Description
Continuous-time operation
Fast power-on time
Low noise
Stable operation over full operating temperature range
Reverse battery protection
Solid-state reliability
Factory-programmed at end-of-line for optimum
performance
Robust EMC performance
High ESD rating
Regulator stability without a bypass capacitor
VCC
To all subcircuits
Regulator
VOUT
Amp
Gain
Offset
Trim
Control
GND
A1202-DS, Rev. 17
A1202
and A1203
Description (continued)
applications, without adding external components. All devices in
the family are identical, except for magnetic switchpoints.
The small geometries of the BiCMOS process allow these devices
to be provided in ultrasmall packages. The package styles available
Selection Guide
Packing*
Part Number
A1202LUA-T
Mounting
Ambient, TA
BRP (Min)
BOP (Max)
40C to 150C
75
75
40C to 85C
95
95
A1203EUA-T
A1203LLHLT-T
A1203LUA-T
40C to 150C
Symbol
Notes
Rating
Units
Supply Voltage
VCC
30
VRCC
30
VOUT
30
VROUT
0.5
IOUTSINK
25
mA
Unlimited
Range E
40 to 85
Range L
40 to 150
TJ(max)
165
Tstg
65 to 170
TA
A1202
and A1203
Pin-out Diagrams
Package UA
GND
Package LH
3
VOUT
VOUT
GND
VCC
1
VCC
Terminal List
Name
VCC
VOUT
GND
Description
Connects power supply to chip
Output from circuit
Ground
Number
Package LH Package UA
1
1
2
3
3
2
A1202
and A1203
OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Electrical Characteristics
Supply Voltage1
Output Leakage Current
Output On Voltage
Power-On Time2
Output Rise Time3
Output Fall
Time3
Supply Current
Reverse Battery Current
VCC
3.8
24
IOUTOFF
10
VOUT(SAT)
215
400
mV
tr
tf
tPO
ICCON
B > BOP
3.8
7.5
mA
ICCOFF
B < BRP
3.5
7.5
mA
VRCC = 30 V
10
mA
IRCC
VZ
32
IZ
VZ = 32 V; TA = 25C
30
mA
A1202
26
75
A1203
26
95
A1202
75
26
A1203
95
26
A1202
30
52
A1203
30
52
Magnetic
Characteristics5
Operate Point
BOP
Release Point
BRP
Hysteresis
BHYS
Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
2 For V
CC slew rates greater than 250 V/s, and TA = 150C, the Power-On Time can reach its maximum value.
3 C =oscilloscope probe capacitance.
S
4 Maximum current limit is equal to the maximum I
CC(max) + 22 mA.
5 Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields.
This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated
by the absolute value of B, and the sign indicates the polarity of the field (for example, a 100 G field and a 100 G field have equivalent strength, but
opposite polarity).
A1202
and A1203
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Symbol
Test Conditions
RJA
Value Units
228
C/W
Package LH, 2-layer PCB with 0.463 in.2 of copper area each
side connected by thermal vias
110
C/W
165
C/W
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
VCC(max)
40
60
80
100
120
140
160
180
Pa
(R cka
ge
QJ
A =
L
11 H, 2
0 -la
Pac
C/ ye
W
(R kage
) r PC
UA
QJA =
B
,
165 1-la
C/ yer
W)
PC
B
Pac
k
(R age LH
,
QJA =
228 1-laye
C/W r PC
B
)
20
40
60
80
100
120
Temperature (C)
140
160
180
A1202
and A1203
(A1202/03)
(A1202/03)
8.0
7.0
7.0
ICCON (mA)
6.0
VCC (V)
5.0
24
3.8
4.0
3.0
ICCON (mA)
8.0
6.0
TA (C)
5.0
40
25
150
4.0
3.0
2.0
2.0
1.0
1.0
50
50
TA (C)
100
150
20
25
(A1202/03)
(A1202/03)
8.0
7.0
7.0
VCC (V)
5.0
24
3.8
4.0
3.0
ICCOFF (mA)
8.0
6.0
ICCOFF (mA)
15
VCC (V)
6.0
TA (C)
5.0
40
25
150
4.0
3.0
2.0
2.0
1.0
1.0
0
0
50
50
TA (C)
100
150
10
15
20
25
(A1202/03)
400
VCC (V)
(A1202/03)
400
350
350
300
300
250
VCC (V)
200
24
3.8
150
100
50
VOUT(SAT) (mV)
VOUT(SAT) (mV)
10
TA (C)
250
40
25
150
200
150
100
50
0
50
50
TA (C)
100
150
10
15
20
25
VCC (V)
A1202
and A1203
BOP (G)
50
VCC (V)
40
24
12
3.8
30
20
10
0
-50
50
TA (C)
100
150
BRP (G)
-25
VCC (V)
-35
24
12
3.8
-45
-55
-65
-75
-50
50
TA (C)
100
150
80
75
70
BHYS (G)
65
VCC (V)
60
24
12
3.8
55
50
45
40
35
30
-50
50
100
150
TA (C)
A1202
and A1203
In contrast to latching, when a device exhibits unipolar switching, it only responds to a south magnetic field. The field must
be of sufficient strength, > BOP , for the device to operate. When
the field is reduced beyond the BRP level, the device switches
back to the high state, as shown in panel B of figure 1. Devices
exhibiting negative switch behavior operate in a similar but
opposite manner. A north polarity field of sufficient strength,
> BRP , (more north than BRP) is required for operation, although
the result is that VOUT switches high, as shown in panel C. When
VS
VCC
B 0
BHYS
VCC
VOUT
Switch to High
Switch to High
VOUT(SAT)
BRP
B+
V+
B+
VOUT(SAT)
B
BOP
BRP
VCC
VOUT
VOUT
V+
BOP
BHYS
BOP
(C)
Switch to Low
VOUT(SAT)
B
(D)
Switch to Low
Switch to High
VCC
Switch to Low
GND
(B)
V+
Output
VOUT
BRP
(A)
A120x
RL
B+
BHYS
Figure 1. Bipolar Device Output Switching Modes. These behaviors can be exhibited when using a circuit such as that shown in panel D. Panel A
displays the hysteresis when a device exhibits latch mode (note that the BHYS band incorporates B= 0), panel B shows unipolar switch behavior (the
BHYS band is more positive than B = 0), and panel C shows negative switch behavior (the BHYS band is more negative than B = 0). Bipolar devices,
such as the 120x family, can operate in any of the three modes.
A1202
and A1203
the field is reduced beyond the BOP level, the device switches
back to the low state.
Bipolar devices adopt an indeterminate output state when powered-on in the absence of a magnetic field or in a field that lies
within the hysteresis band of the device.
CONTINUOUS-TIME BENEFITS
Continuous-time devices, such as the A120x family, offer the
fastest available power-on settling time and frequency response.
Due to offsets generated during the IC packaging process,
continuous-time devices typically require programming after
packaging to tighten magnetic parameter distributions. In contrast, chopper-stabilized switches employ an offset cancellation
technique on the chip that eliminates these offsets without the
need for after-packaging programming. The tradeoff is a longer
settling time and reduced frequency response as a result of the
chopper-stabilization offset cancellation algorithm.
VCC
t
VOUT
t
tPO(max)
Output Sampled
Figure 2. Continuous-Time Application, B < BRP.. This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power.
Position 1, power is applied to the device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max).
The case shown is where the correct output state is HIGH . Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is
valid, a control unit reads the output. Position 5, power is removed from the device.
A1202
and A1203
10
A1202
and A1203
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, RJC, is
relatively small component of RJA. Ambient air temperature,
TA, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN IIN
(1)
T = PD RJA (2)
TJ = TA + T
(3)
A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RJA and TA.
11
A1202
and A1203
+0.12
2.98 0.08
1.49 D
44
+0.020
0.1800.053
0.96 D
+0.10
2.90 0.20
+0.19
1.91 0.06
2.40
0.70
0.25 MIN
1.00
2
0.55 REF
0.25 BSC
0.95
Seating Plane
Gauge Plane
8X 10 REF
Branded Face
C
1.00 0.13
NNT
+0.10
0.05 0.05
0.95 BSC
0.40 0.10
For Reference Only; not for tooling use (reference dwg. 802840)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A
A1202 and
A1203
1
N = Last two digits of device part number
T = Temperature code (letter)
NNN
A1203 only
1
N = Last three digits of device part number
12
A1202
and A1203
45
B
C
2.04
1.52 0.05
1.44 E
Mold Ejector
Pin Indent
+0.08
3.02 0.05
E
Branded
Face
45
1
2.16
MAX
0.79 REF
A
0.51
REF
NNT
+0.03
0.41 0.06
15.75 0.51
+0.05
0.43 0.07
1.27 NOM
13
A1202
and A1203
Revision History
Revision
Revision Date
Rev. 17
Description of Revision
Update LH package branding
14