these standards to evaluate solder joints in such applications as flip chips, BGA,
and laminated packages, mild temperature changes are crucial to successful testing. These
standards specifically mandate a specimen ramp rate of a maximum 15C per minute.
These standards have been incorporated into the IEC standards as of July 2003, and
constitute a significant new method of evaluation.
2-2 Device structural changes
New test standards
3
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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The new model TCC-150W incorporates a specimen temperature ramp control function.
Thermocouples are attached to the specimens, and the specimen temperature may be
controlled linearly at a selected ramp rate. (Refer to Fig.3.)


Fig.3 Specimen temperature in ramp control





















New product features
4
4-1 Specimen temperature ramp control
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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To keep the specimen temperature changes at the targeted ramp rate during the
specimen temperature ramp control, specimen temperature changes are simulated and
optimal air volume is determined. The heat transfer rate is crucial when using air as a
medium for transferring temperature to the specimens. If the air volume is insufficient, the
heat transfer rate will be too small to affect the specimens even if the chamber temperature
is changed. When test conditions call for a short soak time, the test may move on to the
next cycle before the specimens have reached the targeted temperature. With optimal air
volume, specimen temperatures change in response to changes in the chamber
temperature, the targeted ramp rate is quickly reached, and the targeted temperature is
reliably attained. (Refer to Fig.4.)


Fig.4 Specimen temperature change at different air volumes














The IEC/JEDEC test standards prescribe the specimen temperature ramp rate at a
maximum of 15C per minute (10 to 14C per minute recommended). Since conventional
chambers lack the capacity to control specimen temperature, performing tests in
compliance with test standards required preliminary testing to monitor specimen
temperatures. Also, careful adjustments were required to the test conditions and the
quantity and placement of the specimens to insure that the specified temperature ramp rate
for the specimens would be attained. Now, using its specimen temperature ramp control,
the TCC-150W has the capacity to simply and accurately perform the tests according to
IEC/JEDEC standards by merely attaching thermocouples to the specimens.
4-1-1 Optimal air volume for specimen temperature in ramp control
4-1-2 Effectiveness of specimen temperature ramp control (1): Test adaptation to
IEC/JEDEC standards
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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One crucial aspect of evaluating specimen life with temperature cycling is to attain uniform
conditions of specimen distortion. Differences in the thermal coefficients of the different
materials cause distortion in the specimens. Attaining a uniform speed at which this
distortion occurs and attaining symmetry between the distortion waveform and the rise and
fall in temperature are crucial to this test. Test dispersion is created when these factors
differ with each test, and such tests exhibit poor standardization and reproducibility. When
tests exhibit dispersion, specimen life cannot be accurately determined. The TCC-150W
allows the operator to set the ramp rate control for the specimen temperature, creating the
ability to attain uniform distortion speed and a symmetrical distortion waveform, providing
accurate specimen life evaluation. (Refer to Fig.5.)


Fig.5 Comparison of temperature waveform



























4-1-3 Effectiveness of specimen temperature ramp control (2): Accurate specimen life
evaluation capability
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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The TCC-150W has achieved dramatic improvement in temperature uniformity during
temperature change. The model identifies optimum air volume and velocity uniformity
through simulation and then attains those targets. Stress on the specimens can vary widely
during temperature change due to differences in uniformity. Differences in stress due to
specimen placement positions inside the chamber have been reduced to a minimum. (Refer
to Fig.6.)


Fig.6 Temperature uniformity data
















4-2 Improved temperature uniformity
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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The TCC-150W attains a temperature change rate of 20C per minute (average chamber
temperature with no specimens). This model is very useful for tests requiring fast
temperature change, as well as for dramatically reducing test times. (Refer to Fig.7.)

Fig.7 Test time reduction






















4-3 Fast temperature change capability
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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The TCC-150W complies with both JEDEC and IEC standards as well as a number of other
test standards.
Table 1 Major applicable standards
Temperature setting
High temp.C Low temp.C
Temperature
change rate
Number
of cycles
G +125 (+15, -0) -40 (+0, -10)
I +115 (+15, -0) -40 (+0, -10)
J +100 (+15, -0) 0 (+0, -10)
K +125 (+15, -0) 0 (+0, -10)
L +110 (+15, -0) -55 (+0, -10)
N +80 (+15, -0) -30 (+0, -10)
IEC 60749-25
(JESD22-A104B)
O +125 (+15, -0) -25 (+0, -10)
15 C /min.
or less
(specimen temp.)
1, 5, 10, 15min.
after
specimen temp.
attainment
Not
specified
A +85 (+10, -0) -40 (+0, -10)
6.25 C /min.
(specimen temp.)
JESD22-A105B
B +125 (+10, -0) -40 (+0, -10)
5.5 C /min.
(specimen temp.)
10 min.
after
specimen temp.
attainment
1000
TC1 100 0
TC2 100 -25
TC3 125 -40
TC4 125 -55
IPC-9701
TC5 100 -55
20 C /min.
or less
(specimen temp.)
10 min.
after
specimen temp.
attainment
200
500
1000
3000
6000
A +125 (+3, -0) -65 (+0, -5)
IPC-TM-650 2.6.6
B +85 (+3, -0) -55 (+0, -5)
Not specified 30 min. 5
IEC-60068-2-14 Nb
(JIS C 0025 Nb)
+1752
+1552
+1252
+1002
+852
+702
+552
+402
+302
-653
-553
-403
-253
-53
+53
10.2 C /min.
30.6 C /min.
51 C /min.
(Averaged over
a period of not
more than 5 min.)
3 hours
2 hours
1 hour
30 min.
10 min.
(3 hours unless
otherwise specified
in the relevant
specifications)
2
IEC-61747-5
(EIAJ ED-2531A)
+1002
+952
+902
+852
+802
+752
+702
+652
+602
+552
+502
+452
+402
+352
+302
-503
-453
-403
-353
-303
-253
-203
-153
-103
-53
-03
1 0.2 C /min.
3 0.6 C /min.
5 1 C /min.
(Averaged over
a period of not
more than 5 min.)
3 hours
2 hours
1 hour
30 min.
10 min.
(3 hours unless
otherwise specified
in the relevant
specifications)
2



















Compliance with test standards
5
Test standard Soak time
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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Table 2 shows the main specifications for the new model.

Table 2 Main specifications
Model TCC-150W
Temperature control system Balanced temperature control (BTC) system
Working temperature range +5 to +35C
Temperature
range
-70 to +180C
Temperature
fluctuation
0.5C (-70C to +180C) when temperature is stable
- 70 +180C
No specimens (average chamber temperature change)
At temperature rise :22C /min.
At temperature fall :18C /min.
Chamber
Temperature
change
- 40 +125C
Specimens :total 9 kg
Glass epoxy PCB + jigs (Espec standard product)
At ramp control : 5 to 15C /min.
Performance
*1
Specimen
Temperature
change
- 40 +125C
Specimens :total 9 kg
Glass epoxy PCB + jigs (Espec standard product)
At ramp control : 5 to 15C /min.
Load capacity of
specimen basket
5 kg per basket (evenly distributed)
7 shelves can be mounted
Test area dimensions W800 H500 D400 mm (effective test area)
Loading capacity 160 L
Outer dimensions W1000 H1808 D1915 mm
Weight Approx. 950 kg
Power supply
200V AC 3 phase 3W 50/60Hz
208V AC 3 phase 3W 60Hz, NEC spec.
*2

220V AC 3 phase 3W 60Hz
380V AC 3 phase 4W 50Hz
400V AC 3 phase 4W 50Hz, CE spec.
*3

*1: Performances are based on IEC 60068-3-5: 2001.
*2: This equipment is in compliance with the requirements of the National Electric Code (NFPA 70)
for the United States of America.
*3: This equipment is in compliance with the requirements of the European Community Directives.














Specifications
6
New product: Rapid-rate Thermal Cycle Chamber TCC-150W

Espec Technology Report No21
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Our new product, the Rapid-rate Thermal Cycle Chamber TCC-150W, embodies a new
product concept with its specimen temperature ramp control function. Temperature cycle
tests now have the capability of meeting previously unattainable temperature test
standards. We at Espec are offering a new test method with this model, which will serve as
our new standard model. We believe that our customers will find that this model can play a
major role in improving product reliability and in improving productivity by reducing testing
time.


Contact information
For a catalog or more information on the TCC-150W Rapid-rate Thermal Cycle Chamber,
please contact the Espec International Business Headquarters or your nearest local Espec
dealer.





Conclusion
7