Structure
Features
Silicon gate CMOS IC
A wide instruction set (213 instructions) which covers
various types of data
16-bit operation/multiplication and division/Boolean bit operation instructions
Minimum instruction cycle 333ns at 12MHz operation
Incorporated ROM
40K bytes (CXP85840A)
48K bytes (CXP85848A)
56K bytes (CXP85856A)
Incorporated RAM
2176 bytes (Excludes closed caption decoder and VRAM for on-screen display)
Peripheral functions
A/D converter
8-bit 6-channel successive approximation method
(Conversion time of 26.7s at 12MHz)
Serial interface
8-bit clock sync type, 1 channel
Timer
8-bit timer
8-bit timer/counter
19-bit time-base timer
Closed caption decoder
Data slicer
Corresponds to FCC (EDS supported), 8 13 dots, 192 character types
15 character colors, 4 lines 34 characters
frame background 15 colors/ half blanking
italic, underline, vertical scrolling
On-screen display (OSD) function 12 16 dots, 192 character types, 15 character colors
2 lines 24 characters
frame background 8 colors/ half blanking
background on full screen 15 colors/ half blanking
edging and vertical scrolling for every line
jitter elimination circuit
sprite OSD, 12 16 dots, 1 screen, 8 colors for every dot
I2C bus interface
PWM output
8 bits, 8 channels
Remote control reception circuit 8-bit pulse measurement counter, 6-stage FIFO
HSYNC counter
2 channels
Watchdog timer
Interruption
15 factors, 15 vectors, multi-interruption possible
Standby mode
Sleep
Package
64-pin plastic SDIP/QFP
Piggyback/evaluator
CXP85890A 64-pin ceramic PSDIP (Supports custom font)
Perchase of Sony's I2C components conveys a licence under the Philips I2C Patent Rights to use these components
in an I2C system, provided that the system conforms to the I2C Standard Specifications as defined by Philips.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
E97739A86
LFC1
8BIT TIMER/COUNTER 0
8BIT TIMER 1
EC
TO
HSYNC COUNTER 1
HSC1
A/D CONVERTER
HSYNC COUNTER 0
HSC0
AN0 to AN5
REMOCON
RMC
FIFO
LFC2
Cap
ON SCREEN DISPLAY
INT0
INT1
INT2
INTERRUPT CONTROLLER
CVDD
CVss
SI
SO
SCK
VSYNC
B
I
YS
YM
HSYNC
XLC
EXLC
R
G
Vss
MP
VDD
RST
XTAL
RAM
2176 BYTES
CLOCK GENERATOR/
SYSTEM CONTROL
EXTAL
8BIT PWM
WATCHDOG TIMER
PRESCALER/
TIME BASE TIMER
ROM
40K/48K/56K BYTES
I2C BUS
INTERFACE UNIT
SDA0
CC DECODER
SCL0
SDA1
DATA SLICER
SCL1
PB0 to PB6
PC0 to PC7
PF0 to PF7
PE0 to PE2
PD0 to PD7
PA0 to PA7
PORT B
VIN
PWM0 to PWM7
PORT A
PORT C
PORT D
PORT E
PORT F
Block Diagram
CXP85840A/85848A/85856A
CXP85840A/85848A/85856A
PC3
64
PC4
PC2
63
PC5
PC1
62
PC6
PC0
61
PC7
EC/PD7
60
PF0/PWM0
RMC/PD6
59
PF1/PWM1
HS1/PD5
58
PF2/PWM2
HS0/PD4
57
PF3/PWM3
SI/ PD3
56
PF4/SCL0/PWM4
SO/PD2
10
55
PF5/SCL1/PWM5
SCK/PD1
11
54
PF6/SDA0/PWM6
INT2/PD0
HSYNC/PA7
12
53
PF7/SDA1/PWM7
13
52
PE0/TO
VSYNC/PA6
14
51
PE1
RST
15
50
PE2/INT0
Vss
16
49
MP
XTAL
17
48
Vss
EXTAL
18
47
VDD
PA5/AN5
19
46
NC
PA4/AN4
20
45
EXLC
PA3/AN3
21
44
XLC
PA2/AN2
22
43
YM
PA1/AN1
23
42
YS
PA0/AN0
24
41
CVss
25
40
LFC2
26
39
LFC1
27
38
VIN
28
37
PB0
CVDD
29
36
PB1
Cap
30
35
PB2
INT1/PB6
31
34
PB3
PB5
32
33
PB4
Note)
1. NC (Pin 46) is always connected to VDD.
2. Vss (Pins 16 and 48) are both connected to GND.
3. MP (Pin 49) is always connected to GND.
CXP85840A/85848A/85856A
PF2/PWM2
PF1/PWM1
PC7
PF0/PWM0
PC5
PC6
PC4
PC3
PC1
PC2
PC0
PD7/EC
PD6/RMC
64 63 62 61 60 59 58 57 56 55 54 53 52
PF3/PWM3
HS1/PD5
51
HS0/PD4
50
PF4/SCL0/PWM4
SI/PD3
49
PF5/SCL1/PWM5
SO/PD2
48
PF6/SDA0/PWM6
SCK/PD1
47
PF7/SDA1/PWM7
INT2/PD0
46
PE0/TO
HSYNC/PA7
45
PE1
VSYNC/PA6
44
PE2/INT0
RST
43
MP
Vss
10
42
Vss
XTAL
11
41
VDD
EXTAL
12
40
NC
PA5/AN5
13
39
EXLC
PA4/AN4
14
38
XLC
PA3/AN3
15
37
YM
PA2/AN2
16
36
YS
PA1/AN1
17
35
PA0/AN0
18
34
19
33
PB0
PB1
PB3
PB2
PB4
PB5
Cap
INT1/PB6
VIN
CVDD
LFC1
20 21 22 23 24 25 26 27 28 29 30 31 32
LFC2
CVss
Note)
1. NC (Pin 40) is always connected to VDD.
2. Vss (Pins 10 and 42) are both connected to GND.
3. MP (Pin 43) is always connected to GND.
CXP85840A/85848A/85856A
Pin Description
Symbol
I/O
Description
PA0/AN0
to
PA5/AN5
I/O/
Analog input
PA6/VSYNC
I/O/Input
PA7/HSYNC
I/O/Input
PB0 to PB5
I/O
PB6/INT1
I/O/Input
PC0 to PC7
I/O
PD0/INT2
I/O/Input
PD1/SCK
I/O/I/O
PD2/SO
I/O/Output
PD3/SI
I/O/Input
PD4/HS0
I/O/Input
PD5/HS1
I/O/Input
PD6/RMC
I/O/Input
PD7/EC
I/O/Input
PE0/TO
I/O/Output
PE1
I/O
PE2/INT0
I/O/Input
PF0/PWM0
to
PF3/PWM3
Output/Output
PF4/SCL0/PWM4
PF5/SCL1/PWM5
Output/I/O
PF6/SDA0/PWM6
PF7/SDA1/PWM7
Output/I/O
R, G, B, I, YS, YM
Output
(Port A)
8-bit I/O port. I/O
can be set in a unit
of single bits.
(8 pins)
(Port B)
7-bit I/O port. I/O can be set in a unit of single bits.
(7 pins)
External interruption request input.
Active at the falling edge.
(Port C)
8-bit I/O port. I/O can be set in a unit of single bits.
(8 pins)
External interruption request input.
Active at the falling edge.
(Port D)
8-bit I/O port.
I/O can be set in a
unit of single bits.
Can drive 12mA
synk current.
(8 pins)
(Port E)
3-bit I/O port.
I/O can be set in a
unit of single bits.
(3 pins)
(Port F)
8-bit output port
and large current
(12mA) N-channel
open drain output.
Lower 4 bits are
medium drive voltage
(12V); upper 4 bits
are 5V drive.
(8 pins)
CXP85840A/85848A/85856A
Symbol
I/O
EXLC
Input
XLC
Output
VIN
Input
Description
OSD display clock oscillation I/O.
Oscillation frequency is determined by the external L and C.
External composite video signal input.
Input the 2Vp-p signal via a capacitor.
Cap
LFC1, LFC2
Connects a low-pass filter capacitor for PLL circuit between LFC1 and
LFC2.
CVDD
CVss
EXTAL
Input
XTAL
Output
RST
I/O
System reset; active at Low level. I/O pin. Outputs a Low level when the
power is turned on and the internal power-on reset function operates.
(Mask option)
MP
Input
NC
No connected.
Under normal operation, connect to VDD.
VDD
Vss
CXP85840A/85848A/85856A
Circuit format
When reset
Port A
A
A
Port A data
Port A direction
PA0/AN0
to
PA5/AN5
IP
0 when reset
Data bus
Input
protection
circuit
Hi-Z
RD (Port A)
Port A function selection
0 when reset
A/D converter
Input multiplexer
6 pins
Port A
Port A data
A
A
Port A direction
IP
0 when reset
PA6/VSYNC
PA7/HSYNC
Data bus
RD (Port A)
Hi-Z
Schmitt input
VSYNC, HSYNC
Input polarity
2 pins
0 when reset
Port B
Port C
Ports B, C data
PB0 to PB5
PB6/INT1
PC0 to PC7
A
A
Ports B, C direction
IP
0 when reset
Data bus
RD (Ports B, C)
Schmitt input
INT1
15 pins
Hi-Z
CXP85840A/85848A/85856A
Pin
Circuit format
When reset
Port D
Port D data
PD0/INT2
PD3/SI
PD4/HS0
PD5/HS1
PD6/RMC
PD7/EC
Port D direction
0 when reset
AA
IP
Hi-Z
Schmitt input
Data bus
RD (Port D)
6 pins
Port D
SCK, SO
Serial output enable
Port D data
PD1/SCK
PD2/SO
AA
Port D direction
0 when reset
IP
Hi-Z
Schmitt input
Data bus
RD (Port D)
Large current 12mA
SCK only
2 pins
Port E
TO
Port E function
selection
1 when reset
PE0/TO
PE1
PE2/INT0
AA
AA
Port E data
1 when reset for PE0 and 1
Port E direction
IP
Schmitt input
only for PE2
Data bus
RD (Port E)
3 pins
INT0
PE0, PE1:
High level
PE2: Hi-Z
CXP85840A/85848A/85856A
Pin
Circuit format
When reset
Port F
PWM0 to PWM3
PF0/PWM0
to
PF3/PWM3
Port F data
1 when reset
Port F function
selection
0 when reset
4 pins
Hi-Z
Port F
SCL, SDA
PF4/PWM4/SCL0
PF5/PWM5/SCL1
PF6/PWM6/SDA0
PF7/PWM7/SDA1
A
A
PWM4 to PWM7
IP
Port F data
1 when reset
Port F function
selection
0 when reset
R
G
B
I
YS
YM
AAAA
AAAA
2 pins
AA
R, G, B, I, YS, YM
Output polarity
0 when reset
6 pins
EXLC
XLC
BUS SW
Schmitt input
SCL, SDA
(I2C circuit)
4 pins
Hi-Z
AA
AA
AA
AA
AA A
AA A
EXLC
XLC
Hi-Z
IP
IP
Oscillation control
Oscillation
halted
OSC display clock
CXP85840A/85848A/85856A
Pin
EXTAL
XTAL
2 pins
AA
AA
AA
AA
EXTAL
Circuit format
AA
When reset
Diagram shows the circuit
composition during oscillation.
IP
Oscillation
XTAL
Pull-up resistor
RST
1 pin
AA
AA
OP Mask option
Schmitt input
10
Low level
CXP85840A/85848A/85856A
(Vss = 0V reference)
Symbol
Ratings
Unit
V
Remarks
Supply voltage
VDD
Input voltage
VIN
0.3 to +7.0
0.3 to +7.01
Output voltage
VOUT
0.3 to +7.01
VOUTP
0.3 to +15.0
IOH
mA
IOH
50
mA
IOL
15
mA
IOLC
20
mA
IOL
100
mA
Operating temperature
Topr
20 to +75
Storage temperature
Tstg
55 to +150
PD
1000
mW
SDIP-64P-01
600
mW
GFP-64P-L01
Supply voltage
Symbol
Min.
Max.
Unit
4.5
5.5
3.5
5.5
2.5
5.5
4.5
5.5
VIH
0.7VDD
VDD
VIHS
0.8VDD
VDD
VDD
CVDD
Operating temperature
1
2
3
4
5
Remarks
VIL
0.3VDD
EXTAL pin4
2
VILS
0.2VDD
VILEX
0.3
0.4
EXTAL pin4
Topr
20
+75
VIHEX
(Vss = 0V reference)
CXP85840A/85848A/85856A
Electrical Characteristics
DC characteristics
Item
High level output
voltage
Symbol
VOH
VOL
IIHE
Input current
Conditions
Min.
PA to PD, PE
R, G, B, I, YS, YM
4.0
3.5
PA to PD, PE
R, G, B, I, YS, YM,
PF0 to PF3, RST1
0.4
0.6
PD, PF
1.5
PF4 to PF7
(SCL0, SCL1,
SDA0, SDA1)
0.4
0.6
EXTAL
IIHL
Typ.
Max.
Unit
0.5
40
0.5
40
1.5
400
IILR
RST2
IIZ
PA to PE, HSYNC,
VSYNC, R, G, B, I,
YS, YM, RST2
VDD = 5.5V,
VI = 0, 5.5V
10
PF0 to PF3
50
ILOH
PF4 to PF7
10
SCL0: SCL1
SDA0: SDA1
VDD = 4.5V
VSCL0 = VSCL1 = 2.25V
VSDA0 = VSDA1 = 2.25V
120
IDD
Supply current
IDDSL
VDD3
IDDST
Input capacitance
37
50
mA
Sleep mode
VDD = 5.5V,
12MHz crystal oscillation
(C1 = C2 = 15pF)
2.5
mA
Stop mode4
VDD = 5.5V, termination of
12MHz oscillation
VDD = 5.5V
5.0
10.0
mA
10
20
pF
ICVDD
CVDD
CIN
PA to PE, SCL,
Clock 1MHz
SDA, EXLC, EXTAL,
0V for no-measured pins
VIN, RST
1 Specifies RST pin only when the power-on reset circuit is selected with mask option.
2 For RST pin, specifies the input current when pull-up resistor is selected, and specifies the leakage current
when non-resistor is selected.
3 When all output pins are left open. Specifies only when the OSD oscillation is halted.
4 This device does not enter the stop mode.
12
CXP85840A/85848A/85856A
AC Characteristics
(1) Clock timing
Item
Symbol
Pins
Conditions
Typ.
Min.
fC
XTAL
EXTAL
Fig. 1, Fig. 2
tXL,
tXH
EXTAL
Fig. 1, Fig. 2
External clock drive
tCR,
tCF
EXTAL
Fig. 1, Fig. 2
External clock drive
tEH,
tEL
EC
Fig. 3
tER,
tEF
EC
Fig. 3
Max.
Unit
MHz
12.0
ns
37.5
200
tsys1 + 50
ns
ns
20
ms
1 Indicates three values according to the contents of the clock control register (CLC: 00FEh) upper 2 bits
(CPU clock selection).
tsys (ns) = 2000/fc (Upper 2 bits = 00), 4000/fc (Upper 2 bits = 01), 16000/fc (Upper 2 bits = 11)
VDD 0.4V
EXTAL
0.4V
tXH
tCF
tXL
tCR
AAAAA AAAAA
AAAAA
AAAAA
AAAAA AAAAA
Crystal oscillation
Ceramic oscillation
EXTAL
C1
External clock
EXTAL
XTAL
C2
XTAL
OPEN
0.8VDD
EC
0.2VDD
tEH
tEF
13
tEL
tER
CXP85840A/85848A/85856A
Pins
tKCY
SCK
tKH
tKL
SCK
tSIK
SI
tKSI
SI
tKSO
SO
Conditions
Min.
Input mode
Max.
1000
ns
8000/fc
ns
400
ns
4000/fc 50
ns
100
ns
200
ns
200
ns
100
ns
Output mode
SCK input mode
SCK output mode
200
ns
100
ns
Note) The load of SCK output mode and SO output delay time is 50 pF + 1TTL.
tKCY
tKL
tKH
0.8VDD
SCK
0.2VDD
tSIK
tKSI
0.8VDD
Input data
SI
Unit
0.2VDD
tKSO
0.8VDD
SO
Output data
0.2VDD
14
CXP85840A/85848A/85856A
Max.
Unit
Resolution
Bits
Linearity error
LSB
Zero transition
voltage
VZT1
Full-scale transition
voltage
VFT2
Conversion time
Sampling time
tCONV
tSAMP
VIAN
Pins
Conditions
Min.
Ta = 25C
VDD = 5.0V
Vss = 0V
Typ.
10
10
70
mV
4910
4970
5030
mV
160/fADC3
12/fADC3
AN0 to AN5
s
s
VDD
FFh
FEh
Linearity error
01h
00h
VZT
VFT
CKS
0 (/2 selection)
1 ( selection)
00 ( = fEX/2)
fADC = fC/2
fADC = fC
01 ( = fEX/4)
fADC = fC/4
fADC = fC/2
11 ( = fEX/16)
fADC = fC/16
fADC = fC/8
PCK1, 0
Analog input
15
CXP85840A/85848A/85856A
(4) Interruption, reset input (Ta = 20 to +75C, VDD = 4.5 to 5.5V, Vss = 0V reference)
Item
Symbol
Pins
Conditions
Min.
Max.
Unit
tIH
tIL
INT0
INT1
INT2
tRSL
RST
32/fc
tIL
0.8VDD
0.2VDD
RST
0.2VDD
Item
Symbol
tR
Power supply cut-off time tOFF
Power supply rise time
Pins
VDD
Conditions
Power-on reset
Repeated power-on reset
Min.
Max.
Unit
0.05
50
ms
ms
VDD
4.5V
0.2V
0.2V
tR
tOFF
16
CXP85840A/85848A/85856A
Symbol
Pins
Conditions
Min.
Max.
Unit
100
kHz
fSLC
SCL
tBUF
tHD; STA
tLOW
tHIGH
tSU; STA
tHD; DAT
tSU; DAT
tR
tF
tSU; STO
SDA, SCL
4.7
SDA, SCL
4.0
SCL
4.7
SCL
4.0
SDA, SCL
SDA, SCL
4.7
01
SDA, SCL
250
ns
SDA, SCL
SDA, SCL
300
ns
SDA, SCL
4.7
1 The data hold time should be 300ns or more because the SCL rise time (300ns Max.) is not included in it.
SDA
tBUF
tR
tF
tHD; STA
SCL
tHD; STA
tSU; STA
P
tLOW
tHD; DAT
tHIGH
St
tSU; DAT
tSU; STO
P
I2C
device
RS
I2C
device
RS RS
R S RP
RP
SDA0
(or SDA1)
SCL0
(or SCL1)
A pull-up resistor (Rp) must be connected to SDA0 (or SDA1) and SCL0 (or SCL1).
The SDA0 (or SDA1) and SCL0 (or SCL1) series resistance (Rs = 300 or less) can be used to reduce the
spike noise caused by CRT flashover.
17
CXP85840A/85848A/85856A
Item
Symbol
Pins
Conditions
Min.
Max.
Unit
16.5
MHz
EXLC
XLC
Fig. 12
tHWD
tVWD
HSYNC
Fig. 11
1.2
VSYNC
Fig. 11
H*
tHCG
HSYNC
Fig. 11
200
ns
tVCG
VSYNC
Fig. 11
1.0
fOSC
tHWD
0.8VDD
HSYNC
For OSD I/O polarity register
(OPOL: 01FDh)
bit 7 at 0
0.2VDD
tVCG
tVWD
0.8VDD
VSYNC
For OSD I/O polarity register
(OPOL: 01FDh)
bit 6 at 0
0.2VDD
EXLC
XLC
R1
L
C2
C1
1 The XLC series resistor can reduce the frequency of occurrence of the undesired radiation.
18
CXP85840A/85848A/85856A
Symbol
Min.
Typ.
Max.
Unit
Remarks
VIN
0.1
Cap
4700
pF
CLPF
LFC1,
LFC2
0.47
Composite video
signal input
Video In VIN
2.0
Vp-p
CVIN
5.0V
CVDD
LFC2
CLPF
LFC1
CVIN
R1
VIN
Video In
C1
R2
Cap
Ccap
CVss
[Recommended Constant]
R1 = 220 (error: 5%; allowable power dissipation: 1/8W or more)
R2 = 1M (error: 5%; allowable power dissipation: 1/8W or more)
C1 = 1200pF (ceramic), the B characteristics or more of temperature characteristics is recommended.
19
CXP85840A/85848A/85856A
Appendix
Fig. 14. SPC 700 Series recommended oscillation circuit
AAAAA
AAAAA
AAAAA
(i)
EXTAL
XTAL
Rd
C1
Manufacture
C2
Model
fc (MHz)
C1 (pF)
C2 (pF)
HC-49/U03
12.0
Rd ()
01
KINSEKI LTD.
HC-19/U (-S)
12.0
15
15
01
Circuit example
1 The XTAL series resistor can reduce the effect of the noise caused by the electrostatic discharge.
Content
Non-existent
Existent
Non-existent
Existent
20
(i)
(i)
CXP85840A/85848A/85856A
IDD vs. fc
100
1/2 dividing mode
45
35
10
Sleep mode
1
30
25
20
15
10
0
0.1
3
Sleep mode
12
L Inductance [H]
40
10
10MHz
12MHz
14MHz
16MHz
fOSC =
0
1
2
LC
C = C1 // C2
50
C1, C2 Capacitance [pF]
21
100
16
CXP85840A/85848A/85856A
Unit: mm
+ 0.1
0.05
0.25
+ 0.4
57.6 0.1
64
19.05
+ 0.3
17.1 0.1
33
0 to 15
32
3 MIN
0.5 MIN
+ 0.4
4.75 0.1
1.778
0.5 0.1
0.9 0.15
PACKAGE STRUCTURE
MOLDING COMPOUND
SONY CODE
SDIP-64P-01
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
SDIP064-P-0750-A
LEAD MATERIAL
42 ALLOY
PACKAGE WEIGHT
8.6g
JEDEC CODE
64PIN QFP(PLASTIC)
23.9 0.4
+ 0.4
20.0 0.1
+ 0.1
0.15 0.05
51
0.15
32
64
20
16.3
52
17.9 0.4
33
+ 0.4
14.0 0.1
+ 0.2
0.1 0.05
19
+ 0.35
2.75 0.15
+ 0.15
0.4 0.1
1.0
0.8 0.2
Package Outline
0.12 M
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
SONY CODE
QFP64PL01
LEAD TREATMENT
EIAJ CODE
QFP064P1420
LEAD MATERIAL
42/COPPER ALLOY
PACKAGE MASS
1.5g
JEDEC CODE
22